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providing Wafer
ABOUT – LINTEC OF AMERICA, INC Lintec is an industry leader in Wafer Mounting Systems and UV Irradiation Systems. LINTEC OF AMERICA was originally established in Tempe, AZ in April 1996 to handle all semiconductor related product sales in North and South America. Lintec now has two US divisions in both Phoenix, AZ and Dallas, TX. NEWS – LINTEC OF AMERICA, INC Tips to managing stock levels with Lintec of America’s customer service team. Hi there! My name is Mary, and I am a customer service representative at Lintec of America in Phoenix, Arizona. . CONTACT – LINTEC OF AMERICA, INC LINTEC OF AMERICA, INC. Advanced Technologies Division 15930 S. 48th Street, Suite 110 Phoenix, AZ 85048, USA. Tel: 1 480-966-0784 Fax: 1480-966-5321
LINTEC USA BROCHURES Our Team of Experts at Lintec of America would love to hear from you! Please give us a call to discuss your project details or fill out the contact us form and a member of the Lintec Team can get in touch assoon as possible.
THIN WAFER TOUGH CHIP SOLUTIONS 200mm, 300mm 200mm, 300mm 200mm, 300mm BGRAD-2010 Tape RAD-3520F/12 RAD-3500m/12 Wafer Fully-Automatic BG Tape BG Tape Laminator LINTEC-developed peeling mechanism removes BG tape from ultra-thin wafer without damaging the wafer Thin Wafer & 25 µm, 40 µm * * * * * * • • Advanced Technologies DivisionLINTEC
Company Motto The foundation of the Lintec Group’s CSR is its company motto, “Sincerity and Creativity.” These are the ideals that everyone in the group aspires to.ADWILL RAD-3000F/8
Adwill RAD-3000F/8. RAD-3000F/8. 200 mm (8-inch) fully automatic back grinding removal system. 1. Fully automatic BG tape remover based on the latest technology. 2. Newly developed peeling mechanism (patent pending) enables to securely hold the surface protection tape and to peel it without any damage onto the thin wafer after back-grinding. 3. WEBARC20 – LINTEC OF AMERICA, INC Our Team of Experts at Lintec of America would love to hear from you! Please give us a call to discuss your project details or fill out the contact us form and a member of the Lintec Team can get in touch assoon as possible.
MATTEO CIRAMI
Hi there! My name is Mary, and I am a customer service representative at Lintec of America in Phoenix, Arizona. Tips to managing stock levels with Lintec of America’s customer service team. LINTEC OF AMERICA, INC LINTEC's semiconductor manufacturing related products include a wide array of lines. Our Adwill product consists of high-functioning adhesive tapes such as Non UV and UV dicing tape, wafer surface protective tape for BG process, backside laminate tape and die attach specialty films. Additionally, LINTEC is the industry leader inproviding Wafer
ABOUT – LINTEC OF AMERICA, INC Lintec is an industry leader in Wafer Mounting Systems and UV Irradiation Systems. LINTEC OF AMERICA was originally established in Tempe, AZ in April 1996 to handle all semiconductor related product sales in North and South America. Lintec now has two US divisions in both Phoenix, AZ and Dallas, TX. NEWS – LINTEC OF AMERICA, INC Tips to managing stock levels with Lintec of America’s customer service team. Hi there! My name is Mary, and I am a customer service representative at Lintec of America in Phoenix, Arizona. . CONTACT – LINTEC OF AMERICA, INC LINTEC OF AMERICA, INC. Advanced Technologies Division 15930 S. 48th Street, Suite 110 Phoenix, AZ 85048, USA. Tel: 1 480-966-0784 Fax: 1480-966-5321
LINTEC USA BROCHURES Our Team of Experts at Lintec of America would love to hear from you! Please give us a call to discuss your project details or fill out the contact us form and a member of the Lintec Team can get in touch assoon as possible.
THIN WAFER TOUGH CHIP SOLUTIONS 200mm, 300mm 200mm, 300mm 200mm, 300mm BGRAD-2010 Tape RAD-3520F/12 RAD-3500m/12 Wafer Fully-Automatic BG Tape BG Tape Laminator LINTEC-developed peeling mechanism removes BG tape from ultra-thin wafer without damaging the wafer Thin Wafer & 25 µm, 40 µm * * * * * * • • Advanced Technologies DivisionLINTEC
Company Motto The foundation of the Lintec Group’s CSR is its company motto, “Sincerity and Creativity.” These are the ideals that everyone in the group aspires to.ADWILL RAD-3000F/8
Adwill RAD-3000F/8. RAD-3000F/8. 200 mm (8-inch) fully automatic back grinding removal system. 1. Fully automatic BG tape remover based on the latest technology. 2. Newly developed peeling mechanism (patent pending) enables to securely hold the surface protection tape and to peel it without any damage onto the thin wafer after back-grinding. 3. WEBARC20 – LINTEC OF AMERICA, INC Our Team of Experts at Lintec of America would love to hear from you! Please give us a call to discuss your project details or fill out the contact us form and a member of the Lintec Team can get in touch assoon as possible.
MATTEO CIRAMI
Hi there! My name is Mary, and I am a customer service representative at Lintec of America in Phoenix, Arizona. Tips to managing stock levels with Lintec of America’s customer service team.LINTEC OF AMERICA
LINTEC carries a wide variety of tapes for backgrinding and dicing processes. The tape selector will determine the best tape candidate for your application based on the information you provide. TIPS TO MANAGING STOCK LEVELS WITH LINTEC OF AMERICA’S Our Team of Experts at Lintec of America would love to hear from you! Please give us a call to discuss your project details or fill out the contact us form and a member of the Lintec Team can get in touch assoon as possible.
リンテック株式会社 当社は粘着製品や特殊紙の分野におけるリーディングカンパニー として、社是「至誠と創造」の下、お客様第一の精神と LINTEC OF AMERICA, INC LINTEC's semiconductor manufacturing related products include a wide array of lines. Our Adwill product consists of high-functioning adhesive tapes such as Non UV and UV dicing tape, wafer surface protective tape for BG process, backside laminate tape and die attach specialty films. Additionally, LINTEC is the industry leader inproviding Wafer
ABOUT – LINTEC OF AMERICA, INC Lintec is an industry leader in Wafer Mounting Systems and UV Irradiation Systems. LINTEC OF AMERICA was originally established in Tempe, AZ in April 1996 to handle all semiconductor related product sales in North and South America. Lintec now has two US divisions in both Phoenix, AZ and Dallas, TX. NEWS – LINTEC OF AMERICA, INC Tips to managing stock levels with Lintec of America’s customer service team. Hi there! My name is Mary, and I am a customer service representative at Lintec of America in Phoenix, Arizona. . CONTACT – LINTEC OF AMERICA, INC LINTEC OF AMERICA, INC. Advanced Technologies Division 15930 S. 48th Street, Suite 110 Phoenix, AZ 85048, USA. Tel: 1 480-966-0784 Fax: 1480-966-5321
LINTEC USA BROCHURES Our Team of Experts at Lintec of America would love to hear from you! Please give us a call to discuss your project details or fill out the contact us form and a member of the Lintec Team can get in touch assoon as possible.
LINTEC OF AMERICA
LINTEC carries a wide variety of tapes for backgrinding and dicing processes. The tape selector will determine the best tape candidate for your application based on the information you provide. THIN WAFER TOUGH CHIP SOLUTIONS 200mm, 300mm 200mm, 300mm 200mm, 300mm BGRAD-2010 Tape RAD-3520F/12 RAD-3500m/12 Wafer Fully-Automatic BG Tape BG Tape Laminator LINTEC-developed peeling mechanism removes BG tape from ultra-thin wafer without damaging the wafer Thin Wafer & 25 µm, 40 µm * * * * * * • • Advanced Technologies DivisionLINTEC
Company Motto The foundation of the Lintec Group’s CSR is its company motto, “Sincerity and Creativity.” These are the ideals that everyone in the group aspires to.ADWILL RAD-3000F/8
Adwill RAD-3000F/8. RAD-3000F/8. 200 mm (8-inch) fully automatic back grinding removal system. 1. Fully automatic BG tape remover based on the latest technology. 2. Newly developed peeling mechanism (patent pending) enables to securely hold the surface protection tape and to peel it without any damage onto the thin wafer after back-grinding. 3. WEBARC20 – LINTEC OF AMERICA, INC Our Team of Experts at Lintec of America would love to hear from you! Please give us a call to discuss your project details or fill out the contact us form and a member of the Lintec Team can get in touch assoon as possible.
LINTEC OF AMERICA, INC LINTEC's semiconductor manufacturing related products include a wide array of lines. Our Adwill product consists of high-functioning adhesive tapes such as Non UV and UV dicing tape, wafer surface protective tape for BG process, backside laminate tape and die attach specialty films. Additionally, LINTEC is the industry leader inproviding Wafer
ABOUT – LINTEC OF AMERICA, INC Lintec is an industry leader in Wafer Mounting Systems and UV Irradiation Systems. LINTEC OF AMERICA was originally established in Tempe, AZ in April 1996 to handle all semiconductor related product sales in North and South America. Lintec now has two US divisions in both Phoenix, AZ and Dallas, TX. NEWS – LINTEC OF AMERICA, INC Tips to managing stock levels with Lintec of America’s customer service team. Hi there! My name is Mary, and I am a customer service representative at Lintec of America in Phoenix, Arizona. . CONTACT – LINTEC OF AMERICA, INC LINTEC OF AMERICA, INC. Advanced Technologies Division 15930 S. 48th Street, Suite 110 Phoenix, AZ 85048, USA. Tel: 1 480-966-0784 Fax: 1480-966-5321
LINTEC USA BROCHURES Our Team of Experts at Lintec of America would love to hear from you! Please give us a call to discuss your project details or fill out the contact us form and a member of the Lintec Team can get in touch assoon as possible.
LINTEC OF AMERICA
LINTEC carries a wide variety of tapes for backgrinding and dicing processes. The tape selector will determine the best tape candidate for your application based on the information you provide. THIN WAFER TOUGH CHIP SOLUTIONS 200mm, 300mm 200mm, 300mm 200mm, 300mm BGRAD-2010 Tape RAD-3520F/12 RAD-3500m/12 Wafer Fully-Automatic BG Tape BG Tape Laminator LINTEC-developed peeling mechanism removes BG tape from ultra-thin wafer without damaging the wafer Thin Wafer & 25 µm, 40 µm * * * * * * • • Advanced Technologies DivisionLINTEC
Company Motto The foundation of the Lintec Group’s CSR is its company motto, “Sincerity and Creativity.” These are the ideals that everyone in the group aspires to.ADWILL RAD-3000F/8
Adwill RAD-3000F/8. RAD-3000F/8. 200 mm (8-inch) fully automatic back grinding removal system. 1. Fully automatic BG tape remover based on the latest technology. 2. Newly developed peeling mechanism (patent pending) enables to securely hold the surface protection tape and to peel it without any damage onto the thin wafer after back-grinding. 3. WEBARC20 – LINTEC OF AMERICA, INC Our Team of Experts at Lintec of America would love to hear from you! Please give us a call to discuss your project details or fill out the contact us form and a member of the Lintec Team can get in touch assoon as possible.
LINTEC OF AMERICA
LINTEC carries a wide variety of tapes for backgrinding and dicing processes. The tape selector will determine the best tape candidate for your application based on the information you provide. TIPS TO MANAGING STOCK LEVELS WITH LINTEC OF AMERICA’S Our Team of Experts at Lintec of America would love to hear from you! Please give us a call to discuss your project details or fill out the contact us form and a member of the Lintec Team can get in touch assoon as possible.
リンテック株式会社 当社は粘着製品や特殊紙の分野におけるリーディングカンパニー として、社是「至誠と創造」の下、お客様第一の精神とMATTEO CIRAMI
Hi there! My name is Mary, and I am a customer service representative at Lintec of America in Phoenix, Arizona. Tips to managing stock levels with Lintec of America’s customer service team. ABOUT – LINTEC OF AMERICA, INC Lintec is an industry leader in Wafer Mounting Systems and UV Irradiation Systems. LINTEC OF AMERICA was originally established in Tempe, AZ in April 1996 to handle all semiconductor related product sales in North and South America. Lintec now has two US divisions in both Phoenix, AZ and Dallas, TX. NEWS – LINTEC OF AMERICA, INC Tips to managing stock levels with Lintec of America’s customer service team. Hi there! My name is Mary, and I am a customer service representative at Lintec of America in Phoenix, Arizona. . CONTACT – LINTEC OF AMERICA, INC LINTEC OF AMERICA, INC. Advanced Technologies Division 15930 S. 48th Street, Suite 110 Phoenix, AZ 85048, USA. Tel: 1 480-966-0784 Fax: 1480-966-5321
LINTEC USA BROCHURES Our Team of Experts at Lintec of America would love to hear from you! Please give us a call to discuss your project details or fill out the contact us form and a member of the Lintec Team can get in touch assoon as possible.
LINTEC OF AMERICA
LINTEC carries a wide variety of tapes for backgrinding and dicing processes. The tape selector will determine the best tape candidate for your application based on the information you provide. THIN WAFER TOUGH CHIP SOLUTIONS 200mm, 300mm 200mm, 300mm 200mm, 300mm BGRAD-2010 Tape RAD-3520F/12 RAD-3500m/12 Wafer Fully-Automatic BG Tape BG Tape Laminator LINTEC-developed peeling mechanism removes BG tape from ultra-thin wafer without damaging the wafer Thin Wafer & 25 µm, 40 µm * * * * * * • • Advanced Technologies Division TIPS TO MANAGING STOCK LEVELS WITH LINTEC OF AMERICA’S Our Team of Experts at Lintec of America would love to hear from you! Please give us a call to discuss your project details or fill out the contact us form and a member of the Lintec Team can get in touch assoon as possible.
ADWILL RAD-3000F/8
Adwill RAD-3000F/8. RAD-3000F/8. 200 mm (8-inch) fully automatic back grinding removal system. 1. Fully automatic BG tape remover based on the latest technology. 2. Newly developed peeling mechanism (patent pending) enables to securely hold the surface protection tape and to peel it without any damage onto the thin wafer after back-grinding. 3. リンテック株式会社 当社は粘着製品や特殊紙の分野におけるリーディングカンパニー として、社是「至誠と創造」の下、お客様第一の精神と WEBARC20 – LINTEC OF AMERICA, INC Our Team of Experts at Lintec of America would love to hear from you! Please give us a call to discuss your project details or fill out the contact us form and a member of the Lintec Team can get in touch assoon as possible.
ABOUT – LINTEC OF AMERICA, INC Lintec is an industry leader in Wafer Mounting Systems and UV Irradiation Systems. LINTEC OF AMERICA was originally established in Tempe, AZ in April 1996 to handle all semiconductor related product sales in North and South America. Lintec now has two US divisions in both Phoenix, AZ and Dallas, TX. NEWS – LINTEC OF AMERICA, INC Tips to managing stock levels with Lintec of America’s customer service team. Hi there! My name is Mary, and I am a customer service representative at Lintec of America in Phoenix, Arizona. . CONTACT – LINTEC OF AMERICA, INC LINTEC OF AMERICA, INC. Advanced Technologies Division 15930 S. 48th Street, Suite 110 Phoenix, AZ 85048, USA. Tel: 1 480-966-0784 Fax: 1480-966-5321
LINTEC USA BROCHURES Our Team of Experts at Lintec of America would love to hear from you! Please give us a call to discuss your project details or fill out the contact us form and a member of the Lintec Team can get in touch assoon as possible.
LINTEC OF AMERICA
LINTEC carries a wide variety of tapes for backgrinding and dicing processes. The tape selector will determine the best tape candidate for your application based on the information you provide. THIN WAFER TOUGH CHIP SOLUTIONS 200mm, 300mm 200mm, 300mm 200mm, 300mm BGRAD-2010 Tape RAD-3520F/12 RAD-3500m/12 Wafer Fully-Automatic BG Tape BG Tape Laminator LINTEC-developed peeling mechanism removes BG tape from ultra-thin wafer without damaging the wafer Thin Wafer & 25 µm, 40 µm * * * * * * • • Advanced Technologies Division TIPS TO MANAGING STOCK LEVELS WITH LINTEC OF AMERICA’S Our Team of Experts at Lintec of America would love to hear from you! Please give us a call to discuss your project details or fill out the contact us form and a member of the Lintec Team can get in touch assoon as possible.
ADWILL RAD-3000F/8
Adwill RAD-3000F/8. RAD-3000F/8. 200 mm (8-inch) fully automatic back grinding removal system. 1. Fully automatic BG tape remover based on the latest technology. 2. Newly developed peeling mechanism (patent pending) enables to securely hold the surface protection tape and to peel it without any damage onto the thin wafer after back-grinding. 3. リンテック株式会社 当社は粘着製品や特殊紙の分野におけるリーディングカンパニー として、社是「至誠と創造」の下、お客様第一の精神と WEBARC20 – LINTEC OF AMERICA, INC Our Team of Experts at Lintec of America would love to hear from you! Please give us a call to discuss your project details or fill out the contact us form and a member of the Lintec Team can get in touch assoon as possible.
LINTEC OF AMERICA
LINTEC carries a wide variety of tapes for backgrinding and dicing processes. The tape selector will determine the best tape candidate for your application based on the information you provide. リンテック株式会社 当社は粘着製品や特殊紙の分野におけるリーディングカンパニー として、社是「至誠と創造」の下、お客様第一の精神と ABOUT – LINTEC OF AMERICA, INC Lintec is an industry leader in Wafer Mounting Systems and UV Irradiation Systems. LINTEC OF AMERICA was originally established in Tempe, AZ in April 1996 to handle all semiconductor related product sales in North and South America. Lintec now has two US divisions in both Phoenix, AZ and Dallas, TX. NEWS – LINTEC OF AMERICA, INC Tips to managing stock levels with Lintec of America’s customer service team. Hi there! My name is Mary, and I am a customer service representative at Lintec of America in Phoenix, Arizona. . CONTACT – LINTEC OF AMERICA, INC LINTEC OF AMERICA, INC. Advanced Technologies Division 15930 S. 48th Street, Suite 110 Phoenix, AZ 85048, USA. Tel: 1 480-966-0784 Fax: 1480-966-5321
LINTEC USA BROCHURES Our Team of Experts at Lintec of America would love to hear from you! Please give us a call to discuss your project details or fill out the contact us form and a member of the Lintec Team can get in touch assoon as possible.
LINTEC OF AMERICA
LINTEC carries a wide variety of tapes for backgrinding and dicing processes. The tape selector will determine the best tape candidate for your application based on the information you provide. THIN WAFER TOUGH CHIP SOLUTIONS 200mm, 300mm 200mm, 300mm 200mm, 300mm BGRAD-2010 Tape RAD-3520F/12 RAD-3500m/12 Wafer Fully-Automatic BG Tape BG Tape Laminator LINTEC-developed peeling mechanism removes BG tape from ultra-thin wafer without damaging the wafer Thin Wafer & 25 µm, 40 µm * * * * * * • • Advanced Technologies Division TIPS TO MANAGING STOCK LEVELS WITH LINTEC OF AMERICA’S Our Team of Experts at Lintec of America would love to hear from you! Please give us a call to discuss your project details or fill out the contact us form and a member of the Lintec Team can get in touch assoon as possible.
ADWILL RAD-3000F/8
Adwill RAD-3000F/8. RAD-3000F/8. 200 mm (8-inch) fully automatic back grinding removal system. 1. Fully automatic BG tape remover based on the latest technology. 2. Newly developed peeling mechanism (patent pending) enables to securely hold the surface protection tape and to peel it without any damage onto the thin wafer after back-grinding. 3. リンテック株式会社 当社は粘着製品や特殊紙の分野におけるリーディングカンパニー として、社是「至誠と創造」の下、お客様第一の精神と WEBARC20 – LINTEC OF AMERICA, INC Our Team of Experts at Lintec of America would love to hear from you! Please give us a call to discuss your project details or fill out the contact us form and a member of the Lintec Team can get in touch assoon as possible.
ABOUT – LINTEC OF AMERICA, INC Lintec is an industry leader in Wafer Mounting Systems and UV Irradiation Systems. LINTEC OF AMERICA was originally established in Tempe, AZ in April 1996 to handle all semiconductor related product sales in North and South America. Lintec now has two US divisions in both Phoenix, AZ and Dallas, TX. NEWS – LINTEC OF AMERICA, INC Tips to managing stock levels with Lintec of America’s customer service team. Hi there! My name is Mary, and I am a customer service representative at Lintec of America in Phoenix, Arizona. . CONTACT – LINTEC OF AMERICA, INC LINTEC OF AMERICA, INC. Advanced Technologies Division 15930 S. 48th Street, Suite 110 Phoenix, AZ 85048, USA. Tel: 1 480-966-0784 Fax: 1480-966-5321
LINTEC USA BROCHURES Our Team of Experts at Lintec of America would love to hear from you! Please give us a call to discuss your project details or fill out the contact us form and a member of the Lintec Team can get in touch assoon as possible.
LINTEC OF AMERICA
LINTEC carries a wide variety of tapes for backgrinding and dicing processes. The tape selector will determine the best tape candidate for your application based on the information you provide. THIN WAFER TOUGH CHIP SOLUTIONS 200mm, 300mm 200mm, 300mm 200mm, 300mm BGRAD-2010 Tape RAD-3520F/12 RAD-3500m/12 Wafer Fully-Automatic BG Tape BG Tape Laminator LINTEC-developed peeling mechanism removes BG tape from ultra-thin wafer without damaging the wafer Thin Wafer & 25 µm, 40 µm * * * * * * • • Advanced Technologies Division TIPS TO MANAGING STOCK LEVELS WITH LINTEC OF AMERICA’S Our Team of Experts at Lintec of America would love to hear from you! Please give us a call to discuss your project details or fill out the contact us form and a member of the Lintec Team can get in touch assoon as possible.
ADWILL RAD-3000F/8
Adwill RAD-3000F/8. RAD-3000F/8. 200 mm (8-inch) fully automatic back grinding removal system. 1. Fully automatic BG tape remover based on the latest technology. 2. Newly developed peeling mechanism (patent pending) enables to securely hold the surface protection tape and to peel it without any damage onto the thin wafer after back-grinding. 3. リンテック株式会社 当社は粘着製品や特殊紙の分野におけるリーディングカンパニー として、社是「至誠と創造」の下、お客様第一の精神と WEBARC20 – LINTEC OF AMERICA, INC Our Team of Experts at Lintec of America would love to hear from you! Please give us a call to discuss your project details or fill out the contact us form and a member of the Lintec Team can get in touch assoon as possible.
LINTEC OF AMERICA
LINTEC carries a wide variety of tapes for backgrinding and dicing processes. The tape selector will determine the best tape candidate for your application based on the information you provide. リンテック株式会社 当社は粘着製品や特殊紙の分野におけるリーディングカンパニー として、社是「至誠と創造」の下、お客様第一の精神と ABOUT – LINTEC OF AMERICA, INC Lintec is an industry leader in Wafer Mounting Systems and UV Irradiation Systems. LINTEC OF AMERICA was originally established in Tempe, AZ in April 1996 to handle all semiconductor related product sales in North and South America. Lintec now has two US divisions in both Phoenix, AZ and Dallas, TX. NEWS – LINTEC OF AMERICA, INC Tips to managing stock levels with Lintec of America’s customer service team. Hi there! My name is Mary, and I am a customer service representative at Lintec of America in Phoenix, Arizona. . CONTACT – LINTEC OF AMERICA, INC LINTEC OF AMERICA, INC. Advanced Technologies Division 15930 S. 48th Street, Suite 110 Phoenix, AZ 85048, USA. Tel: 1 480-966-0784 Fax: 1480-966-5321
LINTEC USA BROCHURES Our Team of Experts at Lintec of America would love to hear from you! Please give us a call to discuss your project details or fill out the contact us form and a member of the Lintec Team can get in touch assoon as possible.
LINTEC OF AMERICA
LINTEC carries a wide variety of tapes for backgrinding and dicing processes. The tape selector will determine the best tape candidate for your application based on the information you provide. THIN WAFER TOUGH CHIP SOLUTIONS 200mm, 300mm 200mm, 300mm 200mm, 300mm BGRAD-2010 Tape RAD-3520F/12 RAD-3500m/12 Wafer Fully-Automatic BG Tape BG Tape Laminator LINTEC-developed peeling mechanism removes BG tape from ultra-thin wafer without damaging the wafer Thin Wafer & 25 µm, 40 µm * * * * * * • • Advanced Technologies Division TIPS TO MANAGING STOCK LEVELS WITH LINTEC OF AMERICA’S Our Team of Experts at Lintec of America would love to hear from you! Please give us a call to discuss your project details or fill out the contact us form and a member of the Lintec Team can get in touch assoon as possible.
ADWILL RAD-3000F/8
Adwill RAD-3000F/8. RAD-3000F/8. 200 mm (8-inch) fully automatic back grinding removal system. 1. Fully automatic BG tape remover based on the latest technology. 2. Newly developed peeling mechanism (patent pending) enables to securely hold the surface protection tape and to peel it without any damage onto the thin wafer after back-grinding. 3. リンテック株式会社 当社は粘着製品や特殊紙の分野におけるリーディングカンパニー として、社是「至誠と創造」の下、お客様第一の精神と WEBARC20 – LINTEC OF AMERICA, INC Our Team of Experts at Lintec of America would love to hear from you! Please give us a call to discuss your project details or fill out the contact us form and a member of the Lintec Team can get in touch assoon as possible.
ABOUT – LINTEC OF AMERICA, INC Lintec is an industry leader in Wafer Mounting Systems and UV Irradiation Systems. LINTEC OF AMERICA was originally established in Tempe, AZ in April 1996 to handle all semiconductor related product sales in North and South America. Lintec now has two US divisions in both Phoenix, AZ and Dallas, TX. NEWS – LINTEC OF AMERICA, INC Tips to managing stock levels with Lintec of America’s customer service team. Hi there! My name is Mary, and I am a customer service representative at Lintec of America in Phoenix, Arizona. . CONTACT – LINTEC OF AMERICA, INC LINTEC OF AMERICA, INC. Advanced Technologies Division 15930 S. 48th Street, Suite 110 Phoenix, AZ 85048, USA. Tel: 1 480-966-0784 Fax: 1480-966-5321
LINTEC USA BROCHURES Our Team of Experts at Lintec of America would love to hear from you! Please give us a call to discuss your project details or fill out the contact us form and a member of the Lintec Team can get in touch assoon as possible.
LINTEC OF AMERICA
LINTEC carries a wide variety of tapes for backgrinding and dicing processes. The tape selector will determine the best tape candidate for your application based on the information you provide. THIN WAFER TOUGH CHIP SOLUTIONS 200mm, 300mm 200mm, 300mm 200mm, 300mm BGRAD-2010 Tape RAD-3520F/12 RAD-3500m/12 Wafer Fully-Automatic BG Tape BG Tape Laminator LINTEC-developed peeling mechanism removes BG tape from ultra-thin wafer without damaging the wafer Thin Wafer & 25 µm, 40 µm * * * * * * • • Advanced Technologies Division TIPS TO MANAGING STOCK LEVELS WITH LINTEC OF AMERICA’S Our Team of Experts at Lintec of America would love to hear from you! Please give us a call to discuss your project details or fill out the contact us form and a member of the Lintec Team can get in touch assoon as possible.
ADWILL RAD-3000F/8
Adwill RAD-3000F/8. RAD-3000F/8. 200 mm (8-inch) fully automatic back grinding removal system. 1. Fully automatic BG tape remover based on the latest technology. 2. Newly developed peeling mechanism (patent pending) enables to securely hold the surface protection tape and to peel it without any damage onto the thin wafer after back-grinding. 3. リンテック株式会社 当社は粘着製品や特殊紙の分野におけるリーディングカンパニー として、社是「至誠と創造」の下、お客様第一の精神と WEBARC20 – LINTEC OF AMERICA, INC Our Team of Experts at Lintec of America would love to hear from you! Please give us a call to discuss your project details or fill out the contact us form and a member of the Lintec Team can get in touch assoon as possible.
LINTEC OF AMERICA
LINTEC carries a wide variety of tapes for backgrinding and dicing processes. The tape selector will determine the best tape candidate for your application based on the information you provide. リンテック株式会社 当社は粘着製品や特殊紙の分野におけるリーディングカンパニー として、社是「至誠と創造」の下、お客様第一の精神と LINTEC OF AMERICA, INC LINTEC's semiconductor manufacturing related products include a wide array of lines. Our Adwill product consists of high-functioning adhesive tapes such as Non UV and UV dicing tape, wafer surface protective tape for BG process, backside laminate tape and die attachspecialty films.
ABOUT – LINTEC OF AMERICA, INC LINTEC OF AMERICA specializes in proprietary semiconductor manufacturing related products. These include a wide array of product lines featuring high-function adhesive tapes such as Non UV and UV dicing tape, BG surface protective tape, and die attach specialtyfilms.
NEWS – LINTEC OF AMERICA, INC Hi there! My name is Mary, and I am a customer service representative at Lintec of America in Phoenix, Arizona. Tips to managing stock levels with Lintec of America’s customer service team. CONTACT – LINTEC OF AMERICA, INC LINTEC OF AMERICA, INC. Advanced Technologies Division 15930 S. 48th Street, Suite 110 Phoenix, AZ 85048, USA. Tel: 1 480-966-0784 Fax: 1480-966-5321
LINTEC USA BROCHURES Our Team of Experts at Lintec of America would love to hear from you! Please give us a call to discuss your project details or fill out the contact us form and a member of the Lintec Team can get in touch assoon as possible.
THIN WAFER TOUGH CHIP SOLUTIONS 200mm, 300mm 200mm, 300mm 200mm, 300mm BGRAD-2010 Tape RAD-3520F/12 RAD-3500m/12 Wafer Fully-Automatic BG Tape BG Tape Laminator LINTEC-developed peeling mechanism removes BG tape from ultra-thin wafer without damaging the wafer Thin Wafer & 25 µm, 40 µm * * * * * * • • Advanced Technologies DivisionLINTEC
Company Motto The foundation of the Lintec Group’s CSR is its company motto, “Sincerity and Creativity.” These are the ideals that everyone in the group aspires to.ADWILL RAD-3000F/8
RAD-3000F/8. 200 mm (8-inch) fully automatic back grinding removal system. 1. Fully automatic BG tape remover based on the latest technology. 2. Newly developed peeling mechanism (patent pending) enables to securely hold the surface protection tape and to peel it without any damage onto the thin wafer after back-grinding.MATTEO CIRAMI
Hi there! My name is Mary, and I am a customer service representative at Lintec of America in Phoenix, Arizona. Tips to managing stock levels with Lintec of America’s customer service team. WEBARC20 – LINTEC OF AMERICA, INC Our Team of Experts at Lintec of America would love to hear from you! Please give us a call to discuss your project details or fill out the contact us form and a member of the Lintec Team can get in touch assoon as possible.
LINTEC OF AMERICA, INC LINTEC's semiconductor manufacturing related products include a wide array of lines. Our Adwill product consists of high-functioning adhesive tapes such as Non UV and UV dicing tape, wafer surface protective tape for BG process, backside laminate tape and die attachspecialty films.
ABOUT – LINTEC OF AMERICA, INC LINTEC OF AMERICA specializes in proprietary semiconductor manufacturing related products. These include a wide array of product lines featuring high-function adhesive tapes such as Non UV and UV dicing tape, BG surface protective tape, and die attach specialtyfilms.
NEWS – LINTEC OF AMERICA, INC Hi there! My name is Mary, and I am a customer service representative at Lintec of America in Phoenix, Arizona. Tips to managing stock levels with Lintec of America’s customer service team. CONTACT – LINTEC OF AMERICA, INC LINTEC OF AMERICA, INC. Advanced Technologies Division 15930 S. 48th Street, Suite 110 Phoenix, AZ 85048, USA. Tel: 1 480-966-0784 Fax: 1480-966-5321
LINTEC USA BROCHURES Our Team of Experts at Lintec of America would love to hear from you! Please give us a call to discuss your project details or fill out the contact us form and a member of the Lintec Team can get in touch assoon as possible.
THIN WAFER TOUGH CHIP SOLUTIONS 200mm, 300mm 200mm, 300mm 200mm, 300mm BGRAD-2010 Tape RAD-3520F/12 RAD-3500m/12 Wafer Fully-Automatic BG Tape BG Tape Laminator LINTEC-developed peeling mechanism removes BG tape from ultra-thin wafer without damaging the wafer Thin Wafer & 25 µm, 40 µm * * * * * * • • Advanced Technologies DivisionLINTEC
Company Motto The foundation of the Lintec Group’s CSR is its company motto, “Sincerity and Creativity.” These are the ideals that everyone in the group aspires to.ADWILL RAD-3000F/8
RAD-3000F/8. 200 mm (8-inch) fully automatic back grinding removal system. 1. Fully automatic BG tape remover based on the latest technology. 2. Newly developed peeling mechanism (patent pending) enables to securely hold the surface protection tape and to peel it without any damage onto the thin wafer after back-grinding.MATTEO CIRAMI
Hi there! My name is Mary, and I am a customer service representative at Lintec of America in Phoenix, Arizona. Tips to managing stock levels with Lintec of America’s customer service team. WEBARC20 – LINTEC OF AMERICA, INC Our Team of Experts at Lintec of America would love to hear from you! Please give us a call to discuss your project details or fill out the contact us form and a member of the Lintec Team can get in touch assoon as possible.
LINTEC OF AMERICA
LINTEC carries a wide variety of tapes for backgrinding and dicing processes. The tape selector will determine the best tape candidate for your application based on the information you provide. リンテック株式会社 当社は粘着製品や特殊紙の分野におけるリーディングカンパニー として、社是「至誠と創造」の下、お客様第一の精神と* Company ↓
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BG Tape/Release TapeBR Tape Remover
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WELCOME TO LINTEC
For OVER 30 YEARS LINTEC has been in the semiconductor industry playing an important role in bringing the latest technologies to the backend semiconductor industry. LINTEC's semiconductor manufacturing related products Adwill and Opteria include a wide array of lines consisting of high-function adhesive tapes such as Non UV and UV dicing tape, BG surface protective tape, and die attach specialty films. Additionally, LINTEC is the industry leader in providing Wafer Mounting Systems and UV Irradiation Systems. LINTEC will continue to move forward developing new product lines that exceed the customer's expectations while revolutionizing the semiconductor process. SEMICONDUCTOR MANUFACTURING PROCESS MATERIALS AND EQUIPMENT Our products contribute to improve the workability of the quality in the back-grinding process and productivity in dicing process of the Semiconductor manufacturing process*
BG TAPE/RELEASE TAPE*
BG TAPE LAMINATOR
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DICING TAPE
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DIE BONDING TAPE
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