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LATEST IC FORECAST: BIG DEMAND, SHORTAGES McClean: Assuming a 60% increase in spending for TSMC this year to $27.5 billion, a 37% increase for Intel to $19.5 billion and flat spending for Samsung at $28.0 billion this year, we are forecasting a total increase of 18% this year to $133.4 billion. To the best of our knowledge, Samsung has not publicly released its semiconductor capital CHIPLETS: A SOLUTION FOR THE SHORTAGE OF CHIPS Chiplets: A Solution For The Shortage Of Chips. While high-volume chips are expected to recover from recent shortages relatively quickly, small and medium-sized IC orders face a rocky path. May 13th, 2021 - By: Andy Heinig. These days, there are new reports on the shortage of chips almost every day. Currently, this issue is affectingmainly car
FROM FINFETS TO GATE-ALL-AROUND From FinFETs To Gate-All-Around. FinFETs are reaching the end of their utility as challenges mount at the 5- and 3-nm nodes, but new transistor types are on the horizon. When they were first commercialized at the 22 nm node, finFETs represented a revolutionary change to the way we build transistors, the tiny switches in the “brains” of a chip. WHAT’S AFTER CMOS? What’s After CMOS? There are more than 20 possible successors; carbon nanotubes, graphene and 3D devices are way down on the list. January 24th, 2014 - By: Mark LaPedus. Chipmakers continue to scale the CMOS transistor to finer geometries, but the question is for how much longer. The current thinking is that the CMOS transistor couldscale at
TOPS, MEMORY, THROUGHPUT AND INFERENCE EFFICIENCY Throughput/$ (or ¥ or €) is the inference efficiency for a given model, image size, batch size and allows comparison between alternatives. Little price information is available, but we can estimate cost by looking at the key factors of the cost of the chip. All inference accelerators will have 4 key components that will makeup most of the
DIGITAL TWINS IN AUTOMOTIVE The system modeling approach already is in widespread use in automotive, particularly with the goal of verifying the system behavior, but the digital twin represents a significant addition. Digital twins typically have a longer lifetime and greater efficiency compared with a classic system model since they can be re-used atmultiple points
WHAT'S AFTER PAM-4?
The future of high-speed physical signaling is uncertain. While PAM-4 remains one of the key standards today, there is widespread debate about whether PAM-8 will succeed it. This has an impact on everything from where the next bottlenecks are likely to emerge and the best approaches to solving them, to how chips, systems and packages aredesigned.
MOVING FROM ENGINEERING TO MANAGEMENT OR STAYING ON THE If the technical work is an important part of an engineer’s identity, it might be a better choice to stay on the technical side of the business. After all, management requires a different skill set and moves the engineer away from the more technical aspects of product development. Engineers don’t need to feel locked in the backroom. SEMICONDUCTOR ENGINEERING Semiconductor Engineering was created by chip architects, engineers, journalists, end users, industry organizations & standards bodies to provide deep insights into the increasingly complex task of designing, testing, verifying, integrating and manufacturing semiconductors. FLAT-PANEL DISPLAY DEMAND SOARS Demand for PCs, TVs and other products fueled renewed growth for displays. In total, the flat-panel display market reached $118 billion in 2020, up 6% over 2019, according to DSCC. That’s above the previous 2% growth forecast. The numbers include LCDs, OLEDs and other displays. Of those figures, the LCD market reached $84 billion, whileOLEDs
LATEST IC FORECAST: BIG DEMAND, SHORTAGES McClean: Assuming a 60% increase in spending for TSMC this year to $27.5 billion, a 37% increase for Intel to $19.5 billion and flat spending for Samsung at $28.0 billion this year, we are forecasting a total increase of 18% this year to $133.4 billion. To the best of our knowledge, Samsung has not publicly released its semiconductor capital CHIPLETS: A SOLUTION FOR THE SHORTAGE OF CHIPS Chiplets: A Solution For The Shortage Of Chips. While high-volume chips are expected to recover from recent shortages relatively quickly, small and medium-sized IC orders face a rocky path. May 13th, 2021 - By: Andy Heinig. These days, there are new reports on the shortage of chips almost every day. Currently, this issue is affectingmainly car
FROM FINFETS TO GATE-ALL-AROUND From FinFETs To Gate-All-Around. FinFETs are reaching the end of their utility as challenges mount at the 5- and 3-nm nodes, but new transistor types are on the horizon. When they were first commercialized at the 22 nm node, finFETs represented a revolutionary change to the way we build transistors, the tiny switches in the “brains” of a chip. WHAT’S AFTER CMOS? What’s After CMOS? There are more than 20 possible successors; carbon nanotubes, graphene and 3D devices are way down on the list. January 24th, 2014 - By: Mark LaPedus. Chipmakers continue to scale the CMOS transistor to finer geometries, but the question is for how much longer. The current thinking is that the CMOS transistor couldscale at
TOPS, MEMORY, THROUGHPUT AND INFERENCE EFFICIENCY Throughput/$ (or ¥ or €) is the inference efficiency for a given model, image size, batch size and allows comparison between alternatives. Little price information is available, but we can estimate cost by looking at the key factors of the cost of the chip. All inference accelerators will have 4 key components that will makeup most of the
DIGITAL TWINS IN AUTOMOTIVE The system modeling approach already is in widespread use in automotive, particularly with the goal of verifying the system behavior, but the digital twin represents a significant addition. Digital twins typically have a longer lifetime and greater efficiency compared with a classic system model since they can be re-used atmultiple points
WHAT'S AFTER PAM-4?
The future of high-speed physical signaling is uncertain. While PAM-4 remains one of the key standards today, there is widespread debate about whether PAM-8 will succeed it. This has an impact on everything from where the next bottlenecks are likely to emerge and the best approaches to solving them, to how chips, systems and packages aredesigned.
MOVING FROM ENGINEERING TO MANAGEMENT OR STAYING ON THE If the technical work is an important part of an engineer’s identity, it might be a better choice to stay on the technical side of the business. After all, management requires a different skill set and moves the engineer away from the more technical aspects of product development. Engineers don’t need to feel locked in the backroom. SEMICONDUCTOR CAPEX TO GROW 13.0% IN 2021 Semiconductor CapEx To Grow 13.0% In 2021. Total market to reach $127B this year; Samsung, TSMC are top spenders. Semiconductor capital expenditures grew 9.2% in 2020 to US$112.1 billion. This is $14.1 billion higher than our spring 2020 forecast, and $3.2 billion higher than our fall 2020 forecast. As shown in the graph below, the total2020
WHAT'S AFTER 5G
What’s After 5G. The path to 6G will require some radical changes to both infrastructure and use models. This year’s IEEE Symposia on VLSI Technology and Circuits (VLSI 2020) included a presentation by NTT Docomo that looked far into the future of cellular communications, setting the stage for a broad industry shift in communication. This HOW DO MACHINES LEARN? Conclusion. As a summary, machines learn by being trained with high-quality labeled data that embody a good representation of the target classes. Subsequently, what determines the accessibility of a machine learning system is how to make it easy to organize data (defect images, for example), to pre-process them, to label them, topresent them
PRIMARY, ANONYMOUS, OR WHAT? Top level primary I/Os remain mysterious in the verification world, specifically when you consider UPF-based low power designs. In real silicon, they are usually driven by off-chip supplies; however, verification complications are multifold for RTL and gate level simulations of them. This paper WHERE IMPERFECTIONS LEAD TO OPPORTUNITY Evelyn Hu Evelyn Hu is an IEEE Life Fellow and fellow of the American Academy of Arts and Sciences. She is the Tarr-Coyne Professor of Applied Physics and Electrical Engineering at the John A. Paulson School of Engineering and Applied Sciences at Harvard University, and was awarded the 2021 IEEE/RSE James Clerk Maxwell Medal for leadership in nanoscale science and engineering, and forBLOG REVIEW: JUN 9
7 hours ago · Arm’s Partha Maji introduces a collaboration with the University of Cambridge to advance Bayesian statistics and probabilistic machine learning, which could play a vital role in safety-critical AI applications. Siemens’ Thomas Dewey looks at a way to improve autonomous driving capabilities by THE DARKER SIDE OF HYBRID BONDING The Darker Side Of Hybrid Bonding. The approach offers huge performance gains, but pitfalls remain. December 17th, 2020 - By: Katherine Derbyshire. With semiconductors, it’s often things everyone takes for granted that cause the biggest headaches, and that problem is compounded when something fundamental changes — such asbonding two chips
EDA IN THE CLOUD
Hagai Arbel, CEO of Vtool, talks with Semiconductor Engineering about the benefits of moving EDA tools to the cloud, why it has been slow to take off, and what will drive this trend in the future. KOJI MIYAUCHI, AUTHOR AT SEMICONDUCTOR ENGINEERING In recent years, the proliferation of the IoT has focused attention on low-power-wireless applications. IoT modules incorporating functions such as Bluetooth Low Energy (BLE) transceivers, MCUs, and power-management circuitry are becoming system-in VIRTUAL TEST ENVIRONMENT ARCHIVES SEMICONDUCTOR ENGINEERING Servers today feature one or two x86 chips, or maybe an Arm processor. In 5 or 10 years they will feature many more. SEMICONDUCTOR ENGINEERING Semiconductor Engineering was created by chip architects, engineers, journalists, end users, industry organizations & standards bodies to provide deep insights into the increasingly complex task of designing, testing, verifying, integrating and manufacturing semiconductors. HOW DO MACHINES LEARN? Weiyang (Will) Zhou Weiyang "Will" Zhou is a senior staff systems engineer in Onto Innovation’s enterprise software division. His career has centered around algorithm and software development for signal/image processing, pattern recognition and machine learning inWHAT'S AFTER 5G
Fig. 2: 5G will use frequencies higher than what are used for prior generations. In the case of mmWave frequencies (28 GHz and up), they will be far higher, offering more bandwidth but bringing new implementation challenges.ADVANCED PACKAGING
Advanced packaging is a general grouping of a variety of distinct techniques, including 2.5D, 3D-IC, fan-out wafer-level packaging and system-in-package. While putting multiple chips in a package has been around for decades, the driver for advanced packaging is directly correlated with Moore’s Law. Wires are shrinking along with transistors, and the amount of distance that » read more SIC FOUNDRY BUSINESS EMERGES Fig. 1: Power SiC device forecast Source: Yole Développement. SiC is also competitive. Nearly two-dozen SiC device suppliers compete in thebusiness.
SIC CHIP DEMAND SURGES SiC Chip Demand Surges, Electric vehicles drive up market for silicon carbide power semiconductors, but cost remains an issue. TOPS, MEMORY, THROUGHPUT AND INFERENCE EFFICIENCY Notice that TOPS and throughput have a loose correlation but some chips deliver more throughput from fewer TOPS than others. This is because architecture, SRAM size and number of DRAM are also very important in determining throughput. DIGITAL TWINS IN AUTOMOTIVE The term “digital twin” refers to a new principle that is gaining importance in the development of complex hardware/software systems. In general, it refers toTEST COSTS SPIKING
The cost of test is rising as a percentage of manufacturing costs, fueled by concerns about reliability of advanced-node designs in cars and data centers, as well as extended lifetimes for chips in those andother markets.
ELECTION SECURITY AT THE CHIP LEVEL The goal of the program is to develop ideas and design tools that will enable system-on-chip (SoC) designers to safeguard hardware against all known classes of hardware vulnerabilities that can be exploitedthrough software.
SEMICONDUCTOR ENGINEERING Semiconductor Engineering was created by chip architects, engineers, journalists, end users, industry organizations & standards bodies to provide deep insights into the increasingly complex task of designing, testing, verifying, integrating and manufacturing semiconductors.WHAT'S AFTER 5G
What’s After 5G. The path to 6G will require some radical changes to both infrastructure and use models. This year’s IEEE Symposia on VLSI Technology and Circuits (VLSI 2020) included a presentation by NTT Docomo that looked far into the future of cellular communications, setting the stage for a broad industry shift in communication. This HOW DO MACHINES LEARN? Conclusion. As a summary, machines learn by being trained with high-quality labeled data that embody a good representation of the target classes. Subsequently, what determines the accessibility of a machine learning system is how to make it easy to organize data (defect images, for example), to pre-process them, to label them, topresent them
ADVANCED PACKAGING
Advanced packaging is a general grouping of a variety of distinct techniques, including 2.5D, 3D-IC, fan-out wafer-level packaging and system-in-package. While putting multiple chips in a package has been around for decades, the driver for advanced packaging is directly correlated with Moore’s Law. Wires are shrinking along with transistors, and the amount of distance that » read more SIC FOUNDRY BUSINESS EMERGES In total, the SiC device business grew from $420 million in 2018 to $564 million in 2019, according to Yole. The big growth driver is battery-electric cars. Power supplies and solar are also strong markets. “In our forecast, there is still growth in 2020,”Yole’s Lin said.
TOPS, MEMORY, THROUGHPUT AND INFERENCE EFFICIENCY Throughput/$ (or ¥ or €) is the inference efficiency for a given model, image size, batch size and allows comparison between alternatives. Little price information is available, but we can estimate cost by looking at the key factors of the cost of the chip. All inference accelerators will have 4 key components that will makeup most of the
TEST COSTS SPIKING
March 10th, 2020 - By: Ed Sperling. The cost of test is rising as a percentage of manufacturing costs, fueled by concerns about reliability of advanced-node designs in cars and data centers, as well as extended lifetimes for chips in those and other markets. For decades, test was limited to a flat 2% of total manufacturing cost, aformula
SIC CHIP DEMAND SURGES SiC Chip Demand Surges. Electric vehicles drive up market for silicon carbide power semiconductors, but cost remains an issue. The silicon carbide (SiC) power semiconductor market is experiencing a sudden surge in demand amid growth for electric vehicles and other systems. But the demand also is causing a tight supply of SiC-based devices in DIGITAL TWINS IN AUTOMOTIVE The system modeling approach already is in widespread use in automotive, particularly with the goal of verifying the system behavior, but the digital twin represents a significant addition. Digital twins typically have a longer lifetime and greater efficiency compared with a classic system model since they can be re-used atmultiple points
ELECTION SECURITY AT THE CHIP LEVEL Election Security At The Chip Level. RISC-V-based solution under development, but the very nature of a voting system raises issues. January 2nd, 2020 - By: Andy Patrizio. Technological advances have changed every facet of our lives, from reading to driving to cooking, but one task remains firmly rooted in 20th-century technology —voting.
NEWS ARCHIVES SEMICONDUCTOR ENGINEERING Packaging and test TrendForce has released its ranking of the top OSATs in terms of sales in the first quarter of 2021. ASE remains in the top spot, followed in order by Amkor, JCET, SPIL and PTI. “Industry leaders ASE and Amkor posted revenues of $1.69 billion and $1.33 billion, which are YoY increases of 24.6% and 15.0%,respectively, in
MANUFACTURING BITS: JUNE 7 23 hours ago · The University of Warwick and Cambridge Microelectronics have presented a paper on the latest effort to develop of a new type silicon carbide (SiC) power device called a SiC superjunction Schottky diode. Researchers have simulated and optimized the development of 4H-SiC superjunction Schottky diodes UNDERSTANDING MEMORY In terms of function, there are two broad classes of memory: primary (main memory, or memory), which is the active type that works on data, and secondary (data storage), which provides long-term storage. For memory, speed is critical because it holds the SEMICONDUCTORS IN AUTOMOTIVE By the end of 2017, automotive is expected to account for about 9% of worldwide semiconductor revenue. The segment’s need for many types of semiconductors – including processors, analog ICs, sensors, and memory – and its diverse applications make it as interesting as it is challenging for the chipmakers who supply it. Ongoing development. HOW MUCH WILL THAT CHIP COST? Koeter said at mainstream nodes—40nm to 65nm—the price of a new chip is roughly $40m to $50 if it’s from scratch. But yield is high at those nodes, and the software development cost is lower because those chips are not at the leading edge of functionality. “The design may not push the gigahertz range, but that doesn’t meanit’s not
EXTREME QUALITY SEMICONDUCTOR MANUFACTURING Extreme quality semiconductor manufacturing innovations are essential to achieving variability and defectivity control, so that fabs can produce chips that meet strict reliability and performance standards. This article focuses on the scaling, architecture and processing technologies for next-generation ICs that require more stringentquality
CLOUD INFRASTRUCTURE ARCHIVES SEMICONDUCTOR ENGINEERING Lip-Bu Tan, CEO of Cadence, sat down with Semiconductor Engineering to talk about the impact of massive increases in data across a variety of industries, the growing need for computational software, and the potential implications of U.S.-China relations. TAIWAN INTERNATIONAL SEMICONDUCTOR EXECUTIVE SUMMIT This website uses cookies to improve your experience while you navigate through the website. The cookies that are categorized as necessary are stored on your browser as they are essential for the working of basic functionalities of the website. CATAPULT VENTURES ARCHIVES SEMICONDUCTOR ENGINEERING Big investment poured into AI hardware companies this month, with a focus on edge applications. Companies are experimenting with different architectures, including analog-focused devices and those that are capable of withstanding the harsh conditions of CAMBRIDGE MICROELECTRONICS ARCHIVES SEMICONDUCTOR ENGINEERING High-voltage superjunction SiC devices The University of Warwick and Cambridge Microelectronics have presented a paper on the latest effort to develop of a new type silicon carbide (SiC) power device called a SiC superjunction Schottky diode. SEMICONDUCTOR ENGINEERING Semiconductor Engineering was created by chip architects, engineers, journalists, end users, industry organizations & standards bodies to provide deep insights into the increasingly complex task of designing, testing, verifying, integrating and manufacturing semiconductors. HOW DO MACHINES LEARN? Weiyang (Will) Zhou Weiyang "Will" Zhou is a senior staff systems engineer in Onto Innovation’s enterprise software division. His career has centered around algorithm and software development for signal/image processing, pattern recognition and machine learning inWHAT'S AFTER 5G
Fig. 2: 5G will use frequencies higher than what are used for prior generations. In the case of mmWave frequencies (28 GHz and up), they will be far higher, offering more bandwidth but bringing new implementation challenges.ADVANCED PACKAGING
Advanced packaging is a general grouping of a variety of distinct techniques, including 2.5D, 3D-IC, fan-out wafer-level packaging and system-in-package. While putting multiple chips in a package has been around for decades, the driver for advanced packaging is directly correlated with Moore’s Law. Wires are shrinking along with transistors, and the amount of distance that » read more SIC FOUNDRY BUSINESS EMERGES Fig. 1: Power SiC device forecast Source: Yole Développement. SiC is also competitive. Nearly two-dozen SiC device suppliers compete in thebusiness.
SIC CHIP DEMAND SURGES SiC Chip Demand Surges, Electric vehicles drive up market for silicon carbide power semiconductors, but cost remains an issue. TOPS, MEMORY, THROUGHPUT AND INFERENCE EFFICIENCY Notice that TOPS and throughput have a loose correlation but some chips deliver more throughput from fewer TOPS than others. This is because architecture, SRAM size and number of DRAM are also very important in determining throughput. DIGITAL TWINS IN AUTOMOTIVE The term “digital twin” refers to a new principle that is gaining importance in the development of complex hardware/software systems. In general, it refers toTEST COSTS SPIKING
The cost of test is rising as a percentage of manufacturing costs, fueled by concerns about reliability of advanced-node designs in cars and data centers, as well as extended lifetimes for chips in those andother markets.
ELECTION SECURITY AT THE CHIP LEVEL The goal of the program is to develop ideas and design tools that will enable system-on-chip (SoC) designers to safeguard hardware against all known classes of hardware vulnerabilities that can be exploitedthrough software.
SEMICONDUCTOR ENGINEERING Semiconductor Engineering was created by chip architects, engineers, journalists, end users, industry organizations & standards bodies to provide deep insights into the increasingly complex task of designing, testing, verifying, integrating and manufacturing semiconductors. HOW DO MACHINES LEARN? Weiyang (Will) Zhou Weiyang "Will" Zhou is a senior staff systems engineer in Onto Innovation’s enterprise software division. His career has centered around algorithm and software development for signal/image processing, pattern recognition and machine learning inWHAT'S AFTER 5G
Fig. 2: 5G will use frequencies higher than what are used for prior generations. In the case of mmWave frequencies (28 GHz and up), they will be far higher, offering more bandwidth but bringing new implementation challenges.ADVANCED PACKAGING
Advanced packaging is a general grouping of a variety of distinct techniques, including 2.5D, 3D-IC, fan-out wafer-level packaging and system-in-package. While putting multiple chips in a package has been around for decades, the driver for advanced packaging is directly correlated with Moore’s Law. Wires are shrinking along with transistors, and the amount of distance that » read more SIC FOUNDRY BUSINESS EMERGES Fig. 1: Power SiC device forecast Source: Yole Développement. SiC is also competitive. Nearly two-dozen SiC device suppliers compete in thebusiness.
SIC CHIP DEMAND SURGES SiC Chip Demand Surges, Electric vehicles drive up market for silicon carbide power semiconductors, but cost remains an issue. TOPS, MEMORY, THROUGHPUT AND INFERENCE EFFICIENCY Notice that TOPS and throughput have a loose correlation but some chips deliver more throughput from fewer TOPS than others. This is because architecture, SRAM size and number of DRAM are also very important in determining throughput. DIGITAL TWINS IN AUTOMOTIVE The term “digital twin” refers to a new principle that is gaining importance in the development of complex hardware/software systems. In general, it refers toTEST COSTS SPIKING
The cost of test is rising as a percentage of manufacturing costs, fueled by concerns about reliability of advanced-node designs in cars and data centers, as well as extended lifetimes for chips in those andother markets.
ELECTION SECURITY AT THE CHIP LEVEL The goal of the program is to develop ideas and design tools that will enable system-on-chip (SoC) designers to safeguard hardware against all known classes of hardware vulnerabilities that can be exploitedthrough software.
NEWS ARCHIVES SEMICONDUCTOR ENGINEERING Synopsys' Mike Borza checks out how automotive ECUs, infotainment systems, and in-vehicle networks can be compromised by attackers and why it’s important to follow cybersecurity best practices and keep security in mind starting early in the design cycle. MANUFACTURING BITS: JUNE 7 20 hours ago · The University of Warwick and Cambridge Microelectronics have presented a paper on the latest effort to develop of a new type silicon carbide (SiC) power device called a SiC superjunction Schottky diode. Researchers have simulated and optimized the development of 4H-SiC superjunction Schottky diodes SEMICONDUCTORS IN AUTOMOTIVE It was more than 130 years ago in 1885 when Gottlieb Daimler invented the first prototype for the modern gas engine, and in 1886 Karl Benz patented his three-wheel Benz Motor Car, Model No. 1. UNDERSTANDING MEMORY Flash Memory Flash memory is a type of non-volatile memory (data is retained after the power is turned off) used for data storage. The two types, NOR and NAND, get their names from the type of logic gate usedin the cell.
TAIWAN INTERNATIONAL SEMICONDUCTOR EXECUTIVE SUMMIT This website uses cookies to improve your experience while you navigate through the website. The cookies that are categorized as necessary are stored on your browser as they are essential for the working of basic functionalities of the website. WHAT’S AFTER CMOS? What’s after CMOS? That link provides a nice, timely summary of the increasingly not-straightforward world of transistor scaling. The first point I make, or at least agree with, is that you need to apply rigorous benchmarks when looking at all of these potential transistortechnologies.
CLOUD INFRASTRUCTURE ARCHIVES SEMICONDUCTOR ENGINEERING Lip-Bu Tan, CEO of Cadence, sat down with Semiconductor Engineering to talk about the impact of massive increases in data across a variety of industries, the growing need for computational software, and the potential implications of U.S.-China relations. CAMBRIDGE MICROELECTRONICS ARCHIVES SEMICONDUCTOR ENGINEERING High-voltage superjunction SiC devices The University of Warwick and Cambridge Microelectronics have presented a paper on the latest effort to develop of a new type silicon carbide (SiC) power device called a SiC superjunction Schottky diode. HOW MUCH WILL THAT CHIP COST? How Much Will That Chip Cost? From the leading edge of design to older process nodes, development costs are being contained much better than the initial reports would indicate - but not always for the obviousreasons.
ANNE MEIXNER, AUTHOR AT SEMICONDUCTOR ENGINEERING Anne Meixner Anne Meixner is a contributing editor at Semiconductor Engineering. She has 30+ years in the semiconductor industry. She became fascinated by defects in the semiconductor manufacturing process as a young engineer at IBM.Submit__
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SPECIAL REPORTS
New Security Risks Create Need For Stealthy ChipsBy: Ed Sperling
Thinner dies and insulation layers add vulnerabilities for better hacker tools. Solutio... Solving The Memory BottleneckBy: Brian Bailey
Moving large amounts of data around a system is no longer the path to success. It is to... The Race To Next-Gen 2.5D/3D PackagesBy: Mark LaPedus
New approaches aim to drive down cost, boost benefits of heterogeneousintegration.
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TOP STORIES
WHY EV BATTERY DESIGN IS SO DIFFICULT Classic automotive design in a silo no longer works for cars that operate as electronic... October 3rd, 2019 By ANN STEFFORA MUTSCHLER ML, EDGE DRIVE IP TO OUTPERFORM BROADER CHIP MARKET New applications, architectures and customer base provide continuous stream of opportun... October 3rd, 2019 By KEVIN FOGARTY OVER $7 BILLION RAISED IN MEGA-ROUNDS BY 27 FIRMS September was spectacular for startups, as 27 tech companies raised $100 million or mor... October 2nd, 2019 By JEFF DORSCH SECURITY TRADEOFFS IN A SHIFTING GLOBAL SUPPLY CHAIN How many simulation cycles are needed to crack an AES key? Plus, the impact of trade wa... September 30th, 2019 By ED SPERLING OPEN ISAS GAINING TRACTION Emphasis on flexibility, time to market and heterogeneity requires more processing opti... September 26th, 2019 By ANN STEFFORA MUTSCHLER THE GROWING IMPACT OF PORTABLE STIMULUS Experts at the Table: How the Portable Test and Stimulus Standard has affected the indu... September 26th, 2019 By BRIAN BAILEY WHY DATA IS SO DIFFICULT TO PROTECT IN AI CHIPS AI systems are designed to move data through at high speed, not limit access. That crea... September 25th, 2019 By ED SPERLING CHALLENGES GROW FOR FINDING CHIP DEFECTS Costs are rising, and so is the time it takes to inspect a wafer. September 19th, 2019 By MARK LAPEDUS MAGNETIC MEMORIES REACH FOR CENTER STAGE Why MRAM technology works best for connected devices. September 19th, 2019 By KATHERINE DERBYSHIRE USING MACHINE LEARNING IN FABS ML will augment existing manufacturing processes, but it won'treplace them.
September 19th, 2019 By MARK LAPEDUS WHY DRAM WON’T GO AWAY New materials, new architectures and higher density have limited what can be done with ... September 18th, 2019 By ED SPERLING EDA REVENUE UP 6.6% FOR Q2 AI, automotive and design activity by systems companies continue to drive EDA industry ... September 17th, 2019 By ANN STEFFORA MUTSCHLERmore top stories »
LATEST NEWS
WEEK IN REVIEW: MANUFACTURING, TEST Fan-out deal; 5G test; Huawei’s chip vendors. October 4th, 2019 By MARK LAPEDUS WEEK IN REVIEW: DESIGN, LOW POWER Signoff closure; PCB design reviews; Xilinx tool; embedded vis... October 4th, 2019 By JESSE ALLEN WEEK IN REVIEW – IOT, SECURITY,... Cadence teams with Adesto on IoT; Synopsys PrimeECO; UPS drone... October 4th, 2019 By JEFF DORSCHBLOG REVIEW: OCT. 2
Finite element analysis; false claims; HPC utilization. October 2nd, 2019 By JESSE ALLENmore news »
RESEARCH
MANUFACTURING BITS: OCT. 1 3D balloon printing; printed turbines; CAD tools.By MARK LAPEDUS
POWER/PERFORMANCE BITS: OCT. 1 Nighttime energy generation; smart pajamas; organic solar cell...By JESSE ALLEN
SYSTEM BITS: OCT. 1
Faster electronics; quantum internet; sustainable batteries.By JEFF DORSCH
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STARTUP CORNER
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STOCK MARKET NEWS
NAME
SYMBOL
PRICE
CHANGE
% CHANGE
Advanced Micro Devices, Inc.AMD
$ 29.01
__ 0.33
__ 1.15%
ANSYS, Inc.
ANSS
$ 224.63
__ 4.39
__ 1.99%
Applied Materials, Inc.AMAT
$ 50.88
__ 1.24
__ 2.50%
ASE Technology Holding Co., Ltd.ASX
$ 4.70
__ 0.06
__ 1.29%
ASML Holding N.V.
ASML
$ 246.04
__ 1.69
__ 0.69%
Cadence Design Systems, Inc.CDNS
$ 65.91
__ 0.81
__ 1.24%
Intel Corporation
INTC
$ 50.92
__ 0.89
__ 1.78%
KLA Corporation
KLAC
$ 161.11
__ 4.15
__ 2.64%
Lam Research CorporationLRCX
$ 233.27
__ 4.22
__ 1.84%
National Instruments CorporationNATI
$ 40.53
__ 0.38
__ 0.95%
Rambus Inc.
RMBS
$ 13.06
__ 0.15
__ 1.16%
Synopsys, Inc.
SNPS
$ 138.78
__ 2.75
__ 2.02%
Taiwan Semiconductor Manufacturing Company LimitedTSM
$ 47.42
__ 0.29
__ 0.62%
United Microelectronics CorporationUMC
$ 2.13
__ 0.03
__ 1.43%
Veeco Instruments Inc.VECO
$ 11.49
__ 0.32
__ 2.86%
Source: Premium Stock Market Widgets DISCLAIMER:_Semiconductor Engineering/Sperling Media Group LLC expressly disclaims the adequacy, accuracy, or completeness of any data and shall not be liable for any errors, omissions or other faults in, delays or interruptions in such data, or for any actions taken inreliance thereon._
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