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proprietary
ANODIC BONDING
Anodic bonding is a technique to produce hermetic sealing between silicon/metals and glass insulators without using an intermediate layer. Borosilicate glass with high alkali ion concentration is a major requirement for this process. Different from other bonding techniques, anodic bonding involves heating and applying an electricfield to the
EVG ® 6200 NT
The EVG ® 6200 NT mask aligner is a versatile tool for optical double-side lithography and wafer sizes up to 200 mm. Features Technical Data. Known for its automation flexibility and reliability, the EVG6200 NT provides state-of-the-art mask alignment technology on a minimized footprint area combined with the utmost throughput,advanced
EVG ® 7200 LA
The EVG7200 Large-Area UV Nanoimprint System scales nanoimprint lithography (NIL) to Gen 3 (550 mm x 650 mm) panel-size substrates using EVG’s proprietary and volume-proven SmartNIL technology. For applications such as displays, wire grid polarizers, biotechnology and photonic elements, which cannot be reduced in size, it is crucial to COMBOND® AUTOMATED HIGH-VACUUM WAFER BONDING SYSTEM The EVG ComBond high-vacuum wafer bonding platform marks a new milestone in EVG’s unique portfolio of wafer bonding equipment and technology in response to market needs for more sophisticated integration processes. The application areas supported by the EVG ComBond range from advanced engineered substrates, stacked solar cellsand power
EVG ® 620 NT
The EVG ® 620 NT provides state-of-the art mask alignment technology on a minimized footprint area up to 150 mm wafer size. Known for its versatility and reliability, the EVG620 NT provides state-of-the-art mask alignment technology on a minimized footprint area combined with advanced alignment features and optimized total cost of ownership. TECHNOLOGIES MLE™ MASKLESS EXPOSURE 3 04.07.2019 - Maskless Exposure Technology EV Group - DI Erich Thallner Strasse 1 - 4782 St. Florian am Inn - Austria - Contact@EVGroup.com www.EVGroup.com The core element of each lithography process is the exposure unit, which defines the characteristic performance of the lithography EV GROUP JAPANTRANSLATE THIS PAGE EV Group Japan KK Yokohama Business Park East Tower 1F 134, Godo-cho, Hodogaya-ku, Yokohama-shi KANAGAWA, 240-0005, Japan涂胶工艺技术
Resist processing technology is widely used for numerous micro- and nanotechnology applications and products addressing different markets, such as advanced packaging, MEMS, MOEMS and sensors, microfluidics, RF devices, photonics and many more. MLE™ - MOVING BEYOND TRADITIONAL MASK-BASED LITHOGRAPHY MLE (maskless exposure) technology is a revolutionary next-generation lithography technology developed by EV Group to address future back-end lithography needs for advanced packaging, MEMS, biomedical and IC substrate applications. EVG®520 IS SEMI-AUTOMATED WAFER BONDING SYSTEM Single or dual chamber wafer bonding system for low volume production. The EVG520 IS single-chamber unit handles wafers up to 200 mm with semi-automated operation for small-volume-production applications. Redesigned based on customer feedback and EV Group's continuous technological innovations, the EVG520 IS features EV Group'sproprietary
ANODIC BONDING
Anodic bonding is a technique to produce hermetic sealing between silicon/metals and glass insulators without using an intermediate layer. Borosilicate glass with high alkali ion concentration is a major requirement for this process. Different from other bonding techniques, anodic bonding involves heating and applying an electricfield to the
EVG ® 6200 NT
The EVG ® 6200 NT mask aligner is a versatile tool for optical double-side lithography and wafer sizes up to 200 mm. Features Technical Data. Known for its automation flexibility and reliability, the EVG6200 NT provides state-of-the-art mask alignment technology on a minimized footprint area combined with the utmost throughput,advanced
EVG ® 7200 LA
The EVG7200 Large-Area UV Nanoimprint System scales nanoimprint lithography (NIL) to Gen 3 (550 mm x 650 mm) panel-size substrates using EVG’s proprietary and volume-proven SmartNIL technology. For applications such as displays, wire grid polarizers, biotechnology and photonic elements, which cannot be reduced in size, it is crucial to COMBOND® AUTOMATED HIGH-VACUUM WAFER BONDING SYSTEM The EVG ComBond high-vacuum wafer bonding platform marks a new milestone in EVG’s unique portfolio of wafer bonding equipment and technology in response to market needs for more sophisticated integration processes. The application areas supported by the EVG ComBond range from advanced engineered substrates, stacked solar cellsand power
EVG ® 620 NT
The EVG ® 620 NT provides state-of-the art mask alignment technology on a minimized footprint area up to 150 mm wafer size. Known for its versatility and reliability, the EVG620 NT provides state-of-the-art mask alignment technology on a minimized footprint area combined with advanced alignment features and optimized total cost of ownership. TECHNOLOGIES MLE™ MASKLESS EXPOSURE 3 04.07.2019 - Maskless Exposure Technology EV Group - DI Erich Thallner Strasse 1 - 4782 St. Florian am Inn - Austria - Contact@EVGroup.com www.EVGroup.com The core element of each lithography process is the exposure unit, which defines the characteristic performance of the lithography EV GROUP JAPANTRANSLATE THIS PAGE EV Group Japan KK Yokohama Business Park East Tower 1F 134, Godo-cho, Hodogaya-ku, Yokohama-shi KANAGAWA, 240-0005, Japan涂胶工艺技术
Resist processing technology is widely used for numerous micro- and nanotechnology applications and products addressing different markets, such as advanced packaging, MEMS, MOEMS and sensors, microfluidics, RF devices, photonics and many more. EV GROUP UNLOCKS AGILE AND EFFICIENT PRODUCTION SCALING ST. FLORIAN, Austria, June 8, 2021—EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced the EVG ® 770 NT—its next-generation step-and-repeat nanoimprint lithography (NIL) system. The EVG770 NT enables precise replication of micro- and nano-patterns for large-area master stamp MASK ALIGNMENT SYSTEMS Mask Alignment Systems. EVG’s inventions, such as the world’s first bottom-side alignment system in 1985, have pioneered and set the industry standards in both top and double-sided lithography, aligned wafer bonding and nanoimprint lithography. EVG contributes in these areas through continuous development of mask aligner productgenerations
FUSION AND HYBRID BONDING Fusion or direct wafer bonding enables permanent connection via dielectric layers on each wafer surface used for engineered substrate or layer transfer such as backside illuminated CMOS image sensors. Hybrid bonding extends fusion bonding with embedded metal pads in the bond interface, allowing for face-to-face connection of wafers.EVG ® 620 NT
The EVG ® 620 NT provides state-of-the art mask alignment technology on a minimized footprint area up to 150 mm wafer size. Known for its versatility and reliability, the EVG620 NT provides state-of-the-art mask alignment technology on a minimized footprint area combined with advanced alignment features and optimized total cost of ownership. EVG ® 105 - EV GROUP The stand-alone EVG ® 105 bake module is designed for soft- or post-exposure bake processes. Features Technical Data. Softbake, post-exposure bake and hardbake processes can be performed on the EVG105 bake module. Controlled baking environment assures uniform evaporation. Programmable proximity pins provide the best availablecontrol of resist
TECHNOLOGIES MLE™ MASKLESS EXPOSURE 3 04.07.2019 - Maskless Exposure Technology EV Group - DI Erich Thallner Strasse 1 - 4782 St. Florian am Inn - Austria - Contact@EVGroup.com www.EVGroup.com The core element of each lithography process is the exposure unit, which defines the characteristic performance of the lithography EV GROUP | SEMICONDUCTOR MANUFACTURING …TRANSLATE THIS PAGE我们的Triple
i理念体现在整个公司对技术的热情、创新实力和国际化。我们的愿景是“率先探索新技术,为微纳米制造技术的下一代应用服务”,这使我们的客户能够成功地将他们的新产品理念商业化。 EV GROUP® PRODUCTS SOLUTIONS FOR METROLOGY www.EVGroup.com Application Examples EV GROUP® | Products // Metrology // Solutions for Metrology EVG®50 / IMM - Key Features Fusion Bonded Wafers Total stack measurements: - Thickness - TTV - Bow and warp Voids and dimples in bond interface Bonded Wafers w/ IR transparent interlayerEVG GERMANY
Products. Lithography; Nanoimprint Lithography; Bonding; Metrology; Process Development Services; Technologies. MLE™ - Maskless Exposure Technology; Nanoimprint涂胶工艺技术
Resist processing technology is widely used for numerous micro- and nanotechnology applications and products addressing different markets, such as advanced packaging, MEMS, MOEMS and sensors, microfluidics, RF devices, photonics and many more. THIS WEBSITE USES COOKIES We use cookies to provide social media features and to analyse our traffic. We also share information about your use of our site with our social media, advertising and analytics partners who may combine it with other information that you’ve provided to them or that they’ve collected from your use of their services. You consent to our cookies if you continue to use our website. Use necessary cookies only Allow all cookies Show detailsOK
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EV GROUP UNVEILS HYBRID DIE-TO-WAFER BONDING ACTIVATION SOLUTION TO SPEED UP DEPLOYMENT OF 3D HETEROGENEOUS INTEGRATIONRead more
Maskless Lithography EV Group brings maskless lithography to high-volume manufacturing withLITHOSCALE®
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EVG Academy
EV Group establishes state-of-the-art customer training facility at corporate headquartersRead more
EVG in the Press
EVG’s MLE technology takes over where traditional lithography meets its limits. Read more in our article “Maskless lithography and the shift to 3D integration“ in the May/June edition of Chip ScaleReview
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INVENT – INNOVATE – IMPLEMENTTRIPLE I PHILOSOPHY
Our Triple i philosophy is reflected in the enthusiasm for technology, innovative strength and internationality of the entire company. Our vison of “being the first in exploring new techniques and serving next-generation applications of micro- and nanofabrication technologies” enables our customers to successfully commercialize their new product ideas.Our Products
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EV GROUP EARNS IMPRESSIVE NINTH CONSECUTIVE TRIPLE CROWN WIN IN VLSIRESEARCH 2021 CUSTOMER SATISFACTION SURVEYLearn More
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ASM PACIFIC TECHNOLOGY AND EV GROUP JOIN FORCES TO ENABLE INDUSTRY’S FIRST ULTRA PRECISION DIE-TO-WAFER HYBRID BONDING SOLUTIONS FOR 3D-IC HETEROGENEOUS INTEGRATIONLearn More
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