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TECHINSIGHTS INC.
Leading the world in microelectronics reverse engineering, and building the content platform for the semiconductor industry. TechInsights is proud to support a fair marketplace which promotes innovation, and where electronics Intellectual Property can be created and monetized to advance the world we live in.TECHINSIGHTS APP
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APPLE IPAD PRO TEARDOWN The mini-LED display market is still in its infancy for the consumer market. Once TechInsights has completed the Deep Dive Teardown and analyzed the entire Display subsystem, we will have a better understanding as to how the new iPad Pro mini-LED display’s cost compares to the the $116 display costs from the 2019 iPad Pro 12.9”, as well as how the new 12.9” mini-LED display compares to APPLE HOMEPOD MINI TEARDOWN Apple has the most design wins for the Apple HomePod Mini A2374. Apple supplied the 64-bit dual-core S5 APL1W82 application processor, which was introduced in the Apple Watch Series 5 in 2019. Apple also used its own 338S00553-A0/D2482A power management chip, developed in cooperation with Dialog Semiconductor, and 339M00117 WiFi/Bluetoothsolution.
APPLE IPHONE 11 PRO MAX TEARDOWN Cameras. Our investigation of iPhone 11 and iPhone 11 Pro Max’s cameras is progressing, and we have summarized a mix of findings from each in Table 1. We were excited during the September Apple Special Event to hear of 100% Focus Pixels for iPhone’s wide-angle camera. We expected this to coincide with full-chip dual photodiode phase QUALCOMM QET5100 ENVELOPE TRACKER ARCHITECTURE ANALYSIS Mobile RF - Envelope Power Tracker Architecture. Report Code. CWR-1911-801. This is a Envelope Tracker Architecture on the Qualcomm envelope tracker integrated circuit (IC). It consists of a Device Summary, Introduction, Architecture Overview including outside and inside connectivity. View Table of Contents. SIC POWER TRANSISTOR PROCESS FLOW ANALYSIS: THE ROHM TechInsights has recently completed a full analysis of the process flow used to fabricate the Rohm SCT3022ALGC11 N-channel, SiC, trench, power MOSFET. The SCT3022ALGC11 is a 650 V, 93 A device, with an R DSON of 22 m . It is a leading etch SiC trench gate power FET, and is designed for use in solar inverters, DC/DC converters, switch modepower
APPLE IPHONE X TEARDOWN Apple iPhone X Teardown. Apple used the tagline “Say hello to the future” to introduce the era of the iPhone X, and with the iPhone X in our lab for teardown, we are working to bring our readers news of the innovations made by Apple in their latest smartphone offering. We recently completed the iPhone 8 Plus teardown, and have examined the SAMSUNG KLUFG8R1EM-B0C1 64L TLC 3D V-NAND 512 GB DIE MFR-1903-802. This report presents a Memory Floorplan Analysis of the Samsung K9AHGD8U0M die found inside the Samsung KLUFG8R1EM-B0C1 3D V-NAND TLC flash memory package. This report contains the following detailed information: Selected teardown photographs, package photographs, package X-rays, die markings, and die photographs. BROADCOM BCM4387 WI-FI 6/BT 5.0 BASIC FLOORPLAN REPORT Broadcom BCM4387 Wi-Fi 6/BT 5.0 Basic Floorplan Report. This report presents a Basic Floorplan Analysis of the Broadcom BCM4387 die found inside the 339S00761 wireless module, which was extracted from the iPhone 12 Pro Max smartphone. Selected teardown photographs, package photographs, package X-rays, die markings, and die photographs.TECHINSIGHTS INC.
Leading the world in microelectronics reverse engineering, and building the content platform for the semiconductor industry. TechInsights is proud to support a fair marketplace which promotes innovation, and where electronics Intellectual Property can be created and monetized to advance the world we live in.TECHINSIGHTS APP
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APPLE IPAD PRO TEARDOWN The mini-LED display market is still in its infancy for the consumer market. Once TechInsights has completed the Deep Dive Teardown and analyzed the entire Display subsystem, we will have a better understanding as to how the new iPad Pro mini-LED display’s cost compares to the the $116 display costs from the 2019 iPad Pro 12.9”, as well as how the new 12.9” mini-LED display compares to APPLE HOMEPOD MINI TEARDOWN Apple has the most design wins for the Apple HomePod Mini A2374. Apple supplied the 64-bit dual-core S5 APL1W82 application processor, which was introduced in the Apple Watch Series 5 in 2019. Apple also used its own 338S00553-A0/D2482A power management chip, developed in cooperation with Dialog Semiconductor, and 339M00117 WiFi/Bluetoothsolution.
APPLE IPHONE 11 PRO MAX TEARDOWN Cameras. Our investigation of iPhone 11 and iPhone 11 Pro Max’s cameras is progressing, and we have summarized a mix of findings from each in Table 1. We were excited during the September Apple Special Event to hear of 100% Focus Pixels for iPhone’s wide-angle camera. We expected this to coincide with full-chip dual photodiode phase QUALCOMM QET5100 ENVELOPE TRACKER ARCHITECTURE ANALYSIS Mobile RF - Envelope Power Tracker Architecture. Report Code. CWR-1911-801. This is a Envelope Tracker Architecture on the Qualcomm envelope tracker integrated circuit (IC). It consists of a Device Summary, Introduction, Architecture Overview including outside and inside connectivity. View Table of Contents. SIC POWER TRANSISTOR PROCESS FLOW ANALYSIS: THE ROHM TechInsights has recently completed a full analysis of the process flow used to fabricate the Rohm SCT3022ALGC11 N-channel, SiC, trench, power MOSFET. The SCT3022ALGC11 is a 650 V, 93 A device, with an R DSON of 22 m . It is a leading etch SiC trench gate power FET, and is designed for use in solar inverters, DC/DC converters, switch modepower
APPLE IPHONE X TEARDOWN Apple iPhone X Teardown. Apple used the tagline “Say hello to the future” to introduce the era of the iPhone X, and with the iPhone X in our lab for teardown, we are working to bring our readers news of the innovations made by Apple in their latest smartphone offering. We recently completed the iPhone 8 Plus teardown, and have examined the SAMSUNG KLUFG8R1EM-B0C1 64L TLC 3D V-NAND 512 GB DIE MFR-1903-802. This report presents a Memory Floorplan Analysis of the Samsung K9AHGD8U0M die found inside the Samsung KLUFG8R1EM-B0C1 3D V-NAND TLC flash memory package. This report contains the following detailed information: Selected teardown photographs, package photographs, package X-rays, die markings, and die photographs. BROADCOM BCM4387 WI-FI 6/BT 5.0 BASIC FLOORPLAN REPORT Broadcom BCM4387 Wi-Fi 6/BT 5.0 Basic Floorplan Report. This report presents a Basic Floorplan Analysis of the Broadcom BCM4387 die found inside the 339S00761 wireless module, which was extracted from the iPhone 12 Pro Max smartphone. Selected teardown photographs, package photographs, package X-rays, die markings, and die photographs. MEMORY TECHNOLOGY HIGHLIGHTS FROM TECHINSIGHTS 2021 Memory Technology Highlights from TechInsights 2021 Webinar Memory Technology Highlights from TechInsights 2021 Webinar Choose the best timezone for you America/Europe Register for Session 1 June 29, 2021: 3pm - 4pm UTC Asia Pacific Register for Session 2 June 29, 2021: 6am - 7am UTC Due to strong and growing A REVIEW OF THE CHEVY BOLT POWERTRAIN The battery pack on the Chevy Bolt is made by LG Electronics and occupies a large portion of the car’s undercarriage. Lithium ion batteries are somewhat hazardous to work with; due to the very high electrical energy density and the presence of flammable organic electrolyte materials, TechInsights performed the basic teardown work in a storage container in the parking lot of our office, as INTEL'S 2ND GENERATION XPOINT MEMORY In 2017, TechInsights analyzed the details on Intel 1 st gen. XPoint Memory (Optane TM Memory 16GB, MEMPEK1W016GA) including structure, materials, process, design, and circuit as well. Since then, we’ve been waiting for the 2 nd gen. XPoint Memory for many years. 3D XPoint non-volatile memory technology was introduced in 2015, and products started shipping from 2017. LIDAR 101 – SOLID-STATE AND MECHANICAL LIDARS LiDAR 101 – Solid-State and Mechanical LiDARs. 2020 has been an exciting year for LiDAR manufacturers. Five LiDAR companies (Velodyne Inc, Luminar Technologies Inc, Innoviz Technologies Ltd, Aeva Inc, and Ouster Inc) made announcements or went public through SPAC mergers. 2021 promises to get more interesting with LiDARs used in the sensor SIC POWER TRANSISTOR PROCESS FLOW ANALYSIS: THE ROHM TechInsights has recently completed a full analysis of the process flow used to fabricate the Rohm SCT3022ALGC11 N-channel, SiC, trench, power MOSFET. The SCT3022ALGC11 is a 650 V, 93 A device, with an R DSON of 22 m . It is a leading etch SiC trench gate power FET, and is designed for use in solar inverters, DC/DC converters, switch modepower
GROUNDBREAKING SENSWIR SENSOR BY SONY- IMX990/IMX991 Groundbreaking SenSWIR Sensor by Sony - IMX990/IMX991. Sony announced the IMX990 and IMX991 SenSWIR imagers in 2020, with a 1.34 MP and 0.34 MP resolution, respectively. By moving away from pixel-level bump bonds and taking advantage of greater miniaturization in Cu-Cu Direct Bond Interconnect (DBI), Sony was able to reduce the pixel size of GOOGLE PIXEL 3 XL TEARDOWN Google Pixel 3 XL Teardown. November 18, 2018 - the official launch date in the US, saw the release of the Google Pixel 3 and 3 XL, Google’s most advanced flagship smartphone to date. While we have taken a little time in getting to the teardown analysis of this phone, it is certainly not for lack of interest. We found some interesting PART 4: NON-BAYER CFA, PHASE DETECTION AUTOFOCUS (PDAF This blog series is structured in four parts: (1) chip-stacking and chip-to-chip interconnect, (2) pixel scaling and scaling enablers, (3) active Si thickness and deep trench isolation (DTI) structures, and (4) non-Bayer color filter arrays, and phase detection autofocus (PDAF). The time allotted for the IISW talk did not permit discussion of optical stack trends, and it is not a topic that WORLD’S FIRST 1 GB 28 NM STT-MRAM PRODUCT Everspin’s new 1-Gigabit (Gb) Spin Torque Transfer Magneto-resistive Random Access Memory (STT-MRAM) device with a 28 nm process is the world’s first 1 Gb STT-MRAM product. This 4 th generation MRAM technology release is a standalone market leader. Its only industry peers, Intel and Micron XPoint Memory, are developing MRAM, ReRAM, and ANALYSIS OF QUALCOMM'S SNAPDRAGON SDR865 TRANSCEIVER The Snapdragon 865 platform is Qualcomm's most advanced 5G chipset to date with support for 5G, sub-6, mmWave and LTE. 4G/5G dynamic spectrum sharing, will enable "operators to accelerate 5G deployments by using their existing 4G spectrum holdings to deliver both 4G & 5G services dynamically."TECHINSIGHTS INC.
Leading the world in microelectronics reverse engineering, and building the content platform for the semiconductor industry. TechInsights is proud to support a fair marketplace which promotes innovation, and where electronics Intellectual Property can be created and monetized to advance the world we live in.TECHINSIGHTS APP
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APPLE IPAD PRO TEARDOWN The mini-LED display market is still in its infancy for the consumer market. Once TechInsights has completed the Deep Dive Teardown and analyzed the entire Display subsystem, we will have a better understanding as to how the new iPad Pro mini-LED display’s cost compares to the the $116 display costs from the 2019 iPad Pro 12.9”, as well as how the new 12.9” mini-LED display compares toSAMSUNG GALAXY S21
Samsung D1z 12 Gb LPDDR5 chips are being used for Samsung Galaxy S21 Ultra 5G SM-G998B/DS 12GB RAM, while D1z 16 Gb LPDDR5 chips can be found from S21 5G and S21+ 5G 8 Gb RAM components. We are now tearing down the 8 Gb LPDDR5 S21+ and other models, so we will have more findings to update. February 4 update: Finally! QUALCOMM QET5100 ENVELOPE TRACKER ARCHITECTURE ANALYSIS Mobile RF - Envelope Power Tracker Architecture. Report Code. CWR-1911-801. This is a Envelope Tracker Architecture on the Qualcomm envelope tracker integrated circuit (IC). It consists of a Device Summary, Introduction, Architecture Overview including outside and inside connectivity. View Table of Contents. APPLE HOMEPOD MINI TEARDOWN Apple has the most design wins for the Apple HomePod Mini A2374. Apple supplied the 64-bit dual-core S5 APL1W82 application processor, which was introduced in the Apple Watch Series 5 in 2019. Apple also used its own 338S00553-A0/D2482A power management chip, developed in cooperation with Dialog Semiconductor, and 339M00117 WiFi/Bluetoothsolution.
SIC POWER TRANSISTOR PROCESS FLOW ANALYSIS: THE ROHM TechInsights has recently completed a full analysis of the process flow used to fabricate the Rohm SCT3022ALGC11 N-channel, SiC, trench, power MOSFET. The SCT3022ALGC11 is a 650 V, 93 A device, with an R DSON of 22 m . It is a leading etch SiC trench gate power FET, and is designed for use in solar inverters, DC/DC converters, switch modepower
APPLE IPHONE X TEARDOWN Apple iPhone X Teardown. Apple used the tagline “Say hello to the future” to introduce the era of the iPhone X, and with the iPhone X in our lab for teardown, we are working to bring our readers news of the innovations made by Apple in their latest smartphone offering. We recently completed the iPhone 8 Plus teardown, and have examined the SAMSUNG KLUFG8R1EM-B0C1 64L TLC 3D V-NAND 512 GB DIE MFR-1903-802. This report presents a Memory Floorplan Analysis of the Samsung K9AHGD8U0M die found inside the Samsung KLUFG8R1EM-B0C1 3D V-NAND TLC flash memory package. This report contains the following detailed information: Selected teardown photographs, package photographs, package X-rays, die markings, and die photographs. BROADCOM BCM4387 WI-FI 6/BT 5.0 BASIC FLOORPLAN REPORT Broadcom BCM4387 Wi-Fi 6/BT 5.0 Basic Floorplan Report. This report presents a Basic Floorplan Analysis of the Broadcom BCM4387 die found inside the 339S00761 wireless module, which was extracted from the iPhone 12 Pro Max smartphone. Selected teardown photographs, package photographs, package X-rays, die markings, and die photographs.TECHINSIGHTS INC.
Leading the world in microelectronics reverse engineering, and building the content platform for the semiconductor industry. TechInsights is proud to support a fair marketplace which promotes innovation, and where electronics Intellectual Property can be created and monetized to advance the world we live in.TECHINSIGHTS APP
TechInsights App
APPLE IPAD PRO TEARDOWN The mini-LED display market is still in its infancy for the consumer market. Once TechInsights has completed the Deep Dive Teardown and analyzed the entire Display subsystem, we will have a better understanding as to how the new iPad Pro mini-LED display’s cost compares to the the $116 display costs from the 2019 iPad Pro 12.9”, as well as how the new 12.9” mini-LED display compares toSAMSUNG GALAXY S21
Samsung D1z 12 Gb LPDDR5 chips are being used for Samsung Galaxy S21 Ultra 5G SM-G998B/DS 12GB RAM, while D1z 16 Gb LPDDR5 chips can be found from S21 5G and S21+ 5G 8 Gb RAM components. We are now tearing down the 8 Gb LPDDR5 S21+ and other models, so we will have more findings to update. February 4 update: Finally! QUALCOMM QET5100 ENVELOPE TRACKER ARCHITECTURE ANALYSIS Mobile RF - Envelope Power Tracker Architecture. Report Code. CWR-1911-801. This is a Envelope Tracker Architecture on the Qualcomm envelope tracker integrated circuit (IC). It consists of a Device Summary, Introduction, Architecture Overview including outside and inside connectivity. View Table of Contents. APPLE HOMEPOD MINI TEARDOWN Apple has the most design wins for the Apple HomePod Mini A2374. Apple supplied the 64-bit dual-core S5 APL1W82 application processor, which was introduced in the Apple Watch Series 5 in 2019. Apple also used its own 338S00553-A0/D2482A power management chip, developed in cooperation with Dialog Semiconductor, and 339M00117 WiFi/Bluetoothsolution.
SIC POWER TRANSISTOR PROCESS FLOW ANALYSIS: THE ROHM TechInsights has recently completed a full analysis of the process flow used to fabricate the Rohm SCT3022ALGC11 N-channel, SiC, trench, power MOSFET. The SCT3022ALGC11 is a 650 V, 93 A device, with an R DSON of 22 m . It is a leading etch SiC trench gate power FET, and is designed for use in solar inverters, DC/DC converters, switch modepower
APPLE IPHONE X TEARDOWN Apple iPhone X Teardown. Apple used the tagline “Say hello to the future” to introduce the era of the iPhone X, and with the iPhone X in our lab for teardown, we are working to bring our readers news of the innovations made by Apple in their latest smartphone offering. We recently completed the iPhone 8 Plus teardown, and have examined the SAMSUNG KLUFG8R1EM-B0C1 64L TLC 3D V-NAND 512 GB DIE MFR-1903-802. This report presents a Memory Floorplan Analysis of the Samsung K9AHGD8U0M die found inside the Samsung KLUFG8R1EM-B0C1 3D V-NAND TLC flash memory package. This report contains the following detailed information: Selected teardown photographs, package photographs, package X-rays, die markings, and die photographs. BROADCOM BCM4387 WI-FI 6/BT 5.0 BASIC FLOORPLAN REPORT Broadcom BCM4387 Wi-Fi 6/BT 5.0 Basic Floorplan Report. This report presents a Basic Floorplan Analysis of the Broadcom BCM4387 die found inside the 339S00761 wireless module, which was extracted from the iPhone 12 Pro Max smartphone. Selected teardown photographs, package photographs, package X-rays, die markings, and die photographs.TECHINSIGHTS INC.
Leading the world in microelectronics reverse engineering, and building the content platform for the semiconductor industry. TechInsights is proud to support a fair marketplace which promotes innovation, and where electronics Intellectual Property can be created and monetized to advance the world we live in. APPLE HOMEPOD MINI TEARDOWN Apple has the most design wins for the Apple HomePod Mini A2374. Apple supplied the 64-bit dual-core S5 APL1W82 application processor, which was introduced in the Apple Watch Series 5 in 2019. Apple also used its own 338S00553-A0/D2482A power management chip, developed in cooperation with Dialog Semiconductor, and 339M00117 WiFi/Bluetoothsolution.
BLOGS | TECHINSIGHTS December 21, 2020 Stephen Russell Toshiba Integrated Diode into SiC MOSFET Every silicon carbide (SiC) manufacturer seemingly has their own approach to FET fabrication. BLOGS | TECHINSIGHTS Posted: April 24, 2016 Contributing Authors: Jim Morrison, Ray Fontaine, Dick James and Daniel Yang The following teardown blog contains some of our initial findings. BLOGS | TECHINSIGHTS 4-Part Blog Series: The state of the art of smartphone imagers Part 2: Pixel Scaling and Scaling Enablers Posted: July 16, 2019 Contributing Author: Ray Fontaine Content adapted from TechInsights’ paper for the International Image Sensors Workshop (IISW) 2019 Blog outline of the talk was structured INTEL 2ND GENERATION XPOINT MEMORY Intel 2 nd gen. XPoint Memory Cell Structure. WL and BL pitches measure 40nm for each, which results in the same unit cell size, 0.0016µm 2, with 1 st generation. 4-stack PCM/OTS layer structure, effectively 1F 2, is integrated on M4 layer, likely with a WL/BL/WL/BL/WL stack.The Ovonic Threshold Switching Selector (OTS) co-integrated with a PCM layer for the device, which is the same BLOGS | TECHINSIGHTS Posted: December 24, 2014 Contributing Authors: Martin Bijman On December 23, 2014, RPX purchased the remaining assets of Rockstar for$900M.
BLOGS | TECHINSIGHTS Posted: November 1, 2013 Inside On October 23, 2013, Apple announced the newest iPad, the iPad Air. Since the announcement, we at TechInsights have been anxiously waiting for the opportunity to get our hands on the device. BLOGS | TECHINSIGHTS Posted: October 17, 2016 Contributing Authors: Dick James One of the lesser-known stories of mobile phone evolution is the development of proximity sensing in order to save power and disable touch screen functions when the phone is actually being used as a phone. BLOGS | TECHINSIGHTS Posted: February 7, 2018 Contributing Authors: Dirk Caspary, David Olaogbebikan and Martin Bijman It has been a year since Microsoft released the Azure IP Advantage program – a service that “provides the industry’s most comprehensive protection against intellectual property (IP) risks” by making 10TECHINSIGHTS INC.
Leading the world in microelectronics reverse engineering, and building the content platform for the semiconductor industry. TechInsights is proud to support a fair marketplace which promotes innovation, and where electronics Intellectual Property can be created and monetized to advance the world we live in. TECHINSIGHTS APPTECHINSIGHTS PRIVATIZATIONTECHINSIGHTS ROADMAPTECHINSIGHTS IPHONE 11 TEARDOWNTechInsights App
APPLE IPAD PRO TEARDOWN The mini-LED display market is still in its infancy for the consumer market. Once TechInsights has completed the Deep Dive Teardown and analyzed the entire Display subsystem, we will have a better understanding as to how the new iPad Pro mini-LED display’s cost compares to the the $116 display costs from the 2019 iPad Pro 12.9”, as well as how the new 12.9” mini-LED display compares to QUALCOMM QET5100 ENVELOPE TRACKER ARCHITECTURE ANALYSISARCHITECTURE ANALYSIS DIAGRAMSARCHITECTURE ANALYSIS PAPERARCHITECTURE ANALYSIS PAPERSOFTWARE ARCHITECTURE ANALYSIS METHODSOFTWARE ARCHITECTURE ANALYSIS TOOLSYSTEM ARCHITECTURE ANALYSIS Mobile RF - Envelope Power Tracker Architecture. Report Code. CWR-1911-801. This is a Envelope Tracker Architecture on the Qualcomm envelope tracker integrated circuit (IC). It consists of a Device Summary, Introduction, Architecture Overview including outside and inside connectivity. View Table of Contents. SIC POWER TRANSISTOR PROCESS FLOW ANALYSIS: THE ROHM TechInsights has recently completed a full analysis of the process flow used to fabricate the Rohm SCT3022ALGC11 N-channel, SiC, trench, power MOSFET. The SCT3022ALGC11 is a 650 V, 93 A device, with an R DSON of 22 m . It is a leading etch SiC trench gate power FET, and is designed for use in solar inverters, DC/DC converters, switch modepower
APPLE HOMEPOD MINI TEARDOWN Apple has the most design wins for the Apple HomePod Mini A2374. Apple supplied the 64-bit dual-core S5 APL1W82 application processor, which was introduced in the Apple Watch Series 5 in 2019. Apple also used its own 338S00553-A0/D2482A power management chip, developed in cooperation with Dialog Semiconductor, and 339M00117 WiFi/Bluetoothsolution.
APPLE IPHONE 11 PRO MAX TEARDOWN Cameras. Our investigation of iPhone 11 and iPhone 11 Pro Max’s cameras is progressing, and we have summarized a mix of findings from each in Table 1. We were excited during the September Apple Special Event to hear of 100% Focus Pixels for iPhone’s wide-angle camera. We expected this to coincide with full-chip dual photodiode phase APPLE IPHONE X TEARDOWN Apple iPhone X Teardown. Apple used the tagline “Say hello to the future” to introduce the era of the iPhone X, and with the iPhone X in our lab for teardown, we are working to bring our readers news of the innovations made by Apple in their latest smartphone offering. We recently completed the iPhone 8 Plus teardown, and have examined the A REVIEW OF THE CHEVY BOLT POWERTRAIN The battery pack on the Chevy Bolt is made by LG Electronics and occupies a large portion of the car’s undercarriage. Lithium ion batteries are somewhat hazardous to work with; due to the very high electrical energy density and the presence of flammable organic electrolyte materials, TechInsights performed the basic teardown work in a storage container in the parking lot of our office, as GOOGLE PIXEL 3 XL TEARDOWN Google Pixel 3 XL Teardown. November 18, 2018 - the official launch date in the US, saw the release of the Google Pixel 3 and 3 XL, Google’s most advanced flagship smartphone to date. While we have taken a little time in getting to the teardown analysis of this phone, it is certainly not for lack of interest. We found some interestingTECHINSIGHTS INC.
Leading the world in microelectronics reverse engineering, and building the content platform for the semiconductor industry. TechInsights is proud to support a fair marketplace which promotes innovation, and where electronics Intellectual Property can be created and monetized to advance the world we live in. TECHINSIGHTS APPTECHINSIGHTS PRIVATIZATIONTECHINSIGHTS ROADMAPTECHINSIGHTS IPHONE 11 TEARDOWNTechInsights App
APPLE IPAD PRO TEARDOWN The mini-LED display market is still in its infancy for the consumer market. Once TechInsights has completed the Deep Dive Teardown and analyzed the entire Display subsystem, we will have a better understanding as to how the new iPad Pro mini-LED display’s cost compares to the the $116 display costs from the 2019 iPad Pro 12.9”, as well as how the new 12.9” mini-LED display compares to QUALCOMM QET5100 ENVELOPE TRACKER ARCHITECTURE ANALYSISARCHITECTURE ANALYSIS DIAGRAMSARCHITECTURE ANALYSIS PAPERARCHITECTURE ANALYSIS PAPERSOFTWARE ARCHITECTURE ANALYSIS METHODSOFTWARE ARCHITECTURE ANALYSIS TOOLSYSTEM ARCHITECTURE ANALYSIS Mobile RF - Envelope Power Tracker Architecture. Report Code. CWR-1911-801. This is a Envelope Tracker Architecture on the Qualcomm envelope tracker integrated circuit (IC). It consists of a Device Summary, Introduction, Architecture Overview including outside and inside connectivity. View Table of Contents. SIC POWER TRANSISTOR PROCESS FLOW ANALYSIS: THE ROHM TechInsights has recently completed a full analysis of the process flow used to fabricate the Rohm SCT3022ALGC11 N-channel, SiC, trench, power MOSFET. The SCT3022ALGC11 is a 650 V, 93 A device, with an R DSON of 22 m . It is a leading etch SiC trench gate power FET, and is designed for use in solar inverters, DC/DC converters, switch modepower
APPLE HOMEPOD MINI TEARDOWN Apple has the most design wins for the Apple HomePod Mini A2374. Apple supplied the 64-bit dual-core S5 APL1W82 application processor, which was introduced in the Apple Watch Series 5 in 2019. Apple also used its own 338S00553-A0/D2482A power management chip, developed in cooperation with Dialog Semiconductor, and 339M00117 WiFi/Bluetoothsolution.
APPLE IPHONE 11 PRO MAX TEARDOWN Cameras. Our investigation of iPhone 11 and iPhone 11 Pro Max’s cameras is progressing, and we have summarized a mix of findings from each in Table 1. We were excited during the September Apple Special Event to hear of 100% Focus Pixels for iPhone’s wide-angle camera. We expected this to coincide with full-chip dual photodiode phase APPLE IPHONE X TEARDOWN Apple iPhone X Teardown. Apple used the tagline “Say hello to the future” to introduce the era of the iPhone X, and with the iPhone X in our lab for teardown, we are working to bring our readers news of the innovations made by Apple in their latest smartphone offering. We recently completed the iPhone 8 Plus teardown, and have examined the A REVIEW OF THE CHEVY BOLT POWERTRAIN The battery pack on the Chevy Bolt is made by LG Electronics and occupies a large portion of the car’s undercarriage. Lithium ion batteries are somewhat hazardous to work with; due to the very high electrical energy density and the presence of flammable organic electrolyte materials, TechInsights performed the basic teardown work in a storage container in the parking lot of our office, as GOOGLE PIXEL 3 XL TEARDOWN Google Pixel 3 XL Teardown. November 18, 2018 - the official launch date in the US, saw the release of the Google Pixel 3 and 3 XL, Google’s most advanced flagship smartphone to date. While we have taken a little time in getting to the teardown analysis of this phone, it is certainly not for lack of interest. We found some interesting ABOUT US | TECHINSIGHTS Your partner for revealing innovation and analyzing patent rights TechInsights is widely recognized the world’s leading provider of advanced technology analysis and intellectual property services, providing content and services to the world’s most successful technology companies. CAREERS | TECHINSIGHTS Why TechInsights? World Respected Leader TechInsights’ success is founded upon the expertise of its patent and technology analysts, their continuous spirit of research and innovation, and a focus on client satisfaction. Our engineering and consulting teams combine cutting edge reverse-engineering capabilities with a deep understanding of patents to deliver high value solutions for ourclients.
APPLE IPHONE 11 PRO MAX TEARDOWN Apple A13 Bionic. The A13 Bionic has an Apple part number APL1W85. It is a Package on Package (PoP) with both the A13 Application Processor and the Samsung K3UH5H50AM-SGCL 4GB LPDDR4X SDRAM, with the same 4GB DRAM capacity as the previous iPhone Xs Max from last year. BLOGS | TECHINSIGHTS Posted: April 24, 2016 Contributing Authors: Jim Morrison, Ray Fontaine, Dick James and Daniel Yang The following teardown blog contains some of our initial findings. BLOGS | TECHINSIGHTS Posted: October 17, 2016 Contributing Authors: Dick James One of the lesser-known stories of mobile phone evolution is the development of proximity sensing in order to save power and disable touch screen functions when the phone is actually being used as a phone. BLOGS | TECHINSIGHTS Posted: December 24, 2014 Contributing Authors: Martin Bijman On December 23, 2014, RPX purchased the remaining assets of Rockstar for$900M.
BLOGS | TECHINSIGHTS Posted: November 1, 2013 Inside On October 23, 2013, Apple announced the newest iPad, the iPad Air. Since the announcement, we at TechInsights have been anxiously waiting for the opportunity to get our hands on the device. BLOGS | TECHINSIGHTS 4-Part Blog Series: The state of the art of smartphone imagers Part 2: Pixel Scaling and Scaling Enablers Posted: July 16, 2019 Contributing Author: Ray Fontaine Content adapted from TechInsights’ paper for the International Image Sensors Workshop (IISW) 2019 Blog outline of the talk was structured BLOGS | TECHINSIGHTS Posted: February 7, 2018 Contributing Authors: Dirk Caspary, David Olaogbebikan and Martin Bijman It has been a year since Microsoft released the Azure IP Advantage program – a service that “provides the industry’s most comprehensive protection against intellectual property (IP) risks” by making 10 BLOGS | TECHINSIGHTS Posted: June 14, 2017 Contributing Authors: Jeongdong Choe, Senior Technical Fellow Samsung has begun to mass-produce their first 10 nm-class DRAM products, and we’ve taken this opportunity to analyze and compare it to the previous generations of 25 nm and 20 nm DRAMproducts.
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