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SOFTWARE DOWNLOAD
IPMICFG is an in-band utility for configuring IPMI devices. Accept EULA. 303. IPMIView. Windows. exe. 10-07-20. 2.18.0. IPMIView is a GUI-based software application that allows administrators to manage multiple target systems through BMC. SUPERMICRO | PRODUCTS | MOTHERBOARDS | XEON® BOARDS | X9DRD-LF CSE-825TQ-R740LPB. Important Chassis Notes. To support the new generation Intel® Xeon® processor-based motherboards, Revision M chassis is recommended. Please talk to your sales representative for details. Please use optional I/O shield MCP-260-00041-0N in Supermicro 1U chassis. SuperServer (s) with X9DRD-LF. Model (s) SYS-6017R-TDLF. X12SPI-TF | MOTHERBOARDS | PRODUCTS | SUPER MICRO COMPUTER X12SPi-TF | Motherboards | Products | Super Micro Computer, Inc. Print. High Performance. Key Features. 3rd Gen Intel® Xeon® Scalable processors, Single Socket LGA-4189 (Socket P+) supported, CPU TDP supports Up to 270W TDP. Intel® C621A. Up to 2TB RDIMM, DDR4-3200MHz; Up to 2TB LRDIMM, DDR4-3200MHz. Up to 2TB Intel® Optane™ Persistent X12DPT-B6 | MOTHERBOARDS | PRODUCTS | SUPER MICRO COMPUTER X12DPT-B6 | Motherboards | Products | Super Micro Computer, Inc. Print. Key Features. 3rd Gen Intel® Xeon® Scalable processors. Dual Socket LGA-4189 (Socket P+) supported, CPU TDP supports Up to 270W TDP, 3 UPI up to 11.2 GT/s. Intel® C621A. Up to 4TB RDIMM, DDR4-3200MHz; Up to 4TB LRDIMM, DDR4-3200MHz. Up to 2TB Intel® Optane™ Persistent H12DSI-NT6 | MOTHERBOARDS | SUPER MICRO COMPUTER, INC. H12DSi-NT6 | Motherboards | Super Micro Computer, Inc. Print. Key Features. 1. Dual AMD EPYC™ 7003/7002 Series Processors 2. 4TB Registered ECC DDR4 3200MHz SDRAM in 16 DIMMs 3. Expansion slots: 3 PCI-E 4.0 x16 slots, 3 PCI-E 4.0 x8 slots. M.2 Interface: 11019P-FHN2T
Machine Learning (ML) Retail, Smart Medical Expert Systems. . 1. Single Socket P (LGA 3647) supports. 2nd Gen Intel® Xeon® Scalable. processor ‡ 2. 6 DIMMs; up to 1.5TB 3DS ECC. DDR4-2933MHz RDIMM/LRDIMM 3. 2 PCI-E 3.0 x16 (FHFL) slots 4. 2 Hot-swap 2.5" SATA3drive bays;
X11DDW-L | MOTHERBOARDS | PRODUCTS | SUPER MICRO COMPUTER X11DDW-L | Motherboards | Products | Super Micro Computer, Inc. Print. Datacenter Optimized. Key Features. 2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors, Dual Socket LGA-3647 (Socket P) supported, CPU TDP support Up to 205W TDP, 2 UPI up to 10.4 GT/s. Intel® C621. Up to 3TB 3DS ECC RDIMM, DDR4-2933MHz;Up to
X12SPA-TF | MOTHERBOARDS | PRODUCTS | SUPER MICRO COMPUTER Key Features. 3rd Gen Intel® Xeon® Scalable processors. Single Socket LGA-4189 (Socket P+) supported, CPU TDP supports Up to 270W TDP. Intel® C621A. Up to 4TB 3DS ECC RDIMM, DDR4-3200MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-3200MHz. Up to 4TB Intel® Optane™ Persistent Memory 200 Series, DDR4-3200MHz, in 16 DIMM slots. 4 PCI-E 4.0 x16,6049SP-E1CR90
1. Single Node High density, 2 rear mirrored. boot drives, 4 NVMe SSD drives for caching 2. Dual Socket P (LGA 3647) support. 2nd Gen Intel® Xeon® Scalable. processors (Cascade Lake/Skylake)‡ 3. 16 DIMMs; up to 4TB 3DS ECC. DDR4-2933MHz† RDIMM/LRDIMM, SupportsIntel®
SUPERMICRO | SERVER STORAGE, INNOVATION, CLOUD AND AIMOTHERBOARDS5G PLATFORMSRAID / HBAABOUT USC7Q270-CB-MLMINI TOWER Learn about Supermicro, the premier provider of advanced Server Building Block Solutions® for 5G/Edge, Data Center, Cloud, Enterprise, Big Data, HPC and Embedded markets worldwide.SOFTWARE DOWNLOAD
IPMICFG is an in-band utility for configuring IPMI devices. Accept EULA. 303. IPMIView. Windows. exe. 10-07-20. 2.18.0. IPMIView is a GUI-based software application that allows administrators to manage multiple target systems through BMC. SUPERMICRO | PRODUCTS | MOTHERBOARDS | XEON® BOARDS | X9DRD-LF CSE-825TQ-R740LPB. Important Chassis Notes. To support the new generation Intel® Xeon® processor-based motherboards, Revision M chassis is recommended. Please talk to your sales representative for details. Please use optional I/O shield MCP-260-00041-0N in Supermicro 1U chassis. SuperServer (s) with X9DRD-LF. Model (s) SYS-6017R-TDLF. X12SPI-TF | MOTHERBOARDS | PRODUCTS | SUPER MICRO COMPUTER X12SPi-TF | Motherboards | Products | Super Micro Computer, Inc. Print. High Performance. Key Features. 3rd Gen Intel® Xeon® Scalable processors, Single Socket LGA-4189 (Socket P+) supported, CPU TDP supports Up to 270W TDP. Intel® C621A. Up to 2TB RDIMM, DDR4-3200MHz; Up to 2TB LRDIMM, DDR4-3200MHz. Up to 2TB Intel® Optane™ Persistent X12DPT-B6 | MOTHERBOARDS | PRODUCTS | SUPER MICRO COMPUTER X12DPT-B6 | Motherboards | Products | Super Micro Computer, Inc. Print. Key Features. 3rd Gen Intel® Xeon® Scalable processors. Dual Socket LGA-4189 (Socket P+) supported, CPU TDP supports Up to 270W TDP, 3 UPI up to 11.2 GT/s. Intel® C621A. Up to 4TB RDIMM, DDR4-3200MHz; Up to 4TB LRDIMM, DDR4-3200MHz. Up to 2TB Intel® Optane™ Persistent H12DSI-NT6 | MOTHERBOARDS | SUPER MICRO COMPUTER, INC. H12DSi-NT6 | Motherboards | Super Micro Computer, Inc. Print. Key Features. 1. Dual AMD EPYC™ 7003/7002 Series Processors 2. 4TB Registered ECC DDR4 3200MHz SDRAM in 16 DIMMs 3. Expansion slots: 3 PCI-E 4.0 x16 slots, 3 PCI-E 4.0 x8 slots. M.2 Interface: 11019P-FHN2T
Machine Learning (ML) Retail, Smart Medical Expert Systems. . 1. Single Socket P (LGA 3647) supports. 2nd Gen Intel® Xeon® Scalable. processor ‡ 2. 6 DIMMs; up to 1.5TB 3DS ECC. DDR4-2933MHz RDIMM/LRDIMM 3. 2 PCI-E 3.0 x16 (FHFL) slots 4. 2 Hot-swap 2.5" SATA3drive bays;
X11DDW-L | MOTHERBOARDS | PRODUCTS | SUPER MICRO COMPUTER X11DDW-L | Motherboards | Products | Super Micro Computer, Inc. Print. Datacenter Optimized. Key Features. 2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors, Dual Socket LGA-3647 (Socket P) supported, CPU TDP support Up to 205W TDP, 2 UPI up to 10.4 GT/s. Intel® C621. Up to 3TB 3DS ECC RDIMM, DDR4-2933MHz;Up to
X12SPA-TF | MOTHERBOARDS | PRODUCTS | SUPER MICRO COMPUTER Key Features. 3rd Gen Intel® Xeon® Scalable processors. Single Socket LGA-4189 (Socket P+) supported, CPU TDP supports Up to 270W TDP. Intel® C621A. Up to 4TB 3DS ECC RDIMM, DDR4-3200MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-3200MHz. Up to 4TB Intel® Optane™ Persistent Memory 200 Series, DDR4-3200MHz, in 16 DIMM slots. 4 PCI-E 4.0 x16,6049SP-E1CR90
1. Single Node High density, 2 rear mirrored. boot drives, 4 NVMe SSD drives for caching 2. Dual Socket P (LGA 3647) support. 2nd Gen Intel® Xeon® Scalable. processors (Cascade Lake/Skylake)‡ 3. 16 DIMMs; up to 4TB 3DS ECC. DDR4-2933MHz† RDIMM/LRDIMM, SupportsIntel®
SOFTWARE DOWNLOAD
IPMICFG is an in-band utility for configuring IPMI devices. Accept EULA. 303. IPMIView. Windows. exe. 10-07-20. 2.18.0. IPMIView is a GUI-based software application that allows administrators to manage multiple target systems through BMC. X12SPI-TF | MOTHERBOARDS | PRODUCTS | SUPER MICRO COMPUTER X12SPi-TF | Motherboards | Products | Super Micro Computer, Inc. Print. High Performance. Key Features. 3rd Gen Intel® Xeon® Scalable processors, Single Socket LGA-4189 (Socket P+) supported, CPU TDP supports Up to 270W TDP. Intel® C621A. Up to 2TB RDIMM, DDR4-3200MHz; Up to 2TB LRDIMM, DDR4-3200MHz. Up to 2TB Intel® Optane™ Persistent SUPERMICRO | PRODUCTS | MOTHERBOARDS | XEON® BOARDS Products Motherboards Xeon® Boards 1. Dual socket R (LGA 2011) supports. and E5-2600 v2 family† 2. Intel® C602 chipset; QPI up to 8.0GT/s 3. Up to 1.5TB ECC DDR3, up to 1866MHz; * Depends on memory configuration 4. X12SPA-TF | MOTHERBOARDS | PRODUCTS | SUPER MICRO COMPUTER Key Features. 3rd Gen Intel® Xeon® Scalable processors. Single Socket LGA-4189 (Socket P+) supported, CPU TDP supports Up to 270W TDP. Intel® C621A. Up to 4TB 3DS ECC RDIMM, DDR4-3200MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-3200MHz. Up to 4TB Intel® Optane™ Persistent Memory 200 Series, DDR4-3200MHz, in 16 DIMM slots. 4 PCI-E 4.0 x16, X11SPL-F | MOTHERBOARDS | PRODUCTS | SUPER MICRO COMPUTER 12" x 9.6" (30.48cm x 24.38cm) Processor/Cache. CPU. 2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors. Single Socket LGA-3647 (Socket P) supported, CPU TDP supports Up to 165W TDP. Cores / Cache. Up to 28 cores. Note. BIOS version 3.0a or above is required to support 2nd Generation Intel Xeon ScalableProcessors-SP.
X12DPI-NT6 | MOTHERBOARDS | PRODUCTS | SUPER MICRO X12DPi-NT6 | Motherboards | Products | Super Micro Computer, Inc. Print. Key Features. 3rd Gen Intel® Xeon® Scalable processors. Dual Socket LGA-4189 (Socket P+) supported, CPU TDP supports Up to 270W TDP, 3 UPI up to 11.2 GT/s. Intel® C621A. Up to 4TB RDIMM, DDR4-3200MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-3200MHz. SECURITY VULNERABILITIES REGARDING SPECTRE, MELTDOWN, AND Security Vulnerabilities Regarding Side Channel Speculative Execution and Indirect Branch Prediction Information Disclosure (CVE-2017-5715, CVE-2017-5753, CVE-2017-5754, CVE-2018-3639, CVE-2018-3640, Intel-SA-00088, Spectre, Meltdown, Intel-SA-00088, Intel-SA-00115,CVE)
H12SSG-AN6 | MOTHERBOARDS | SUPER MICRO COMPUTER, INC. Optional Parts List : Part Number: Qty: Description: TPM security module: AOM-TPM-9655V-TPM 1.2 module with Infineon 9655, RoHS/REACH,PBF; AOM-TPM-9655V-S LIQUID COOLING SOLUTIONS FROM SUPERMICRO 202 1Copyright Super Micro Computer, Inc. All rights reserved June 202 5 is the pump, which circulates the liquid and is placed directly on the chip to improve flow.5019S-MR-G1585L
Y split, big 4 pin to two RA SATA power estenstion 30cm: Hot-swap 2.5" kit (FDD slot) MCP-220-81504-0N: 1: Single slim 2.5" SAS3 (12Gb/s) hot swap in slim FDD form factor This website stores cookies on your computer. These cookies are used to collect information about how you interact with our website and allow us to remember you. We use this information in order to improve and customize your browsing experience and for analytics and metrics about our visitors both on this website and other media. To find out more about the cookies we use, see our Privacy Policy. If you decline, your information won’t be tracked when you visit this website. A single cookie will be used in your browser to remember your preference not to be tracked.Accept Decline
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