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JC-70, JEDEC’s newest main committee, is focused on the development of universal standards to help advance the adoption of wide bandgap (WBG) power technologies. STANDARDS & DOCUMENTS SEARCH Paying JEDEC Members may login for free access.. TEST METHODS TO CHARACTERIZE VOIDING IN PRE-SMT BALL GRID ARRAY PACKAGES: JESD217.01 Oct 2016: This publication provides an overview of solder void types, outlines current metrologies and test methods used for pre-SMPT solder void characterization and potential limitations, and prescribes sampling strategy for data collection, and STANDARDS & DOCUMENTS SEARCH Title Document # Date; Addendum No. 1 to JESD79-3 - 1.35 V DDR3L-800, DDR3L-1066, DDR3L-1333, DDR3L-1600, and DDR3L-1866 This is a minor editorial revision, the differences between revisions can be found on page 17 of the document. STANDARDS & DOCUMENTS SEARCH JC-10: Terms, Definitions, and Symbols (1) Apply JC-10: Terms, Definitions, and Symbols filter JC-14: Quality and Reliability of Solid State Products (2) Apply JC-14: Quality and Reliability of STANDARDS & DOCUMENTS SEARCH MODULE (4, 4.2, 4.3, 4.4, 4.5, 4.6, 4.7 Modules) (80) Apply MODULE (4, 4.2, 4.3, 4.4, 4.5, 4.6, 4.7 Modules) filter SPD (4.1.2 Serial Presence Detect) (12) Apply SPD LOW TEMPERATURE STORAGE LIFE The test is applicable for evaluation, screening, monitoring, and/or qualification of all solid state devices Low Temperature storage test is typically used to determine the effect of time and temperature, under storage conditions, for thermally activated failure mechanisms of solid state electronic devices, including nonvolatile memory devices (data retention failure mechanisms). CUSTOMER NOTIFICATION STANDARD FOR PRODUCT/PROCESS … This standard is applicable to suppliers of, and affected customers for, electronic products and their constituent components. This standard establishes the requirements for timely customer notification of changes to electronic products and associated processes. STRESS-TEST-DRIVEN QUALIFICATION OF AND FAILURE … This publication contains a set of frequently recommended and accepted JEDEC reliability stress tests. These tests are used for qualifying new and modified technology/ process/ product families, as well as individual solid state surface-mount products, in particular leadless chip carriers, ball grid array (BGA) packages, direct chip attach die and packages with exposed pads that are attached SELECTION OF BURN-IN/LIFE TEST CONDITIONS AND CRITICAL This publication is intended as a guideline to develop and establish conditions for burn-in and life test of MIL-PRF-38535 QML integratedcircuits.
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JC-70, JEDEC’s newest main committee, is focused on the development of universal standards to help advance the adoption of wide bandgap (WBG) power technologies. STANDARDS & DOCUMENTS SEARCH Paying JEDEC Members may login for free access.. TEST METHODS TO CHARACTERIZE VOIDING IN PRE-SMT BALL GRID ARRAY PACKAGES: JESD217.01 Oct 2016: This publication provides an overview of solder void types, outlines current metrologies and test methods used for pre-SMPT solder void characterization and potential limitations, and prescribes sampling strategy for data collection, and STANDARDS & DOCUMENTS SEARCH Title Document # Date; Addendum No. 1 to JESD79-3 - 1.35 V DDR3L-800, DDR3L-1066, DDR3L-1333, DDR3L-1600, and DDR3L-1866 This is a minor editorial revision, the differences between revisions can be found on page 17 of the document. STANDARDS & DOCUMENTS SEARCH JC-10: Terms, Definitions, and Symbols (1) Apply JC-10: Terms, Definitions, and Symbols filter JC-14: Quality and Reliability of Solid State Products (2) Apply JC-14: Quality and Reliability of STANDARDS & DOCUMENTS SEARCH MODULE (4, 4.2, 4.3, 4.4, 4.5, 4.6, 4.7 Modules) (80) Apply MODULE (4, 4.2, 4.3, 4.4, 4.5, 4.6, 4.7 Modules) filter SPD (4.1.2 Serial Presence Detect) (12) Apply SPD LOW TEMPERATURE STORAGE LIFE The test is applicable for evaluation, screening, monitoring, and/or qualification of all solid state devices Low Temperature storage test is typically used to determine the effect of time and temperature, under storage conditions, for thermally activated failure mechanisms of solid state electronic devices, including nonvolatile memory devices (data retention failure mechanisms). CUSTOMER NOTIFICATION STANDARD FOR PRODUCT/PROCESS … This standard is applicable to suppliers of, and affected customers for, electronic products and their constituent components. This standard establishes the requirements for timely customer notification of changes to electronic products and associated processes. STRESS-TEST-DRIVEN QUALIFICATION OF AND FAILURE … This publication contains a set of frequently recommended and accepted JEDEC reliability stress tests. These tests are used for qualifying new and modified technology/ process/ product families, as well as individual solid state surface-mount products, in particular leadless chip carriers, ball grid array (BGA) packages, direct chip attach die and packages with exposed pads that are attached SELECTION OF BURN-IN/LIFE TEST CONDITIONS AND CRITICAL This publication is intended as a guideline to develop and establish conditions for burn-in and life test of MIL-PRF-38535 QML integratedcircuits.
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JC-70, JEDEC’s newest main committee, is focused on the development of universal standards to help advance the adoption of wide bandgap (WBG) power technologies. STANDARDS & DOCUMENTS SEARCH Title Document # Date; JOINT JEDEC/ECA STANDARD, DEFINITION OF “LOW-HALOGEN” FOR ELECTRONIC PRODUCTS: JS709C Mar 2018: This standard provides terms and definitions for “low-halogen” electronic products that have the potential to contain the halogens bromine (Br) and chlorine (Cl) from the use of BFRs, CFRs, and PVC, and recommends methods for marking and labeling. STANDARDS & DOCUMENTS SEARCH Paying JEDEC Members may login for free access.. UNIVERSAL FLASH STORAGE (UFS), Version 3.1: JESD220E Jan 2020: This document replaces all past versions, however JESD220D, January (V 3.0), is available for reference only.The purpose of this standard is definition of an UFS Universal Flash Storage electrical interface and an UFS memory device.. This standard defines a unique UFS feature set and STANDARDS & DOCUMENTS SEARCH Title Document # Date; FAILURE MECHANISMS AND MODELS FOR SEMICONDUCTOR DEVICES: JEP122H Sep 2016: This publication provides a list of failure mechanisms and their associated activation energies or acceleration factors that may be used in making system failure rate estimations when the only available data is based on tests performed at accelerated stress test conditions. STANDARDS & DOCUMENTS SEARCH Title Document # Date; Registration - .050 inch Center Leadless Rectangular Chip Carrier Type E. Variations AA-AF. Item 11.10-350.MO-041-C
STANDARDS & DOCUMENTS SEARCH Title Document # Date; SERIAL INTERFACE FOR DATA CONVERTERS: JESD204C Dec 2017: This standard describes a serialized interface between data converters and logic devices. STANDARDS & DOCUMENTS SEARCH Title Document # Date; ELECTROSTATIC DISCHARGE (ESD) SENSITIVITY TESTING HUMAN BODY MODEL (HBM) Status: Superseded by ANSI/ESDA/JEDEC JS-001, April 2010.: JESD22-A114F Dec 2008 STANDARDS & DOCUMENTS SEARCH Title Document # Date; WIRE BOND SHEAR TEST: JESD22-B116B May 2017: This fully revised test provides a means for determining the strength of gold and copper ball bonds to a die or package bonding surface, and may be performed on pre-encapsulation or post-encapsulation parts. STANDARDS & DOCUMENTS SEARCH JC-10: Terms, Definitions, and Symbols (17) Apply JC-10: Terms, Definitions, and Symbols filter JC-11: Mechanical Standardization (600) Apply JC-11: Mechanical Standardization filter JC-13: Government Liaison (36) Apply JC-13: Government Liaison filter JC-14: Quality and Reliability of Solid State Products (154) Apply JC-14: Quality and Reliability of Solid State Products filterRDIMM | JEDEC
This specification defines the electrical and mechanical requirements for Raw Card E, 288-pin, 1.2 Volt (VDD), Registered, Double Data Rate, Synchronous DRAM Dual HOME | JEDECSTANDARDS & DOCUMENTSCOMMITTEESNEWSEVENTS &MEETINGSJOINABOUT
JC-70, JEDEC’s newest main committee, is focused on the development of universal standards to help advance the adoption of wide bandgap (WBG) power technologies. STANDARDS & DOCUMENTS SEARCH JEP70C. Oct 2013. This document gathers and organizes common standards and publications relating to quality processes and methods relating to the solid-state, microelectronics, and associated industries. This is intended to facilitate access to the applicable documents when working with electronic hardware. STANDARDS & DOCUMENTS SEARCH Title Document # Date; Addendum No. 1 to JESD79-3 - 1.35 V DDR3L-800, DDR3L-1066, DDR3L-1333, DDR3L-1600, and DDR3L-1866 This is a minor editorial revision, the differences between revisions can be found on page 17 of the document. ROCS WORKSHOP: MAY 24, 2021 Registration is now closed. On Monday, May 24, 2021 we will hold the 35th Annual ROCS (Reliability of Compound Semiconductors) Workshop. ROCS will be co-located with the CS MANTECH Conference on its online, virtual conference platform, with the objective of bringing together researchers, manufacturers and users of compound semiconductordevices.
STANDARDS & DOCUMENTS SEARCH MODULE (4, 4.2, 4.3, 4.4, 4.5, 4.6, 4.7 Modules) (80) Apply MODULE (4, 4.2, 4.3, 4.4, 4.5, 4.6, 4.7 Modules) filter SPD (4.1.2 Serial Presence Detect) (12) Apply SPD CUSTOMER NOTIFICATION STANDARD FOR PRODUCT/PROCESS … J-STD-046. Published: Jul 2016. This standard is applicable to suppliers of, and affected customers for, electronic products and their constituent components. This standard establishes the requirements for timely customer notification of changes to electronic products and associated processes. This document replaces JESD46. Committee (s): JC-14.4. SELECTION OF BURN-IN/LIFE TEST CONDITIONS AND CRITICAL JEP163. This publication is intended as a guideline to develop and establish conditions for burn-in and life test of MIL-PRF-38535 QML integrated circuits. These guidelines are intended to provide manufacturers with a consistent means of defining burn-in and life test stress and electrical test requirements acceptable to userorganizations and
STRESS-TEST-DRIVEN QUALIFICATION OF AND FAILURE … This publication contains a set of frequently recommended and accepted JEDEC reliability stress tests. These tests are used for qualifying new and modified technology/ process/ product families, as well as individual solid state surface-mount products, in particular leadless chip carriers, ball grid array (BGA) packages, direct chip attach die and packages with exposed pads that are attached LOW TEMPERATURE STORAGE LIFE The test is applicable for evaluation, screening, monitoring, and/or qualification of all solid state devices Low Temperature storage test is typically used to determine the effect of time and temperature, under storage conditions, for thermally activated failure mechanisms of solid state electronic devices, including nonvolatile memory devices (data retention failure mechanisms). MECHANICAL COMPRESSIVE STATIC STRESS TEST METHOD JESD22-B119. Published: Oct 2018. This test method is intended for customers to determine the ability of a device to withstand the mechanical compressive static stress generated when a heat sink is being initially attached to the device, and to help the customer generate design rules for their heat sink design and validate theirthermal solution.
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JC-70, JEDEC’s newest main committee, is focused on the development of universal standards to help advance the adoption of wide bandgap (WBG) power technologies. STANDARDS & DOCUMENTS SEARCH JEP70C. Oct 2013. This document gathers and organizes common standards and publications relating to quality processes and methods relating to the solid-state, microelectronics, and associated industries. This is intended to facilitate access to the applicable documents when working with electronic hardware. STANDARDS & DOCUMENTS SEARCH Title Document # Date; Addendum No. 1 to JESD79-3 - 1.35 V DDR3L-800, DDR3L-1066, DDR3L-1333, DDR3L-1600, and DDR3L-1866 This is a minor editorial revision, the differences between revisions can be found on page 17 of the document. ROCS WORKSHOP: MAY 24, 2021 Registration is now closed. On Monday, May 24, 2021 we will hold the 35th Annual ROCS (Reliability of Compound Semiconductors) Workshop. ROCS will be co-located with the CS MANTECH Conference on its online, virtual conference platform, with the objective of bringing together researchers, manufacturers and users of compound semiconductordevices.
STANDARDS & DOCUMENTS SEARCH MODULE (4, 4.2, 4.3, 4.4, 4.5, 4.6, 4.7 Modules) (80) Apply MODULE (4, 4.2, 4.3, 4.4, 4.5, 4.6, 4.7 Modules) filter SPD (4.1.2 Serial Presence Detect) (12) Apply SPD CUSTOMER NOTIFICATION STANDARD FOR PRODUCT/PROCESS … J-STD-046. Published: Jul 2016. This standard is applicable to suppliers of, and affected customers for, electronic products and their constituent components. This standard establishes the requirements for timely customer notification of changes to electronic products and associated processes. This document replaces JESD46. Committee (s): JC-14.4. SELECTION OF BURN-IN/LIFE TEST CONDITIONS AND CRITICAL JEP163. This publication is intended as a guideline to develop and establish conditions for burn-in and life test of MIL-PRF-38535 QML integrated circuits. These guidelines are intended to provide manufacturers with a consistent means of defining burn-in and life test stress and electrical test requirements acceptable to userorganizations and
STRESS-TEST-DRIVEN QUALIFICATION OF AND FAILURE … This publication contains a set of frequently recommended and accepted JEDEC reliability stress tests. These tests are used for qualifying new and modified technology/ process/ product families, as well as individual solid state surface-mount products, in particular leadless chip carriers, ball grid array (BGA) packages, direct chip attach die and packages with exposed pads that are attached LOW TEMPERATURE STORAGE LIFE The test is applicable for evaluation, screening, monitoring, and/or qualification of all solid state devices Low Temperature storage test is typically used to determine the effect of time and temperature, under storage conditions, for thermally activated failure mechanisms of solid state electronic devices, including nonvolatile memory devices (data retention failure mechanisms). MECHANICAL COMPRESSIVE STATIC STRESS TEST METHOD JESD22-B119. Published: Oct 2018. This test method is intended for customers to determine the ability of a device to withstand the mechanical compressive static stress generated when a heat sink is being initially attached to the device, and to help the customer generate design rules for their heat sink design and validate theirthermal solution.
STANDARDS & DOCUMENTS SEARCH JEP70C. Oct 2013. This document gathers and organizes common standards and publications relating to quality processes and methods relating to the solid-state, microelectronics, and associated industries. This is intended to facilitate access to the applicable documents when working with electronic hardware. STANDARDS & DOCUMENTS SEARCH JC-13: Government Liaison (4) Apply JC-13: Government Liaison filter JC-14: Quality and Reliability of Solid State Products (10) Apply JC-14: Quality and Reliability of Solid State Products filter JC-16: Interface Technology (1) Apply JC-16: Interface Technology filter JC-42: Solid State Memories (1) Apply JC-42: Solid State Memories filter JC-45: DRAM Modules (1) Apply JC-45: DRAM Modules filter STANDARDS & DOCUMENTS SEARCH This standard defines the form, fit and function of DDR4 connectors for U/R/LR modules supporting channels with transfer rates as high as 3.2 GT/S. It contains mechanical, electrical and reliability requirements for a one-piece connector mated to a module with nominal thickness of 1.40 mm. The intent of this document is to providePerformance
STANDARDS & DOCUMENTS SEARCH The appropriate references to existing and proposed JEDEC (or EIA) standards and publications are cited. This document is also intended to provide an educational background and overview of some of the technical and economic factors associated with assessing and qualifying microcircuit reliability. Committee (s): JC-14, JC-14.3. STANDARDS & DOCUMENTS SEARCH JC-10: Terms, Definitions, and Symbols (17) Apply JC-10: Terms, Definitions, and Symbols filter JC-11: Mechanical Standardization (600) Apply JC-11: Mechanical Standardization filter JC-13: Government Liaison (36) Apply JC-13: Government Liaison filter JC-14: Quality and Reliability of Solid State Products (154) Apply JC-14: Quality and Reliability of Solid State Products filter ROCS WORKSHOP: MAY 24, 2021 Registration is now closed. On Monday, May 24, 2021 we will hold the 35th Annual ROCS (Reliability of Compound Semiconductors) Workshop. ROCS will be co-located with the CS MANTECH Conference on its online, virtual conference platform, with the objective of bringing together researchers, manufacturers and users of compound semiconductordevices.
STANDARDS & DOCUMENTS SEARCH RELIABILITY QUALIFICATION OF POWER AMPLIFIER MODULES. JESD237. Mar 2014. This standard is intended to identify a core set of qualification tests that apply specifically for Power Amplifier Modules and their primary application in mobile devices such as cellular phones. This standard is intended to describe specific stresses and failure STANDARDS & DOCUMENTS SEARCH Title Document # Date; WIRE BOND SHEAR TEST: JESD22-B116B May 2017: This fully revised test provides a means for determining the strength of gold and copper ball bonds to a die or package bonding surface, and may be performed on pre-encapsulation or post-encapsulation parts. STANDARDS & DOCUMENTS SEARCH JESD84-B51A. Jan 2019. This document provides a comprehensive definition of the e •MMC Electrical Interface, its environment, and handling. It also provides design guidelines and defines a tool box of macro functions and algorithms intended to reduce design-in overhead. The purpose of this standard is the definition of the e •MMCElectrical
LOW TEMPERATURE STORAGE LIFE The test is applicable for evaluation, screening, monitoring, and/or qualification of all solid state devices Low Temperature storage test is typically used to determine the effect of time and temperature, under storage conditions, for thermally activated failure mechanisms of solid state electronic devices, including nonvolatile memory devices (data retention failure mechanisms). HOME | JEDECSTANDARDS & DOCUMENTSCOMMITTEESNEWSEVENTS &MEETINGSJOINABOUT
JC-70, JEDEC’s newest main committee, is focused on the development of universal standards to help advance the adoption of wide bandgap (WBG) power technologies. STANDARDS & DOCUMENTS SEARCH HIGHLY ACCELERATED TEMPERATURE AND HUMIDITY STRESS TEST (HAST) JESD22-A110E. JOINT IPC/JEDEC STANDARD FOR HANDLING, PACKING, SHIPPING, AND USE OF MOISTURE/REFLOW SENSITIVE SURFACE-MOUNT DEVICES. J-STD-033D. JOINT IPC/JEDEC STANDARD FOR MOISTURE/REFLOW SENSITIVITY CLASSIFICATION FOR NONHERMETIC SURFACE-MOUNT DEVICES. STANDARDS & DOCUMENTS SEARCH JEP70C. Oct 2013. This document gathers and organizes common standards and publications relating to quality processes and methods relating to the solid-state, microelectronics, and associated industries. This is intended to facilitate access to the applicable documents when working with electronic hardware. STANDARDS & DOCUMENTS SEARCH Status: SupersededBy J-STD-046, July 2016. JESD46D. Dec 2011. This standard establishes procedures to notify customers of semiconductor product and process changes. Requirements include: documentation; procedures for classification, notification and customer response; content; and records. Documentation of a suppliers change notificationsystem
REGISTERED OUTLINES: JEP95 Registered Outlines: JEP95. JEP95, JEDEC Registered and Standard Outlines for Solid State and Related Products, is a compilation of some 3000 pages of outline drawings for microelectronic packages including transistors, diodes, DIPS, chip carriers, sockets, and package interface BGA outlines in both inch and metric versions. STANDARDS & DOCUMENTS SEARCH JESD84-B51A. Jan 2019. This document provides a comprehensive definition of the e •MMC Electrical Interface, its environment, and handling. It also provides design guidelines and defines a tool box of macro functions and algorithms intended to reduce design-in overhead. The purpose of this standard is the definition of the e •MMCElectrical
JEP30: PART MODEL GUIDELINES JEP30: Part Model Guidelines. JEP30 and its related documents are currently published and maintained as a JEDEC-wide project between the JC-11, JC-14, JC-15 and JC-42 Committees. JEP30 establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products. CUSTOMER NOTIFICATION STANDARD FOR PRODUCT/PROCESS … J-STD-046. Published: Jul 2016. This standard is applicable to suppliers of, and affected customers for, electronic products and their constituent components. This standard establishes the requirements for timely customer notification of changes to electronic products and associated processes. This document replaces JESD46. Committee (s): JC-14.4. LOW TEMPERATURE STORAGE LIFE The test is applicable for evaluation, screening, monitoring, and/or qualification of all solid state devices Low Temperature storage test is typically used to determine the effect of time and temperature, under storage conditions, for thermally activated failure mechanisms of solid state electronic devices, including nonvolatile memory devices (data retention failure mechanisms). DDR4 MINI WORKSHOPDDR4 MINI WORKSHOP Disclaimer E th h M j it f DDR4 h b d fi d/Fi d thEven though Majority of DDR4 spec has been defined/Fixed, there might be chance of updatebefore publicationt
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JC-70, JEDEC’s newest main committee, is focused on the development of universal standards to help advance the adoption of wide bandgap (WBG) power technologies. STANDARDS & DOCUMENTS SEARCH HIGHLY ACCELERATED TEMPERATURE AND HUMIDITY STRESS TEST (HAST) JESD22-A110E. JOINT IPC/JEDEC STANDARD FOR HANDLING, PACKING, SHIPPING, AND USE OF MOISTURE/REFLOW SENSITIVE SURFACE-MOUNT DEVICES. J-STD-033D. JOINT IPC/JEDEC STANDARD FOR MOISTURE/REFLOW SENSITIVITY CLASSIFICATION FOR NONHERMETIC SURFACE-MOUNT DEVICES. STANDARDS & DOCUMENTS SEARCH JEP70C. Oct 2013. This document gathers and organizes common standards and publications relating to quality processes and methods relating to the solid-state, microelectronics, and associated industries. This is intended to facilitate access to the applicable documents when working with electronic hardware. STANDARDS & DOCUMENTS SEARCH Status: SupersededBy J-STD-046, July 2016. JESD46D. Dec 2011. This standard establishes procedures to notify customers of semiconductor product and process changes. Requirements include: documentation; procedures for classification, notification and customer response; content; and records. Documentation of a suppliers change notificationsystem
REGISTERED OUTLINES: JEP95 Registered Outlines: JEP95. JEP95, JEDEC Registered and Standard Outlines for Solid State and Related Products, is a compilation of some 3000 pages of outline drawings for microelectronic packages including transistors, diodes, DIPS, chip carriers, sockets, and package interface BGA outlines in both inch and metric versions. STANDARDS & DOCUMENTS SEARCH JESD84-B51A. Jan 2019. This document provides a comprehensive definition of the e •MMC Electrical Interface, its environment, and handling. It also provides design guidelines and defines a tool box of macro functions and algorithms intended to reduce design-in overhead. The purpose of this standard is the definition of the e •MMCElectrical
JEP30: PART MODEL GUIDELINES JEP30: Part Model Guidelines. JEP30 and its related documents are currently published and maintained as a JEDEC-wide project between the JC-11, JC-14, JC-15 and JC-42 Committees. JEP30 establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products. CUSTOMER NOTIFICATION STANDARD FOR PRODUCT/PROCESS … J-STD-046. Published: Jul 2016. This standard is applicable to suppliers of, and affected customers for, electronic products and their constituent components. This standard establishes the requirements for timely customer notification of changes to electronic products and associated processes. This document replaces JESD46. Committee (s): JC-14.4. LOW TEMPERATURE STORAGE LIFE The test is applicable for evaluation, screening, monitoring, and/or qualification of all solid state devices Low Temperature storage test is typically used to determine the effect of time and temperature, under storage conditions, for thermally activated failure mechanisms of solid state electronic devices, including nonvolatile memory devices (data retention failure mechanisms). DDR4 MINI WORKSHOPDDR4 MINI WORKSHOP Disclaimer E th h M j it f DDR4 h b d fi d/Fi d thEven though Majority of DDR4 spec has been defined/Fixed, there might be chance of updatebefore publicationt
STANDARDS & DOCUMENTS SEARCH Aug 2018. This standard describes a baseline set of acceptance tests for use in qualifying electronic components as new products, a product family, or as products in a process which is being changed. Committee (s): JC-14.3. Available for purchase: $76.00 Add to Cart. STANDARDS & DOCUMENTS SEARCH JC-13: Government Liaison (4) Apply JC-13: Government Liaison filter JC-14: Quality and Reliability of Solid State Products (10) Apply JC-14: Quality and Reliability of Solid State Products filter JC-16: Interface Technology (1) Apply JC-16: Interface Technology filter JC-42: Solid State Memories (1) Apply JC-42: Solid State Memories filter JC-45: DRAM Modules (1) Apply JC-45: DRAM Modules filter STANDARDS & DOCUMENTS SEARCH JESD47K. Aug 2018. This standard describes a baseline set of acceptance tests for use in qualifying electronic components as new products, a product family, or as products in a process which is being changed. Committee (s): JC-14.3. Available for purchase: $76.00 Add to Cart. To help cover the costs of producing standards, JEDEC is nowcharging
STANDARDS & DOCUMENTS SEARCH JEP70C. Oct 2013. This document gathers and organizes common standards and publications relating to quality processes and methods relating to the solid-state, microelectronics, and associated industries. This is intended to facilitate access to the applicable documents when working with electronic hardware. STANDARDS & DOCUMENTS SEARCH RELIABILITY QUALIFICATION OF POWER AMPLIFIER MODULES. JESD237. Mar 2014. This standard is intended to identify a core set of qualification tests that apply specifically for Power Amplifier Modules and their primary application in mobile devices such as cellular phones. This standard is intended to describe specific stresses and failure STANDARDS & DOCUMENTS SEARCH JC-10: Terms, Definitions, and Symbols (17) Apply JC-10: Terms, Definitions, and Symbols filter JC-11: Mechanical Standardization (600) Apply JC-11: Mechanical Standardization filter JC-13: Government Liaison (36) Apply JC-13: Government Liaison filter JC-14: Quality and Reliability of Solid State Products (154) Apply JC-14: Quality and Reliability of Solid State Products filter JEP30: PART MODEL GUIDELINES JEP30: Part Model Guidelines. JEP30 and its related documents are currently published and maintained as a JEDEC-wide project between the JC-11, JC-14, JC-15 and JC-42 Committees. JEP30 establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products.JC-70 | JEDEC
JC-70 Wide Bandgap Power Electronic Conversion Semiconductors is JEDEC's newest main committee. Led by Chair Dr. Stephanie Watts Butler from Texas Instruments, the new JC-70 committee has two subcommittees: JC-70.1 Subcommittee for GaN Power Electronic Conversion Semiconductor Standards, and JC-70.2 Subcommittee for SiC Power Electronic Conversion Semiconductor Standards.JC-14 | JEDEC
JC-14 is responsible for standardizing quality and reliability methodologies for solid state products used in commercial applications such as computers, automobiles, telecommunications equipment, etc. It also includes developing standards for board-level reliability of solid state products used in ESD: ELECTROSTATIC DISCHARGE ESD: Electrostatic Discharge. JEDEC has taken a leadership role in developing standards for ESD since the early 1980s, including standards for device handling and test methods related to ESD. Below is a summary of useful standards and documents related to ESD. HOME | JEDECSTANDARDS & DOCUMENTSCOMMITTEESNEWSEVENTS &MEETINGSJOINABOUT
JC-70, JEDEC’s newest main committee, is focused on the development of universal standards to help advance the adoption of wide bandgap (WBG) power technologies. STANDARDS & DOCUMENTS SEARCH HIGHLY ACCELERATED TEMPERATURE AND HUMIDITY STRESS TEST (HAST) JESD22-A110E. JOINT IPC/JEDEC STANDARD FOR HANDLING, PACKING, SHIPPING, AND USE OF MOISTURE/REFLOW SENSITIVE SURFACE-MOUNT DEVICES. J-STD-033D. JOINT IPC/JEDEC STANDARD FOR MOISTURE/REFLOW SENSITIVITY CLASSIFICATION FOR NONHERMETIC SURFACE-MOUNT DEVICES. STANDARDS & DOCUMENTS SEARCH Title Document # Date; Addendum No. 1 to JESD79-3 - 1.35 V DDR3L-800, DDR3L-1066, DDR3L-1333, DDR3L-1600, and DDR3L-1866 This is a minor editorial revision, the differences between revisions can be found on page 17 of the document. JEP30: PART MODEL GUIDELINES JEP30: Part Model Guidelines. JEP30 and its related documents are currently published and maintained as a JEDEC-wide project between the JC-11, JC-14, JC-15 and JC-42 Committees. JEP30 establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products. CUSTOMER NOTIFICATION STANDARD FOR PRODUCT/PROCESS … J-STD-046. Published: Jul 2016. This standard is applicable to suppliers of, and affected customers for, electronic products and their constituent components. This standard establishes the requirements for timely customer notification of changes to electronic products and associated processes. This document replaces JESD46. Committee (s): JC-14.4. STANDARDS & DOCUMENTS SEARCH JEP152. May 2007. This document is the work product of the JC-45.1 DDR2 DIMM Clock Skew Measurement task group.The purpose of this document is to define procedures to measure clock parameters on registered DIMMs using the DDR2 Clock Reference Board. It is NOT the intent of this document to set specification values or validationrequirements.
STANDARDS & DOCUMENTS SEARCH Title Document # Date; WIRE BOND SHEAR TEST: JESD22-B116B May 2017: This fully revised test provides a means for determining the strength of gold and copper ball bonds to a die or package bonding surface, and may be performed on pre-encapsulation or post-encapsulation parts. GUIDELINES FOR MEASURING THE THRESHOLD VOLTAGE (VT) OF SIC JEP183. Published: Jan 2021. This publication describes the guidelines for VT measurement methods and conditioning prior to VT testing in SiC power MOSFETs to reduce or eliminate the effect of the aforementioned hysteresis. Committee (s): JC-70.1. Free download. Registration orlogin required.
STRESS-TEST-DRIVEN QUALIFICATION OF AND FAILURE … This publication contains a set of frequently recommended and accepted JEDEC reliability stress tests. These tests are used for qualifying new and modified technology/ process/ product families, as well as individual solid state surface-mount products, in particular leadless chip carriers, ball grid array (BGA) packages, direct chip attach die and packages with exposed pads that are attached REQUIREMENTS FOR MICROELECTRONIC SCREENING AND TEST This document is designed to assist the manufacturer in optimizing the test flow while maintaining and/or improving assurance of providing high quality and reliable product in an efficient manner. This will allow for optimization of testing that is not adding value, hence, reducing cycle time and costs. Committee (s): JC-13, JC-13.2. HOME | JEDECSTANDARDS & DOCUMENTSCOMMITTEESNEWSEVENTS &MEETINGSJOINABOUT
JC-70, JEDEC’s newest main committee, is focused on the development of universal standards to help advance the adoption of wide bandgap (WBG) power technologies. STANDARDS & DOCUMENTS SEARCH HIGHLY ACCELERATED TEMPERATURE AND HUMIDITY STRESS TEST (HAST) JESD22-A110E. JOINT IPC/JEDEC STANDARD FOR HANDLING, PACKING, SHIPPING, AND USE OF MOISTURE/REFLOW SENSITIVE SURFACE-MOUNT DEVICES. J-STD-033D. JOINT IPC/JEDEC STANDARD FOR MOISTURE/REFLOW SENSITIVITY CLASSIFICATION FOR NONHERMETIC SURFACE-MOUNT DEVICES. STANDARDS & DOCUMENTS SEARCH Title Document # Date; Addendum No. 1 to JESD79-3 - 1.35 V DDR3L-800, DDR3L-1066, DDR3L-1333, DDR3L-1600, and DDR3L-1866 This is a minor editorial revision, the differences between revisions can be found on page 17 of the document. JEP30: PART MODEL GUIDELINES JEP30: Part Model Guidelines. JEP30 and its related documents are currently published and maintained as a JEDEC-wide project between the JC-11, JC-14, JC-15 and JC-42 Committees. JEP30 establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products. CUSTOMER NOTIFICATION STANDARD FOR PRODUCT/PROCESS … J-STD-046. Published: Jul 2016. This standard is applicable to suppliers of, and affected customers for, electronic products and their constituent components. This standard establishes the requirements for timely customer notification of changes to electronic products and associated processes. This document replaces JESD46. Committee (s): JC-14.4. STANDARDS & DOCUMENTS SEARCH JEP152. May 2007. This document is the work product of the JC-45.1 DDR2 DIMM Clock Skew Measurement task group.The purpose of this document is to define procedures to measure clock parameters on registered DIMMs using the DDR2 Clock Reference Board. It is NOT the intent of this document to set specification values or validationrequirements.
STANDARDS & DOCUMENTS SEARCH Title Document # Date; WIRE BOND SHEAR TEST: JESD22-B116B May 2017: This fully revised test provides a means for determining the strength of gold and copper ball bonds to a die or package bonding surface, and may be performed on pre-encapsulation or post-encapsulation parts. GUIDELINES FOR MEASURING THE THRESHOLD VOLTAGE (VT) OF SIC JEP183. Published: Jan 2021. This publication describes the guidelines for VT measurement methods and conditioning prior to VT testing in SiC power MOSFETs to reduce or eliminate the effect of the aforementioned hysteresis. Committee (s): JC-70.1. Free download. Registration orlogin required.
STRESS-TEST-DRIVEN QUALIFICATION OF AND FAILURE … This publication contains a set of frequently recommended and accepted JEDEC reliability stress tests. These tests are used for qualifying new and modified technology/ process/ product families, as well as individual solid state surface-mount products, in particular leadless chip carriers, ball grid array (BGA) packages, direct chip attach die and packages with exposed pads that are attached REQUIREMENTS FOR MICROELECTRONIC SCREENING AND TEST This document is designed to assist the manufacturer in optimizing the test flow while maintaining and/or improving assurance of providing high quality and reliable product in an efficient manner. This will allow for optimization of testing that is not adding value, hence, reducing cycle time and costs. Committee (s): JC-13, JC-13.2. STANDARDS & DOCUMENTS SEARCH This standard establishes requirements for the generation of electronic-device package designators for the JEDEC Solid State Technology Association. The requirements herein are intended to ensure that such designators are presented in as uniform a manner as practicable. Item 11.2-962. Committee (s): JC-11.2. STANDARDS & DOCUMENTS SEARCH JC-13: Government Liaison (4) Apply JC-13: Government Liaison filter JC-14: Quality and Reliability of Solid State Products (10) Apply JC-14: Quality and Reliability of Solid State Products filter JC-16: Interface Technology (1) Apply JC-16: Interface Technology filter JC-42: Solid State Memories (1) Apply JC-42: Solid State Memories filter JC-45: DRAM Modules (1) Apply JC-45: DRAM Modules filter STANDARDS & DOCUMENTS SEARCH JEP70C. Oct 2013. This document gathers and organizes common standards and publications relating to quality processes and methods relating to the solid-state, microelectronics, and associated industries. This is intended to facilitate access to the applicable documents when working with electronic hardware. STANDARDS & DOCUMENTS SEARCH Aug 2018. This standard describes a baseline set of acceptance tests for use in qualifying electronic components as new products, a product family, or as products in a process which is being changed. Committee (s): JC-14.3. Available for purchase: $76.00 Add to Cart. STANDARDS & DOCUMENTS SEARCH JC-10: Terms, Definitions, and Symbols (17) Apply JC-10: Terms, Definitions, and Symbols filter JC-11: Mechanical Standardization (600) Apply JC-11: Mechanical Standardization filter JC-13: Government Liaison (36) Apply JC-13: Government Liaison filter JC-14: Quality and Reliability of Solid State Products (154) Apply JC-14: Quality and Reliability of Solid State Products filter STANDARDS & DOCUMENTS SEARCH JEP70C. Oct 2013. This document gathers and organizes common standards and publications relating to quality processes and methods relating to the solid-state, microelectronics, and associated industries. This is intended to facilitate access to the applicable documents when working with electronic hardware. This will have a positive effect on STANDARDS & DOCUMENTS SEARCH This standard defines the form, fit and function of DDR4 connectors for U/R/LR modules supporting channels with transfer rates as high as 3.2 GT/S. It contains mechanical, electrical and reliability requirements for a one-piece connector mated to a module with nominal thickness of 1.40 mm. The intent of this document is to providePerformance
STANDARDS & DOCUMENTS SEARCH JESD204C. Dec 2017. This standard describes a serialized interface between data converters and logic devices. It contains normative information to enable designers to implement devices that communicate with other devices covered by this document. Informative sections are included to clarify and exemplify the standard. Committee (s): JC-16. STANDARDS & DOCUMENTS SEARCH JESD251A. Feb 2020. This standard is intended for use by SoC, ASIC, ASSP, and FPGA developers or vendors interested in incorporating a master interface having a low signal count and high data transfer bandwidth with access to multiple sources of slave devices compliant with the interface. It is also, intended for use by peripheraldevelopers or
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Please direct all media inquiries to: Emily Desjardins JEDEC Director of Marketing & Communications 703-907-7560 Email Emily HOME | JEDECSTANDARDS & DOCUMENTSCOMMITTEESNEWSEVENTS &MEETINGSJOINABOUT
JC-70, JEDEC’s newest main committee, is focused on the development of universal standards to help advance the adoption of wide bandgap (WBG) power technologies. STANDARDS & DOCUMENTS SEARCH HIGHLY ACCELERATED TEMPERATURE AND HUMIDITY STRESS TEST (HAST) JESD22-A110E. JOINT IPC/JEDEC STANDARD FOR HANDLING, PACKING, SHIPPING, AND USE OF MOISTURE/REFLOW SENSITIVE SURFACE-MOUNT DEVICES. J-STD-033D. JOINT IPC/JEDEC STANDARD FOR MOISTURE/REFLOW SENSITIVITY CLASSIFICATION FOR NONHERMETIC SURFACE-MOUNT DEVICES. STANDARDS & DOCUMENTS SEARCH Title Document # Date; Addendum No. 1 to JESD79-3 - 1.35 V DDR3L-800, DDR3L-1066, DDR3L-1333, DDR3L-1600, and DDR3L-1866 This is a minor editorial revision, the differences between revisions can be found on page 17 of the document. JEP30: PART MODEL GUIDELINES JEP30: Part Model Guidelines. JEP30 and its related documents are currently published and maintained as a JEDEC-wide project between the JC-11, JC-14, JC-15 and JC-42 Committees. JEP30 establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products. CUSTOMER NOTIFICATION STANDARD FOR PRODUCT/PROCESS …JEDEC MEMORY STANDARDJEDEC STANDARD PDFJEDEC STANDARD TRAYSWHAT IS JEDEC J-STD-046. Published: Jul 2016. This standard is applicable to suppliers of, and affected customers for, electronic products and their constituent components. This standard establishes the requirements for timely customer notification of changes to electronic products and associated processes. This document replaces JESD46. Committee (s): JC-14.4. STANDARDS & DOCUMENTS SEARCH JEP152. May 2007. This document is the work product of the JC-45.1 DDR2 DIMM Clock Skew Measurement task group.The purpose of this document is to define procedures to measure clock parameters on registered DIMMs using the DDR2 Clock Reference Board. It is NOT the intent of this document to set specification values or validationrequirements.
STANDARDS & DOCUMENTS SEARCH Title Document # Date; WIRE BOND SHEAR TEST: JESD22-B116B May 2017: This fully revised test provides a means for determining the strength of gold and copper ball bonds to a die or package bonding surface, and may be performed on pre-encapsulation or post-encapsulation parts. GUIDELINES FOR MEASURING THE THRESHOLD VOLTAGE (VT) OF SIC JEP183. Published: Jan 2021. This publication describes the guidelines for VT measurement methods and conditioning prior to VT testing in SiC power MOSFETs to reduce or eliminate the effect of the aforementioned hysteresis. Committee (s): JC-70.1. Free download. Registration orlogin required.
STRESS-TEST-DRIVEN QUALIFICATION OF AND FAILURE … This publication contains a set of frequently recommended and accepted JEDEC reliability stress tests. These tests are used for qualifying new and modified technology/ process/ product families, as well as individual solid state surface-mount products, in particular leadless chip carriers, ball grid array (BGA) packages, direct chip attach die and packages with exposed pads that are attached REQUIREMENTS FOR MICROELECTRONIC SCREENING AND TEST This document is designed to assist the manufacturer in optimizing the test flow while maintaining and/or improving assurance of providing high quality and reliable product in an efficient manner. This will allow for optimization of testing that is not adding value, hence, reducing cycle time and costs. Committee (s): JC-13, JC-13.2. HOME | JEDECSTANDARDS & DOCUMENTSCOMMITTEESNEWSEVENTS &MEETINGSJOINABOUT
JC-70, JEDEC’s newest main committee, is focused on the development of universal standards to help advance the adoption of wide bandgap (WBG) power technologies. STANDARDS & DOCUMENTS SEARCH HIGHLY ACCELERATED TEMPERATURE AND HUMIDITY STRESS TEST (HAST) JESD22-A110E. JOINT IPC/JEDEC STANDARD FOR HANDLING, PACKING, SHIPPING, AND USE OF MOISTURE/REFLOW SENSITIVE SURFACE-MOUNT DEVICES. J-STD-033D. JOINT IPC/JEDEC STANDARD FOR MOISTURE/REFLOW SENSITIVITY CLASSIFICATION FOR NONHERMETIC SURFACE-MOUNT DEVICES. STANDARDS & DOCUMENTS SEARCH Title Document # Date; Addendum No. 1 to JESD79-3 - 1.35 V DDR3L-800, DDR3L-1066, DDR3L-1333, DDR3L-1600, and DDR3L-1866 This is a minor editorial revision, the differences between revisions can be found on page 17 of the document. JEP30: PART MODEL GUIDELINES JEP30: Part Model Guidelines. JEP30 and its related documents are currently published and maintained as a JEDEC-wide project between the JC-11, JC-14, JC-15 and JC-42 Committees. JEP30 establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products. CUSTOMER NOTIFICATION STANDARD FOR PRODUCT/PROCESS …JEDEC MEMORY STANDARDJEDEC STANDARD PDFJEDEC STANDARD TRAYSWHAT IS JEDEC J-STD-046. Published: Jul 2016. This standard is applicable to suppliers of, and affected customers for, electronic products and their constituent components. This standard establishes the requirements for timely customer notification of changes to electronic products and associated processes. This document replaces JESD46. Committee (s): JC-14.4. STANDARDS & DOCUMENTS SEARCH JEP152. May 2007. This document is the work product of the JC-45.1 DDR2 DIMM Clock Skew Measurement task group.The purpose of this document is to define procedures to measure clock parameters on registered DIMMs using the DDR2 Clock Reference Board. It is NOT the intent of this document to set specification values or validationrequirements.
STANDARDS & DOCUMENTS SEARCH Title Document # Date; WIRE BOND SHEAR TEST: JESD22-B116B May 2017: This fully revised test provides a means for determining the strength of gold and copper ball bonds to a die or package bonding surface, and may be performed on pre-encapsulation or post-encapsulation parts. GUIDELINES FOR MEASURING THE THRESHOLD VOLTAGE (VT) OF SIC JEP183. Published: Jan 2021. This publication describes the guidelines for VT measurement methods and conditioning prior to VT testing in SiC power MOSFETs to reduce or eliminate the effect of the aforementioned hysteresis. Committee (s): JC-70.1. Free download. Registration orlogin required.
STRESS-TEST-DRIVEN QUALIFICATION OF AND FAILURE … This publication contains a set of frequently recommended and accepted JEDEC reliability stress tests. These tests are used for qualifying new and modified technology/ process/ product families, as well as individual solid state surface-mount products, in particular leadless chip carriers, ball grid array (BGA) packages, direct chip attach die and packages with exposed pads that are attached REQUIREMENTS FOR MICROELECTRONIC SCREENING AND TEST This document is designed to assist the manufacturer in optimizing the test flow while maintaining and/or improving assurance of providing high quality and reliable product in an efficient manner. This will allow for optimization of testing that is not adding value, hence, reducing cycle time and costs. Committee (s): JC-13, JC-13.2. STANDARDS & DOCUMENTS SEARCH This standard establishes requirements for the generation of electronic-device package designators for the JEDEC Solid State Technology Association. The requirements herein are intended to ensure that such designators are presented in as uniform a manner as practicable. Item 11.2-962. Committee (s): JC-11.2. STANDARDS & DOCUMENTS SEARCH JC-13: Government Liaison (4) Apply JC-13: Government Liaison filter JC-14: Quality and Reliability of Solid State Products (10) Apply JC-14: Quality and Reliability of Solid State Products filter JC-16: Interface Technology (1) Apply JC-16: Interface Technology filter JC-42: Solid State Memories (1) Apply JC-42: Solid State Memories filter JC-45: DRAM Modules (1) Apply JC-45: DRAM Modules filter STANDARDS & DOCUMENTS SEARCH JEP70C. Oct 2013. This document gathers and organizes common standards and publications relating to quality processes and methods relating to the solid-state, microelectronics, and associated industries. This is intended to facilitate access to the applicable documents when working with electronic hardware. STANDARDS & DOCUMENTS SEARCH Aug 2018. This standard describes a baseline set of acceptance tests for use in qualifying electronic components as new products, a product family, or as products in a process which is being changed. Committee (s): JC-14.3. Available for purchase: $76.00 Add to Cart. STANDARDS & DOCUMENTS SEARCH JC-10: Terms, Definitions, and Symbols (17) Apply JC-10: Terms, Definitions, and Symbols filter JC-11: Mechanical Standardization (600) Apply JC-11: Mechanical Standardization filter JC-13: Government Liaison (36) Apply JC-13: Government Liaison filter JC-14: Quality and Reliability of Solid State Products (154) Apply JC-14: Quality and Reliability of Solid State Products filter STANDARDS & DOCUMENTS SEARCH This standard defines the form, fit and function of DDR4 connectors for U/R/LR modules supporting channels with transfer rates as high as 3.2 GT/S. It contains mechanical, electrical and reliability requirements for a one-piece connector mated to a module with nominal thickness of 1.40 mm. The intent of this document is to providePerformance
STANDARDS & DOCUMENTS SEARCH JEP70C. Oct 2013. This document gathers and organizes common standards and publications relating to quality processes and methods relating to the solid-state, microelectronics, and associated industries. This is intended to facilitate access to the applicable documents when working with electronic hardware. This will have a positive effect onNEWS | JEDEC
Please direct all media inquiries to: Emily Desjardins JEDEC Director of Marketing & Communications 703-907-7560 Email Emily STANDARDS & DOCUMENTS SEARCH JESD204C. Dec 2017. This standard describes a serialized interface between data converters and logic devices. It contains normative information to enable designers to implement devices that communicate with other devices covered by this document. Informative sections are included to clarify and exemplify the standard. Committee (s): JC-16. STANDARDS & DOCUMENTS SEARCH JESD251A. Feb 2020. This standard is intended for use by SoC, ASIC, ASSP, and FPGA developers or vendors interested in incorporating a master interface having a low signal count and high data transfer bandwidth with access to multiple sources of slave devices compliant with the interface. It is also, intended for use by peripheraldevelopers or
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JC-70, JEDEC’s newest main committee, is focused on the development of universal standards to help advance the adoption of wide bandgap (WBG) power technologies. STANDARDS & DOCUMENTS SEARCH JC-10: Terms, Definitions, and Symbols (17) Apply JC-10: Terms, Definitions, and Symbols filter JC-11: Mechanical Standardization (600) Apply JC-11: Mechanical Standardization filter JC-13: Government Liaison (36) Apply JC-13: Government Liaison filter JC-14: Quality and Reliability of Solid State Products (154) Apply JC-14: Quality and Reliability of Solid State Products filter STANDARDS & DOCUMENTS SEARCH JC-10: Terms, Definitions, and Symbols (9) Apply JC-10: Terms, Definitions, and Symbols filter JC-11: Mechanical Standardization (107) Apply JC-11: Mechanical Standardization filter JC-13: Government Liaison (21) Apply JC-13: Government Liaison filter JC-14: Quality and Reliability of Solid State Products (122) Apply JC-14: Quality and Reliability of Solid State Products filter JEP30: PART MODEL GUIDELINES JEP30 and its related documents are currently published and maintained as a JEDEC-wide project between the JC-11, JC-14, JC-15 and JC-42 Committees.JEP30 establishes the requirements for exchanging part data between part manufacturers and their customers for STANDARDS & DOCUMENTS SEARCH Title Document # Date; Addendum No. 1 to JESD79-3 - 1.35 V DDR3L-800, DDR3L-1066, DDR3L-1333, DDR3L-1600, and DDR3L-1866 This is a minor editorial revision, the differences between revisions can be found on page 17 of the document. STANDARDS & DOCUMENTS SEARCH Title Document # Date; DDR2 DIMM CLOCK SKEW MEASUREMENT PROCEDURE USING A CLOCK REFERENCE BOARD: JEP152 May 2007: This document is the work product of the JC-45.1 DDR2 DIMM Clock Skew Measurement task group.The purpose of this document is to define procedures to measure clock parameters on registered DIMMs using the DDR2 Clock ReferenceBoard.
STANDARDS & DOCUMENTS SEARCH Title Document # Date; WIRE BOND SHEAR TEST: JESD22-B116B May 2017: This fully revised test provides a means for determining the strength of gold and copper ball bonds to a die or package bonding surface, and may be performed on pre-encapsulation or post-encapsulation parts. STRESS-TEST-DRIVEN QUALIFICATION OF AND FAILURE … This publication contains a set of frequently recommended and accepted JEDEC reliability stress tests. These tests are used for qualifying new and modified technology/ process/ product families, as well as individual solid state surface-mount products, in particular leadless chip carriers, ball grid array (BGA) packages, direct chip attach die and packages with exposed pads that are attached CUSTOMER NOTIFICATION STANDARD FOR PRODUCT/PROCESS …JEDEC MEMORY STANDARDJEDEC STANDARD PDFJEDEC STANDARD TRAYSWHAT IS JEDEC This standard is applicable to suppliers of, and affected customers for, electronic products and their constituent components. This standard establishes the requirements for timely customer notification of changes to electronic products and associated processes. REQUIREMENTS FOR MICROELECTRONIC SCREENING AND TEST The purpose of this document provides the basis for the optimization of 100% screening/stress operations and sample inspection testactivities.
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JC-70, JEDEC’s newest main committee, is focused on the development of universal standards to help advance the adoption of wide bandgap (WBG) power technologies. STANDARDS & DOCUMENTS SEARCH JC-10: Terms, Definitions, and Symbols (17) Apply JC-10: Terms, Definitions, and Symbols filter JC-11: Mechanical Standardization (600) Apply JC-11: Mechanical Standardization filter JC-13: Government Liaison (36) Apply JC-13: Government Liaison filter JC-14: Quality and Reliability of Solid State Products (154) Apply JC-14: Quality and Reliability of Solid State Products filter STANDARDS & DOCUMENTS SEARCH JC-10: Terms, Definitions, and Symbols (9) Apply JC-10: Terms, Definitions, and Symbols filter JC-11: Mechanical Standardization (107) Apply JC-11: Mechanical Standardization filter JC-13: Government Liaison (21) Apply JC-13: Government Liaison filter JC-14: Quality and Reliability of Solid State Products (122) Apply JC-14: Quality and Reliability of Solid State Products filter JEP30: PART MODEL GUIDELINES JEP30 and its related documents are currently published and maintained as a JEDEC-wide project between the JC-11, JC-14, JC-15 and JC-42 Committees.JEP30 establishes the requirements for exchanging part data between part manufacturers and their customers for STANDARDS & DOCUMENTS SEARCH Title Document # Date; Addendum No. 1 to JESD79-3 - 1.35 V DDR3L-800, DDR3L-1066, DDR3L-1333, DDR3L-1600, and DDR3L-1866 This is a minor editorial revision, the differences between revisions can be found on page 17 of the document. STANDARDS & DOCUMENTS SEARCH Title Document # Date; DDR2 DIMM CLOCK SKEW MEASUREMENT PROCEDURE USING A CLOCK REFERENCE BOARD: JEP152 May 2007: This document is the work product of the JC-45.1 DDR2 DIMM Clock Skew Measurement task group.The purpose of this document is to define procedures to measure clock parameters on registered DIMMs using the DDR2 Clock ReferenceBoard.
STANDARDS & DOCUMENTS SEARCH Title Document # Date; WIRE BOND SHEAR TEST: JESD22-B116B May 2017: This fully revised test provides a means for determining the strength of gold and copper ball bonds to a die or package bonding surface, and may be performed on pre-encapsulation or post-encapsulation parts. STRESS-TEST-DRIVEN QUALIFICATION OF AND FAILURE … This publication contains a set of frequently recommended and accepted JEDEC reliability stress tests. These tests are used for qualifying new and modified technology/ process/ product families, as well as individual solid state surface-mount products, in particular leadless chip carriers, ball grid array (BGA) packages, direct chip attach die and packages with exposed pads that are attached CUSTOMER NOTIFICATION STANDARD FOR PRODUCT/PROCESS …JEDEC MEMORY STANDARDJEDEC STANDARD PDFJEDEC STANDARD TRAYSWHAT IS JEDEC This standard is applicable to suppliers of, and affected customers for, electronic products and their constituent components. This standard establishes the requirements for timely customer notification of changes to electronic products and associated processes. REQUIREMENTS FOR MICROELECTRONIC SCREENING AND TEST The purpose of this document provides the basis for the optimization of 100% screening/stress operations and sample inspection testactivities.
STANDARDS & DOCUMENTS SEARCH JC-10: Terms, Definitions, and Symbols (9) Apply JC-10: Terms, Definitions, and Symbols filter JC-11: Mechanical Standardization (107) Apply JC-11: Mechanical Standardization filter JC-13: Government Liaison (21) Apply JC-13: Government Liaison filter JC-14: Quality and Reliability of Solid State Products (122) Apply JC-14: Quality and Reliability of Solid State Products filter STANDARDS & DOCUMENTS SEARCH JC-13: Government Liaison (4) Apply JC-13: Government Liaison filter JC-14: Quality and Reliability of Solid State Products (10) Apply JC-14: Quality and Reliability of Solid State Products filter JC-16: Interface Technology (1) Apply JC-16: Interface Technology filter JC-42: Solid State Memories (1) Apply JC-42: Solid State Memories filter JC-45: DRAM Modules (1) Apply JC-45: DRAM Modules filter STANDARDS & DOCUMENTS SEARCH Paying JEDEC Members may login for free access.. TEST METHODS TO CHARACTERIZE VOIDING IN PRE-SMT BALL GRID ARRAY PACKAGES: JESD217.01 Oct 2016: This publication provides an overview of solder void types, outlines current metrologies and test methods used for pre-SMPT solder void characterization and potential limitations, and prescribes sampling strategy for data collection, and STANDARDS & DOCUMENTS SEARCH JC-10: Terms, Definitions, and Symbols (17) Apply JC-10: Terms, Definitions, and Symbols filter JC-11: Mechanical Standardization (600) Apply JC-11: Mechanical Standardization filter JC-13: Government Liaison (36) Apply JC-13: Government Liaison filter JC-14: Quality and Reliability of Solid State Products (154) Apply JC-14: Quality and Reliability of Solid State Products filter STANDARDS & DOCUMENTS SEARCH To help cover the costs of producing standards, JEDEC is now charging for non-member access to selected standards and design files. Most ofthe content on
STANDARDS & DOCUMENTS SEARCH To help cover the costs of producing standards, JEDEC is now charging for non-member access to selected standards and design files. Most ofthe content on
STANDARDS & DOCUMENTS SEARCH Title Document # Date; JOINT JEDEC/ECA STANDARD, DEFINITION OF “LOW-HALOGEN” FOR ELECTRONIC PRODUCTS: JS709C Mar 2018: This standard provides terms and definitions for “low-halogen” electronic products that have the potential to contain the halogens bromine (Br) and chlorine (Cl) from the use of BFRs, CFRs, and PVC, and recommends methods for marking and labeling.NEWS | JEDEC
Please direct all media inquiries to: Emily Desjardins JEDEC Director of Marketing & Communications 703-907-7560 Email Emily MEMBERSHIP DUES & DETAILS Membership in JEDEC is open to companies and organizations conducting business that itself or through a related entity manufactures electronic equipment or electronics-related products or relatedservices.
STANDARDS & DOCUMENTS SEARCH Title Document # Date; SERIAL INTERFACE FOR DATA CONVERTERS: JESD204C Dec 2017: This standard describes a serialized interface between data converters and logic devices. Forgot Password | Site Login Go to maincontent Menu
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SEARCH & DOWNLOAD JEDEC DOCUMENTS Search by keyword or document number. Search: or Browse by Keyword » ------------------------- TECHNOLOGY FOCUS AREAS For over 50 years, JEDEC has been the global leader in developing open standards and publications for the microelectronics industry. JEDEC committees provide industry leadership in developing standards for a broad range of technologies. Current areas of focus include: * Main Memory: DDR4 & DDR5 SDRAM * Flash Memory: SSDs, UFS, e.MMC * Mobile Memory: LPDDR, Wide I/O * Memory Module Design File Registrations * Memory Configurations: JESD21-C * Registered Outlines: JEP95 * JEP30: Part Model Guidelines * Lead-Free Manufacturing * ESD: Electrostatic DischargeCOMMITTEE MEETINGS
Web Conference: BoD
7 May 2020
JC-14.7
10 - 11 May 2020
Web Conference: JC-1412 - 14 May 2020
CANCELED JC-13
18 - 21 May 2020
CANCELED JC-16,40,42,45,63,641 - 4 Jun 2020
CANCELED JC-11
3 - 4 Jun 2020
Board of Directors
3 Aug 2020
JC-16,40,42,45,63,6431 Aug - 3 Sep 2020
See more meetings »COMMITTEE MEETINGS
Web Conference: BoD
7 May 2020
JC-14.7
10 - 11 May 2020
Web Conference: JC-1412 - 14 May 2020
CANCELED JC-13
18 - 21 May 2020
CANCELED JC-16,40,42,45,63,641 - 4 Jun 2020
CANCELED JC-11
3 - 4 Jun 2020
Board of Directors
3 Aug 2020
JC-16,40,42,45,63,6431 Aug - 3 Sep 2020
See more meetings »EVENTS
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JEDEC committees develop open standards, which are the basic building blocks of the digital economy and form the bedrock on which healthy, high-volume markets are built. JEDEC's technical committees focus on a broad range of technologies from memory to wide bandgap semiconductors, and quality & reliability, to name just a few.More »
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