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August 16-18, 2020
DISTRIBUTED SERVICES ARCHITECTURE P4 Stage Design HotChips 2020 | August 18,2020 5 Table Engine builds lookup keys up to 2048-bits wide • Hash, TCAM, and direct indextables supported
HOT CHIPS-RYZEN MOBILE-SONU ARORA 071720 V17 green electronics council catalyst awards 2016 energy manager today awards product 2016 2014 2015 2016 2017 2018 2019 31.7x additionalenergy
INSIDE TIGER LAKE
Fabrics and Memory Coherent Fabric • 2x increase in coherent fabric bandwidth – Dual ring microarchitecture • 50% LLC size increase to non-inclusive • IO caching Memory • More efficient memory bandwidth for graphics and cores – Support for up to ~86GB/s of memory bandwidth – Deeper, narrower dual memory controller forhigher
HIGH-DENSITY MULTI-TENANT BARE-METAL CLOUD WITH MEMORY Problems Problem1: VM-based Cloud has non- ignorable virtualization overhead, isolation/security concern and limited single thread performance, but good manageability Problem2: Existing bare-metal cloud design for single tenant, lack of HANGUANG 800 NPU THE ULTIMATE AI INFERENCE SOLUTION FOR Hanguang 800 NPU –The Ultimate AI Inference Solution for Data Centers Yang Jiao, Liang Han, Xin Long, & Team Alibaba Group SAINT-S: 3D SRAM STACKING SOLUTION BASED ON 7NM TSV TECHNOLOGY SAINT-S: 3D SRAM Stacking Solution based on 7nm TSV technology Kyoungsun Cho, Jinhong Park, Billy Koo, Sunkyoung Seo, Yoonjae Hwang, Sungcheol Park and Mijung Noh THE ERA OF HIGH BANDWIDTH MEMORY 7 Mechanical Outline : molded KGSD Confidential Item Value Bump Remark CD Pitch (a) Gen1 - Package Dimension (X, Y) 5.48 mm x 7.29mm 25um (As Reflow) 55um Face Centered Rectangular (FCR) patternHOT CHIPS 2019
Habana Labs Hot Chips 2019 1 Hot Chips 2019 Eitan Medina Aug 2019 HOME ATTENDEESIN THE NEWSARCHIVESSPONSORS COURTYARD Home Register Now! Please join us on-line for Hot Chips 33 held Sunday-Tuesday, August 22-24, 2021. Due to continued uncertainty around the spread of Covid-19, IBM’S POWER10 PROSSOR IBM’s POWER10 Prossor William Starke Brian Thompto Hot Chips 32August 16-18, 2020
DISTRIBUTED SERVICES ARCHITECTURE P4 Stage Design HotChips 2020 | August 18,2020 5 Table Engine builds lookup keys up to 2048-bits wide • Hash, TCAM, and direct indextables supported
HOT CHIPS-RYZEN MOBILE-SONU ARORA 071720 V17 green electronics council catalyst awards 2016 energy manager today awards product 2016 2014 2015 2016 2017 2018 2019 31.7x additionalenergy
INSIDE TIGER LAKE
Fabrics and Memory Coherent Fabric • 2x increase in coherent fabric bandwidth – Dual ring microarchitecture • 50% LLC size increase to non-inclusive • IO caching Memory • More efficient memory bandwidth for graphics and cores – Support for up to ~86GB/s of memory bandwidth – Deeper, narrower dual memory controller forhigher
HIGH-DENSITY MULTI-TENANT BARE-METAL CLOUD WITH MEMORY Problems Problem1: VM-based Cloud has non- ignorable virtualization overhead, isolation/security concern and limited single thread performance, but good manageability Problem2: Existing bare-metal cloud design for single tenant, lack of HANGUANG 800 NPU THE ULTIMATE AI INFERENCE SOLUTION FOR Hanguang 800 NPU –The Ultimate AI Inference Solution for Data Centers Yang Jiao, Liang Han, Xin Long, & Team Alibaba Group SAINT-S: 3D SRAM STACKING SOLUTION BASED ON 7NM TSV TECHNOLOGY SAINT-S: 3D SRAM Stacking Solution based on 7nm TSV technology Kyoungsun Cho, Jinhong Park, Billy Koo, Sunkyoung Seo, Yoonjae Hwang, Sungcheol Park and Mijung Noh THE ERA OF HIGH BANDWIDTH MEMORY 7 Mechanical Outline : molded KGSD Confidential Item Value Bump Remark CD Pitch (a) Gen1 - Package Dimension (X, Y) 5.48 mm x 7.29mm 25um (As Reflow) 55um Face Centered Rectangular (FCR) patternHOT CHIPS 2019
Habana Labs Hot Chips 2019 1 Hot Chips 2019 Eitan Medina Aug 2019 IBM’S POWER10 PROSSOR IBM’s POWER10 Prossor William Starke Brian Thompto Hot Chips 32August 16-18, 2020
THE GPU ARCHITECTURE The Road to Gen 11 Gen 8 Gen 7 Gen 6 Gen 1 Gen 2 Gen 3 Gen 4 Gen 5 Gen 9 Discrete Chipset Integrated DISTRIBUTED SERVICES ARCHITECTURE P4 Stage Design HotChips 2020 | August 18,2020 5 Table Engine builds lookup keys up to 2048-bits wide • Hash, TCAM, and direct indextables supported
PERFORMANCE INNOVATION FOR GPU COMPUTING 3 3rd gen. NVLINK 40MB L2 6.7x capacity 108 SMs 6912 CUDA Cores 1.56 TB/s HBM2 1.7x bandwidth 54 Billion Transistors in 7nm Multi-Instance GPU A100 HBM2 HBM2 HBM2 HBM2 HBM2 HOT CHIPS-RYZEN MOBILE-SONU ARORA 071720 V17 green electronics council catalyst awards 2016 energy manager today awards product 2016 2014 2015 2016 2017 2018 2019 31.7x additionalenergy
INSIDE TIGER LAKE
Fabrics and Memory Coherent Fabric • 2x increase in coherent fabric bandwidth – Dual ring microarchitecture • 50% LLC size increase to non-inclusive • IO caching Memory • More efficient memory bandwidth for graphics and cores – Support for up to ~86GB/s of memory bandwidth – Deeper, narrower dual memory controller forhigher
DGX A100 SUPERPOD
13 DGX A100 SUPERPOD A Modular Model 1K GPU SuperPOD Cluster • 140 DGX A100 nodes (1,120 GPUs) in a GPU POD • 1st tier fast storage - DDN AI400x with Lustre IBM ZNEXT - HOT CHIPS 2012 IBM Corporation Smarter Systems for a Smarter Planet 3 0 1 2 3 4 5 2000 Z900 2003 Z990 2005 z9 2008 z10 2010 z196 770 MHz 1.2 GHz 1.7GHz
RTX ON THE NVIDIA TURING GPU 3 tu102 –titan rtx 18.6 billion transistors introducing turing sm 72 cuda cores 4608 tensor cores 576 rt cores 72 geometry units 36 texture units 288 rop units 96 memory 384-bit 7 ghz gddr6 nvlink channels 2 PROFESSIONAL H.265/HEVC ENCODER LSI TOWARD HIGH-QUALITY 4K Copyright©2015 NTT corp. All Rights Reserved. 10 NARA block diagram 8K Configurable Reference Picture Image CacheReference Picture ImageCache
HOME ATTENDEESIN THE NEWSARCHIVESSPONSORS COURTYARD Home Register Now! Please join us on-line for Hot Chips 33 held Sunday-Tuesday, August 22-24, 2021. Due to continued uncertainty around the spread of Covid-19, TUTORIALS - HOT CHIPS A Symposium on High Performance Chips. Title Tutorial 1A: Machine Learning Scale Out BREAK Tutorial 1B: Machine Learning Scale Out HIGH-DENSITY MULTI-TENANT BARE-METAL CLOUD WITH MEMORY Problems Problem1: VM-based Cloud has non- ignorable virtualization overhead, isolation/security concern and limited single thread performance, but good manageability Problem2: Existing bare-metal cloud design for single tenant, lack of SAINT-S: 3D SRAM STACKING SOLUTION BASED ON 7NM TSV TECHNOLOGY SAINT-S: 3D SRAM Stacking Solution based on 7nm TSV technology Kyoungsun Cho, Jinhong Park, Billy Koo, Sunkyoung Seo, Yoonjae Hwang, Sungcheol Park and Mijung Noh IBM ZNEXT - HOT CHIPS 2012 IBM Corporation Smarter Systems for a Smarter Planet 3 0 1 2 3 4 5 2000 Z900 2003 Z990 2005 z9 2008 z10 2010 z196 770 MHz 1.2 GHz 1.7GHz
XILINX FIRST 7NM DEVICE: VERSAL AI CORE (VC1902) Copyright 2019 Xilinx Accelerating 5G Wireless on Versal 5G Wireless Infrastructure g l r g g g O d s o DAC o y Digital Radio w/ ADC/DAC DUC: Digital Up Converter PROFESSIONAL H.265/HEVC ENCODER LSI TOWARD HIGH-QUALITY 4K Copyright©2015 NTT corp. All Rights Reserved. 10 NARA block diagram 8K Configurable Reference Picture Image CacheReference Picture ImageCache
ARM’S FIRST-GENERATION MACHINE LEARNING PROCESSOR 2018 Arm Limited Arm’s First-Generation Machine LearningProcessor Ian Bratt
PERFORMANCE CHARACTERISTICS OF THE POWER8 PROCESSOR Performance Characteristics of the POWER8™ Processor Alex Mericas Systems Performance IBM Systems & Technology Group Development SOFTWARE IN SILICON IN THE ORACLE SPARC M7 Title: How to Use the PowerPoint Template Author: dllutz Subject: Corproate Presentation Template Created Date: 8/19/2016 2:47:11 PM HOME ATTENDEESIN THE NEWSARCHIVESSPONSORS COURTYARD Home Register Now! Please join us on-line for Hot Chips 33 held Sunday-Tuesday, August 22-24, 2021. Due to continued uncertainty around the spread of Covid-19, TUTORIALS - HOT CHIPS A Symposium on High Performance Chips. Title Tutorial 1A: Machine Learning Scale Out BREAK Tutorial 1B: Machine Learning Scale Out HIGH-DENSITY MULTI-TENANT BARE-METAL CLOUD WITH MEMORY Problems Problem1: VM-based Cloud has non- ignorable virtualization overhead, isolation/security concern and limited single thread performance, but good manageability Problem2: Existing bare-metal cloud design for single tenant, lack of SAINT-S: 3D SRAM STACKING SOLUTION BASED ON 7NM TSV TECHNOLOGY SAINT-S: 3D SRAM Stacking Solution based on 7nm TSV technology Kyoungsun Cho, Jinhong Park, Billy Koo, Sunkyoung Seo, Yoonjae Hwang, Sungcheol Park and Mijung Noh IBM ZNEXT - HOT CHIPS 2012 IBM Corporation Smarter Systems for a Smarter Planet 3 0 1 2 3 4 5 2000 Z900 2003 Z990 2005 z9 2008 z10 2010 z196 770 MHz 1.2 GHz 1.7GHz
XILINX FIRST 7NM DEVICE: VERSAL AI CORE (VC1902) Copyright 2019 Xilinx Accelerating 5G Wireless on Versal 5G Wireless Infrastructure g l r g g g O d s o DAC o y Digital Radio w/ ADC/DAC DUC: Digital Up Converter PROFESSIONAL H.265/HEVC ENCODER LSI TOWARD HIGH-QUALITY 4K Copyright©2015 NTT corp. All Rights Reserved. 10 NARA block diagram 8K Configurable Reference Picture Image CacheReference Picture ImageCache
ARM’S FIRST-GENERATION MACHINE LEARNING PROCESSOR 2018 Arm Limited Arm’s First-Generation Machine LearningProcessor Ian Bratt
PERFORMANCE CHARACTERISTICS OF THE POWER8 PROCESSOR Performance Characteristics of the POWER8™ Processor Alex Mericas Systems Performance IBM Systems & Technology Group Development SOFTWARE IN SILICON IN THE ORACLE SPARC M7 Title: How to Use the PowerPoint Template Author: dllutz Subject: Corproate Presentation Template Created Date: 8/19/2016 2:47:11 PM TUTORIALS - HOT CHIPS A Symposium on High Performance Chips. Title Tutorial 1A: Machine Learning Scale Out BREAK Tutorial 1B: Machine Learning Scale Out DISTRIBUTED SERVICES ARCHITECTURE P4 Stage Design HotChips 2020 | August 18,2020 5 Table Engine builds lookup keys up to 2048-bits wide • Hash, TCAM, and direct indextables supported
INSIDE TIGER LAKE
Fabrics and Memory Coherent Fabric • 2x increase in coherent fabric bandwidth – Dual ring microarchitecture • 50% LLC size increase to non-inclusive • IO caching Memory • More efficient memory bandwidth for graphics and cores – Support for up to ~86GB/s of memory bandwidth – Deeper, narrower dual memory controller forhigher
64-BIT ARM CPU AND SOC 1 X-Gene™: 64-bit ARM CPU and SoC 8.29.2012 Gaurav Singh Greg FavorParamesh Gopi
IBM ZNEXT - HOT CHIPS 2012 IBM Corporation Smarter Systems for a Smarter Planet 3 0 1 2 3 4 5 2000 Z900 2003 Z990 2005 z9 2008 z10 2010 z196 770 MHz 1.2 GHz 1.7GHz
GPU - HOT CHIPS
7nm 251 sqmm 10.3 Billion Transistors X16 PCIe® Gen 4.0 8 GB GDDR6 256b @14 Gbps 448 GB/S* 2560 Stream Processors Up To 9.75 TFLOPs *256 pin G6 * 14 Gbps *1B/8b = 448 GBS THE ERA OF HIGH BANDWIDTH MEMORY 7 Mechanical Outline : molded KGSD Confidential Item Value Bump Remark CD Pitch (a) Gen1 - Package Dimension (X, Y) 5.48 mm x 7.29mm 25um (As Reflow) 55um Face Centered Rectangular (FCR) patternHOT CHIPS 2019
Habana Labs Hot Chips 2019 1 Hot Chips 2019 Eitan Medina Aug 2019 PERFORMANCE CHARACTERISTICS OF THE POWER8 PROCESSOR Performance Characteristics of the POWER8™ Processor Alex Mericas Systems Performance IBM Systems & Technology Group Development JACK DOWECK, WEN-FU KAO Jack Doweck, Wen-fu Kao Intel Corporation, 2016 Authors: Ittai Anati, David Blythe, Jack Doweck, Hong Jiang, Wen-fu Kao, Julius Mandelblat,Lihu
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REGISTER NOW!PERMALINK__ Please join us on-line for Hot Chips 33 held Sunday-Tuesday, August 22-24, 2021. Due to continued uncertainty around the spread of Covid-19, there will not be an in-person conference for Hot Chips 33. All tutorials, keynotes, and sessions will be broadcast in a live video stream that all registered conference attendees will be able to access with a password protected login. Credentials will be emailed to you before the start of the conference. The broadcast will originate in the Pacific Time Zone. Once a session is completed you will also be able to watch a recorded video at any time that is convenient for you. Per-talk Slack channels connect you to presenters for live Q&A and discussions with other attendees. This year there is a single fee that includes both tutorial and conference days. There are no single day or single session options.ATTENDEE TYPE
EARLY
LATE
PROFESSIONAL, IEEE MEMBER$100
$130
PROFESSIONAL, NON-MEMBER$125
$160
STUDENT, IEEE MEMBER$40
$50
STUDENT, NON-MEMBER
$50
$65
PAYMENT METHODS : At the present time we can ONLY accept Master Card, Visa, and Discover for payment. SPECIAL NOTE ON AMERICAN EXPRESS™: At the moment we cannot accept American Express™ cards. We apologize for this inconvenience. We are working on the problem and expect to have it solved soon. Please checkback.
TO OUR COLLEAGUES AROUND THE WORLD: HOT CHIPS is open to everyone. Due to security measures imposed by some countries and internet vendors you may experience difficulty registering or paying for your registration. If this happens please contact us directly at registration@hotchips.org. More registration information can be found here . ADVANCE PROGRAMPERMALINK__ TUTORIALS: SUNDAY, AUGUST 22ND, 2021PERMALINK__TITLE
_Tutorial 1: ML Performance and Real World Applications Machine learning is a rich, varied, and rapidly evolving field. This tutorial will explore the applications, performance characteristics, and key challenges of many different unique workloads across training and inference. In particular, we will focus on hardware/software co-optimization for the industry-standard MLPerf™ benchmarks and selected applications and considerations at prominent cloud players._ _Tutorial 2: Advanced Packaging This tutorial will discuss advanced packaging technologies that enable performance and density improvements. Descriptions of the technologies and how they are used in cutting edge applications will be made by industry leaders in packaging and chip design._ CONFERENCE DAY 1: MONDAY, AUGUST 23RD, 2021PERMALINK__TIME (PDT)
TITLE
PRESENTERS
8:45AM-9:00AM
_Introductions_
9:00AM-11:00AM
_CPUs_
INTEL ALDER LAKE CPU ARCHITECTURESEfraim Rotem, Intel
AMD NEXT GENERATION “ZEN 3” COREMark Evers, AMD
THE >5GHZ NEXT GENERATION IBM Z PROCESSOR CHIP Christian Jacobi, IBM NEXT-GEN INTEL XEON CPU - SAPPHIRE RAPIDS Arijit Biswas and Sailesh Kottapalli, Intel11:30AM-12:30PM
_Academic Spinout Chips_ MOZART: DESIGNING FOR SOFTWARE MATURITY AND THE NEXT PARADIGM FORCHIP ARCHITECTURES
Karu Sankaralingam, University of Wisconsin- Madison MORPHEUS II: A RISC-V SECURITY EXTENSION FOR PROTECTING VULNERABLE SOFTWARE AND HARDWARE Todd Austin, University of Michigan12:30PM-1:30PM
_Keynote_
SYNOPSYS KEYNOTE
Aart de Geus, CEO, Synopsys2:30PM-4:00PM
_Infrastructure and Data Processors_ ARM NEOVERSE N2: ARM’S SECOND-GENERATION HIGH PERFORMANCE INFRASTRUCTURE CPUS AND SYSTEM PRODUCTS Andrea Pellegrini, ARM NVIDIA DATA CENTER PROCESSING UNIT (DPU) ARCHITECTURE Idan Burstein, NVIDIA INTEL’S HYPERSCALE-READY SMARTNIC FOR INFRASTRUCTURE PROCESSING Bradley Burres, Intel4:00PM-5:00PM
_Keynote_
SKYDIO AUTONOMY ENGINE: ENABLING THE NEXT GENERATION OF AUTONOMOUSFLIGHT
Abraham Bachrach, CTO, Skydio5:30PM-7:00PM
_Enabling Technologies_ HETEROGENEOUS COMPUTING TO ENABLE THE HIGHEST LEVEL OF SAFETY INAUTOMOTIVE SYSTEMS
Ramanujan Venkatadri, Infineon ARCHITECTING AN OPEN RISC-V 5G AND AI SOC FOR NEXT GENERATION 5G OPEN RADIO ACCESS NETWORK Sriram Rajagopal, EdgeQ AQUABOLT-XL: SAMSUNG HBM2-PIM WITH IN-MEMORY PROCESSING FOR MACHINE LEARNING ACCELERATORS Jin Hyun Kim, Samsung Electronics CONFERENCE DAY 2: TUESDAY, AUGUST 24TH, 2021PERMALINK__TIME (PDT)
TITLE
PRESENTERS
8:30AM-10:00AM
_ML Inference for the Cloud_ ACCELERATING ML RECOMMENDATION WITH OVER A THOUSAND RISC-V/TENSOR PROCESSORS ON ESPERANTO’S ET-SOC-1 CHIP David Ditzel, Esperanto Technologies AI COMPUTE CHIP FROM ENFLAME Ryan Liu and Chuang Feng, Enflame Technology QUALCOMM CLOUD AI 100: 12 TOPS/W SCALABLE, HIGH PERFORMANCE AND LOW LATENCY DEEP LEARNING INFERENCE ACCELERATOR Karam Chatha, Qualcomm Inc10:00AM-11:00AM
_Keynote_
KEYNOTE
Dimitri Kusnezov, Deputy Under Secretary for AI and Technology, Department of Energy11:30AM-1:30PM
_ML and Computation Platforms_ GRAPHCORE COLOSSUS MK2 IPU Simon Knowles, Graphcore THE MULTI-MILLION CORE, MULTI-WAFER AI CLUSTER Sean Lie, Cerebras Systems SAMBANOVA SN10 RDU: ACCELERATING SOFTWARE 2.0 WITH DATAFLOW Raghu Prabhakar and Sumti Jairath, SambaNova Systems, Inc THE ANTON 3 ASIC: A FIRE-BREATHING MONSTER FOR MOLECULAR DYNAMICSSIMULATIONS
J. Adam Butts and David E. Shaw, D.E. Shaw Research2:30PM-4:30PM
_Graphics and Video_ INTEL’S PONTE VECCHIO GPU ARCHITECTUREDavid Blythe, Intel
AMD RDNA(TM) 2 GRAPHICS ARCHITECTURE Andrew Pomianowski, AMD GOOGLE’S VIDEO CODING UNIT (VCU) ACCELERATOR Aki Kuusela and Clint Smullen, Google XILINX 7NM EDGE PROCESSORS Juanjo Noguera, Xilinx5:00PM-7:00PM
_New Technologies_
MOJO LENS - AR CONTACT LENSES FOR REAL PEOPLE Michael Wiemer and Renaldi Winoto, Mojo Vision WORLD LARGEST MOBILE IMAGE SENSOR WITH ALL DIRECTIONAL PHASE DETECTION AUTO FOCUS FUNCTION Sukki Yoon, Samsung Electronics NEW VALUE CREATION BY NANO-TACTILE SENSOR CHIP EXCEEDING OUR FINGERTIP DISCRIMINATION ABILITY Hidekuni Takao, Kagawa University THE IONQ TRAPPED ION QUANTUM COMPUTER ARCHITECTURE Christopher Monroe, IonQ, Inc* __ Twitter
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2021 Hot Chips.
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