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PDN TERM DEFINITION
Definition of the PDN acronym term used in manufacturing. VISIBLE HAND TERM DEFINITION The Visible Hand is a term that comes from the book: The Managerial Revolution in American Business is a 1977 business book by AlfredChandler.
PC&L TERM DEFINITION Definition of the PC&L acronym term used in manufacturing. Production, Control and Logistics. The engineering group responsible for ensuring smooth flow of needed material (physical and information). SYSTEMATIC LAYOUT PLANNING TERM DEFINITION Systematic layout planning (SLP) is an organized way to conduct layout planning. It consists of a framework of phases, a pattern of procedures and a set of conventions for identifying, rating and visualizing the elements and areas involved in planning a layout. GPDS TERM DEFINITION Definition of the GPDS acronym term used in manufacturing. Global Product Description System. A corporate common mainframe computer system for product engineering. CRITICAL CHARACTERISTICS TERM DEFINITION (1) Characteristics applicable to a component material, assembly, or vehicle assembly operation which are designated by Engineering as being critical to part function and having particular quality, reliability and/or durability significance. PRODUCTION LEVELLING TERM DEFINITION Production leveling, also known as production smoothing is a technique for reducing the muda waste and vital to the development of production efficiency in Lean Manufacturing. STANDARD IN-PROCESS STOCK TERM DEFINITION One of the three elements that make up standard work. It is the minimum quantity of parts always on hand for processing during and between subprocesses. PROCESS VELOCITY TERM DEFINITION Is the ratio of actual throughput time that it takes for a product to go through the process by the value added time required to complete the product or service. ABC ΟΡΙΣΜΌΣ ΌΡΟΣ ΑΠΟΘΕΜΆΤΩΝTRANSLATE THIS PAGE abc Απογραφή είναι επίσης γνωστή ως ανάλυση abc, είναι ένας όρος των επιχειρήσεων πουPDN TERM DEFINITION
Definition of the PDN acronym term used in manufacturing. VISIBLE HAND TERM DEFINITION The Visible Hand is a term that comes from the book: The Managerial Revolution in American Business is a 1977 business book by AlfredChandler.
PC&L TERM DEFINITION Definition of the PC&L acronym term used in manufacturing. Production, Control and Logistics. The engineering group responsible for ensuring smooth flow of needed material (physical and information). SYSTEMATIC LAYOUT PLANNING TERM DEFINITION Systematic layout planning (SLP) is an organized way to conduct layout planning. It consists of a framework of phases, a pattern of procedures and a set of conventions for identifying, rating and visualizing the elements and areas involved in planning a layout. GPDS TERM DEFINITION Definition of the GPDS acronym term used in manufacturing. Global Product Description System. A corporate common mainframe computer system for product engineering. CRITICAL CHARACTERISTICS TERM DEFINITION (1) Characteristics applicable to a component material, assembly, or vehicle assembly operation which are designated by Engineering as being critical to part function and having particular quality, reliability and/or durability significance. PRODUCTION LEVELLING TERM DEFINITION Production leveling, also known as production smoothing is a technique for reducing the muda waste and vital to the development of production efficiency in Lean Manufacturing. STANDARD IN-PROCESS STOCK TERM DEFINITION One of the three elements that make up standard work. It is the minimum quantity of parts always on hand for processing during and between subprocesses. PROCESS VELOCITY TERM DEFINITION Is the ratio of actual throughput time that it takes for a product to go through the process by the value added time required to complete the product or service. ABC ΟΡΙΣΜΌΣ ΌΡΟΣ ΑΠΟΘΕΜΆΤΩΝTRANSLATE THIS PAGE abc Απογραφή είναι επίσης γνωστή ως ανάλυση abc, είναι ένας όρος των επιχειρήσεων πουSTS TERM DEFINITION
Definition of the STS acronym term used in manufacturing. Meaning 1: Sales (& Use) Tax System Meaning 2: Sealed Tank System. Meaning 3: MASTER PRODUCTION SCHEDULE (MPS) TERM DEFINITION A Master Production Schedule or MPS is the plan that a company has developed for production, inventory, staffing, etc. It sets the quantity of each end item to be completed in each week of a short-range planning horizon. CRITICAL CHARACTERISTICS TERM DEFINITION (1) Characteristics applicable to a component material, assembly, or vehicle assembly operation which are designated by Engineering as being critical to part function and having particular quality, reliability and/or durability significance. CAPDO TERM DEFINITION Definition of the CAPDo acronym term used in manufacturing. Check, Act, Plan, Do. A variation of the PDCA cycle that initiates the "check" to understand how the process is VITAL FEW, USEFUL MANY TERM DEFINITION (1) A term Joseph M. Juran used to describe the Pareto principle, which he first defined in 1950. (The principle was used much earlier in economics and inventory control methods.) TOTAL QUALITY CONTROL (TQC) TERM DEFINITION Total quality control, also called total quality management, is an approach that extends beyond ordinary statistical quality control techniques and quality improvement methods.PQP TERM DEFINITION
Definition of the PQP acronym term used in manufacturing. CONTROL SHIPPING LEVEL 2 TERM DEFINITION Refers to GM terminology when the non conformances reach a criteria it is than required to have a third party and a supplier conduct 100% of all inspection of manufactured parts before delivery. HYDROPLASTIC FORMING TERM DEFINITION Definition of the Hydroplastic forming acronym term used inmanufacturing.
ABC ΟΡΙΣΜΌΣ ΌΡΟΣ ΑΠΟΘΕΜΆΤΩΝTRANSLATE THIS PAGE abc Απογραφή είναι επίσης γνωστή ως ανάλυση abc, είναι ένας όρος των επιχειρήσεων πουPDN TERM DEFINITION
PDN - short version. Product Discrepancy Notice. AdvertisingMFC TERM DEFINITION
MFC - short version. Material Flow Coordinator . Advertising PC&L TERM DEFINITION Definition of the PC&L acronym term used in manufacturing. Production, Control and Logistics. The engineering group responsible for ensuring smooth flow of needed material (physical and information). SYSTEMATIC LAYOUT PLANNING TERM DEFINITION Systematic layout planning (SLP) is an organized way to conduct layout planning. It consists of a framework of phases, a pattern of procedures and a set of conventions for identifying, rating and visualizing the elements and areas involved in planning a layout. GPDS TERM DEFINITION GPDS - short version. Global Product Description System. A corporate common mainframe computer system for product engineering. The System provides a common product database for GM. It describes and authorizes product description information throughout STANDARD IN-PROCESS STOCK TERM DEFINITION Standard In-Process Stock - short version. One of the three elements that make up standard work. It is the minimum quantity of parts always on hand for processing during and between subprocesses. It allows workers to do their jobs continuously in a set sequence, repeating the PRODUCTION LEVELLING TERM DEFINITION Production is levelled by making one model, then another model, and so on. Production leveling, also known as production smoothing is a technique for reducing the muda waste and vital to the development of production efficiency in Lean Manufacturing. The general idea is to produce intermediate goods at a constant rate, to allow further CRITICAL CHARACTERISTICS TERM DEFINITION Critical Characteristics - short version. (1) Characteristics applicable to a component material, assembly, or vehicle assembly operation which are designated by Engineering as being critical to part function and having particular quality, reliability and/or durability significance. PROCESS VELOCITY TERM DEFINITION Process Velocity - short version. Is the ratio of actual throughput time that it takes for a product to go through the process by the value added time required to complete the product or service. ABC ΟΡΙΣΜΌΣ ΌΡΟΣ ΑΠΟΘΕΜΆΤΩΝTRANSLATE THIS PAGE abc Απογραφή είναι επίσης γνωστή ως ανάλυση abc, είναι ένας όρος των επιχειρήσεων πουPDN TERM DEFINITION
PDN - short version. Product Discrepancy Notice. AdvertisingMFC TERM DEFINITION
MFC - short version. Material Flow Coordinator . Advertising PC&L TERM DEFINITION Definition of the PC&L acronym term used in manufacturing. Production, Control and Logistics. The engineering group responsible for ensuring smooth flow of needed material (physical and information). SYSTEMATIC LAYOUT PLANNING TERM DEFINITION Systematic layout planning (SLP) is an organized way to conduct layout planning. It consists of a framework of phases, a pattern of procedures and a set of conventions for identifying, rating and visualizing the elements and areas involved in planning a layout. GPDS TERM DEFINITION GPDS - short version. Global Product Description System. A corporate common mainframe computer system for product engineering. The System provides a common product database for GM. It describes and authorizes product description information throughout STANDARD IN-PROCESS STOCK TERM DEFINITION Standard In-Process Stock - short version. One of the three elements that make up standard work. It is the minimum quantity of parts always on hand for processing during and between subprocesses. It allows workers to do their jobs continuously in a set sequence, repeating the PRODUCTION LEVELLING TERM DEFINITION Production is levelled by making one model, then another model, and so on. Production leveling, also known as production smoothing is a technique for reducing the muda waste and vital to the development of production efficiency in Lean Manufacturing. The general idea is to produce intermediate goods at a constant rate, to allow further CRITICAL CHARACTERISTICS TERM DEFINITION Critical Characteristics - short version. (1) Characteristics applicable to a component material, assembly, or vehicle assembly operation which are designated by Engineering as being critical to part function and having particular quality, reliability and/or durability significance. PROCESS VELOCITY TERM DEFINITION Process Velocity - short version. Is the ratio of actual throughput time that it takes for a product to go through the process by the value added time required to complete the product or service. ABC ΟΡΙΣΜΌΣ ΌΡΟΣ ΑΠΟΘΕΜΆΤΩΝTRANSLATE THIS PAGE abc Απογραφή είναι επίσης γνωστή ως ανάλυση abc, είναι ένας όρος των επιχειρήσεων πουSTS TERM DEFINITION
STS - short version. Meaning 1: Sales (& Use) Tax System. Meaning 2: Sealed Tank System. Meaning 3: Service Training Standards. Meaning 4: Seville Touring Sedan. CAPDO TERM DEFINITION Definition of the CAPDo acronym term used in manufacturing. Check, Act, Plan, Do. A variation of the PDCA cycle that initiates the "check" to understand how the process is MASTER PRODUCTION SCHEDULE (MPS) TERM DEFINITION Master Production Schedule (MPS) - long version. A Master Production Schedule or MPS is the plan that a company has developed for production, inventory, staffing, etc. It sets the quantity of each end item to be completed in each week of a short-range planning horizon. The Master Production Schedule gives production, planning, purchasing,and
PQP TERM DEFINITION
PQP - short version. Product Quality Planning . Advertising VITAL FEW, USEFUL MANY TERM DEFINITION Vital Few, Useful Many - short version. (1) A term Joseph M. Juran used to describe the Pareto principle, which he first defined in 1950. (The principle was used much earlier in economics and inventory control methods.) The principle suggests most effects come from relatively few causes; that is, 80% of the effects come from 20% ofthe possible
TOTAL QUALITY CONTROL (TQC) TERM DEFINITION Total quality control, also called total quality management, is an approach that extends beyond ordinary statistical quality control techniques and quality improvement methods. It implies a complete overview and re-evaluation of the specification of a product, rather than just considering a more limited set of changeable features withinan
CRITICAL CHARACTERISTICS TERM DEFINITION Critical Characteristics - short version. (1) Characteristics applicable to a component material, assembly, or vehicle assembly operation which are designated by Engineering as being critical to part function and having particular quality, reliability and/or durability significance. CONTROL SHIPPING LEVEL 2 TERM DEFINITION Control Shipping Level 2 - short version. Refers to GM terminology when the non conformances reach a criteria it is than required to have a third party and a supplier conduct 100% of all inspection of manufactured parts before delivery. HYDROPLASTIC FORMING TERM DEFINITION Definition of the Hydroplastic forming acronym term used inmanufacturing.
ABC ΟΡΙΣΜΌΣ ΌΡΟΣ ΑΠΟΘΕΜΆΤΩΝTRANSLATE THIS PAGE abc Απογραφή είναι επίσης γνωστή ως ανάλυση abc, είναι ένας όρος των επιχειρήσεων πουPDN TERM DEFINITION
PDN - short version. Product Discrepancy Notice. AdvertisingMFC TERM DEFINITION
MFC - short version. Material Flow Coordinator . Advertising PC&L TERM DEFINITION Definition of the PC&L acronym term used in manufacturing. Production, Control and Logistics. The engineering group responsible for ensuring smooth flow of needed material (physical and information). SYSTEMATIC LAYOUT PLANNING TERM DEFINITION Systematic layout planning (SLP) is an organized way to conduct layout planning. It consists of a framework of phases, a pattern of procedures and a set of conventions for identifying, rating and visualizing the elements and areas involved in planning a layout. GPDS TERM DEFINITION GPDS - short version. Global Product Description System. A corporate common mainframe computer system for product engineering. The System provides a common product database for GM. It describes and authorizes product description information throughout STANDARD IN-PROCESS STOCK TERM DEFINITION Standard In-Process Stock - short version. One of the three elements that make up standard work. It is the minimum quantity of parts always on hand for processing during and between subprocesses. It allows workers to do their jobs continuously in a set sequence, repeating the PRODUCTION LEVELLING TERM DEFINITION Production is levelled by making one model, then another model, and so on. Production leveling, also known as production smoothing is a technique for reducing the muda waste and vital to the development of production efficiency in Lean Manufacturing. The general idea is to produce intermediate goods at a constant rate, to allow further CRITICAL CHARACTERISTICS TERM DEFINITION Critical Characteristics - short version. (1) Characteristics applicable to a component material, assembly, or vehicle assembly operation which are designated by Engineering as being critical to part function and having particular quality, reliability and/or durability significance. PROCESS VELOCITY TERM DEFINITION Process Velocity - short version. Is the ratio of actual throughput time that it takes for a product to go through the process by the value added time required to complete the product or service. ABC ΟΡΙΣΜΌΣ ΌΡΟΣ ΑΠΟΘΕΜΆΤΩΝTRANSLATE THIS PAGE abc Απογραφή είναι επίσης γνωστή ως ανάλυση abc, είναι ένας όρος των επιχειρήσεων πουPDN TERM DEFINITION
PDN - short version. Product Discrepancy Notice. AdvertisingMFC TERM DEFINITION
MFC - short version. Material Flow Coordinator . Advertising PC&L TERM DEFINITION Definition of the PC&L acronym term used in manufacturing. Production, Control and Logistics. The engineering group responsible for ensuring smooth flow of needed material (physical and information). SYSTEMATIC LAYOUT PLANNING TERM DEFINITION Systematic layout planning (SLP) is an organized way to conduct layout planning. It consists of a framework of phases, a pattern of procedures and a set of conventions for identifying, rating and visualizing the elements and areas involved in planning a layout. GPDS TERM DEFINITION GPDS - short version. Global Product Description System. A corporate common mainframe computer system for product engineering. The System provides a common product database for GM. It describes and authorizes product description information throughout STANDARD IN-PROCESS STOCK TERM DEFINITION Standard In-Process Stock - short version. One of the three elements that make up standard work. It is the minimum quantity of parts always on hand for processing during and between subprocesses. It allows workers to do their jobs continuously in a set sequence, repeating the PRODUCTION LEVELLING TERM DEFINITION Production is levelled by making one model, then another model, and so on. Production leveling, also known as production smoothing is a technique for reducing the muda waste and vital to the development of production efficiency in Lean Manufacturing. The general idea is to produce intermediate goods at a constant rate, to allow further CRITICAL CHARACTERISTICS TERM DEFINITION Critical Characteristics - short version. (1) Characteristics applicable to a component material, assembly, or vehicle assembly operation which are designated by Engineering as being critical to part function and having particular quality, reliability and/or durability significance. PROCESS VELOCITY TERM DEFINITION Process Velocity - short version. Is the ratio of actual throughput time that it takes for a product to go through the process by the value added time required to complete the product or service. ABC ΟΡΙΣΜΌΣ ΌΡΟΣ ΑΠΟΘΕΜΆΤΩΝTRANSLATE THIS PAGE abc Απογραφή είναι επίσης γνωστή ως ανάλυση abc, είναι ένας όρος των επιχειρήσεων πουSTS TERM DEFINITION
STS - short version. Meaning 1: Sales (& Use) Tax System. Meaning 2: Sealed Tank System. Meaning 3: Service Training Standards. Meaning 4: Seville Touring Sedan. CAPDO TERM DEFINITION Definition of the CAPDo acronym term used in manufacturing. Check, Act, Plan, Do. A variation of the PDCA cycle that initiates the "check" to understand how the process is MASTER PRODUCTION SCHEDULE (MPS) TERM DEFINITION Master Production Schedule (MPS) - long version. A Master Production Schedule or MPS is the plan that a company has developed for production, inventory, staffing, etc. It sets the quantity of each end item to be completed in each week of a short-range planning horizon. The Master Production Schedule gives production, planning, purchasing,and
PQP TERM DEFINITION
PQP - short version. Product Quality Planning . Advertising VITAL FEW, USEFUL MANY TERM DEFINITION Vital Few, Useful Many - short version. (1) A term Joseph M. Juran used to describe the Pareto principle, which he first defined in 1950. (The principle was used much earlier in economics and inventory control methods.) The principle suggests most effects come from relatively few causes; that is, 80% of the effects come from 20% ofthe possible
TOTAL QUALITY CONTROL (TQC) TERM DEFINITION Total quality control, also called total quality management, is an approach that extends beyond ordinary statistical quality control techniques and quality improvement methods. It implies a complete overview and re-evaluation of the specification of a product, rather than just considering a more limited set of changeable features withinan
CRITICAL CHARACTERISTICS TERM DEFINITION Critical Characteristics - short version. (1) Characteristics applicable to a component material, assembly, or vehicle assembly operation which are designated by Engineering as being critical to part function and having particular quality, reliability and/or durability significance. CONTROL SHIPPING LEVEL 2 TERM DEFINITION Control Shipping Level 2 - short version. Refers to GM terminology when the non conformances reach a criteria it is than required to have a third party and a supplier conduct 100% of all inspection of manufactured parts before delivery. HYDROPLASTIC FORMING TERM DEFINITION Definition of the Hydroplastic forming acronym term used inmanufacturing.
ABC ΟΡΙΣΜΌΣ ΌΡΟΣ ΑΠΟΘΕΜΆΤΩΝTRANSLATE THIS PAGE abc Απογραφή είναι επίσης γνωστή ως ανάλυση abc, είναι ένας όρος των επιχειρήσεων πουSTS TERM DEFINITION
STS - short version. Meaning 1: Sales (& Use) Tax System. Meaning 2: Sealed Tank System. Meaning 3: Service Training Standards. Meaning 4: Seville Touring Sedan. SYSTEMATIC LAYOUT PLANNING TERM DEFINITIONSYSTEMATIC EVALUATION PLAN DEFINITIONSYSTEMATIC PLANNING APPROACHSYSTEMATIC PLANNING PROCESS Systematic layout planning (SLP) is an organized way to conduct layout planning. It consists of a framework of phases, a pattern of procedures and a set of conventions for identifying, rating and visualizing the elements and areas involved in planning a layout.DTS TERM DEFINITION
Definition of the DTS acronym term used in manufacturing. Meaning 1: Dimensional Technical Specifications. Meaning 2: Dock To Stores PC&L TERM DEFINITION Definition of the PC&L acronym term used in manufacturing. Production, Control and Logistics. The engineering group responsible for ensuring smooth flow of needed material (physical and information). PRODUCTION LEVELLING TERM DEFINITION Production is levelled by making one model, then another model, and so on. Production leveling, also known as production smoothing is a technique for reducing the muda waste and vital to the development of production efficiency in Lean Manufacturing. The general idea is to produce intermediate goods at a constant rate, to allow further STANDARD IN-PROCESS STOCK TERM DEFINITIONSTANDARD IN PROCESS STOCKSTANDARD PROCESS STOCKSTANDARD STOCK DEFINITIONAMERICAN STANDARD STOCKROBOTIC AUTOMATION PROCESS STOCKSSHORT SALE STOCK PROCESS Standard In-Process Stock - short version. One of the three elements that make up standard work. It is the minimum quantity of parts always on hand for processing during and between subprocesses. It allows workers to do their jobs continuously in a set sequence, repeating the CRITICAL CHARACTERISTICS TERM DEFINITIONCRITICAL CHARACTERISTICS MEANINGCRITICAL CHARACTERISTICS ON DRAWINGSCRITICAL CHARACTERISTICS MATRIXAIAG CRITICAL CHARACTERISTICSCRITICAL CHARACTERISTIC SYMBOLCRITICAL AND SIGNIFICANT CHARACTERISTICS Critical Characteristics - short version. (1) Characteristics applicable to a component material, assembly, or vehicle assembly operation which are designated by Engineering as being critical to part function and having particular quality, reliability and/or durability significance. VITAL FEW, USEFUL MANY TERM DEFINITION Vital Few, Useful Many - short version. (1) A term Joseph M. Juran used to describe the Pareto principle, which he first defined in 1950. (The principle was used much earlier in economics and inventory control methods.) The principle suggests most effects come from relatively few causes; that is, 80% of the effects come from 20% ofthe possible
SOCIETAL ENVIRONMENT TERM DEFINITION Societal Environment - short version. The portion of a firm's environment pertaining to cultural factors such as language, business customs, customer preferences, and patterns of communication. ABC ΟΡΙΣΜΌΣ ΌΡΟΣ ΑΠΟΘΕΜΆΤΩΝTRANSLATE THIS PAGE abc Απογραφή είναι επίσης γνωστή ως ανάλυση abc, είναι ένας όρος των επιχειρήσεων πουSTS TERM DEFINITION
STS - short version. Meaning 1: Sales (& Use) Tax System. Meaning 2: Sealed Tank System. Meaning 3: Service Training Standards. Meaning 4: Seville Touring Sedan. SYSTEMATIC LAYOUT PLANNING TERM DEFINITIONSYSTEMATIC EVALUATION PLAN DEFINITIONSYSTEMATIC PLANNING APPROACHSYSTEMATIC PLANNING PROCESS Systematic layout planning (SLP) is an organized way to conduct layout planning. It consists of a framework of phases, a pattern of procedures and a set of conventions for identifying, rating and visualizing the elements and areas involved in planning a layout.DTS TERM DEFINITION
Definition of the DTS acronym term used in manufacturing. Meaning 1: Dimensional Technical Specifications. Meaning 2: Dock To Stores PC&L TERM DEFINITION Definition of the PC&L acronym term used in manufacturing. Production, Control and Logistics. The engineering group responsible for ensuring smooth flow of needed material (physical and information). PRODUCTION LEVELLING TERM DEFINITION Production is levelled by making one model, then another model, and so on. Production leveling, also known as production smoothing is a technique for reducing the muda waste and vital to the development of production efficiency in Lean Manufacturing. The general idea is to produce intermediate goods at a constant rate, to allow further STANDARD IN-PROCESS STOCK TERM DEFINITIONSTANDARD IN PROCESS STOCKSTANDARD PROCESS STOCKSTANDARD STOCK DEFINITIONAMERICAN STANDARD STOCKROBOTIC AUTOMATION PROCESS STOCKSSHORT SALE STOCK PROCESS Standard In-Process Stock - short version. One of the three elements that make up standard work. It is the minimum quantity of parts always on hand for processing during and between subprocesses. It allows workers to do their jobs continuously in a set sequence, repeating the CRITICAL CHARACTERISTICS TERM DEFINITIONCRITICAL CHARACTERISTICS MEANINGCRITICAL CHARACTERISTICS ON DRAWINGSCRITICAL CHARACTERISTICS MATRIXAIAG CRITICAL CHARACTERISTICSCRITICAL CHARACTERISTIC SYMBOLCRITICAL AND SIGNIFICANT CHARACTERISTICS Critical Characteristics - short version. (1) Characteristics applicable to a component material, assembly, or vehicle assembly operation which are designated by Engineering as being critical to part function and having particular quality, reliability and/or durability significance. VITAL FEW, USEFUL MANY TERM DEFINITION Vital Few, Useful Many - short version. (1) A term Joseph M. Juran used to describe the Pareto principle, which he first defined in 1950. (The principle was used much earlier in economics and inventory control methods.) The principle suggests most effects come from relatively few causes; that is, 80% of the effects come from 20% ofthe possible
SOCIETAL ENVIRONMENT TERM DEFINITION Societal Environment - short version. The portion of a firm's environment pertaining to cultural factors such as language, business customs, customer preferences, and patterns of communication. ABC ΟΡΙΣΜΌΣ ΌΡΟΣ ΑΠΟΘΕΜΆΤΩΝTRANSLATE THIS PAGE abc Απογραφή είναι επίσης γνωστή ως ανάλυση abc, είναι ένας όρος των επιχειρήσεων πουSTS TERM DEFINITION
STS - short version. Meaning 1: Sales (& Use) Tax System. Meaning 2: Sealed Tank System. Meaning 3: Service Training Standards. Meaning 4: Seville Touring Sedan.PDN TERM DEFINITION
PDN - short version. Product Discrepancy Notice. AdvertisingSOP TERM DEFINITION
Meaning 1: Small Outline Package Meaning 2: Standard Operating Procedures. Meaning 3: Start of Pilot. Meaning 4: Start of Production. A benchmark that represents the date on which the parts(s) must be available in the assembly plant for the first vehicle build.LCR TERM DEFINITION
Definition of the LCR acronym term used in manufacturing. Lean Capacity Rate (Calculated out of the MCR's (MCR=LCR*1.15). All allied and outside suppliers are expected to capacitize to the "lowest practical level" to meet LCR and current model service while providing 100% absolute certainty of supporting the LCR + 15%) CONTINUOUS SAMPLING PLAN TERM DEFINITION In acceptance sampling, a plan, intended for application to a continuous flow of individual units of product, that involves acceptance and rejection on a unit-byunit basis and employs alternate periods of 100% inspection and sampling. The relative amount of 100% inspection depends on the quality of submitted product. Continuoussampling plans
IP TERM DEFINITION
Meaning 1: Instrument Panel. See I/P. Meaning 2: Intellectual Property. Meaning 3: Internet Protocol, IP refers to the set of communication standards that control communications activity on the Internet. An IP address is the number assigned to any Internet-connected computer. BILL OF MATERIALS (BOM) TERM DEFINITION Bill of materials (BOM) is a list of the raw materials, sub-assemblies, intermediate assemblies, sub-components, components, parts and the quantities of each needed to manufacture an end item (final product) . It may be used for communication between manufacturing partners, or confined to a single manufacturing plant. TOTAL QUALITY CONTROL (TQC) TERM DEFINITION Total quality control, also called total quality management, is an approach that extends beyond ordinary statistical quality control techniques and quality improvement methods. It implies a complete overview and re-evaluation of the specification of a product, rather than just considering a more limited set of changeable features withinan
PROCESS VELOCITY TERM DEFINITION Process Velocity - short version. Is the ratio of actual throughput time that it takes for a product to go through the process by the value added time required to complete the product or service. KALTVERFESTIGUNG BEGRIFF DEFINITIONTRANSLATE THIS PAGE Kaltverfestigung oder auch bekannt als Kaltverformung und Kaltverfestigung, ist die Stärkung eines Metalls durch plastische Verformung. Diese Verstärkung tritt auf, weil der Luxation Bewegungen innerhalb der Kristallstruktur des Materials. Jegliches Material mit einer relativ hohen Schmelzpunkt wie Metalle und Legierungen könnenauf diese
STS TERM DEFINITION
STS - short version. Meaning 1: Sales (& Use) Tax System. Meaning 2: Sealed Tank System. Meaning 3: Service Training Standards. Meaning 4: Seville Touring Sedan. SYSTEMATIC LAYOUT PLANNING TERM DEFINITIONSYSTEMATIC EVALUATION PLAN DEFINITIONSYSTEMATIC PLANNING APPROACHSYSTEMATIC PLANNING PROCESS Systematic layout planning (SLP) is an organized way to conduct layout planning. It consists of a framework of phases, a pattern of procedures and a set of conventions for identifying, rating and visualizing the elements and areas involved in planning a layout.DTS TERM DEFINITION
Definition of the DTS acronym term used in manufacturing. Meaning 1: Dimensional Technical Specifications. Meaning 2: Dock To Stores PC&L TERM DEFINITION Definition of the PC&L acronym term used in manufacturing. Production, Control and Logistics. The engineering group responsible for ensuring smooth flow of needed material (physical and information). PRODUCTION LEVELLING TERM DEFINITION Production is levelled by making one model, then another model, and so on. Production leveling, also known as production smoothing is a technique for reducing the muda waste and vital to the development of production efficiency in Lean Manufacturing. The general idea is to produce intermediate goods at a constant rate, to allow further STANDARD IN-PROCESS STOCK TERM DEFINITIONSTANDARD IN PROCESS STOCKSTANDARD PROCESS STOCKSTANDARD STOCK DEFINITIONAMERICAN STANDARD STOCKROBOTIC AUTOMATION PROCESS STOCKSSHORT SALE STOCK PROCESS Standard In-Process Stock - short version. One of the three elements that make up standard work. It is the minimum quantity of parts always on hand for processing during and between subprocesses. It allows workers to do their jobs continuously in a set sequence, repeating the CRITICAL CHARACTERISTICS TERM DEFINITIONCRITICAL CHARACTERISTICS MEANINGCRITICAL CHARACTERISTICS ON DRAWINGSCRITICAL CHARACTERISTICS MATRIXAIAG CRITICAL CHARACTERISTICSCRITICAL CHARACTERISTIC SYMBOLCRITICAL AND SIGNIFICANT CHARACTERISTICS Critical Characteristics - short version. (1) Characteristics applicable to a component material, assembly, or vehicle assembly operation which are designated by Engineering as being critical to part function and having particular quality, reliability and/or durability significance. VITAL FEW, USEFUL MANY TERM DEFINITION Vital Few, Useful Many - short version. (1) A term Joseph M. Juran used to describe the Pareto principle, which he first defined in 1950. (The principle was used much earlier in economics and inventory control methods.) The principle suggests most effects come from relatively few causes; that is, 80% of the effects come from 20% ofthe possible
SOCIETAL ENVIRONMENT TERM DEFINITION Societal Environment - short version. The portion of a firm's environment pertaining to cultural factors such as language, business customs, customer preferences, and patterns of communication. ABC ΟΡΙΣΜΌΣ ΌΡΟΣ ΑΠΟΘΕΜΆΤΩΝTRANSLATE THIS PAGE abc Απογραφή είναι επίσης γνωστή ως ανάλυση abc, είναι ένας όρος των επιχειρήσεων πουSTS TERM DEFINITION
STS - short version. Meaning 1: Sales (& Use) Tax System. Meaning 2: Sealed Tank System. Meaning 3: Service Training Standards. Meaning 4: Seville Touring Sedan. SYSTEMATIC LAYOUT PLANNING TERM DEFINITIONSYSTEMATIC EVALUATION PLAN DEFINITIONSYSTEMATIC PLANNING APPROACHSYSTEMATIC PLANNING PROCESS Systematic layout planning (SLP) is an organized way to conduct layout planning. It consists of a framework of phases, a pattern of procedures and a set of conventions for identifying, rating and visualizing the elements and areas involved in planning a layout.DTS TERM DEFINITION
Definition of the DTS acronym term used in manufacturing. Meaning 1: Dimensional Technical Specifications. Meaning 2: Dock To Stores PC&L TERM DEFINITION Definition of the PC&L acronym term used in manufacturing. Production, Control and Logistics. The engineering group responsible for ensuring smooth flow of needed material (physical and information). PRODUCTION LEVELLING TERM DEFINITION Production is levelled by making one model, then another model, and so on. Production leveling, also known as production smoothing is a technique for reducing the muda waste and vital to the development of production efficiency in Lean Manufacturing. The general idea is to produce intermediate goods at a constant rate, to allow further STANDARD IN-PROCESS STOCK TERM DEFINITIONSTANDARD IN PROCESS STOCKSTANDARD PROCESS STOCKSTANDARD STOCK DEFINITIONAMERICAN STANDARD STOCKROBOTIC AUTOMATION PROCESS STOCKSSHORT SALE STOCK PROCESS Standard In-Process Stock - short version. One of the three elements that make up standard work. It is the minimum quantity of parts always on hand for processing during and between subprocesses. It allows workers to do their jobs continuously in a set sequence, repeating the CRITICAL CHARACTERISTICS TERM DEFINITIONCRITICAL CHARACTERISTICS MEANINGCRITICAL CHARACTERISTICS ON DRAWINGSCRITICAL CHARACTERISTICS MATRIXAIAG CRITICAL CHARACTERISTICSCRITICAL CHARACTERISTIC SYMBOLCRITICAL AND SIGNIFICANT CHARACTERISTICS Critical Characteristics - short version. (1) Characteristics applicable to a component material, assembly, or vehicle assembly operation which are designated by Engineering as being critical to part function and having particular quality, reliability and/or durability significance. VITAL FEW, USEFUL MANY TERM DEFINITION Vital Few, Useful Many - short version. (1) A term Joseph M. Juran used to describe the Pareto principle, which he first defined in 1950. (The principle was used much earlier in economics and inventory control methods.) The principle suggests most effects come from relatively few causes; that is, 80% of the effects come from 20% ofthe possible
SOCIETAL ENVIRONMENT TERM DEFINITION Societal Environment - short version. The portion of a firm's environment pertaining to cultural factors such as language, business customs, customer preferences, and patterns of communication. ABC ΟΡΙΣΜΌΣ ΌΡΟΣ ΑΠΟΘΕΜΆΤΩΝTRANSLATE THIS PAGE abc Απογραφή είναι επίσης γνωστή ως ανάλυση abc, είναι ένας όρος των επιχειρήσεων πουSTS TERM DEFINITION
STS - short version. Meaning 1: Sales (& Use) Tax System. Meaning 2: Sealed Tank System. Meaning 3: Service Training Standards. Meaning 4: Seville Touring Sedan.PDN TERM DEFINITION
PDN - short version. Product Discrepancy Notice. AdvertisingSOP TERM DEFINITION
Meaning 1: Small Outline Package Meaning 2: Standard Operating Procedures. Meaning 3: Start of Pilot. Meaning 4: Start of Production. A benchmark that represents the date on which the parts(s) must be available in the assembly plant for the first vehicle build.LCR TERM DEFINITION
Definition of the LCR acronym term used in manufacturing. Lean Capacity Rate (Calculated out of the MCR's (MCR=LCR*1.15). All allied and outside suppliers are expected to capacitize to the "lowest practical level" to meet LCR and current model service while providing 100% absolute certainty of supporting the LCR + 15%) CONTINUOUS SAMPLING PLAN TERM DEFINITION In acceptance sampling, a plan, intended for application to a continuous flow of individual units of product, that involves acceptance and rejection on a unit-byunit basis and employs alternate periods of 100% inspection and sampling. The relative amount of 100% inspection depends on the quality of submitted product. Continuoussampling plans
IP TERM DEFINITION
Meaning 1: Instrument Panel. See I/P. Meaning 2: Intellectual Property. Meaning 3: Internet Protocol, IP refers to the set of communication standards that control communications activity on the Internet. An IP address is the number assigned to any Internet-connected computer. BILL OF MATERIALS (BOM) TERM DEFINITION Bill of materials (BOM) is a list of the raw materials, sub-assemblies, intermediate assemblies, sub-components, components, parts and the quantities of each needed to manufacture an end item (final product) . It may be used for communication between manufacturing partners, or confined to a single manufacturing plant. TOTAL QUALITY CONTROL (TQC) TERM DEFINITION Total quality control, also called total quality management, is an approach that extends beyond ordinary statistical quality control techniques and quality improvement methods. It implies a complete overview and re-evaluation of the specification of a product, rather than just considering a more limited set of changeable features withinan
PROCESS VELOCITY TERM DEFINITION Process Velocity - short version. Is the ratio of actual throughput time that it takes for a product to go through the process by the value added time required to complete the product or service. KALTVERFESTIGUNG BEGRIFF DEFINITIONTRANSLATE THIS PAGE Kaltverfestigung oder auch bekannt als Kaltverformung und Kaltverfestigung, ist die Stärkung eines Metalls durch plastische Verformung. Diese Verstärkung tritt auf, weil der Luxation Bewegungen innerhalb der Kristallstruktur des Materials. Jegliches Material mit einer relativ hohen Schmelzpunkt wie Metalle und Legierungen könnenauf diese
INDEX
# |A
|B |C
|D |E
|F |G
|H |I
|J |K
|L |M
|N |O
|P |Q
|R |S
|T |U
|V |W
|X |Y
|Z
Index
# (CLICK TO OPEN/CLOSE)* 14 Points
* 1st-Party Audit
* 21 CFR Part 820
* 2D Rendering
* 2nd-Party Audit
* 360 Brass
* 3D Database
* 3DL
* 3Dr
* 3D Rendering
* 3 M
* 3rd-Party Audit
* 5 M
* 5S
* 5W2H
* 5 Whys
* 6 Sigma
* 80 20 Rule
* 8D
A (CLICK TO OPEN/CLOSE)* A
* A-class Finish
* A Class Items
* A1R
* A1VA
* A2LA
* A2R
* A2VA
* A3
* A4
* AA
* AAA
* AAAAA
* AAAD
* AAC
* AACA
* AAD
* AADT
* AAES
* AALA
* AAM
* AAMA
* AAMI
* AAOL
* AAP
* AAPA
* AAR
* AARS
* AAS
* AASHTO
* AAT
* AB
* ABA
* ABAP
* ABB
* ABC
* ABC Classification* ABC Inventory
* ABCM
* ABE
* ABEL
* ABF
* ABI
* Abilene Paradox
* ABIOS
* ABL
* ABM
* ABMF
* ABMM
* ABMP
* Abnormal Production Loss* ABNT
* ABP
* ABR
* Abrasive
* ABS
* Absorption
* ABTS
* Abv
* ABWO
* A/C
* AC
* ACB
* ACC
* ACCA
* Accel
* Acceptance Number
* Acceptance Quality Limit (AQL) * Acceptance Sampling * Acceptance Sampling Plan* Acceptor level
* Acclrm
* Acclrtm
* ACCM
* Accountability
* Accreditation
* Accreditation Body * Accredited Laboratory * Accredited Registrars* Accum
* Accuracy
* Accy
* ACD
* ACDS
* ACE
* ACEA
* ACEC
* ACEEE
* Acetal
* Acetate
* ACF
* ACG
* ACGW
* ACH
* ACI
* ACIA
* A/CL
* ACL
* ACM
* ACMT
* ACN
* Acnt
* ACPI
* ACPO
* ACRONYM
* ACRS
* Acrylic
* ACS
* ACSI
* Acsry
* ACT
* ACTC
* Activation Energy
* Activation Polarization* Active state
* Active Data Gathering * Actively Solicited Customer Feedback* Active Part
* Activity
* Activity-Based Costing (ABC)* Activity Board
* Activity Network Diagram* Activity Plan
* Activity Relationship Diagram* Actr
* ACTS
* ACTV
* ACV
* A/D,D/A
* A/D
* AD
* ADA
* ADAMS
* Adap
* Adapt
* Adapts
* ADC
* ADD
* Addition (or chain reaction) Polymerization * Addition Rule of Probabilities* Addt
* ADDYMS
* A/DFL
* ADG
* Adhes
* Adhesion
* Adhesion, Mechanical* Adhesive
* ADI
* Adj
* Adjr
* ADL
* A/DM
* ADM
* ADN
* ADP
* ADPCM
* ADQA
* ADR
* ADS
* ADSG
* ADSIM
* ADSL
* ADT
* ADTS
* ADTT
* A/D/V
* ADV
* Advanced Product Quality Planning* Adverse Event
* ADVMS
* A/D/VP&R
* AE
* AEC
* AECD
* AED
* AEEP
* AEI
* AERA
* AES
* Aesthetics
* AETR
* A/F
* AF
* AFAIK
* AFC
* AFD
* AFECM
* Affinity Diagram
* Affinity Codes
* AFIM
* AFL
* AFL-CIO
* AFM
* AFO
* AFR
* AFS
* AFSM
* Aft
* AFV
* Ag
* AGA
* AGC
* Age Hardening
* Agile Manufacturing* AGM
* AGND
* AGP
* AGV
* AGVS
* AGW
* A/H
* Ah
* AHAR
* AHBA
* AHDL
* AHESI
* AHIPC
* AHL
* AHLD
* AHP
* AHRS
* AHS
* AI
* AIA
* AIAG
* AIAM
* AIB
* AIC
* AICC
* AID
* AIDC
* AIEG
* AIIM
* AIM
* AIMI
* AIN
* AIP
* AIPE
* AIR
* Air-Dried Timber
* Air-Bubble Void
* Air locks
* AISI
* AISI SAE Steels
* AITC
* AITPM
* AIW
* Aka
* AKS
* Al
* AL2
* AL3
* ALAPCO
* ALBS
* ALC
* ALCL
* ALDL
* ALDM
* ALE
* ALG
* ALGOL
* Algorithm
* ALI
* Alignment
* Allotropy
* Alloy
* Alloy Steel
* ALM
* ALN
* Alpha Test
* Alpha Value
* ALR
* ALRR
* ALS
* Alt
* Alternating Copolymer * Alternative Hypothesis* AltFuel
* ALTO
* ALU
* AM
* AMA
* Amb
* AMC
* AMD
* AMDSG
* AME
* AMECS
* American National Standards Institute-American Society for Quality(ANSI-ASQ)
* American Society for Nondestructive Testing (ASNT) * American Society for Quality (ASQ) * American Society for Quality Control (ASQC) * American Society for Testing and Materials (ASTM) * American Society for Training and Development (ASTD) * American Standard Code for Information Interchange (ASCII)* AMEX
* AMFA
* AMHS
* AMHSS
* AMIC
* AML
* Amm
* Amorphous
* Amortization
* Amp
* Ampf
* AMPO
* AMPS
* AMPTS
* AMR
* AMRC
* AMS
* AMSL
* AMT
* AMuS
* AN
* Analyse
* Analysis of Means (ANOM) * Analysis Of Variance (ANOVA)* Analytical Tools
* ANC
* AND
* Andon
* Andon Board
* ANDS
* Anelastic Deformation* ANFIA
* Anion
* Anisotropic
* Anisotropic Laminate* ANL
* ANMC
* Anneal
* Annealing
* Annealing Point (Glass)* Annrep
* Annuity Relationship* Anode
* ANOVA
* Anova Studies
* ANPRM
* ANS
* ANSI
* ANSI/ASQ Q90
* ANT
* Antiferromagnetism* A/Nut
* ANX
* AOA
* AOB
* AOIB
* AOL
* AOQL
* AORC
* AORS
* AOS
* AOT
* A/P
* AP
* APA
* APAA
* APAC
* AP&P
* APB
* APC
* APD
* APE
* APEAL
* APEC
* APET
* APEX
* APG
* API
* APIC
* APICS
* APL
* APLQ
* APM
* APMES
* APMM
* APMT
* APMTS
* APO
* APP
* Appearance Item
* Appearance Model
* APPL
* Appraisal Cost
* Approved
* Approved Drawing
* Approved Source List* APQP
* APR
* APRA
* AP/S
* APS
* APSB
* APSC
* APSMB
* APT
* APTA
* APU
* APV
* APVD
* APY
* AQ
* AQC
* AQL
* AQM
* AQMD
* AQNS
* A/R
* AR
* ARA
* ARAN
* ARB
* ARC
* ARD
* ARG
* ARI
* Arithmetical Mean Deviation Ra* ARM
* ARMS
* ARO
* ARP
* ARPA
* ARR
* ARRANT
* Arrow Diagram
* ARS
* A/Rst
* ARTBA
* ARTEMIS
* Artificial Aging
* A/Rtl
* ARTS
* Arumaud Feigenbaum* A/S
* AS
* AS9100
* ASA
* ASAM
* ASAP
* ASB
* ASBC
* ASBE
* ASC
* ASCII
* ASC MH10
* ASC X12
* ASC X3
* ASD
* ASDF
* ASDM
* ASE
* ASEP
* ASG
* ASI
* ASIA
* ASIAN
* ASIC
* A-side
* ASK
* Ask Why Five Times* ASLE
* ASM
* ASME
* ASMW
* ASN
* ASNT
* ASO
* ASP
* ASPECT
* ASPRO
* ASPT
* ASQ
* ASQC
* ASR
* ASRS
* ASSE
* Assembly Chart
* Assessment
* Assignable Cause
* Assn. for Quality and Participation (AQP)* ASSO
* ASSP
* ASST
* Assurance
* AST
* ASTA
* A stage
* ASTEC
* ASTM
* ASTN
* ASTT
* A/Susp
* ASV
* ASVR
* A/T
* AT
* ATA
* ATAC
* Atactic
* ATAM
* ATAPI
* ATB
* ATC
* ATCH
* ATD
* ATDC
* ATDM
* ATE
* ATEC
* ATF
* Athermal Transformation* ATIS
* ATM
* ATMIE
* ATMS
* ATN
* ATO
* Atomic Mass Unit (amu)* Atomic Number (Z)
* Atomic Packing Factor (APF)* Atomic Structure
* Atomic Vibration
* Atomic Weight (A)
* Atom Percent
* ATP
* ATPG
* ATR
* A/Trns
* ATRS
* ATS
* ATSA
* ATSAC
* ATSC
* ATSSA
* ATT
* Attribute
* Attribute Data
* Attributes, Method of* Attributes
* Attrition
* ATV
* ATW
* ATWO
* Au
* AuC
* Audit
* Audit Conclusion
* Audit Criteria
* Auditee
* Audit Evidence
* Audit Findings
* Auditor
* Audit Program
* Audit Team
* Aug
* Auger Conveyors
* AUP
* AUR
* Austenite
* Austenitizing
* Auto
* Autoclave
* Autoclave Moulding * Automotive Industry Action Group (AIAG)* Autonomation
* Autonomous Maintenance* Autoseque
* AUX MEM
* A/V
* AV
* AVA
* Availability
* AVCG
* AVCS
* AVCSS
* AVD
* AVDC
* AVDP
* AVE
* Average
* Average Chart
* Average Completion Rate* Average Flow Time
* Average Outgoing Quality * Average Outgoing Quality Limit * Average Run Lengths * Average Sample Number * Average Total Inspection (ATI)* AVG
* AVI
* AVIP
* AVL
* AVLE
* AVLS
* AVM
* AVO
* AVR
* AVSE
* AvtoVAZ
* AWA
* Award Audits
* AWARE
* AWD
* AWDA
* AWDIT
* AWG
* AWI
* AWO
* AWOL
* AWS
* Axial Winding
* Axioms of Probability* Axisymmetric
* AYES
B (CLICK TO OPEN/CLOSE)* B
* B+
* B2B
* BA
* BAA
* BABFU
* BABT
* BAC
* Backtracking
* BACS
* BACT
* BAD
* BAI
* Bainite
* Baka-yoke
* BAL
* Balanced Plant
* Balanced Production * Balanced Scorecard * Balancing The Line* Baldrige Award
* Baldrige-Lite
* Baldrige-Qualified* Ballistic Motions
* Ball Mill
* Ball Tables
* BALR
* BALUN
* BAM
* Band Gap Energy
* B&P
* BAP
* BAPI
* BAPS
* Bar
* Bar Chart
* Baro
* BARR
* Barrier to Entry
* BARS
* BAS
* BASEC
* BASEEFA
* Baseline Performance* BASIC
* Basic Events
* Basic Prototype
* Basic Seven (B7) Tools of Quality* BASIS
* BASS
* Batch
* Batch and Queue
* Batch Manufacturing (a.k.a. "Batch Processing")* Bates Log
* Bates Number
* Bathtub Curve
* Bathtub-Shaped Hazard Function* Batt
* BAUD
* Bayes' Rule
* Bayes Theorem
* BB
* BBB
* BBC
* BBIS
* BBL
* BBM
* BBQVC
* BBS
* BBSC
* BBV
* B/C
* BC
* BCA
* BCC
* BCCSE
* BCD
* BCI
* BCM
* BCNC
* BCP
* BCR
* BCS
* BD
* BDA
* BDC
* BDI
* BDM
* BDS
* BDSC
* Be
* BEA
* BEAB
* BEC
* BEI
* BELLCORE
* Bell Curve
* BEM
* BEMC
* BEMIC
* Benchmark
* Benchmarking
* Benefit Cost Analysis * Benefit Effort Matrix* BER
* BERT
* BESC
* BESS
* Best-In-Class
* Best-of-the-Best
* Best Practice
* BET
* Beta Build
* Beta Test
* BETIDC
* BEV
* BF
* BFA
* BFC
* BFI
* BFL
* BFM
* BG
* BGA
* BGI
* BGO
* BGS
* BHD
* BHN
* BHP
* B.I.
* Bi
* Bias
* Biased Sample
* BIAT
* Biaxial Stretching* BIC
* BICMOS
* BICS
* BID
* Bi-Directional Laminate* BIFS
* Bifunctional
* Big Q, little q
* Bill of Materials
* Billet
* Bill of Lading
* Bill of Materials (BOM)* BIM
* Bimodal Distribution* BIND
* Binomial Data
* Binomial Experiment * Binomial Probability Distribution* BIO
* Biocomposite
* Biofibre Reinforced Plastics* Bioplastic
* BioRID
* BIOS
* BioSID
* BIPS
* BIRG
* BIS
* Biscuit/Bisque
* BIST
* BIT
* BITE
* BIW
* BIWDA
* B/JNT
* BJT
* Bk
* BKG
* BKL
* BKLT
* BKT
* BL
* Black Belt
* BLD
* BLEDR
* Bleed-Out
* Blemish
* BLK
* BLMP
* BLO
* Block Copolymer
* Block Diagram
* Blow Molding
* BLS
* Blts
* Blue Sky
* BLW
* BM
* BMCS
* BMD
* BME
* BMEP
* BMF
* BMP
* BMS
* BMS Load
* BMW
* Bn
* BNA
* BNC
* BNL
* BO
* Board of Standards Review (BSR)* BoB
* BOC
* BOD
* Body-Centered Cubic (BCC) * Body of Knowledge (BOK)* BOE
* BOF
* Bohr Atomic Model
* Bohr magneton
* BOI
* BOL
* BOLS
* Boltzmann's Constant (k)* BOM
* BOM+
* BOMP
* Bonding Energy
* BOOS
* BOP
* BOPS
* Bore
* Boring
* Boss
* Bottleneck
* Bottlenecks
* Bottom Line
* Box Behnken Design* Box Plot
* BP
* BPA
* BPC
* BPCM
* BPDM
* BPE
* BPEGR
* BPF
* BPM
* BPMV
* BPO
* BPP
* BPR
* BPS
* BPSC
* BPSK
* BPV
* BPW
* BQE
* BQM
* BR
* Bragg's Law
* Brainstorming
* Branched Polymer
* Brand
* Brass
* BRAT
* Braze
* Brazing
* BRC
* BRD
* BRDR
* Breadboard
* Breakdown Maintenance (BM) * Breakthrough Improvement* BRG
* Brittle Fracture
* BRK
* BRKR
* BRKT
* BRM
* Broach
* Broaching
* Broadcast
* Bronze
* BRP
* BRS
* BRTC
* BRTG
* BS
* BSA
* BSAP
* BSCO
* BSD
* BSFC
* BSG
* BSHC
* BSI
* BSL
* BSM
* BSNO2
* BSPMC
* BSS
* B stage
* BT
* BTC
* BTCM
* BTD
* BTDC
* BTHR
* BTI
* BTL
* BTM
* BTS
* BTSI
* BTU
* BTW
* BTY
* B/U
* Bubble Processing
* BUC
* Buck
* Buffer Stock
* BUGM
* BUL
* Bulk Materials
* BUM
* Bump-Back
* BUR
* Burgers Vector (b)* BURNDY
* Burning Platform
* Burnish
* Burring
* Burst Strength
* BUSH
* Bushing
* Business Non Value Added (BNVA)* Business plan
* Business Process Reengineering * Business Value Added* BUT
* Buyer
* BV
* BVA
* BVD
* BVS
* BW
* BWARN
* BWC
* BWG
* BWL
* BWO
* BWS
* BYTE
* By What Method
* BZL
C (CLICK TO OPEN/CLOSE)* C
* C2C
* C2R2
* C3
* C4
* C4 Compliant
* C4 Program
* C4SA
* C4 Systems
* C4 Translator
* C5
* CA
* CAA
* CAAA
* CAB
* CABT
* CAC
* CACC
* CAD
* CADAM
* CADANCE
* CADAT
* CAD/CAM
* CAD/CAM Math Data
* CADD
* CAD/M/E
* CADMP
* CADRE
* CAE
* CAEE
* CAF
* CAFC
* CAFE
* CAGR
* CAHPS
* CAI
* CAIR
* CAL
* CAL3D
* CALB
* Calc
* CALCE
* Calcination
* Calibration
* Calibration Verification* CALL
* CALN
* CALR
* CALS
* CAM
* CAMAC
* CAMAS
* CAMI
* CAMIP
* CAMS
* CAN
* CANC
* C&F
* CANdi
* CANEXPO
* Cannibalization
* CAP
* Capability
* Capability Analysis* Capability Index
* Capability Maturity Model (CMM) * Capability of Process * Capability Ratio (CR)* Capable
* Capable Process
* CAPAC
* Capacitance (C)
* Capacity
* Capacity Constraint * Capacity Constraint Resources * Capacity Requirements Planning* CAPDo
* CAPE
* CAPEX
* CAPM
* CAPP
* CAPS
* CAR
* CARAT
* CARB
* Carburize
* Carburizing
* CARD
* CARDD
* CARE
* CARIR
* CARPORT
* CARR
* CARS
* CART
* Cartesian Management * Car Type Conveyors* CAS
* CASA
* Cascading
* CASE
* Case Harden
* Case Hardening
* CASL
* CASM
* CASPER
* Cass
* CASSIS
* CAST
* Cast Iron
* CAT
* Catchball
* Categorizing
* Cathode
* Cathodic Protection* CATIA
* Cation
* CATS
* CATV
* Caul
* Causation
* Cause
* Cause and Effect
* Cause and Effect (or Fishbone or Ishikawa) Diagram * Cause and Effect Matrix* CAV
* CAW
* CB
* CBA
* C/BAL
* C/BAR
* CBC
* CBDR
* CBE
* CBEMA
* CBGA
* CBI
* CBL
* C/BLK
* CBM
* CBO
* CBP
* CBR
* CBS
* CBT
* CBU
* CC
* C-C
* CCA
* C/CASE
* CCB
* CCC
* CCCC
* CCCI
* CCCR
* CCCS
* CCD
* CCDI
* CCDIC
* CCESC
* CCFL
* CCG
* C Chart
* CCIB
* CCIR
* CCITT
* CCITT1
* CCITT2
* CCL
* CCM
* CCMB
* CCMP
* CCMS
* CCMST
* CCO
* CCOB
* CCOE
* CCOT
* CCP
* CCPO
* CCR
* CCRR
* CCS
* CCSDT
* CCTV
* CCU
* CCV
* CCW
* CD
* CDA
* CDAP
* CDAS
* CDB
* CDC
* CDD
* CDI
* CDIF
* CDIS
* CDL
* CDLS
* CDM
* CDMA
* CDMe
* CDMS
* CDP
* CDPD
* CD/PLYR
* CDPT
* CDR
* CD-ROM
* CDS
* CD/SS
* CDT
* CDV
* CDX
* CE
* CEA
* CEBEC
* CEC
* CECC
* CECR
* Cedac
* CEe
* CEE1
* CEE2
* CEI
* Cell
* Cellular Manufacturing * Cellular Operations* CEMA
* Cement
* Cementite
* CEMMV
* CEMSS
* CEN
* CENELEC
* Centerline
* Central Limit Theorem* Central Location
* Central Tendency
* CEO
* CEP
* CEPS
* CER
* Ceramic
* Ceramics
* CERES
* Cermet
* CERT
* Certificate of Compliance * Certificate of Conformance (Certificate of Conformity)* Certification
* Certification Audits* CESCA
* CESS
* CET
* CETF
* CETS
* CEU
* CEX
* CF
* CFA
* CFB
* CFC
* CFD
* CFFP
* CFG
* CF/H
* CFI
* CFM
* CFMT
* CFO
* CFOD
* CFP
* CFPM
* CFPR
* CFR
* CFS
* CFT
* CFV
* CFVT
* CG
* CGA
* CGC
* CGDP
* CGH
* CGI
* CGI-BIN
* CGIT
* CGL
* CGM
* CGS
* CGSB
* CGUC
* CGVWR
* CH
* CHA
* Chain-Folded Model * Chain of Customers* Chain Reaction
* Chain Sampling Plan* Chamfer
* Champion
* Champion
* CHAN
* Chance Causes
* Chance Variation, Chance Error* Change
* Change Agent(s)
* Change Management Checklist* Changeover
* Changeover Time
* Characteristic
* Characteristics Matrix* Charpy Test
* Chart
* Charter
* CHAS
* Chase
* Chebychev's Inequality* Checked Print
* Checkpoint
* Check Sheet
* CHEM
* CHEMS
* CHFDR
* C/H/G
* Chill
* Chills
* Chip
* Chip-Forming cutting* CHIPS
* Chi-Square Curve
* Chi-Square Statistic* CHK
* CHMBR
* CHMSL
* CHOM
* CHPT
* CHQ
* CHR
* CHRG
* CI
* CIAC
* CIAS
* CIB
* CICMHE
* CICS
* CID
* CIDE
* CIDI
* CIDR
* CIE
* CIEM
* CIF
* CIH
* CIHe
* CII
* CIIL
* CIL
* CIM
* CIMM
* CIMPLICITY
* CIMS
* CIN
* CIO
* CIP
* CIPB
* CIPS
* CIPV
* CIR
* CIRC
* Circuit (Filament Winding) * Circumferential Winding* CIREN
* CIRT
* CIS
* CISA
* CISC
* CISCO
* CISCO Code
* CISPR
* CISSP
* CIT
* CIU
* CIX
* CKC
* CKD
* CKP
* Ckt
* C/L
* CL
* CLA
* Clamp Trucks
* Class
* Classical Probability * Classification of Defects* Clay
* CLC
* CLCC
* CLCD
* CLD
* CLDD
* Clean Data
* CLEC
* CLEFI
* CLEPA
* CLER
* CLF
* CLG
* CLGC
* CLIPS
* CLK
* CLNG
* CLNP
* CLNR
* CLNS
* C/LO
* CLOOP
* Closed-Loop Corrective Action (CLCA)* Closure
* C/LP
* CLPR
* CLR
* CLSF
* CLSR
* CLTBI
* CLTP
* C/LTR
* CLU
* Cluster Sample
* CLUT
* CLV
* CM
* CMA
* CMAI
* CMAQ
* CMB
* C/MBR
* CMBS
* CMC
* CMD
* CMDB
* CMI
* CMID
* CMIP
* CMIT
* CML
* CMM
* Cmmd
* CMMI
* CMO
* CMOP
* CMOS
* CMP
* CMPD
* CMPR
* CMPRN
* CMPTR
* CMR
* CMRR
* CMRS
* CMS
* CM/SHF
* CMSS
* CMT
* CMTR
* CMV
* CMVSA
* CMVSS
* CNC
* CNC Folding
* CNCT
* CNDCT
* CNDSR
* CNE
* CNG
* CNI
* CNP
* CNSL
* CNSTR
* CNTNR
* CNTR
* CNTS
* C/O
* CO
* CO2
* COA
* Coarse Pearlite
* COAX
* COB
* COBD
* COBOL
* COBRA
* COC
* COD
* CODEC
* CODP
* COE
* Coefficient of Determination * Coefficient of Multiple Correlation * Coefficient of Variance * Coercivity (or Coercive Field, Hc)* COES
* COFC
* COGNOS
* COGS
* COI
* COL
* COLA
* COLD
* Cold Forming
* Cold Working
* Collaborative
* Collar
* CoLMS
* Co-Location
* Color
* Colorant
* COLR
* COLT
* COMB
* Combo
* COM Code
* COMFASS
* COMI
* COML
* Comm
* Commodity
* Commodity Thermoplastic * Commodity Polymers* Common Cause
* Common Causes
* Common Cause System * Common Cause Variation* COMP
* Company Culture
* Comparative Analysis* COMPASS
* Compensate
* Compensation
* Competence
* Competitive Advantage* Compl
* Complaint
* Complaint Tracking * Complementary Products * Completely Randomized One-Way ANOVA* Compliance
* Compliance and Affirmative* Component
* Component Reliability* Components Search
* Component Work Cell* Composite
* Composites
* Composition
* Compound
* Compression Molding* COMPT
* Computer Aided Design (CAD) * Computer Aided Engineering (CAE) * Computer-Aided Inspection (CAI) * Computer-Aided Testing (CAT) * Computer Assisted Design (CAD) * Computer-Based Training* COMS
* Concentration (Ci) * Concentration Diagrams * Concentration Gradient (dC/dx) * Concentration Polarization * Concentration Profile* Concept
* Concept Design
* Concept Development * Concept Generation* Concept Testing
* Concrete
* Concurrent Engineering* Cond
* Condensation (or Step Reaction) Polymerization * Conditional Based Maintenance (CBM) * Conditional Probability* Conduction Band
* Conductivity, Electrical* Confidence
* Confidence Interval* Confidence Level
* Confidence Limits
* Config
* Conflict Resolution* Conformance
* Conformity Assessment * Congruent transformation* Conjoint Analysis
* CONN
* Consensus
* Consequential Metrics* Const
* Constant Cause System* Constraint
* Constraints Management* Consultant
* Consultant Audits
* Consumer
* Consumer market
* Consumer Product Safety Commission (CPSC)* Consumers Risk
* CONT
* Contact Inspection* Contact Personnel
* Containment
* CONTAM
* Contingency Table
* Contingency Theory * Continual Improvement* Continuous Flow
* Continuous Colling transformation (CCT) Diagram* Continuous Data
* Continuous Flow Production * Continuous Improvement (CI) * Continuous Motions * Continuous Quality Improvement (CQI) * Continuous Quality Improvement * Continuous Random Variable * Continuous Sampling Plan* CONTOUR
* Contract
* Contract Review
* Contrition
* Control
* Control Chart
* Control Charts
* Control Factors
* Control Freak
* Control / Halt Correcting Method* Control Item
* Controlled Document * Controlled Experiment * Controlled or Restrictive Motions * Controlled Shipping * Control Limit (UCL and LCL)* Control Limits
* Control Plan
* Control Plans
* Control Process
* Control Shipping Level 1 * Control Shipping Level 2* CONUS
* CONV
* Convergent Thinking * Conversion Process* Conveyance
* CONV FD
* COO
* COOL
* COOP
* COOPE
* Coordinate Measuring Machine (CMM) * Coordination Number* C.O.P.
* COP
* COPE
* COPICS
* Copolymer
* COPQ
* COPS
* COQ
* COR
* CORBA
* CORE SMT
* Core Team Steering Committee* CORP
* Corporate Culture
* Corrective Action
* Corrective Action Recommendation (CAR) * Corrective Maintenance (CM) * Correlation (Statistical)* Correlation
* Correlation Coefficient r* Correlation
* Corrosion
* Corrosion Fatigue
* Corrosion Penetration Rate (CPR)* COS
* COSE
* COSMOS
* COSS
* Cost Benefit Analysis* Cost-Effective
* Cost of Goods Sold (COGS) * Cost of Poor Quality (COPQ) * Cost of Quality (COQ)* Cost Plus
* Cost Reduction Formula* COT
* COTS
* Coulombic Force
* Count Chart
* Count Checking Method* Counterbore
* Countersink
* Count Per Unit Chart* COV
* Covalent Bond
* Covalent Bonding
* COVE
* COVIMEP
* C/OVR
* COWA
* CP
* CP2
* CPA
* CPAA
* CP&S
* CPBR
* CPC
* CPCI
* CPCIP
* CPCV
* CPD
* CPDB
* CPDS
* CPE
* CPET
* CPF
* CPG
* CPI
* CPID
* CPIM
* CPIP
* CPIPE
* CPIR
* CPIT
* CPK
* Cpk Index
* Cpl
* CPLC
* CPLD
* CPLG
* C/PLR
* CPLY
* CP/M
* CPM
* CPN
* CPO
* CPP
* CPPI
* CPPO
* CPPT
* CPQE
* CPR
* CPS
* CPSA
* CPSC
* CPSL
* CPT
* CPTA
* CPU
* CPV
* CPVS
* CPWR
* CQ
* CQA
* CQACP
* CQA/E/T
* CQC
* CQE
* CQEP
* CQFP
* CQI
* CQIC
* Cqis
* CQLE
* CQM
* CQP
* CQPI
* CQT
* C/R
* CR
* CRA
* CRABI
* CRADA
* CRAM
* CR&W
* CRASH
* Crawford Slip Method* Crazing
* CRB
* CRC
* CRCA
* CRCONT
* CRD
* CR/DN
* CRDN
* Creep
* Crevice Corrosion
* CRF
* CRFI
* CRFM
* CRIB
* CRIT
* Criteria
* Critical Characteristics* Criticality
* Critical Mass
* Critical Processes * Critical Resolved Shear Stress * Critical Success Factors * Critical To Characteristic (CT)* Critical Value
* Critical X Worksheet* CRK
* CRL
* CRM
* CROM
* Cross Functional
* Cross-Functional Teams * Crosslinked Polymer* Cross Pilot
* Cross Traffic
* Cross-Training
* Crown
* CRP
* CRS
* CRSB
* CRSC
* CRSG
* CR/SHF
* CRSN
* CRSO
* CRT
* CRTC
* CRTL
* CRUD
* CRV
* CRW
* Crystalline
* Crystallinity
* Crystallite
* Crystal Structure
* Crystal System
* CS
* CSA
* CSAC
* CSB
* CSC
* CSD
* CSE
* CSF
* CSG
* C/SHF
* CSI
* CSIC
* CSIDS
* CSIP
* CSIS
* CSIT
* CSKD
* CSL
* CSM
* CSMA
* CSMA/CD
* CSMA/CR
* CSMB
* CSN
* CSO
* CSO3
* CSO4
* CSO5
* CSP
* CSPM
* CSPS
* CSR
* CSRS
* CSS
* CSSA
* CSSP
* CST
* C Stage
* CSTEM
* CSTG
* CSTR
* CSV
* CT
* CT3
* CTA
* CTC
* CTD
* CTe
* CTEP
* CTF
* CT Flowdown
* CTG
* CTH
* CTHF
* CTHR
* CTI
* CTIP
* CTIS
* CTL
* CTLTC
* CTM
* CTN
* CTP
* CTQ
* CTR
* CTRG
* Ctrl
* CTS
* CTSHF
* Ctsy
* CTT
* CTUR
* CTW
* CUCV
* Cultural Resistance * Culture, Organizational* Culture Change
* Cumulative Frequency Distribution * Cumulative Sum Control Chart (CUSUM)* CUR
* Cure
* Curie Temperature
* Curing Agent
* Curing Temperature* Curing time
* Current Good Manufacturing Practices (CGMP) * Current State Map (CSM)* CURT
* CUSH
* Customer
* Customer Demend
* Customer Benefits Package (CBP)* Customer Contact
* Customer Coproduction * Customer Co-Production* Customer Delight
* Customer Demand Planning * Customer-Driven quality * Customer Expectations * Customer Future Needs * Customer Future Needs Projection* Customer Needs
* Customer Outcomes
* Customer Perceptions * Customer Rationalization * Customer-Related Ratios * Customer Relationship Management (CRM) * Customer Retention * Customer Satisfaction* Customer Service
* Customer Service Surveys * Customer Supplier Model (CSM) * Customer Supplier Partnership * Customer Value Added Ratio* Cusum Chart
* CUV
* CV
* CVAF
* CVC
* CVD
* CVDAH
* CVE
* CVEP
* CVER
* CVIN
* CVIND
* C/VLV
* CVMS
* CVP
* CVR
* CVRCA
* CVRSS
* CVRTD
* CVS
* CVSA
* CVSE
* CVSP
* CVT
* CW
* CWDAR
* CWe
* CWG
* CWI
* CWQC
* CWT
* CXD
* CY
* CYC
* Cycle
* Cycle time
* Cycle Time Variation* Cyl
* CYTD
D (CLICK TO OPEN/CLOSE)* D
* D+E
* D2
* D3
* D4
* D-669
* D83
* D/A
* DA
* DAA
* DAB
* DABT
* DAC
* DACOR
* DAD
* DADA
* DAF
* DAFE
* DAH
* DAHVL
* DAL
* DAMVL
* D&A
* D&E
* DAP
* DAPM
* DAQ
* DAR
* DARPA
* DARS
* DARTS
* DAS
* DASCAR
* DASD
* DASM
* DAT
* Data
* Data-Collection-Sheet* DATES
* DAUG
* DAVE
* DAVTK
* Daylight
* DB
* DBA
* DBC
* DBCS
* DBE
* DBL
* DBM
* DBMS
* DBPSK
* DBR
* DBRC
* DBS
* D/C
* DC
* DCA
* DC&A
* DCAR
* DCC
* DCCH
* DCD
* DCE
* DCES
* DCFPR
* DCG
* D Chart
* DCI
* DCLR
* DCLS
* DCM
* DCN
* DCP
* DCR
* DCS
* DCSCM
* DCT
* DCU
* D/CVR
* DCXO
* DD
* DDA
* DDC
* DDCMP
* DDE
* DDIC
* DDL
* DDM
* DDM/MARS
* DDMS
* DDN
* DDP
* DDS
* DE
* DEA
* Dead Messenger Society* DEAL
* DEBPIT
* D/EC
* DEC
* Decel
* Decision Matrix
* DECS/ExeCS
* DECT
* Deduction
* Deep Draw
* Deep Drawing
* Def
* Defect
* Defective
* Defect Opportunity* Defect Structure
* DEFG
* DEFI
* Define
* Defog
* DEFR
* Deg
* Deg C
* Degradation
* Degree of Polymerization * Degrees of Freedom* DEGS
* DEHYDR
* DEIS
* DEK1
* DEK2
* DEL
* Delaminate, Delamination* Delay Allowance
* Delayed Effects
* DELCO
* Delighter
* Deliverable
* Delphi-C
* Delphi-E
* Delphi-H
* Delphi-I
* Delphi Method
* Delphi-P
* Delphi-S
* Demand Management
* Demerit Chart
* Deming Cycle
* Deming Prize
* DEMT
* Denier
* DeNox
* DENSCI
* DEP
* Dependability
* Dependent Events
* Dependent Sample
* Dependent Variables* Deployment
* Deployment Champion* Deployment
* Deployment Infrastructure * Deployment Planning* DEPR
* DEPS
* DERM
* DES
* DESAL
* DESC
* Descriptive Statistics* Design
* Design Failure Mode and Effects Analysis (DFMEA) * Design for Manufacturability and Assembly * Design Information Checklist* Design Reviews
* Design Validation
* Design Verification * Design and Development * Design Brief (Design Criteria)* Design Control
* Design for Assembly (DFA) * Design for Disassembly (DFD) * Design for Maintainability * Design for Manufacturability and Assembly * Design for Manufacture (DFM) * Design for Manufacturing and Assembly (DFMA) * Design for Manufacturing and Manufacturability (DFM) * Design for Remanufacture* Design for Reuse
* Design for Six Sigma (DFSS)* Design Input
* Design Life
* Design of Experiments* Design Record
* Design Review
* Design Validation
* Design Verification* DEST
* Detection
* DEV
* Development Plan
* Deviation
* Deviation Permit
* Devil's Advocate
* Devitrification
* D/EXH
* DF
* DFA
* DFC
* DFCO
* DFD
* DFE
* DFHSM
* DFI
* DFM
* DFM/A
* DFMA
* DFMEA
* DFMECA
* DFP
* DFR
* DFS
* DF SORT
* DFSS
* DFT
* DFW
* D glass
* DGM
* DGN
* DGND
* DGS
* D/H
* DHS
* DHTML
* DI
* DIA
* DIAC
* DIAG
* DIAGN
* Diagnosis
* Diagnostic Journey and Remedial Journey* Diamagnetism
* DIAPH
* DIBS
* DIC
* DIC-DIS
* DID
* Die
* dieCAS
* Die Casting
* Die Casting Alloys* Die Cutting
* Dielectric (Breakdown) Strength* Dielectric
* Dielectric Constant * Dielectric Displacement* Die Stamping
* Diff
* Diffraction (x-ray)* Diffusion
* Diffusion Coefficient (D) * Diffusion Flux (J)* Dig
* Digerati
* DILAC
* DIM
* Dimensioning
* Dimensionless Block Diagram* DIMM
* DIMR
* DIN
* DIP
* Dipole (Electric)
* DIR
* Direct Manufacturing * Direct Observation* DIRTFT
* DIS
* DISA
* DISB
* DISC
* DISCH
* Discon
* Discrete Data
* Discrete Probability Distribution * Discrete Proces Simulation * Discrete Random Variable* Discrete Variable
* Discrim
* Discrimination
* DISCRM
* Dislocation
* Dislocation Density* Dislocation Line
* DISP
* Dispersed Phase
* Dispersion
* Dispersion Hardening * Dispersion Strengthening* DISPL
* DISPR
* Dissatisfiers
* DIST
* Distance Learning
* DISTR
* Distributed Inspection* Distribution
* Distribution Management* DIT
* DIV
* Divergent Thinking* DJI
* DKE1
* DKE2
* DLA
* DLC(S/P)
* DLC
* DLE
* DLL
* DLM
* DLO
* DLPS
* DLS
* DLSC
* DLSCR
* DLT
* DLVY
* DM
* DMA
* DMADV
* DMAIC
* DMAIC Project
* DMAIIC
* DMC
* DMCM
* DMD
* DME
* DMECS
* DMEDVI
* DMFC
* DMG
* DMGM
* DMI
* DMLS
* DMM
* DMN
* DMOS
* DMP
* DMR
* DMS
* DMT
* DN
* DNA
* DNC
* DNL
* DNPS
* DNR
* DNS
* DNSHFT
* DNV
* D/O
* DO
* DOA
* DOB
* DOC
* DOCSIS
* Document
* Document Tagging
* DOD
* Dodge-Romig Sampling Plans* DOE
* DOF
* DOHC
* DOI
* DOL
* DOM
* Domain
* Donor Level
* DOO
* Doping
* DOR
* Dorian Shaninin
* DOS
* DOSP
* DOT
* Dot Plot
* Double Sampling
* Downtime
* DP
* DPA
* DP&C
* DPC
* DPD
* DPDT
* DPF
* D/PFMEA
* DPG
* DPG/VEL
* DPI
* DPID
* DPM
* DPMA
* DPMO Calculations
* DPMO Definition
* DPNR
* DPP
* DPS
* DPSK
* DPST
* DPTV
* DPV
* DPX
* DQ&V
* DQI
* DQIT
* DQM
* DQS
* DQV
* DR
* DRA
* Draft Angle
* DRAM
* Drape
* Draw
* Drawing (Metals)
* Drawing (Polymers)* Drawing
* DRB
* DRBFM
* DRC
* DRD
* DRE
* DRF
* DRG
* DRGS
* DRI
* Drill
* Drill Press
* Driving Force
* Driving Forces
* DRL
* DRM
* DRMSDP
* DRN
* DRO
* Drop Forging
* DRP
* DRP II
* DRR
* DRS
* DRT
* DRU
* DRVN
* Drvr
* Dry Lay-up
* Dry Winding
* DS
* DSA
* DSAR
* DSB
* DSC
* DSCM
* DS/D
* DSDT
* DSE
* D/SEAL
* D/SEAT
* DSF
* DSGN
* D/SHLD
* DSI
* DSIR
* DSITT
* DSK
* DSL
* DSM
* DSMC
* DSO
* DSOC
* DSP
* DSS
* DSSS
* DST
* DSTM
* DSVD
* DSVT
* D/SW
* DTA
* DTC
* DTD
* DTDG
* DTE
* DTF
* DTG
* DTL
* DTM
* DTMF
* DTNT
* DTP
* DTQI
* DTR
* DTRNT
* DTS
* DTV
* DTX
* DU
* Dual Sourcing
* DUART
* ductile Fracture
* Ductile Iron
* Ductile-To-Brittle Transition* Ductility
* DUFC
* DUI
* Dump Hoppers
* DUNS
* DURA
* Durability
* Durometer Hardness* DUT
* DV
* DVAL
* DVAR
* DVB
* DVD
* DVDV
* DVM
* DVO
* DVP&R
* DVPS
* DVPS-T
* DVPTN
* DVT
* DVTD
* DVTR
* DVX
* D/W
* DW
* DW2
* DWA
* DWD
* DWDM
* Dwell
* DWG
* DWHI
* DWI
* Dwn
* DWO
* DYC
E (CLICK TO OPEN/CLOSE)* E
* E10
* E2
* E85
* EA
* EA1CT
* EA2CT
* EAC
* EACR
* EACSV
* EACT
* EACV
* EAD
* EAF
* EAG
* EAL
* EAM
* EAN
* E&C
* E&ES
* E&O
* EAO
* EAP
* EAPA
* EAPEL & A
* EAPG
* EAR
* Early Adopters
* Early Production Containment* Earlywood
* EARON
* EAS
* EASA
* EASV
* EAT
* EAU
* EBA
* EBC
* EBCDIC
* EBCM
* EBCT
* EBEDIC
* EBIT
* EBL
* EBM
* EBOM
* EBQ
* EBS
* EBT
* EBTCM
* EBW
* E/C
* EC
* ECA
* ECAR
* ECAS
* ECC
* ECD
* ECE
* ECF
* ECI
* ECIG
* ECL
* ECM
* ECM-VSSM
* ECO
* Eco-Design
* Econ
* ECOS
* ECOTEC
* ECR
* ECRC
* ECS
* ECT
* ECU
* ECUID
* ECV
* ECV/VCVS
* EDA
* EDC
* EDCC
* EDD
* EDDL
* EDE
* EDEC
* EDES
* EDFT
* Edge Dislocation
* EDI
* EDIF
* EDIFACT
* EDIR
* EDIS
* EDM
* EDMS
* EDOT
* EDP
* EDRD
* EDRU
* EDS
* EDSNET
* EDU
* Edwards Deming
* EE
* EEAS
* EEB
* EEC
* EECS
* EEFE
* EEMP
* EEMS
* EEO
* EEOC
* EEP
* EEPROM
* EERS
* EES
* EESB
* EETAC
* EEVC
* EFA
* EFC
* EFE
* EFELC
* EFEO
* EFF
* Effect
* Effectiveness
* Efficiency
* Efficient
* EFI
* eFlex
* EFO
* EFS
* EFSD
* EFT
* e.g.
* EG
* EGA
* E/GATE
* E glass
* EGM
* e-GM
* EGR
* EH
* EHA
* EHCU
* EHD
* EHPS
* EI
* EIA
* EI&S
* EIC
* EICD
* EIDE
* Eight Disciplines Problem Solving * Eight Kinds of Muda (Waste)* Eight Wastes
* Eighty-Twenty (80-20)* EIS
* EISA
* EISB
* EISC
* EIT
* EJCTR
* EL
* ELAS
* Elastic Deformation* Elastic Recovery
* Elastomer
* ELAZ
* ELB
* ELBA
* ELC
* ELDO
* Elec
* ELECT
* Electrical Conductivity* Electric Dipole
* Electric Field
* Electrodischarge Machining * Electroluminescence* Electrolyte
* Electromotive Force (emf) Series * Electron Beam Machining * Electron Configuration* Electronegative
* Electron Energy Band* Electroneutrality
* Electronic Data Interchange * Electron State (Level) * Electron Volt (Ev)* Electroplating
* Electropositive
* ELEK
* Elongation
* ELPO
* ELR
* ELV
* E/M
* EMA
* EMAC
* EMB
* EMBASSY
* EMC
* EMCASS
* EMD
* EMER
* EMF
* EMI
* EMIS
* EML
* EMM
* EMP
* Empathy
* Empirical Law of Averages* Empirical Method
* Empirical Probability* Empirical Rule
* Employee Involvement (EI)* Empowerment
* EMR
* EMS
* EMT
* EMU
* EN
* ENB
* Endurance Limit
* End Use
* End User
* Energy Band Gap
* ENG
* Engineering Thermoplastic * Engineering Timber * Engineering Analysis * Engineering Design* Engineering Model
* Engineering Pilot
* Engineering Polymers * Engineering Strain * Engineering Stress* ENGMT
* ENGRG
* ENGY
* ENGZR
* ENIAC
* Enterprise Capabilities * Enterprise Resource Planning (ERP) System* Entitlement
* Entrepreneur
* Entropy
* ENV
* ENVIC
* EO
* EOA
* EOB
* EOD
* EOF
* EOG
* EOM
* EOP
* EOPC
* EOPTS
* EOQ
* EOS
* EOT
* EP
* EPA
* EPAC
* EPA/CM
* EPACT
* EPAD
* EPA/LVM
* EPA/OM
* EPCA
* EPC&L
* EPCI
* EPCMT
* EPCOT
* EPCS
* EPCT
* EPD
* EPDC
* EPDM
* EPEC
* EPF
* EPFI
* EPIC
* EPICenter
* EPICS
* EPICS EST
* EPIC Solution Matrix* EPL
* EPLD
* EPM
* EPMS
* EPN
* EPN Status Code
* EPP
* EPPC
* EPR
* ePRA
* EPRI
* EPROM
* EPS
* EPT
* EPTV
* EPU
* EQ
* EQC
* EQLZR
* EQSC
* Equator (Filament Winding) * Equilibrium (Phase)* EQUIP
* Equipment Availability * Equipment Failure Loss* ER
* ERA
* ERAPA
* ERD
* ERDS
* EREP
* ERG
* Ergomation
* Ergonomics
* Ergonomic Study
* ERGS
* ERIS
* ERISA
* ERM
* ERO
* Erosion-Corrosion
* ERPM
* Error & Mistake-Proofing a.k.a. Poka-Yoke (Japanese)* Error Detection
* Error Proofing
* Error Proofing Layout* ERS
* ERW
* ES
* ESA
* ESAC
* ESAL
* ESB
* ESC
* ESCS
* ESCUT
* ESD
* ESDI
* ESDW
* ESI
* ESIS
* ESL
* ESM
* ESMG
* ESN
* ESO
* ESP
* ESPG
* ESPRIT
* ESQI
* ESRD
* ESS
* ESSI
* ESSO
* ESSR
* EST
* Estimated Sigma
* ESTM
* ESV
* ETA
* ETC
* ETD
* ETFE
* ETG
* Ethics
* Ethnography
* ETI
* ETI/P
* ETIR
* ETM
* ETMS
* ETO
* ETR
* ETS
* ETSC
* ETSD
* ETSM
* eTT
* ETTM
* EU
* EUC
* EUI
* EUN
* EUR
* EURM
* EUROSID
* Eutectic Phase
* Eutectic Reaction
* Eutectic Structure * Eutectoid Reaction* EV
* EVA
* EVAC
* Evaluation
* Evaluation Assessment* EVAP
* Evaporating Cloud
* EVC
* Event
* EVL
* EVO
* EVP
* EVPA
* EVPD
* EVPR
* EVRV
* EVT
* EWB
* EWL
* EWMA
* EWO
* EWO+
* EWOVPR
* EWS
* EX
* EXCH
* Excited State
* EXH
* EXIT
* Exit Criteria
* Exogenous Factors
* EXP
* EXPDG
* Expectations
* Expected Frequencies * Experiential Training Techniques* Experiment
* Experimental Design* Expert System
* EXPN
* Exponential Smoothing* Exporter
* EXPRESS
* EXT
* External Changeover Steps* External Customer
* External customers* External Events
* External Failure
* External Failure Costs* External Services
* External Setup Steps * External Validation* EXTN
* EXTR
* Extrinsic Motivation * Extrinsic semiconductor* Extrusion
* EYLT
F (CLICK TO OPEN/CLOSE)* F
* F23
* F4WD
* F/A
* FA
* FA1C
* FA2C
* FAA
* FaAA
* FAB
* Fabric
* Fabrication
* FAC
* Face
* Face-Centered Cubic (FCC)* Facilitate
* Facilitation
* Facilitator
* Facilities Design
* FACT
* Factor
* Factorial Experiments* Factory Cost
* FACTS
* FAD
* FAE
* FAFVM
* FAI
* Failure
* Failure Modes Analysis (FMA)* Failure Cost
* Failure Mode, Effect, and Criticality Analysis * Failure Mode Analysis (FMA) * Failure Mode Effects and Criticality Analysis (FMECA) * Failure Modes and Effects Analysis (FMEA)* Failure Rate
* False Discovery Rate* FAMAS
* FAMC
* FAMSO
* FAN
* F&L
* FAPM
* FAQ
* FARAD
* FARM
* FARS
* FAS
* FAS-ID
* FASM
* FAST
* FAT
* Fatigue
* Fatigue Allowance
* Fatigue Life
* Fatigue Limit
* Fatigue Strength
* Fault Tree Analysis* FAVM
* FAX
* F/AXL
* FBBA
* FBC
* FBDA
* FBG
* FBHP
* FBR
* FC
* FCA
* Fcast
* FCB
* FCC
* FCEV
* FCL
* F/CMPT
* FCN
* FCO
* FCP
* FCR
* FCS
* FCT
* F/D
* FD
* Fdbk
* FDC
* FDDI
* FDF
* FDI
* FDM
* FDMA
* FDNR
* FDR
* FDS
* FDTN
* FE
* FEA
* FEAD
* Feasibility
* Feather
* Feature
* Feature Checking Method* Feature Creep
* Features
* Feb
* FEC
* FECS
* FED
* FEDR
* FEDS
* Feeder Lines
* FEERS
* FEF
* FEGA
* FEIC
* FELT
* FELVP
* FEM
* FEMA
* FEMP
* F/END
* FEP
* FER
* Fermi Energy
* Ferrimagnetism
* Ferrite (Ceramic)
* Ferrite (Iron)
* Ferromagnetism
* Ferrous
* Ferrous Alloy
* FES
* FE-SID
* FESM
* FET
* FETS
* Fettling
* FEV
* FEX
* F/F
* FFA
* FFB
* FFCRS
* F/FDR
* FFE
* FFF
* FFH
* FFI
* F/FLR
* FFP
* FFR
* FFS
* FFT
* FFV
* FFY
* FG1C
* FG2C
* F/GA
* FGI
* FH
* FH&C
* FHMR
* FHP
* FHSS
* FHV
* FHWA
* FI
* FIA
* Fiber
* Fiber-Reinforced Composite * Fiber reinforcement * Fibre Reinforced Plastics (FRP) * Fibre Saturation Point (FSB)* FICA
* Fick's First Law
* Fick's Second Law
* FICM
* FID
* F/IDL
* Field Testing
* FIFO
* Figured Grain
* FIL
* FILA
* File
* File Transfer Protocol (FTP)* Filler
* Fillet
* Film Adhesive
* FILO
* Filt
* FIM
* FIN
* Final Inspection
* Final Product Definition* Final Report
* Final Yield
* Financial Analysis * Financial Benchmarking* Financial Ratios
* Fine pearlite
* Finished Goods Supermarket * Finite Element Analysis (FEA)* F/INJN
* F/INJR
* FIP
* FIPS
* FIR
* Fire Fighting
* Firing
* First Article
* First In First Out (F.I.F.O.) * First Pass Yield (FPY) * First Time Quality (FTQ)* First Time Yield
* First-To-Market
* FIRTFT
* FIS
* Fishbone Diagram
* Fishing Expedition* FIT
* Fitness For Use
* FIVC
* Five-Phase Lean Approach* Five S's
* Five Whys
* FL
* FLA
* Flame Retardant
* Flange
* FLASH
* Flashing
* FLC
* FLDG
* FLEV
* FLEX
* Flexible Automation * Flexible Manufacturing System (FMS)* FLG
* FLIP
* FLIR
* FLMBTY
* FLOPS
* Flow
* Flow Chart
* Flow Diagrams
* Flow Kaizen
* Flow Process Chart* Flow Racks
* Flr
* FLS
* FLSHR
* FLTR
* Fluorescence
* FLYWHL
* Fm
* FM1C
* FM2C
* FMA
* FMC
* FMCS
* FMCSR
* FMEA
* FMECA
* FMH
* FMIS
* FMIT
* FMMDP
* FMMP
* FMP
* FMS
* FMSCM
* FMVBC
* FMVB-ns
* FMVCP
* FMVSR
* FMVSS
* FNA
* FNC
* FNES
* FNM
* FNR
* FO
* Foam
* FOB
* Focused Factories
* Focus Group
* Focus Groups
* FOD
* FOG
* FOH
* FOIA
* FOIL
* FOIRL
* FOM
* Forced Ranking
* Force Field Analysis* FORG
* Forge
* Forging
* FORMAC
* Forming
* Form Study
* FORTRAN
* Forward Bias
* FOT
* FOTS
* Foundry
* FP
* FPA
* FPAA
* FPBW
* FPC
* FPD
* FPE
* FPGA
* FPHS
* FPM
* F/PMP
* FPMR
* FPN
* FPP
* FPR
* FPV1C
* FPV2C
* FQIT
* FR
* FRACAS
* Fractional Factorial DOE * Fracture Mechanics * Fracture Toughness* FRAM
* FRATE
* FRB
* FRBP
* FRED
* Free Electron
* Free Energy
* Frenkel Defect
* Freq
* Frequency Chart
* Frequency Distribution* FRICT
* Friction Welding
* FRL
* FRM
* FRM/U
* Frnt
* From To Chart
* FRP
* FRS
* F/RST
* FRT
* FRU
* FS
* FSA
* FSCM
* FSD
* FSE
* F/SEAT
* FSF
* FSG
* FSK
* FSL
* FSM
* FSO
* FSR
* FSS
* FST
* FSTN
* FSU
* FSVC
* FSW
* FT
* FTA
* FTBD
* FTC
* FTE
* FTG
* FTL
* ft-lb
* F/TNK
* F/TOP
* FTP
* FTP-H
* FTQ
* FTQC
* FTT
* FTTA
* FTTC
* FTTH
* FTVV
* FTZ
* FUBAR
* FUD
* FUDS
* Full Annealing
* Full-Baldrige Approach * Full Factorial DOE* Function
* Functional Benchmarking* Functional Layout
* Functional Verification * Fundamental Counting Principle * Fundamental Rule of Counting* Funnel Experiment
* FUT
* FV
* FVC
* FVS
* FWD
* FWG
* FWH
* FWHM
* FWIW
* FWS
* FY
* FYI
G (CLICK TO OPEN/CLOSE)* G
* GA
* GAAP
* GaAs
* GAC
* GACB
* GACM
* GAE
* Gage R&R
* Gage Repeatability and Reproducibility (GR&R)* GAI
* GAIM
* Gain Sharing
* GAL
* GALC
* GALIA
* Galvanic Corrosion* Galvanic Series
* Galvanize
* GAMRF
* G&A
* Gantt Chart
* GAO
* Gap
* Gap Analysis
* GAPC
* GARN
* Gas Constant
* GATE
* Gatekeeper
* GATS
* Gauge R&R
* GAW
* GAWR
* Gb
* G/BHP-H
* GBOF
* GBOM
* GBOP
* GBP
* GBRS
* GCAS
* GCC
* GCW
* GCWR
* g/cyl
* GD
* GD&T
* GDE
* GDI
* GDO
* GDOE
* GDS
* GDSII
* GDSS
* GDT
* GEBFWC
* GEC
* GEDOC
* Gel
* GELC
* Gel Coat
* Gel Point
* GEM
* Gemba
* GEMS
* Gen
* Genchi Genbutsu
* Generic Benchmarking* GEN I
* Genichi Taguchi
* GEN II
* Geometric Dimensioning and Tolerancing (GD and T)* Geometric Mean
* Geometric Modelling* GEPS
* GEPSC
* GES
* GESMG
* GFCI
* GFI
* GFIC
* GFS
* GFSK
* GGE
* GGRR
* GHG
* Ghz
* GI&TT
* GIB
* Gibbs Phase Rule
* GIC
* GIDEP
* GIF
* GIGO
* GIL
* GIM
* GIRP
* GIRS
* GIS
* GIS/PP
* G/L
* GL
* GLA
* Glass
* Glass-Ceramic
* Glass Filament Bushing * Glass Transition Temperature* GLCTTR
* GLIS
* Globalization
* GLOSSAR
* GLPI
* GLPS
* GLS
* GLTC
* GLZ
* GM1927-14
* GM1927-17
* GM1927-19
* GM1927-2
* GM1927-20
* GM1927-21
* GM1927-5
* GM1927-7
* GMAT
* GMAW
* GMEITC
* G/MLDG
* GMPCS
* GMPX
* GMQ
* GMRR
* GMS
* GMSCM
* GMSIPS
* GMSK
* GMT
* GMX
* GND
* GNP
* G/NUT
* Goal
* Gob
* Go/No-Go
* Good Laboratory Practices (GLP) * Good Manufacturing Practices (GMP) * Goodness-Of-Fit Test* GOPS
* GOV
* GOVT
* GP
* GP-03
* GP-04
* GP-05
* GP-06
* GP-07
* GP-08
* GP-09
* GP-10
* GP-11
* GP-12
* GPC
* GPD
* GPDAS
* GPDBS
* GPDC
* GPDIC
* GPDP
* GPDS
* GPDT
* GPDW
* GPIB
* GPM
* GPPC
* GPPS
* GPRTS
* GPS
* GPSG
* GPSM
* GPSS
* GPU
* GQC
* GQIR
* GQIT
* GQL
* GQS
* GQTS
* GR
* Grade
* Graduate
* Graft Copolymer
* Grain
* Grain Boundary
* Grain Growth
* Grain Size
* GR&R
* Grant Chart
* Gray cast Iron
* GRC
* GRE
* Green Timber
* Green Belt (GB)
* Green Belt
* Green Ceramic Body * Green Manufacturing* Green State
* GRI
* GRIDS
* GRIN
* Grind
* Grinding Machine
* GRIP
* GRL
* GROM
* Ground State
* Group Decision
* Group Decision Support System* Group Dynamic
* Group "Memory"
* Group Technology (GT) (A.k.a. Part Families)* Groupthink
* GRP
* GRS
* GRV
* GRVD
* G/S
* GS
* G's
* GSA
* GSB
* GSFUDS
* GSIS
* GSKT
* GSLC
* GSM
* GSMK
* GSMP
* GSN
* GSP
* GSS
* GSTN
* GT
* GTAW
* GTC
* GTESMG
* GTO
* GTR
* GTS
* GTT
* GUI
* GUSS
* GVAR
* GVDP
* GVL
* GVM
* GVMR
* GVW
* GVWR
* GW
* GWO
H (CLICK TO OPEN/CLOSE)* H
* HA
* HAC
* Hack
* HAIR
* Hall Effect
* HALT
* HANS
* Hansei
* HAR
* Hard Data
* Hard Data Measurements* Hardenability
* Hard Magnetic Material* Hardness
* Hardness Test
* Hard Savings Definition* Hardware Mock-Ups
* Hardwood
* HARM
* HARN
* HASS
* Hawthorne Effect
* HAZ
* HBCC
* HB-CI
* HBT
* H/C
* HC
* HCCI
* HCDSS
* HCG
* HCHO
* HCI
* HCL
* HCM
* HCP
* HD
* HDAC
* HDB
* HDDE
* HDE
* HDI
* HDL
* HDLC
* HDLNG
* HDLP
* HDM
* HDO
* HDPE
* HDR
* HDRA
* HDS
* HDSL
* HDTMA
* HDTP
* HDTV
* HDV
* HDW
* HE
* HEA
* Heartwood
* Heat Capacity
* HEBA
* HEBBA
* HEC
* HEI
* Heijunka
* Heijunka Box
* HELP
* HEMT
* HEOS
* HER
* HERTZ
* HESI
* Heterogeneous
* Heteroscedasticity* HEUI
* HEV
* HEVES
* Hex
* Hexagonal Close-Packed (HCP)* HF
* HFC
* HFCI
* HFDO
* HFE
* HFET
* Hg
* HGI
* HGL
* H/HF
* Hi
* HIC
* HID
* Hidden Factory
* Hidden Factory Definition * Hierarchy of Product Features * Highly Accelerated Life Test (HALT) * Highly Accelerated Stress Audits (HASA) * Highly Accelerated Stress Screening (HASS)* High Polymer
* High-Strength, Low-Alloy (HSLA) Steels* HIN
* HIP
* HIPO
* HIPOT
* Hips
* HIR
* HIS
* Hist
* Histogram
* HITEC
* HITS
* HLA
* HLB
* HLC
* HLD
* HLDI
* HLDR
* HLL
* HLLAPI
* HMCC
* HMD
* HMI
* HMMWV
* HMO
* HMR
* HMS
* HMTA
* HNGR
* HNS
* HO
* HO2S
* HOLDN
* Hole (Electron)
* Homopolymer
* Homoscedasticity
* HOP
* Horiz
* Horizontal Deployment * Horizontal Magnification of a Profile Recording Instrument* Hoshin
* Hoshin Kanri
* Hoshin Planning Definition * Hoshin Planning Process* Hot Working
* House of Quality (HOQ)* HOV
* H/P
* HP
* HPAF
* HPC
* HPDI
* HPGL
* HPIB
* H/PLR
* HPM
* H/PRF
* HPS
* HPV
* HPVM
* HPVS
* HQIT
* HR(D)
* HR
* HRC
* HRD
* hrdw
* HRM
* HRRC
* Hrs
* H/RST
* HRTF
* HRTSC
* HS
* HSC
* HSDI
* HSE
* HSG
* HSHL
* H/SHLD
* HSIRS
* HSIS
* HSLA
* HSPDS
* HSR
* HSRI
* HSS
* HSTP
* HSWIM
* HT
* HTCM
* HTD
* HTF
* HTFS
* HTI
* HTL
* HTML
* Htr
* HTT
* HTTP
* HUD
* HUFSAM
* Human Resource Measures* HV
* HVAC
* HVAC/PTC
* HVAIC
* HVD
* HVEMP
* HVL
* HVOF
* HVPE
* HVPSP
* HVS
* HVUT
* HVY
* H/W
* HW
* HW4
* HWCI
* HWF
* HWG
* HWIO
* HWPS
* HWS
* HWY
* HYB III
* Hybrid Composite
* Hybridization
* HYD
* Hydrogen Bond
* Hydroplastic Forming* HYGE
* Hypereutectoid Alloy* Hypothesis
* Hypothesis Alternative* Hypothesis Null
* Hypothesis Testing * Hysteresis (Magnetic)* Hz
I (CLICK TO OPEN/CLOSE)* I
* I2L
* I2L/MTL
* I2O
* I2U
* I3
* IA
* IAB
* IAC
* IACP
* IACS
* IACV
* IAF
* IAFM
* IAFS
* IAMS
* IAOB
* IAPIE
* IAPIE Model
* I/ARM
* IARV
* IAT
* IATF
* IAV
* IBEW
* IBIS
* IBM
* IBMA
* IBNR
* IBP
* IBS
* IBT
* IBTTA
* IBU
* IC
* ICA
* ICAFM
* ICAM
* ICC
* ICCS
* ICD
* ICDX
* ICE
* ICEA
* ICF
* ICIP
* ICM
* ICMP
* ICP
* ICRP/ICRQ
* ICS
* ICSS
* ICU
* ICV
* ICVM
* ICW
* ID
* IDB
* IDC
* IDDAS
* IDE
* IDEA
* Ideal Final Result (IFR) * Ideal Manning Levels* Ideal Quality
* Ideal State Map
* IDEAS
* IDEF0
* IDEF1
* IDENT
* IDES
* IDI
* IDL
* Idle Time
* IDLN
* IDN
* IDP
* IDR
* IDSR
* IDTN
* i.e.
* IE
* IEA
* IEAFM
* IEC
* IECA
* IE/CM
* IEDP
* IEE
* IEEE
* IEFI
* IEMA
* IEMO
* IEPD
* IES
* IETF
* I/F
* IFA
* IFC
* IFF
* IFG
* IFI
* IFR
* IFRD
* IFS
* IFTA
* IGBT
* IGCT
* IGDG
* IGES
* IGM
* Ign
* IGR
* IGS
* IHO
* IHRA
* IHS
* IHSD
* IHSDM
* IIA
* IID
* IIE
* IIEC
* IIHS
* III
* IIL
* IIO
* IIR
* IIRS
* IIS
* IJCAI
* IJVP
* IL
* ILAC
* ILC
* ILD
* ILEV
* Illum
* ILM
* ILRS
* I/M
* IM
* IMA
* IMAC
* Imagineering
* IMAN
* IMAP
* IMC
* IMD
* IMDX
* IMFI
* IMHO
* IMI
* Immo
* IMP
* IMPA
* IMPAC
* IMPACS
* Impact energy (Notch Toughness)* Imperfection
* Implementation Plan * Implementation Training Matrix* IMPLR
* Impregnate
* IMPRESS
* Impression Die Forging* Improve
* Improvement
* IMQ
* IMRC
* IMS
* IMST
* IMT
* IMTG
* IMTT
* In
* In Process Supermarket* Inadv
* Inc
* Incand
* Incident Chart (I-Chart)* IN CL FD
* INCLR
* In-Control Process * Incremental Improvement* IND
* Independent Event
* Independent Observations * Independent Sample * Independent Variable * Index of Refraction* Indicators
* Individual Cycle Time * Individual Needs Assessment * Individuals Control Chart* Induction
* INEEL
* INEL
* Inferential Statistics* Infl
* INFLR
* Info
* Information Flow
* Information Integrity or Infotegrity * Informative Inspection * Informative Inspection Method * Informative Self Inspection* Infrastructure
* INF-S
* Ingot
* Inherent Process Variation* in-Hg
* Inhibitor
* Init
* Initialization
* Initial Sample
* Initiator Firm
* Inj
* Injection Molding
* INJN
* INJR
* INL
* In-lb
* Innovation
* In-Process Inspection* Input
* Inputs
* INR
* INS
* INSL
* INSP
* Inspection, 100%
* Inspection, Curtailed * Inspection, Normal * Inspection, Reduced * Inspection, Tightened* Inspection
* Inspection Cost
* Inspection Lot
* INST
* Instant Pudding
* INSTL
* INSTR
* Instrument Bias
* Insulator (Electrical)* INT
* INTA
* Intangible
* Integrated Circuit* INTELSAT
* INTER
* Interaction Effect* Interdiffusion
* Interested Party
* Interference
* Interference Checking * Intergranular Corrosion * Intergranular Fracture* Interim Approval
* Interlaminar Shear Strength * Intermediate Customers * Intermediate Solid Solution * Intermetallic Compound * Internal Assessment * Internal Changeover Steps* Internal Customer
* Internal Customers* Internal Failure
* Internal Failure Costs * Internal Quality Audit* Internal Rises
* Internal Services
* Internal Setup
* Internal Suppliers * Internal Validation * International Organization for Standardization * Interquatile Range * Interrelationship Diagram * Interrelationship Digraph* Interruption
* Intersection
* Interstitial Diffusion * Interstitial Solid Solution* Interval Estimate
* Interval Level of Measurement* Intervention
* INTL
* INTLK
* INTR
* Intrinsic Motivation * Intrinsic Semiconductor* INV
* Invariant Point
* Inventive Benchmarking* Inventory
* Inventory Turns
* Investigation
* Involuntary Services* I/O
* IO
* IOCG
* Ionic Bond
* IOS
* I/P
* IP
* IPA
* IPACS
* IPC
* IPCI
* IPCM
* IPCP
* IPD
* IPE
* IPG
* IPI
* IPL
* IPLAy
* IPM
* IPMS
* IPO
* IPP
* IPPDS
* IPPS
* IPR
* IPS
* IPSD
* IPT
* IPTV
* IPU
* IPX
* IQL
* IQR: Internal Quality Review* IQS
* IR
* IRAM
* IRAM2
* IRANOR
* IRB
* IRC
* IRCP
* IRDA
* IRE
* IR/EAS
* IRF
* IRI
* IROC
* IRQ
* IRR
* IRS
* IRSS
* IRT
* IRVM
* IRVSM
* I/S
* ISA
* ISA-95
* ISAD
* IS&S
* ISB
* ISBN
* ISBM
* ISC
* ISCM
* ISCTA
* ISDN
* ISDR
* ISE
* I/SEAT
* ISEE
* ISF
* ISG
* Ishikawa Diagram
* ISI
* ISICR
* ISIP
* ISIR
* ISIS
* ISM
* ISO
* ISO 10013
* ISO 10019
* ISO 13485
* ISO-14000
* ISO 14001
* ISO 19011
* ISO 22000
* ISO 29001
* ISO-9000
* ISO 9000 Series of Documents Including ISO 9001 * ISO 9000 Series Standards* ISO 9001
* ISOC
* Isomersism
* Isomorphous
* Isotactic
* Isothermal
* Isothermal transformation (T-T-T) Diagram* Isotopes
* Isotropic
* ISO/TS 16949
* ISP
* ISP&P
* ISPEC
* ISPI
* ISRV
* ISRVM
* ISS
* ISSC
* ISSCC
* ISSCO
* ISTEA
* ISTO
* ISTR
* ISWYM
* IT
* ITA
* ITAA
* ITAC
* ITBI
* ITC
* ITD
* ITDC
* ITE
* ITGT
* ITH
* ITI
* ITIC
* ITIS
* ITK
* ITO
* ITP
* ITRI
* ITS
* ITSD
* ITSM
* ITSP
* ITT
* ITTR
* ITU
* IUE
* IUU
* IUVA
* IV
* IVCS
* IVD
* IVDS
* IVDT
* IVED
* IVER
* IVER-LL
* IVHS
* IVI
* IVN
* IVO
* IVR
* IVS
* IVSS
* IVT
* IW
* IWC
* IYSWIM
* Izod test
J (CLICK TO OPEN/CLOSE)* J
* J1850
* J1962
* J2EE
* J2SE
* JA
* JAD
* JAIA
* JAMA
* JAMCO
* Jan
* JAR
* JASIC
* JATE
* J/BLK
* JCL
* JDBC
* JDK
* JDP
* JEDEC
* JEIDA
* JES
* JES2
* JETL
* JETS
* JFET
* Jib Cranes
* JIC
* JICST
* JIDL
* Jidohka
* Jidoka
* Jig
* JIS
* JISC
* JIT
* JK
* JKG
* JKT
* JL
* JMOS
* JMS
* JN
* JND
* JOA
* Job
* Job Analysis
* Job Instruction
* Joint Commission
* Joint Probability
* Jominy End-quench test* Joseph Juran
* JOVIAL
* JPCA
* JPEG
* JPH
* JPL
* JPR
* JR
* JRT
* J/SCR
* JST
* JT
* JTAB
* JTAG
* JTAPI
* JTC1
* JTFA
* JTPL
* Judgment Inspection* Jul
* Jun
* JUNC
* Junction transistor* Juran Trilogy
* Just Do It Project * Just-In-Time (JIT) Manufacturing * Just-In-Time (JIT) Purchasing * Just-In-Time (JIT) Training* Just In Time
* JV
K (CLICK TO OPEN/CLOSE)* K
* Kaizen
* Kaizen event
* Kaizen-Blitz-Definition * Kaizen Event (or Kaizen Blitz) * Kaizen-Event-Facilitator-Definition* KAM
* Kanban
* Kano-Model-Definition* KANSE
* Kaoru Ishikawa
* KAP
* kB
* KBE
* KBps
* KBS
* KC
* KCC
* KCDS
* KCU
* KDD
* KE
* Keiretsu
* Kerf
* KES
* Key
* Key Business Factors aka KBF * Key Control Characteristics (KCCs) * Key Performance Indicator (KPI)* Key Process
* Key Process Characteristic * Key Process Input Variable aka KPIV * Key Process Output Variable aka KPOV * Key Product Characteristics (KPC)* Key Results Area
* Keyway or Keyset
* KF
* KFOD
* Kg
* KGD
* Kg/h
* KHz
* KI
* Kiln-Dried Timber
* Kinetics
* KIOD
* KISS
* Kitting
* Kitting System
* kJ
* KJ Method
* KLCR
* KLOTS
* KLP
* km
* Km/h
* Km/l
* KMS
* KNDI
* Knoop Hardness Number (KHN) * Knowledge-Growth Systems * Knowledge-Transfer-Definition* Knowledge Work
* KNU
* Knurl
* Knurling
* KO
* KOL
* KP
* kPa
* KPC
* KPH
* KPI
* KPL
* KR
* Kruskal-Wallis test* KS
* Ksp
* K/UP
* Kurtosis
* kV
* kW
* kWh
L (CLICK TO OPEN/CLOSE)* L
* L/100km
* L4
* L850
* La
* LAAM(O)
* LAAM
* LAB
* Laboratory
* Laboratory Scope
* LACT
* LAD
* LAER
* LAM
* Laminar Composite
* Laminate ply
* LAN
* LANL
* LAO
* Lap
* LAR
* Large-Particle Composite* LASER
* Laser Beam Machining* Laser Cutting
* Last In First Out (L.I.F.O.) * Last Off Part Comparison* LAT
* LATA
* LATCH
* Lathe
* Lathing
* LATL
* Lattice
* Lattice Parameters* Lattice Strains
* LAV
* Law of Averages
* Law of Diminishing Marginal Returns * Law of Large Numbers* Lay
* Layered Audits
* Layout
* Layout Inspection
* LBL
* Lbs
* LBS.FT.
* LBS.IN.
* LBT
* LBW
* LC2MOS
* LCA
* LCC
* LCCA
* LCCC
* LCCMOS
* LCD
* LCE
* LCF
* LCG
* LCI
* LCIDE
* LCL
* LCM
* LCMA
* LCOS
* LCP
* LCR
* LCS
* LCT
* LCV
* LD
* LDAP
* LDC
* LDCL
* LDCM
* LDFD
* LDGV
* LDM
* LDMOS
* LDO
* LDPE
* LD-RRIM
* LDSPS
* LDT(1)
* LDT(2)
* LDT
* Lduty
* LDV
* LE
* LEAD
* Leader Behaviour
* Leadership
* Leader Skills
* Leading
* Lead Time
* Lead Time Quantity * Lead-Time Reduction* Lean Office
* Lean
* Lean Enterprise (a.k.a. Lean Manufacturing) * Lean Manufacturing * Lean Manufacturing / Production* Lean Migration
* Lean Production
* Lean Six Sigma
* Learning Curve Effect * Learning Organization * Least Squares Method* LEC
* LED
* LEF
* LEGR
* Leinear Coefficient of Thermal Expansion* LEO
* LEP
* LEPC
* LEPT
* LESO
* LETN
* LEV
* Level
* Leveling
* Level-Loading & Mixed-Level-Loading (a.k.a. Heijunka, Balancing)* Level Loading
* Level of Significance* Lever rule
* L/F
* LF
* LFL
* LFTR
* LFW
* LFWD
* LFWS
* L/GATE
* LGM
* LGR
* LGT
* LGTDNL
* LH
* LHD
* LHN
* Li
* LIC
* Licensing
* LID
* LIDAR
* LIE
* LIF
* Life Cycle Cost
* Life Testing
* LIFO
* Li-Ion
* LIL
* LIMS
* LINCAP
* Linearity
* Linear polymer
* Linear Regression
* Line Balancing
* Line Chart
* Line-Stop Authority * Line Stop Concept (Andon)* LiPo
* LIQ
* Liquidus Line
* LISO
* LISP
* Listening Post
* Littles Law
* LIU
* LK
* LKG
* LLA
* LLA1R
* LLA2R
* LLBR
* LLC
* LLDPE
* LLF
* LLNL
* LLP
* LLPR
* LLPS
* LLVM
* LM
* LMD
* LMET
* LMG
* LMS
* LMSO
* LMT
* LMTNG
* L/N
* LN
* LNA
* LNB
* LNG
* LNKG
* LNR
* LNT
* L/O
* LO
* LOA
* Load Levelling
* Load-Load
* Load Smoothing
* LoB
* LOC
* LOCR
* LOC/SOC
* LOF
* Logbook
* LOGIC
* Logic Flow
* LOGS
* Log Sheet
* LOL
* LOMA
* Longitudinal Direction* LOR
* LOS
* LOSI
* Loss to Society
* Lost Customer Analysis* Lot, Batch
* Lot
* Lot Quality
* Lot Size (also referred to as N) * Lot Tolerance Percent Defective aka LTPD * Lot Tolerance Percent/Percentage Defective (LTPD)* Lot Waiting
* Lower Control Limit (LCL) * Lower Critical Temperature * Lower Specification Limit (LSL)* Low Hanging Fruit
* L/P
* LP
* LPC
* LPDFM
* LPEFI
* LPF
* LPG
* LPGA
* LPI
* LPL
* L/PLR
* LPM
* LPS
* LPT
* LPTW
* LQIT
* L/R
* LR
* LRC
* LRD
* LRMC
* Lrn
* LRPP
* LRRC
* LRS
* L/S
* LS
* LSA
* LSB
* LSC
* LSE
* LSES
* LSI
* LSL
* L/SLIP
* LSTG
* LT
* LTA
* LTCC
* LTD
* LTFC
* LTG
* LTHEF
* LTL
* LTM
* LTPD
* LTPW
* LTPWS
* LTQ
* LTR
* LTT
* LTV
* LU
* LUB
* LUGG
* Lumber
* Luminescence
* LUT
* LUV
* LVD
* LVDS
* LVDT
* LVL
* LVLG
* LVM
* LVP
* LVR
* L/V SEP
* LVW
* L/W
* LWA
* LWB
* L/WDO
* LWP
* LWR
M (CLICK TO OPEN/CLOSE)* M
* M2VA
* M4
* M85
* mA
* MAC
* Machinability
* Machine
* Machine Capability* Machine Shop
* Machine Vision
* Machining
* MACOS
* MACRO
* Macromolecule
* MACRS
* MACS
* MAD
* MADYMO
* MAF
* MAFS
* MAG
* MAG CARD
* Magnetic Field Strength * Magnetic Flux Density (B) * Magnetic Induction (B) * Magnetic Susceptibility* Magnetization (M)
* MAI
* MAINT
* Maintainability
* MAIR
* Major Disruption
* Malcolm Baldrige National Quality Award* Malf
* MALL
* Malleable Casting
* Malleable Cast Iron* Malpractice
* MAM
* Man
* Management
* Management by objective * Management By Fact* Management Review
* Management System
* Manager
* M&E
* Mandrel
* MANIF
* Manufact
* Manufacturability
* Manufacturing
* Manufacturing-Based * Manufacturing Execution System (MES) * Manufacturing Facilities Design * Manufacturing Lead Time * Manufacturing Process * Manufacturing Replenishment Lead Time * Manufacturing Resource Planning (MRP II) * Manufacturing System Design * Manufacturing Systems * Manufacturing Test/Verify* ManVal
* MAO
* MAP
* MAPI
* MAPICS
* Mapping Symbols or Icons* MAPS
* Mar
* MARCO
* Margin of Error
* Marked Print
* Market Price
* Market Research
* Market Share Data
* MARS
* Martensite
* MAS
* MASER
* MASH
* Mass Customization * Master Black Belt (MBB) * Master Black Belt Definition * Master Production Schedule (MPS)* Master Schedule
* MAT
* MATE
* Material Handling
* Material Requirements Planning (MRP) * Material Review Board * Materials Handling* MATL
* MATLSPEC
* Matrix
* Matrix Data Analysis* Matrix Diagram
* Matrix Phase
* MATS
* Matthiessen's Rule* MATV
* MAU
* Max
* Maximum Acceptable Subgroup Size* MB
* MBD
* MBE
* MBL
* MBM
* MBO
* MBOM
* Mbps
* MBR
* MBT
* M/C
* MC
* MCA
* MCAE
* MCARS
* MCAS
* MCB
* MCBF
* MCD
* MCDM
* MCE
* MCE1
* MCE2
* MCE3
* MCFC
* MCHG
* MCM
* MCN
* MCNS
* MCP
* MCR
* MCREGIS
* MCRL
* MCS
* MCSE
* MCU
* MCXO
* M/CYL
* MD
* MDA
* MDAI
* MDB
* MDBS
* MDC
* MDD
* MDDA
* MDF
* MDH
* MDI
* MDL
* MDM
* MDOT
* MDP
* MDPS
* MDRAM
* MDRE
* MDX
* ME
* MEA
* ME&D
* Mean
* Means
* Mean Square Between (MEB) * Mean Squared Error aka MSE * Mean Square Within (MSW) * Mean Standard Error Of * Mean Time Between Failures (MTBF)* Measure
* Measurement
* Measurement System * Measurement Systems Analysis (MSA) * Measurement Uncertainty * Measure of Central Tendency * Measure of Relative Position* Measures Matrix
* MEC
* MECE
* Med
* Median
* MEDLN
* MEEL
* Meeting Management* MEGR
* MEGR/EPR
* Melting Point (glass)* Mem
* MEMA
* MEMS
* MEO
* MEO&I
* MeOH
* Mer
* MERS
* MES
* MESFET
* MESI
* MESS
* MET
* Metal
* Metallic Bond
* Metallic Bonding
* Metastable
* Metric
* Metrics.
* Metrology
* METT
* Mezzanine
* MF
* MFAD
* MFC
* MFD
* MFG
* MFI
* MFLOPS
* MFM
* MFMEA
* MFN
* MFS
* M/FUNC
* MG
* MGM
* Mgmt
* MGO
* MGO Asm.
* MGO Cmpnt
* MGR
* MGVMR
* MH10
* MHC
* MHD
* MHDID
* MHE
* MHI
* MHS
* MHz
* mi
* MIA
* MIB
* MIC
* MICR
* MICRO
* Microconstituent
* Micro-Management
* Micron
* Microscopy
* Microstructure
* MID
* MIDAS
* MIDB
* MIDI
* MID / LUX
* MIE
* MIFF
* MIG
* MII
* MIL
* Milky Way Training* Mill
* Miller Indices
* Milling
* Milling Machine
* MIL-Q-9858 A
* MIL-STD-105 E
* MIL-STD-45662 A
* MIM
* MIMD
* MIME
* MIMIC
* MIN
* Mindmapping
* Minimum Acceptable Subgroup Size* MINLODE
* Minor Stoppages
* MIOSHA
* MIPS
* MIR
* MIRA
* MIRS
* MIS
* MISAR
* MISC
* MISS
* Mission
* Mission Statement
* Mistake Proofing
* Mistake Prevention * Mistake Proofing Kaizen* MIT
* MITI
* MIW
* MIX
* Mixed dislocation
* Mixed/Level-Loaded Production* Mixed Lines
* MKR
* MKT
* MLBS
* MLCG
* MLDG
* MLPS
* MLS
* MLSA
* MM
* mm3
* MMA
* MMC
* MMDB
* MMES
* MMF
* mmhg
* MMI
* MMIC
* MMIS
* MML
* MMM
* MMQC
* MMQIT
* MMR
* MMS
* MMSTS
* MMT
* MMTC
* MMTF
* MMTS
* MMU
* MMUCC
* MMX
* Mn
* MNG
* MNOS
* MNP
* MO
* MOC
* MOD
* MODE
* MODEM
* Modulus of Elasticity (E) * Modulus of Rupture* MOE
* MOEMS
* MOFTEC
* Mohs Hardness Number* Molarity (M)
* Mold
* Molding (Plastics)* Mole
* Molecular Chemistry (Polymer) * Molecular Structure (Polymer)* Molecular Weight
* Molecule
* MOM
* Moment of Truth
* Moment of Truth Analysis* MON
* Monomer
* Monorail Trolley Conveyors * Monte Carlo Simulation* Monument
* MOO
* MOOSE
* MOP
* MOPB
* MOPS
* MOR
* MOS
* MOSES
* MOSFET
* MOSIGT
* MOT
* Motion Step Checking Method* Motion Study
* MOU
* Mould-Release Agent* MOV
* MOVE
* Moving Range
* Moving Range Chart* MOW
* MOWAG
* MP
* MPa
* MPC&L
* MPCE
* MPCF
* MPD-2
* MPDS
* MPEG
* MPFI
* MPG
* MPG EFEO
* MPH
* MPI
* MPMP
* MPO
* M/PORT
* MPP
* MPS
* MPSC
* MPSDC
* MPTT
* MPU
* MPV
* MQ
* MQF
* MQFP
* MQM
* MR
* MRA
* MRB
* MR Chart
* MRD
* MRE
* MRF
* MRG
* MRI
* MRM
* MRO
* MROS
* MRP
* MRPII
* MRPS
* MRR
* MRT
* MS
* MSA
* MSAP
* MSAPC
* MSB
* MSC
* MSDS
* MSE
* MSEC,ms
* MSED
* MSF
* Msg
* MSI
* MSK
* MSL
* MSM
* MSNF
* MSO
* MSOP
* MSP
* MSPC
* MSRP
* MSS
* MS/SE
* MSSE
* MSTRE
* MSTS
* MSU
* MSV
* MSVA
* MSW
* MSZH1
* M/T
* MT
* MTA
* MTBE
* MTBF
* MTC
* MTD
* MTE
* MTFF
* MTG
* MTL
* MTM
* MTO
* MTP
* MTPI
* MTR
* MTRG
* M/TRNS
* MTS
* MTSO
* MTT
* MTTF
* MTTR
* MTV
* MU
* MUD
* Muda
* MUFF
* Mult
* Multicolumn Process Chart* MULTICS
* Multi Functional Teams * Multilevel Approach * Multiple Regression Analysis* Multiple Sampling
* Multiple Skills Matrix * Multiple Skills Systems * Multiplication Rule of Probabilities * Multi-Product Process Chart * Multi-User-CAD systems * Multivariate Analysis * Multivariate Control Chart* Multi-Vari Chart
* Multi-Vari Studies* Multivoting
* MUMPS
* Mura
* Muri
* MUSE
* MUST
* MUTCD
* Mutually Exclusive Events* Mux
* MVA
* MVB
* MVC
* MVDP
* MVEG
* MVEL
* MVMA
* MVNS
* MVO
* MVP
* MVS
* MVSA
* MVSR
* MVSS
* MVS TCP/IP
* MVS/XA
* MVTT
* MVZ
* MXI
* MY
* MY_XX
* MYM
* MYTD
N (CLICK TO OPEN/CLOSE)* N
* N/A
* NA
* NAA
* NAACP
* NAAQNA
* NAAQS
* NAB
* NAC
* NACCB
* NACE
* NACG
* NAD
* NADA
* NADC
* NADE
* NAE
* NAES
* NAFTA
* Nagara System
* NAGHSR
* NAHSC
* NAIAS
* NAIT
* NAM
* NAMA
* NAMPS
* NANC
* N&V
* NANP
* NANPA
* NAO
* NAOC
* NAP
* NAPA
* NAPCA
* NAPCP
* NAPP
* NAR
* NARSA
* NAS
* NASA
* NASB
* NASCAR
* NASPE
* NASS
* NATA
* NATB
* NATG
* National Institute of Standards and Technology (NIST)* NATP
* Natural Aging
* Natural Team
* Natural Work Groups* NAU
* NAV
* NAVMSS
* NAVO
* NAVSA
* NB
* NBC
* NBFM
* NBH
* NBS
* NBV
* N/C
* NC
* NCA
* NCAC
* NCAN
* NCAP
* NCAR
* NCBS
* NCHPT
* NCM
* NCMS
* NCP
* NCPA
* NCR
* NCRR
* NCS
* NCSA
* NCSI
* N/C (STATS)
* NC-UTCD
* NCWM
* N/D
* ND
* NDA
* NDC
* NDDTF
* NDH
* NDIR
* NDL
* NDR
* NDT
* NDUV
* Nd:YAG
* NE
* NEA
* NEB
* NEC
* Neck
* NEDA
* NEG
* Negative Correlation * Negatively Skewed Distribution* NEK
* NEMS
* NEPA
* NESEA
* NESSI
* Net Operating Time* Netting Analysis
* Networking
* Network Polymer
* NEU
* NEV
* New Philosophy
* Next Operation as Customer* NFS
* NGA
* NGEN
* NGEP
* NGM
* NGMBP
* NGO
* NGS
* NGT
* NGV
* NGVTP
* NHRA
* NHS
* NHTSA
* NHVR
* Ni
* NIADA
* NIASE
* NIBBLE
* NIC
* Ni-CD
* NIEE
* NIH
* Ni-Ion
* NIMBY
* NiMH
* Nine Dots
* NINQ
* NIOSH
* NIP
* NIP3
* NIPDE
* NIR
* NIS
* NIST
* NIU
* NI-V
* NIVHS
* NL
* NLEV
* NLRA
* NLRB
* Nm
* NMA
* NMAPC
* NMFT
* NMFTA
* NMHC
* NMI
* NMOC
* NMOG
* NMOS
* NMPA
* NMTBA
* NNTP
* NO
* NO2
* NOA
* NOB
* NOC
* NOCONTAM
* NOD
* Nodular Iron
* Nominal Group Technique * Nominal Level of Measurement* Nominal Value
* Non Ferrous
* Non-Chip-Forming Cutting* Nonconformance
* Nonconforming
* Nonconforming Unit* Nonconformities
* Nonconformity
* Noncontact Inspection* Noncrystalline
* Nondestructive Evaluation (NDE) * Nondestructive Testing and Evaluation (NDT, NDE)* Nonferrous Alloy
* Nonlinear Parameter Estimation* Nonnormal Data
* Nonnormal Data Distribution * Nonparametric Tests* Nonrandom Pattern
* Nonrandom Variation * Nonsteady-State Diffusion* Non Value Added
* Non Value Added
* Non-Woven Fabric
* NOPIC
* NOPUS
* Norm (Behavioral)
* NORMA
* Normal Curve
* Normal Distribution* Normality
* Normality Tests
* Normalized Yield
* Normalizing
* Normal Pace
* Normal Probability Plot * Normal Production Loss* Norming
* NOST
* NOU
* Nov
* NOx
* NOZ
* NPA
* NPC
* Np Chart
* NPD
* NPG
* N/PLT
* NPN
* NPO
* NPRA
* NPRM
* NPS
* NPTC
* NPTF
* NPV
* NQI
* N/R
* NR
* NRC
* NRE
* NREL
* NREN
* NRGP
* NROTC
* NRZ
* NRZI
* NS
* NS8
* NSB
* NSBE
* NSB Gates
* NSBU
* NSC
* NSEC
* NSF
* NSP
* NSPE
* NSPS
* NSR
* NTA
* NTC
* NTCL
* NTDB
* NTDRA
* NTEA
* NTF
* NTIA
* NTIS
* NTK
* NTLA
* NTP
* NTS
* NTSB
* NTSC
* NTTC
* n-Type semiconductor* Nucleation
* Null Hypothesis
* NUM
* NUMA
* Number of Affected Units Chart* NUMMI
* NURBS
* N/V
* NV
* NVAL
* NVBARS
* NVC
* NVD
* NVH
* NVI
* NVL
* NVM
* NVPP
* NVRAM
* NVRH
* NW
* NWR
* NWRA
* Nylon
* NYTO
* NZEV
O (CLICK TO OPEN/CLOSE)* O
* O2
* O2S
* OAAT
* OAFE
* OAG
* OAH
* OAL
* OA LAN
* OAP
* OASCR
* OAT
* OAW
* OBC
* OBD
* OBD II
* OBE
* Objective
* OBPA
* Observation
* Observed Frequencies * Observed Level of Significance* OC
* OCAR
* OCC
* OCF
* OCIP
* OCM
* OCP
* OCR
* OCS
* Oct
* Octahedral Position* OCXO
* O/D
* OD
* ODB
* ODBC
* ODBMS
* ODC
* ODETTE
* ODI
* ODM
* ODO
* ODOM
* ODPC
* ODQ
* OE
* OED
* OEE
* OEL
* OEM
* OEP
* OFD
* Office Layout
* Off-Line Experimentation* OFP
* OFQ
* OFW
* O/GA
* OGC
* O/H
* OH
* OHC
* OHIM
* Ohm's Law
* OHS
* OHV
* OHVT
* OIL
* OIS
* OJT
* OL
* OLAP
* OLAS
* OLBS
* OLC
* OLCS
* OLE
* OLH
* OLIMPIC
* OLIVIA
* OLTBI
* OLTP
* O/M
* OM
* OMB
* OMSAPC
* OMVSS
* ONC
* OnCE
* One-Piece Flow
* One Point Lesson
* One-Tail Hypothesis Test * One-Touch Exchange of Dies* One-Way ANOVA
* ONS
* On-the-Job Training* O/O
* OOP
* OP
* OPA
* Opaque
* OPC
* OPEB
* OPEC
* Open Die Forging
* OPEN I/O
* OPER
* Operating Characteristic (OC) Curve * Operating Expenses* Operating Results
* Operating Time
* Operation
* Operational Auditing * Operational Definition* Operations
* Operations Chart
* Operations Flow Charting (OFC)* Operation Waste
* Operator Bias
* OPERG
* OPG
* O/PMP
* OPP
* Opportunity
* OPS
* OPSC
* OPT
* Optimization
* Optimization Routine* OR
* ORACLE
* ORC
* Orchestra Director* ORD
* Order Interval (OI) * Order Point System* Ordinal Data
* Ordinal Level of Measurement* Organization
* Organizational Design * Organizational Learning * Organizational Structure* ORIENT
* Oriented materials* Orig
* Original Equipment Manufacturer (OEM)* ORM
* ORMB
* ORNA
* ORNL
* ORP
* ORR
* ORS
* Orthogonal Arrays
* Orthotropic
* ORV
* ORVR
* OS and D
* O/S
* OS
* OSA
* OSB
* OSC
* OSCAR
* OSHA
* OSHS
* OSI
* OSI Model
* OSM
* OSRP
* OSRV
* OSRVM
* OSS
* OSTI
* OSTP
* OT
* OTC
* OTD
* OTDR
* OTLT
* OTP
* OTR
* OTRGR
* OTU
* Outcome
* Outgasing
* Outlier
* Outliers
* Outline Process Charts* Out-of-Control
* Out-of-Control Process* Out of Spec
* Output
* Outputs
* Outsourcing
* OVAPP
* OVD
* OVE
* Overaging
* Overall Equipment Effectiveness (OEE) * Overall Plant Effectiveness* Overcontrol
* Overmolding
* Over Production
* Overtemp
* Over The Wall Syndrome* OVFL
* OVP
* OVSC
* OW
* OWI
* Oxidation
* OXIDN
* OXY
P (CLICK TO OPEN/CLOSE)* P
* P4P
* PA
* PAA
* PAB
* PABX
* PAC
* PACE
* Paced Withdrawal
* Packaging
* Pack-harden
* Packing List
* PACS
* PACX
* PAD
* Pad Plates
* PAFC
* PAG
* PAI
* PAIC
* Painted Floor
* PAIR
* Pair Wise Ranking
* PAL
* PAM
* PAN
* P&A
* P&P
* P&W
* PAP
* Paper Prototypes
* PAPIR
* PAR
* Paradigm
* Parallel Operation * Parallel Processing in Focused Teams* Paramagnetism
* Parameter
* Parameter Design
* PARC
* PARD
* Pareto, Vilfredo
* Pareto Chart
* Pareto Analysis
* Pareto Chart
* Pareto Diagram
* Pareto Principle
* Paretos Law (the 80/20 rule)* PARIS
* PARK
* Parking Lot
* Parms
* PARR
* Part 820
* ParTech
* Particle-Reinforced Composite* Parting agent
* Parting lines
* Partnering
* Partnership/Alliance* PARTS
* Parts Per Million (PPM)* Part to Part
* PAS
* PASCOM
* PASDS
* PASER
* PASG
* Pasivity
* PASS
* Passive Analysis
* Passive Data
* Passive Data Gathering * Passively Solicited Customer Feedback* PATAC
* PATH
* Patina
* PATP
* PATS
* PATT
* Pattern
* Pattern Shop
* Pauli Exclusion Principle* PAV
* PAW
* Pay-For-Learning Programs* P/B
* PB
* PBC
* PBCR
* PBGA
* PBL
* PBOM
* PBPCI
* PBS
* PBT
* P/BUT
* PBV
* PBX
* PC
* PCA
* PC&L
* PC&S
* PCB
* PCC
* PC/CODE
* PCD
* PCDR
* PCE
* PCG
* p chart
* PCI
* PCICN
* PCIF
* PCIT
* PCL
* PCLL
* PCM
* PCMCIA
* PCME
* PCMIA
* PCMT
* PCN
* PCO
* PCP
* PCR
* P-CR
* PCRF
* PCS
* PCSD
* PCSE
* PCT
* PC/TCP
* PCU
* PCV
* PD
* PDA
* PDB
* PDBS
* PDC
* PDCA
* PDCA Cycle
* PDCR
* PDCS
* PDD
* PDDI
* PDES
* PDG
* PDI
* PDIF
* PDIP
* PDIS
* PDIT
* PDL
* PDM
* PDMS
* PDN
* PDO
* PDP
* PDPC
* PDQ
* PDR
* PDRE
* PDS
* PDSA
* PDSS
* PDT
* PDU
* PDW
* P/E
* PE
* PEA
* PEAM
* Pearlite
* PEB
* PEC
* PECL
* PECT
* PED
* PEDD
* Peel Ply
* Peel Strength
* Peen
* PEFC
* PEM
* PEMFC
* PEP
* PEPE
* PER
* Perceived Quality
* Percent Chart
* PERF
* Performance
* Performance Benchmarking * Performance Dashboard* Performance Index
* Performance Rate
* Performance Ratio (PR) * Performance Standard* Performing
* Periodic Table
* Perishable Tools
* Peritectic Reaction* PERL
* Permanent Mould Casting * Permeability (Magnetic)* Permittivity
* Permutations
* PERT
* PERT Charts
* PEST
* PET
* PETC
* PETCM
* PETG
* PEU
* PF and D
* PF
* PFA
* PFC
* PFD
* PFEP
* PFI
* PFM
* PFMA
* PFMEA
* PFMS
* PFP
* PFSE
* PFSSA
* PFT
* PG
* PGA
* PGM
* P/GR
* PGR
* PGS
* Phase
* Phase Diagram
* Phase Equilibrium
* Phase Tranformation* Philip Crosby
* Phn
* Phonon
* Phosphorescence
* Photochromic
* Photoconductivity
* Photomicrograph
* Photon
* PHT
* PHUD
* Physical Environment * Physical Transformation Task* P/I
* PI
* PIA
* PIAD
* PIC
* PICD
* Picking Carts
* Pickle
* PICOS
* PICS
* Pictograph
* PID
* Pie Chart
* Piezoelectric
* PIG
* Pilling-Bedworth ratio (P-B ratio)* PILO
* Pilot
* PIM
* PIMREP
* PIMS
* PIN
* PING
* PIO
* PIP
* PIPS
* PIQA
* PIT
* Pitch
* Pitting
* PIV
* PIW
* Pixel
* PJJ
* PKG
* P.K. Setup
* PKT
* PL/1
* PLA
* Plain Carbon Steel* Planck's Constant
* Plan-Do-Check-Act (PDCA) cycle* Plan-Do-Study-Act
* Plane
* Planer
* Plane Strain
* Plane Strain Fracture Toughness * Plarization (Ionic) * Plasma Arc Cutting* Plastic
* Plastic State
* Plastic Deformation* Plasticizer
* PLB
* PLC
* PLCC
* PLCP
* PLD
* PLE
* PLEB
* PLGR
* PLL
* PLM
* PLNM
* PLNT
* Plot Plan
* PLP
* PLR
* PLS
* PLT
* PLTF
* PLYR
* PLYRAT
* PLZT
* PM
* PM&C
* PMB
* PMC
* PMCS
* PMD
* PMF
* PMFS
* PMI
* P/MI CI
* PML
* PMM
* PMMA
* PMO
* PMOS
* PMP
* PMQH
* PMR
* PMS
* PMT
* PMV
* P/N
* PN
* PNA
* PNC
* PNDLM
* PNG
* PNGV
* PNL
* PNNL
* PNP
* PNSI
* PNT
* PO
* POA
* POC
* POD
* PODS
* POF
* POGEN
* Point Defect
* Point Estimate
* Point Kaizen
* Point of Use
* Poisson Data
* Poisson Distribution * Poisson Probability Distribution* Poisson's Ratio
* Poka-yoke
* Polarization (Corrosion) * Polarization (Electronic) * Polarization (Orientation)* Polarization
* Polar Molecule
* Policy
* Policy Deployment
* Polish
* Polishing
* Polycrystalline
* Polymer
* Polymorphism
* POM
* POMS
* PONC
* Pooled Estimate of the Standard Deviation* POP
* POPA
* Population
* POQ
* POR
* POS
* POSA
* Positive Correlation * Positively Skewed Distribution* Positive Recall
* POSN
* POST
* Post-Cure
* Post Hoc Ergo Propter Hoc * Post-Crocess Operations* POSU
* POTS
* POV
* Powder Metallurgy (P/M)* Powder Metallurgy
* Power Curve
* Powered Round Tables * Power Influence Map* POX
* PP
* PPA
* PPAA
* PPAH
* PP&E
* PP&T
* PPAP
* PPB
* PPC
* PPCO
* P/PD
* PPD
* P/PDP
* PPDP
* PPDR
* P/PDS
* PPEC
* PPEI
* PPG
* PPH
* PPHV
* PPIR
* PPIT
* Ppk
* PPL
* PPM
* PPME
* PPMP
* PPO
* PPP
* PPPR
* PPPS
* PPQ
* PPQC
* PPR
* PPS
* PPSC
* PPSS
* PPT
* PPTF
* PPU
* PPV
* PQAP
* PQC
* PQCDSM
* P-Q Chart
* PQE
* PQFP
* PQI
* PQM
* PQMS
* PQP
* PQPT
* PQRR
* PQS
* PR&R
* PR
* PRA
* PR&T
* PRB
* PRBK
* PRC
* PRCN
* PRCS
* PRD
* PRDA
* Precipitation Hardening * Precipitation Heat Treatment * Precision Definition * Predictable Output * Predictive Maintenance* PREDLVY
* Preform
* PRELEX
* Preliminary Bill of Materials * Preliminary Process Flow Chart * Preliminary Process Capability* Prepreg
* PreProd
* PreQVR
* PRES
* Presidential Audits* PRESS REG
* Prestressed Concrete* Preten
* Prev
* Prevention
* Prevention Cost
* Prevention Versus Detection* Preventive Action
* Preventive Maintenance (PM)* PRG
* PRGM
* PRI
* PRIM
* Primary Auxiliary View * Primary Auxiliary Views* Primary Bonds
* Primary Data
* Primary Metric
* Primary Phase
* Primer
* PRIMO
* Principle of Combined Action * Prioritization Grid * Prioritization Matrix* PRIP
* PRISM
* PRJ
* PR Lamps
* PRM
* PRMC
* PRMS
* PRND
* PRND4
* PRNDL
* Probability
* Probability Density Function * Probability Distribution * Probability of Rejection* Probability Plot
* Problem Solving
* Problem Adjustment Loss* Problem Solving
* Problem Statement
* PROC
* PROCARD
* PROCD
* Procedure
* Process Definition * Process Failure Mode Effects Analysis (PFMEA)* Process Mapping
* Process Annealing
* Process Average Quality* Process Batch
* Process Benchmarking * Process Capability * Process Capability Index* Process Chart
* Process Charts
* Process Control
* Process Cycle Efficiency (PCE) * Process Decision Program Chart * Process Deficiency Worksheet* Process Failure
* Process Failure Loss * Process Flow Diagram * Process Improvement * Process Improvement Team * Process Improvement Teams* Processing Waste
* Process Kaizen
* Process Lead Time
* Process Management * Process Management Charts* Process Map
* Process Mapping
* Process Measurables* Process Owners
* Process Performance * Process Performance Index * Process Performance Management (PPM)* Process QA Matrix
* Process Quality
* Process Quality Audit * Process Re-Engineering* Process Velocity
* Process Waiting
* Producers Risk
* Product
* Product Assurance Plan* Product-Based
* Product Benchmarking * Product Data Management * Product Description * Product Design and Evaluation * Product Design Engineering* Product Feature
* Product Idea Generation * Production (Analysis) Board* Production Kanban
* Production Trial Run * Production Activity Control* Production Boards
* Production Levelling * Production Part Approval Process (PPAP) * Production Part Approval Submissions * Production Process Chart * Production Smoothing* Productivity
* Productivity Ratios* Product Liability
* Product Manufacture, Delivery, and Use * Product Manufacture * Product Marketing and Distribution Preparation* Product No.
* Product or Service Liability * Product Quality Audit * Product Satisfaction * Product Traceability* Product Warranty
* Proeutectoid Cementite * Profound Knowledge of System * Profound Knowledge * Profound Organizational Learning* Prog
* PROGMR
* PROGWO
* PROJ
* Project Charter
* Project Management * Project Planning Worksheet* Project Scope
* Project Scorecard
* Project Team
* Project Transition Action Plan (PTAP)* PROM
* PROP
* Property
* PROPN
* Proportional Limit* Proportion Chart
* PROSPEC
* PROTN
* PROTO
* Protocol
* Prototype
* Prototyping
* PROTR
* PROTV
* PROX
* PRP
* PRPE
* PR/R
* PRR
* PRSS
* PRSV
* PRT
* PRTS
* PRTS+
* PRTS+RA
* PRV
* P/S
* PS
* PSA
* PSAM
* PSAT
* PSC
* PSCM
* PSD
* PSDC
* PSDN
* PSE
* P/SEAT
* PSEC, ps
* PSEO
* Psgr
* PSI
* PSIC
* PSIG
* PSIR
* PSIV
* PSK
* PSL
* PSM
* PSMP
* PSOD
* PSP
* PSPF
* PSQRC
* PSR
* PSRM
* PS/R/R
* PSRR
* PSS
* PSSC
* PST
* PSTN
* PSVSR
* PSW
* P/T
* PT
* PTAB
* PT&E
* PTAT
* PTC
* PTCM
* PTCP
* PTCS
* PTD
* PTDL
* PTED
* PTFE
* PTFFU
* PTL
* PTLHK
* PTM
* PTN
* PTO
* PTOX
* PTP
* PTPD
* PTR
* PTRR
* PTS
* PTSE
* PTSR
* PTSS
* PTT
* PTTR
* PT/VI
* PTVI
* PTW
* p-Type Semiconductor* P/U
* PU
* PUB
* P/UBX
* PUBX
* PUG
* Pugh Matrix
* PUL
* PULDN
* Pull
* Pull System
* PUMA
* Punch
* PUP
* PUR
* PURB
* Purchasing Lead Time * Purchasing Replenishment Lead Time* PURFIN
* PURFINDATA
* Push
* PUT
* PV
* PVA
* p Value
* PVB
* PVC
* PVCS
* PVD
* PVEC
* PVI
* PVM
* PVO
* PVOH
* PVP
* PVS
* PVT
* PVV
* P/W
* PW
* PWA
* PWB
* PWL
* PWM
* PWO
* PWR
* PWRT
* PXI
* Pygmalion Effect
* PZEV
* PZM
* PZT
Q (CLICK TO OPEN/CLOSE)* Q
* Q9000 Series
* QA
* QAC
* QAM
* QAP
* QAS
* QAT
* QAV
* QBC
* QBF
* QBT
* QC
* QC&A
* QCM
* QCP
* QCRI
* QCS
* QDC
* QDI
* QDM
* QDOS
* QE
* QED
* QEDS Standards Group* QEIT
* QEMT
* QES
* QFD
* QFDI
* QFP
* QFT
* QGM
* QGP
* QI
* QIC
* QIP
* QIS
* QIT
* QLP
* QM
* QMF
* QMS
* QN
* QNIP
* QNPM
* QNSP
* QOS
* QP
* QPA
* QPAC
* QPC
* QPD
* Q/PNL
* QPO
* QPRP
* QPSK
* QPSO
* QRC
* QRCOI
* QRD
* QRD Center
* QRDP
* QRDPS
* QRI
* QRM
* QS
* QS9000
* QSA
* QSDD
* QSDD-RC
* QS/ISO
* QSL
* QSM
* QSOP
* QSP
* QSQN
* QSR
* QSS
* QST
* QTC
* QTP
* QTR
* QTT
* QTY
* QUA
* Quad of Aims
* Qualified Laboratory* Qualitative Data
* Qualitician
* Quality
* Quality Planning Sign Off* Quality Assurance
* Quality Assurance Control Charts * Quality at the Source* Quality Audit
* Quality-by-Design
* Quality Circle
* Quality Control
* Quality Council
* Quality Defect
* Quality Defect Loss* Quality
* Quality Dimensions * Quality Engineering * Quality Function Deployment (QFD) * Quality Improvement * Quality Improvement System * Quality Loss Function (QLF) * Quality Management (QM) * Quality Management Representative (QMR) * Quality Management System (QMS)* Quality Manual
* Quality Maturity Analysis (QMA)* Quality Measures
* Quality Objective
* Quality Plan
* Quality Planning
* Quality Policy
* Quality Rate
* Quality Records
* Quality Score Chart* Quality System
* Quality System Review* Quality Tool
* Quality Trilogy
* Quantitative Data
* Quantum Mechanics
* Quantum Numbers
* Quartiles
* Queue Times
* Queue Models
* Queue time
* Queuing Theory
* Quick Change Over
* Quincunx
* QV00C
* QVP
* QVR
* QVS
* Q/WDO
* QWG
* QWIK
* QWL
R (CLICK TO OPEN/CLOSE)* R
* R/A
* RA
* RAB
* RABQSA International* RAC
* RACF
* RACI
* RACK
* Racks
* RAD
* RADAR
* Radar Chart
* RAIL
* RAIR
* RALP
* RAM
* RAMP
* Ran
* R&D
* R&H
* R&I
* Random Cause
* Random Copolymer
* Random Distribution * Randomized Block of ANOVA* Randomness
* Random Sample
* Random Sampling
* Random Variable
* Random Variation
* Random-Word
* R&R
* R&T
* Range (Statistical)* Range
* Range Chart (R Chart)* RAP
* Rapid Changeover
* Rapid Prototyping
* RARB
* RARS
* RAS
* RASI
* RASIC
* RAT
* Ratio Level of Measurement* RAVE
* RAVIS
* R/AXL
* RB
* RBCD
* RBCM
* RBE
* RBF
* RBND
* RBR
* RBX
* R/C
* RC
* RCAR
* RCC
* RCCP
* RCD
* RCE
* RC ENGINE
* r Chart
* RCL
* R/CMPT
* RCO
* R/CON
* RCPT
* RCR
* RCRA
* RCRSA
* RCS
* RCSM
* RCU
* RCV
* R/C VALVE
* RCVG
* RCVR
* RCVY
* R/D
* RDACS
* RDBMS
* RDC
* RDCM
* RDCN
* RDCR
* RDD
* RDES
* RDF
* RDG
* RDM
* RDMM
* RDO
* RDS
* RDV
* RDW
* RE
* REA
* Reach Truck
* Reactive Customer-Driven Quality (RCDQ)* Readiness
* Ready-Fire-Aim
* Reality Tree
* Ream
* REBOOT
* REBS
* REC
* Recal
* Recall Procedures
* Recep
* Recirc
* Recl
* Recovery
* RECRG
* Recrystallization
* Recrystallization Temperature * Rectifying Uunction* Red Tag
* Red Bead Experiment* Red Tag Event
* Reduction
* Redundancy
* Re-Engineering
* Re-Entrant Angles
* Ref
* REFL
* Reflection
* REFLTY
* Refraction
* Refractory
* Refractory materials* Refrig
* REG
* Regen
* REGIS
* Registrar
* Registration
* Registration to Standards* Regression
* Regression Analysis * Regular Production Tooling* REINF
* Reinforced Concrete* Reinforcement
* Rejected
* Rejection Number
* REL
* Relations Diagram
* Relationship Management * Relative Frequency Distribution * Relative Magnetic Permeability * Relaxation Frequency * Relaxation Modulus* RELDSN
* Reliability
* Reliability Engineering* RELTRACK
* REM
* REMAN
* Remanence (Remanent Induction)* RenCen
* R/END
* REO
* Reorder Points
* Reorder Time
* REP
* Repeatability
* REPL
* Replenishment Lead Time (LT)* Replications
* Reprocess
* Reprocessing Loss
* Reproducibility
* REQ
* REQT
* Requirements
* RES
* Residual
* Residual Error
* Residual Stress
* Resilience
* Resin
* Resin Content
* Resin-Rich Area
* Resin-Starved Area* Resist
* Resistivity
* RESO
* Resolved Shear Stress * Resource Utilization * Response Surface Methods * Response Surface Modeling* Response Variable
* Responsibility
* Responsibility Flow Chart* Responsiveness
* Results
* RESV
* Resync
* RET
* Retention
* RETO
* RETR
* Retrofit
* REV
* REVBR
* REV BST
* Reverse Bias
* Reverse Engineering* REVLDT
* REVS
* Reward System
* REWK
* Rework
* RF
* RFA
* RFAB
* RFC
* RFCSS
* RFD
* RF/DC
* RFE
* RFF
* RFG
* RFI(C)
* RFI
* RF/ID
* RFIFO
* RFIS
* R/FLR
* R/FND
* RFP
* RFQ
* RFR
* RFW
* RFWS
* RG
* RGAMR
* RGAWR
* RGB
* RGL
* RGM
* RGP
* R/GR
* RGS
* RGTRN
* RG/U
* RH
* RHC
* RHD
* RHL
* RHM
* RHS
* RHT
* RHVL
* RIA
* RIAA
* Rib
* RIC
* RID
* RIF
* Right Size
* Right The First Time* RIM
* RIMS
* RIO
* RIP
* RISC
* Risers
* Risk Management
* Risk Priority Number (RPN)* RISS
* RIT
* RIV
* Rivet
* RJE
* RKE
* RKM
* RKR
* R/L
* RL
* RLDA
* RLF
* RLN
* RLR
* RLY
* RLYCHK
* RM
* RMA
* RMB
* RMC
* RMD
* RMG
* RMI
* R/MLDG
* RMM
* RM-OPD
* RMS
* RMS/D
* RMS-G's
* RND
* RO
* ROA
* Robust
* Robust Design
* Robustness
* Robust Process
* ROE
* ROG
* ROH
* ROI
* Rolled Throughput Yield (RTY) * Rolled Throughput Yield* Rolling
* ROM
* RON
* RONA
* Root cause
* Root Cause Analysis* ROPS
* ROS
* ROSA
* ROSICC
* ROT
* ROTS
* Round
* Route Sheet
* Roving
* ROYGBIV
* RP
* RPA
* RPAIR
* RPC
* RPER
* RPG
* RPIO
* RPK
* RPM
* RPM/1
* RPN
* RPO
* RPP
* RPR
* RPRT
* RPS
* RPT
* R/Q
* RQA
* RQC
* RQCS
* RQCV
* RQE
* RR
* RRAB
* RRB
* RRC
* RRD
* RR-H PT
* RRI
* RRIM
* R/RL
* RRL
* RRM
* R/RPPM
* RRS
* RS
* RSA
* RSB
* RSC
* RSE
* R/SEAT
* RSEC
* RSEE
* RSG
* RSL
* RSM
* RSO
* RSP
* RSR
* RSS
* RSSA
* RSSI
* RST
* RSTC
* RSTG
* RSTN
* RSTP
* RSVR
* RT
* RTA
* RT&TM
* RTC
* RTD
* RTDB
* RTF
* RTFM
* RTI
* RTK
* RTL
* RTM
* RTN
* RTO
* R/TOP
* RTOS
* RTP
* RTS
* RTT
* RTTP
* RTV
* Ru
* Rubber
* Rule of Mixtures
* Run at Rate
* Run Chart
* Runner
* Runners
* RUP
* Rupture
* RV
* RVC
* RVDAH
* RVDC
* RVHSM
* RVIA
* RVL
* RVLG
* RVP
* RVS
* RWAL
* RWD
* R/WDO
* RWH
* RWS
* RX
* RXD
* RZ
S (CLICK TO OPEN/CLOSE)* S
* S3
* SA
* SA8000
* SAA
* SAAB
* SAAC
* SAAP
* S/ABS
* SABS
* Sacrificial Anode
* SAD
* SADS
* SAE
* SAE AS9100
* SAE International
* SAES
* SAF
* Safe Stress
* Safety Stock
* Safety Characteristics* SAGE
* SAIC
* SAM
* SAMI
* Sample
* Sample Size
* Sample Sstandard Deviation Chart (S chart)* SAMPLE
* Sampling, Double
* Sampling, Multiple* Sampling, Single
* Sampling, Unit
* Sampling at Random * Sampling Distribution for the Difference in Means * Sampling Distribution of the Mean* Sampling Error
* Sampling Event
* Sampling Frequency* Sampling Length
* Sampling Plan
* SAMS
* SAN
* Sandblast
* Sand Casting
* S&PDS
* S&R
* S&RC
* Sandwich Construction* Sandwich Panel
* Sanitizing
* SANZ
* SAP
* Sapwood
* SAR
* Sarbanes Oxley Act* SARS
* SAS
* SATAN
* SATC
* Satisfier
* Saturated
* Saturation Magnetization, Flux Density* SAV
* SAVE
* SAW
* SB
* SBA
* SBAD
* SBB
* SBC
* SBD
* SBM
* SBO
* SBP
* SBR
* SBS
* SBT
* SBU
* S/C
* SC
* SCA
* SCAAP
* SCAC
* SCADA
* SCAM
* Scanning Electron Microscope (SEM)* SCAQMD
* SCARA
* SCAS
* Scatter Diagram
* Scatterplot
* SCAV
* SCC
* SCCA
* SCE
* SCFI
* SCG
* Scheffe Test
* Schottky Defect
* SCI
* Scientific Management/Approach * Scientific Management* Scientific Method
* SCIP
* Scissor Lifts
* SCM
* Scorecard
* SCP
* SCPI
* SCPP
* SCR
* S-CR
* SCREAM
* SCRN
* SCROC
* SCS
* SCSD
* SCSI
* SCT
* SCTR
* SCV
* S/D
* SD
* SDA
* SDARS
* SDB
* SDC
* SDD
* SDE
* SDF
* SDG
* SDH
* SDI
* SDL
* SDLC
* SDM
* SDM-99
* SDM-B
* SDM-CL2
* SDM-E
* SDM-F
* SDM-G
* SDM-I
* SDM-MCD
* SDM-O
* SDM-R
* SDM-REDD
* SDM-RS
* SDM-RSD
* SDM-S
* SDP
* SDP-21
* SDR
* SDRAM
* SDRS
* SDS
* SDSF
* SDT
* SDTV
* SDV
* SDVE
* SDX
* SE
* SEA
* Seasoned Timber
* SEBS
* SEC
* SECAMI
* SECD
* Secondary Auxiliary View* Secondary Bonds
* Secondary Data
* Secondary Metrics
* SECT
* SECV
* SED
* SEGR
* SEGR/EPR
* SEI
* Seiban
* Seiketsu
* Seiri
* Seiso
* SEIT
* Seiton
* SEK
* SEL
* Selection
* Selective Leaching* Self-difusion
* Self-Directed Work Team (SDWT)* Self-Direction
* Self-interstitial
* SEM
* SEMA
* Semi-Crystalline
* Semiconductor
* SEMKO
* SEMT
* SEMWAN
* SEN
* Sentinel Event
* SEO
* SEP
* SEQ
* Sequencing
* Sequential Approach to Design aka Departmental Approach to Design * Sequential or Departmental Approach to Design* Ser
* SERG
* SERT
* SERV
* Service
* Serviceability
* Service Level
* Service Level Agreement * Service Reliability * Services Blueprinting* SERVQUAL
* SES
* SET
* Set In Order
* SETI
* SETL
* SEV
* SEV1
* Seven (b7 or Big 7) * Seven Quality Tools* Seven S's
* Seven Waste
* SF
* SFC
* SFDR
* SFE
* SFE2ABI
* SFE2CIMP
* SFE2PRT
* SFG
* SFI
* SFMEA
* SFP
* SFTA
* SFTP
* S glass
* SGM
* SGML
* S/GR
* SGRAM
* S.g.R.P.
* SgRP
* SH
* SHA
* Shadow Board
* SHAININ
* Shape Memory
* Shaper
* Shaping and Planing* SHARC
* SHAWS
* SHB
* Shear
* Shear Strain
* Shear Stress
* SHED
* Shell Moulding
* Shewhart Cycle
* SHF
* SHFT
* Shift and Drift
* Shift
* Shigeo Shingo
* Shim
* Shine
* Shitsuke
* SHK
* SHKL
* SHLA
* SHLD
* SHLDR
* SHLF
* Shop Scheduling
* Shore Hardness
* Short-Beam Shear Strength* SHPE
* SHPG
* SHRD
* SHRP
* SHTTP
* Shusa
* Shutdown Loss
* SI
* SI 2000
* SI2K
* SIA
* SIAB
* SIAM
* SIC
* SICL
* SID
* SIDAC
* SIDI
* SIE
* Sifting
* SIG
* Sigma
* Sigma Kaizen
* Sigma Level
* Sigma of the Individuals* Signal Kanban
* Signal Factors
* Signal to Noise Ratio (S/N ratio)* SIHR
* SII
* SIL
* SIM
* SIMD
* SIMDB
* SIMM
* SIMP
* Simple Moving Average * Simple Random Sample* Simple Regression
* Simpson's Paradox
* Simulation
* Simulation
* Simultaneous Engineering* SINAD
* SINCAP
* Single Crystal
* Single Minute Exchange of Die (S.M.E.D.)* Single-Piece Flow
* Single Sampling
* Sink Marking
* Sintering
* SIO
* SIP
* SIPG
* Sipoc
* SIPOC Diagram
* SIPOC Map
* SIPS
* SIPT
* SIR
* SIS
* SISA
* SISC
* SISM
* SISTRAC
* SIT
* SITQ
* Situational Leadership Model* SIU
* Six Sigma
* Six Sigma Quality
* Six Thinking Hats
* SK
* SKD
* Skewed Distribution* Skewness
* S/KNU
* SKU
* SL
* SLA
* SLAP
* Slat Conveyors
* SLC
* SLD
* SLDC
* SLDG
* SLDR
* SLEV
* SLGC
* SLI
* SLIC
* SLIM
* SLIP
* Slip Casting
* Slip System
* SLOT
* S/LP
* SLR
* SLS
* SLVFC
* SM
* S/MA
* SMA
* SMAD
* S.M.A.R.T
* SMART
* SMB
* SMBP
* SMBP Network
* S/MBR
* SMBus
* SMC
* SMCC
* SMCCII
* SMD
* SMDS
* SME
* SMED
* SMI
* SMIMS
* SMN
* SMO
* SMP
* SMPTE
* SMR
* SMS
* SMT
* SMTA
* SMTFE
* SMTP
* SMUG
* SMVBns
* SMVBs
* SMVP
* S/N
* SN
* SNA
* SNAC
* SNAFU
* SNBR
* SND
* SNEF
* SNFR
* SNG
* SNI
* SNMP
* SNOBL
* SNPRM
* SNR
* SO2
* SOA
* SOAP
* SOC
* Societal Environment* SOCS
* SOD
* SOF
* SOFC
* Softwood
* Soft Data
* Softening Point (Glass) * Soft Magnetic Material* Soft Savings
* Software Quality Assurance (SQA)* SOG
* SOH
* SOHC
* SOHO
* SOI
* SOIC
* SOJ
* SOL
* Soldering
* SOLES
* Sole-Source Filters* Sole Sourcing
* Solid Solution
* Solid-Solution hardening * Solid State Cameras * Solid-State Forming* Solidus Line
* Solubility Limit
* Solute
* Solution Heat Treatment* SOLV
* Solvent
* Solvus Line
* SOMS
* SONAR
* SONET
* SOO
* SOP
* SOPA
* SOPR
* SOR
* SORP
* Sort
* SOS
* SOT
* Source Inspection Method* Sourcing
* SOVA
* SOVP
* SOW
* SOX
* SP
* SPA
* SPAC
* SPAC CASE
* SPACE(S)
* Spacing
* Spaghetti Diagram
* SPARC
* SPC
* SPCHG
* SPCR
* SPD
* SPDC
* SPDIF
* SPDL
* SPDT
* SPE
* SPEAR
* SPEC
* SPECD
* Special Characteristics* Special Cause
* Special Causes
* Special Cause Variation * Special Characteristic* Specification
* Specification Limits* Specifications
* Specific Heat
* Specific Modulus (Specific Stiffness)* Specific Strength
* SPEED
* SPEEDO
* SPEP
* SPF
* SPFI
* SPG
* SPGA
* SPH
* SPHER
* Spheroidite
* Spheroidizing
* Spherulite
* SPI
* SPICE
* SPIE
* Spinning
* SPIP
* S-PIT
* SPKR
* SPKT
* SPL
* SPLG
* Spline
* SPLP
* SPLTR
* SPLY
* SPM
* S/PNL
* SPO
* SPOBARS
* SPOIE
* Sponsor
* SPOOL
* SPOPRICING
* Spotface
* Spotting Trailers
* Spot Weld
* SPP
* Spread
* SPRINT
* Sprue
* SPS
* SPST
* SPT
* SPURs
* SPVS
* SPWELD
* SQA
* SQ&V
* SQAT
* SQC
* SQE
* SQIP
* SQIT
* SQL
* SQRC
* SQT
* SQV
* SR
* SRA
* SRAM
* SR&I
* SRB
* SRC
* SRD
* SRDL
* SRE
* SRHVL
* SRI
* SRIM
* S/RL
* SRM
* SRO
* SRP
* SRR
* SRS
* SRV
* S/S
* SS
* SSA
* SSB
* SSC
* SSD
* SSE
* SSF
* SSFDC
* SSG
* SSH
* SSI
* SSL
* SSLD
* SSLT
* SSM
* SSO
* SSOP
* SSP
* SSPO
* S-SPP
* SSPR
* SSR
* SSS
* SSS (S3)
* SSSSSSS
* SST
* SSTL
* SSTM
* S/STR
* SSTS
* SSU
* SSV
* ST
* S-T
* STA
* STAB
* Stability
* Stabilizer
* STABISTOR
* Stable
* Stable Process
* Stages of Team Growth* Staging Orders
* Stakeholder
* Stakeholder Action Plan * Stakeholder Analysis* Standard
* Standard Work
* Standard Work Chart * Standard Work Combination Table * Standard Deviation * Standard Error of the Difference Between Two Means * Standard Error of the Estimate * Standard Error of the Mean * Standard Error of the Proportion * Standard Half-Cell * Standard In-Process Stock* Standardization
* Standardize
* Standard Operating Procedures (SOPs)* Standard Work
* Standard Work Analysis * Standard Work Instructions* STAR
* STAT
* Statistical Control * Statistical Process Control (SPC) * Statistical Quality Control (SQC) * Statistical Thinking* Statistic
* Statistics
* STATS
* STATS+
* STATS-Load
* Status Report
* STC
* STCHG
* STD
* Stdby
* STDR
* STDS
* STE
* Steady-State Diffucion* STEE
* Steel
* Steel Casting
* STEM
* Stem and Leaf Display* STEN
* STEP
* Stereoisomerism
* STFNR
* STG
* STGo
* STGPE
* STID
* Stiffness
* STIP
* STIS
* STKR
* STL
* STM
* STMI
* STMS
* STNR
* STO
* Stockless Production* Stoichiometry
* Stop The Line Authority* STOR
* Store
* Stores
* StORM
* Storming
* Storyboard
* STOW
* STP
* STPI
* STPL
* ST/PPS
* STR
* Straddle Truck
* Strain, Engineering* Strain, True
* Strain Aging
* Strain Hardening
* Strain Point (Glass) * Strategic Benchmarking * Strategic Partnership* Strategy
* Stratification
* Stratified Sample
* STRC
* Strengths, Weaknesses, Opportunities, Threats (SWOT) Analysis * Stress, Engineering* Stress, True
* Stress Concentration * Stress Corrosion (Cracking)* Stress Corrosion
* Stress Crack
* Stress Intensity Factor* Stress Raiser
* Stress Relief
* Stretch Goals
* Stretch Target
* STRG
* STRGR
* String Diagram
* STRP
* STRPE
* STRTR
* Structural Clay products * Structural Composite * Structural Measures * Structural Variation* Structure
* STS
* STT
* Student's t Curve
* StVO
* StVZO
* STW
* SUB
* Subcontractors
* Subgroup
* Subjective Probability* Submission Level
* Suboptimization
* SUBS
* Substitutional Solid Solution* Substrate
* SUC
* Successive Inspection Method* SULEV
* Sum of Squares Between (SSB) * Sum of Squares Block (SSBL) * Sum of Squares Within (SSW)* SUN
* SUP
* Superconductivity
* Supercooling
* Supermarket
* Superordinate Goals * Superstitious Learning* Supplier
* Supplier Audit
* Supplier Card
* Supplier Certification or Qualification Programs* Supplier
* Supplier Development * Supplier Development Programs * Supplier Evaluation * Supplier Lead Time * Supplier Partnering * Supplier Quality Assurance* Suppliers
* Supply Chain
* Supply Chain Management* SUPPR
* SUPT
* SURF
* Surface Texture
* SURFSEG
* Surveillance
* Survey
* Surveying
* Surveys
* SUS
* SUSP
* Sustain
* SUV
* SUW
* S/V
* SV
* SVA
* SVC
* SVER
* SVER-LL
* SVGA
* SVI
* SVIE
* SVM
* SVO
* SVP
* S/V RATIO
* SVRD
* SVS
* S/W
* SW
* SWA
* Swage
* SWB
* SWC
* SWE
* Sweat
* SWIM
* Swim Lane Flow Chart* Switz
* SWIV
* SWO
* SWOT
* SWOT Analysis
* SWPS
* SWR
* SWRAT
* SwRI
* SWS
* SXGA
* SXGA+
* SXR
* Symmetrical Distribution* Symptom
* SYN
* Sync
* Syndiotactic
* Synergy aka Synergism* SYS
* Sysop
* System
* System Folder
* Systematic Error
* Systematic Layout Planning* Systematic Sample
* System Kaizen
* System of Profound Knowledge aka SOPK * System Reliability * Systems Integration* Systems View
T (CLICK TO OPEN/CLOSE)* T
* T1
* T3
* T/A
* TA
* TAB
* TABD
* TAC
* TACH
* Tack
* Tack Weld
* TACM
* TACOM
* Tactic
* TAD
* TAG
* Taguchi Loss Function* Taguchi Method
* Takt
* Takt Broads
* Takt Time
* TAL
* TALC
* Tampering
* T&B
* T&C
* T&E
* T&T
* T&V
* T&WS
* Tangibles
* TAP
* Taper
* Taper Pin
* Target
* Target Company
* Targeted Process
* Target Value
* TARO
* TARP
* TAS
* TASC
* Task
* Task Environment
* Task Needs
* TAT
* TAU
* TAV
* TAZ
* TB
* TBA
* TBC
* TBD
* TBDOA
* TBE
* TBGA
* TBI
* T/BLK
* TBM
* TBP
* TBS
* TBVV
* T/C
* TC
* TC 176
* TCA
* TCAM
* TCB
* TCC
* TCCM
* TCE
* TCF
* TCI
* TCL
* TCM
* TCO
* TCP
* TCP/IP
* TCR
* TCS
* TCSC
* TCSS
* T/CV
* TCXO
* TD
* TDAS
* TDB
* TDC
* TDD
* TDDL
* TDL
* TDM
* TDMA
* TDMF
* TDMF/MVS
* TDMF/UNIX
* TDR
* TDS
* T.E.
* TE
* TEAM
* Team Charter
* Team Feasibility Commitment* Team Building
* Team Leader
* Teams
* Team Start-Up Worksheet* Teamware
* Technical Report (TR)* Technical Reviews
* Technical Specification (TS) * Technology Feasibility Statement * Technology Selection for Product Development* TECL
* TED
* TEDIS
* TEEA
* TEEP
* TEL
* Tele
* Telescope Conveyor* TELNET
* TEMP
* Temper
* Temper Designation * Tempered Martensite* Tempering (Glass)
* Tempering
* TEMPEST
* TEMPL
* Template
* TEMS
* Ten Point Height (Rz)* TENS
* Tensile Strength (TS)* TENSR
* TEP
* TERM
* Terminal Solid Solution* Terpolymer
* Tertiary Auxiliary View * Tests of Significance* Test Statistic
* TETRA
* Tetrahedral Position* TETT
* Texel
* TF
* TFE
* TFIFO
* TFP
* TFT
* TFU
* TFWD
* T/GA
* TGA
* TGF
* TGG
* TGIF
* TGM
* TGR
* TGT
* TGW
* TH
* THC
* THD
* The Seven Quality Tools * The National Institute of Standards and Technology (NIST) * Theoretical Flow Time * Theory (Frequency) of Probability * Theory (Subjective) of Probability* Theory
* Theory of Constraints * Theory of Equally Likely Outcomes * Theory of Inventive Problem Solving (TRIZ) * Theory of Probability* The Process Book
* THERM
* THERMA-AC
* Thermal Conductivity (k)* Thermal Expansion
* Thermal Expansion Coefficient, Linear* Thermal Fatigue
* Thermally Activated Transformation* Thermal Shock
* Thermal Stress
* Thermal Tempering
* Thermochromatic
* Thermoplastic (Polymer)* Thermoplastic
* Thermoplastic Elastomer* Thermoplastics
* Thermosets
* Thermosetting (Polyer) * Thermosetting Plastic* THM
* THNR
* THR
* Three Spheres of Quality* Three Ts
* THROT
* Throughput
* Throughput Yield
* Ti
* TIA
* TIB
* TIC
* TIE
* Tie line
* Tier 1 Supplier
* Tier 2 Supplier
* TIFF
* TIFS
* TIG
* TIGER
* Tiger Teams
* TIM
* Time-Based Competition * Time Based Maintenance (TPM)* Timeline Analysis
* Times Series Chart* Time Standard
* Time Study
* Time-Bemperatue-Bransformation ( T-T-T) Diagram* Time to Market
* Time Trap
* Timing Plan
* TIMS
* TIN
* TIO
* TIP
* TIPS
* TIR
* TIRS
* TIS
* TITSUP
* TK
* Tl
* TLA
* TLDS
* TLEV
* TLO
* T/LP
* TLSCP
* TLT
* TLV
* TM
* TM2
* TMC
* TME
* TMF
* TMG
* TMI
* TMIE
* TMJ
* TML
* TMN
* TMNSS
* TMPO
* TMPRY
* TMS
* TMVI
* TNC
* TNF
* TNI
* TO
* TOC
* TOE
* TOL
* Tolerance
* Tolerance Design
* Tollgating
* Tooling Maintenance * Tooling Refurbishment* Tool Life
* Tools
* TOP
* Top Management
* Top Management Commitment* TOPS
* TORQ
* TORS
* Total Cycle Time
* Total Productive Maintance (TPM) * Total Process Variation* Total Quality
* Total Quality Control (TQC) * Total Quality Management (TQM) * Total Sum of Squares* Toughess
* TOW
* Tow Conveyors
* Toyota Production System (TPS)* TP
* TPA
* TPC
* TPC-ET
* TPCC
* TPCV
* TPI
* TPIM
* TPL
* T/PLYR
* TPM
* T/PNL
* TPS
* TPT
* TPU
* TQ
* TQC
* TQE
* TQFP
* TQHRM
* TQI
* TQM
* TQS
* TR
* TRA
* Trac
* Traceability
* TRACON
* TRACS
* TRACT
* Training Needs
* Training Needs Assessment * Training Program Design* Trait Dimension
* Tranformation Rate* TRANS
* Transaction Data
* Transcendent
* Transfer Batch Size* Transfer Function
* Transgranular Fracture* Translucent
* Transmission Electron Microscope (TEM)* Transp
* Transparent
* Transportation
* Transverse Direction* Transx
* Travel Chart
* TRB
* TRC
* Tree Diagram
* Trend Control Chart* Trend
* Trend Projections
* TRFER
* TRI
* TRIAC
* Trial Limits
* Triangle Kanban
* TRIAS
* Trifunctional mer
* TRIP
* TRIPTS
* TRIS
* Trivial Many
* TRIZ
* TRK
* TRL
* TRLR
* Troughed Bet Conveyors* TRP
* TRRL
* TRS
* True Capacity
* True Strain
* True Stress
* TRUN
* TRW
* TS16949
* TSB
* TSC
* TSD
* TSDP
* TSE
* TSEI
* TSG
* TSI
* T/SIG
* TSIS
* TSLC
* TSM
* TSO
* TSOP
* TSP
* TSR
* TSS
* TSSOP
* TSTR
* TT
* TTA
* TTC
* TTCL
* t-test
* TTF
* TTFN
* TTI
* TTL
* TTM
* TTOP
* TTP
* TTR
* TTT
* TTUC
* TTURM
* TTY
* TUC
* TUMB
* Tumble
* TUN
* TURB
* TURBO
* Turn
* TUV
* T/V
* TV
* TV2K
* TVA
* TVAE
* TVAT
* TVC
* TVDE
* TVE
* TVF
* TVI
* TVIE
* TVME
* TVQE
* TVR
* TVS
* TVSE
* TVSOP
* TV/TC
* TVTP
* TVV
* TVVA
* TVVE
* TW
* TWA
* TWAIN
* TWC
* TWG
* TWIMC
* TWO
* Two-Tail Hypothesis Test* TWR
* TWS
* Twtr
* TWX
* TX
* TXV
* Type I Error
* Type II Error
U (CLICK TO OPEN/CLOSE)* U
* UAAI
* UAL
* UART
* UAT
* UAW
* U/B
* UBEC
* U/C
* UC
* UCA
* UCBITS
* UCC
* u Chart
* UCL
* UCLDS
* UCS
* UDC
* UDDS
* UDM
* UDR
* UE
* UEC
* UES
* UF
* UFC
* UFO
* UFT
* UFUNC
* UG
* UG/MMR
* UGPC
* UGS
* UH
* UHDPE
* UHF
* U/HOOD
* UHP
* UI
* UIL
* UJT
* UK
* UL
* ULC
* ULDPE
* ULEV
* ULSAB
* ULSAC
* ULSAS
* Ultimate (Tensile) Strength * Ultrasonic Welding* UMA
* UMD
* UMI
* UML
* UMS
* UMTRI
* UNC
* UND
* Undercontrol
* Undercut
* Undercuts
* Undeveloped Events* UN/ECE
* UNICS
* Unified Theory for Services Management * Uniform Distribution* Union
* Unit
* Unit Cell
* Unit Load
* UNIVAC
* UNIX
* Unlk
* UNM
* Unsaturated
* UNSM
* Unstable System
* UOM
* uP
* UPA
* UPC
* UPC&FNA
* UPC-FNA
* UPD
* UPL
* Upper Control Limit (UCL) * Upper Critical Temperature * Upper Specification Limit (USL)* UPR
* UPS
* Upset
* UPSHFT
* Upstream
* Uptime
* uPVC
* URC
* URGT
* URL
* URR
* URT
* URTC
* US
* USABC
* USAC
* USAMP
* USART
* USB
* USC
* USCAR
* USCC
* USDOT
* USE
* U/SEAT
* USEC
* USENET
* User-Based
* User Group
* Users
* USG
* USGPO
* USIA
* USL
* USOC
* US-PRO
* USS
* USSB
* USSRS
* UTC
* UTD
* UTE
* UTP
* UTQR
* U/V
* UV
* UVA
* UVI
* UXGA
V (CLICK TO OPEN/CLOSE)* V
* V6
* V8
* VA
* VABA
* VAC
* Vacancy
* Vacancy Diffusion
* VAD
* VADC
* VAIS
* VAL
* Valence Band
* Valence Electrons
* Validation
* Validity
* VALP
* Valuable Operating Time* Value
* Value Added Time Reporting Log* Value Engineering
* Value Stream
* Value Stream Management* Value Stream Map
* Value Add Chart
* Value Added
* Value Added Ratio
* Value Added Work
* Value-Adding (VA): (a.k.a. Value-Added, Value-Add)* Value Analysis
* Value Based
* Value Chain
* Value Chain Activities* Value Creation
* Value Engineering
* Values
* Value Stream
* Value Stream Loops * Value Stream Manager * Value Stream Mapping (VSM)* Value Streams
* VAM
* VAMS
* VAN
* Van Der Waals Bond* V&M
* VAPIR
* VAR
* VARACTOR
* Variability
* Variable
* Variable Data
* Variables Data
* Variance
* Variation
* Variety
* VAS
* VASTD
* VAT
* VATS
* VAV
* VAX
* VBARS
* VBAT
* VBC
* VBOM
* VBR
* VBS
* VBT
* VC
* VCC
* VCCI
* VCD
* VCE
* VCI
* VCIT
* VCM
* VCME
* VCO
* VCP
* VCR
* VCRI
* VCRP
* VCS
* VCSEL
* VCSL
* VCTS
* VCV
* VCVA
* V/CVR
* VCVS
* VCW
* VCXO
* VDA
* VDAH
* VDA-SF
* VDC
* VDCC
* VDCSS
* VDD
* VDE
* VDI
* VDL
* VDM
* VDN
* VDOC
* VDP
* VDP18
* VDP24
* VDPC
* VDPO
* VDPP
* VDR
* VDS
* VDSL
* VDSR
* VDT
* VDTA
* VDTO
* VDTOG
* VDTV
* VDU
* VDV
* VE
* VEBM
* VEC
* VEH
* VEL
* VEO
* VEQRD
* Ver
* Verdigris
* Verification
* VERN
* VERONICA
* VERP
* VERR
* VERT
* Vertical Deployment* VES
* VESA
* VESC
* VESCOM
* VET
* VE/VA
* VF
* VFAT
* VFC
* VFD
* VFFS
* VFS
* VFV
* VGA
* VGC
* VGI
* VGPD
* VH
* VHCM
* VHDL
* VHF
* VHS
* VHSIC
* VHSS
* VHT
* VIA
* VIAC
* VIB
* Vibratory Conveyors* Vibratory Feeders
* VIC
* VICS
* VID
* Vidicon Cameras
* VIDS
* VIE
* VIM
* VINCR
* ViniVA
* VIP
* VIP 2000
* VIPS
* VIRR
* VIRS
* Virtual Prototyping* Virtual Team
* Virtual Teams
* VIS
* VISA
* Viscoelasticity
* Viscosity
* VISFLY
* Visible Hand
* Vision
* Vision Shift
* VISS
* Visual Control
* Visual Factory
* Visual Metric
* Visual Controls
* Visual Workplace
* VIT
* VITA
* Vital Few, Useful Many* Vitrification
* VIU
* VIV
* VIVA
* VIVAC
* VLAN
* VLAT
* VLC
* VLCS
* VLD
* VLE
* VLE Gates
* VLES
* VLE Team
* VLFL
* VLIW
* VLM
* VLO
* VLP
* VLPD
* VLPM
* VLR
* VLSI
* VLT
* VLV
* VM
* VMAS
* VMDS
* VME
* VMI
* VMOS
* VMRR
* VMS
* VMT
* VMTS
* VN
* VNC
* VNS
* VNT
* VOC
* VOCIP
* VOD
* Voice of the Customer * Voice of the Process* Void Content
* Voids
* Voluntary Standard* VOM
* VOMS
* VOO
* VOS
* Voting and Ranking* VOV
* VOX
* VP
* VPB
* VPC
* VPF
* VPI
* VPIS
* VPIT
* VPM
* VPN
* VPNV
* VPP
* VPPS
* VPR
* VPS
* VPVA
* VPVV
* VPW
* VQ
* VQL
* VR
* VRA
* VRAM
* VRC
* VRDS
* VRLA
* VRM
* VRML
* VRR
* VRS
* VRT
* VRU
* VS
* VSA
* VSAS
* VSB
* VSC
* VSCL
* VSD
* VSE
* VSES
* VSG
* VSI
* VSIA
* VSIC
* VSIE
* VSIL
* VSIM
* VSIP
* VSIS
* VSL-GME
* VSM
* VSMT
* VSP
* VSPA
* VSPD
* VSPLL
* VSR
* VSRM
* VSS
* VSSA
* VSSM
* VSV
* VSVA
* VSVAC
* VSWR
* VTA
* VTAM
* VTD
* VTEC
* VTF
* VTG
* VTIMS
* VTM
* VTP
* VTR
* VTS
* VTVML
* Vulcanization
* Vulcanize
* VV
* VVA
* VVB
* VVE
* VVP
* VVSS
* VVT(&L)
* VVT
* VWS
* VXI
W (CLICK TO OPEN/CLOSE)* W
* WA
* WAAS
* WAC
* WAD
* WAIS
* WAITS
* WAL
* Walking Beams
* Walter Shewhart
* WAN
* Warehousing
* WARIA
* Warn
* Warning Correcting Method* Warp
* WARR
* Warrant
* WASHTO
* Waste
* WAT
* Water Jet Cutting
* WATS
* WAVE
* Wave Mechanical Model* WAWOT
* WB
* WBBA
* WBL
* WBM
* WBS
* WBT
* WC
* WCB
* WCDC
* WCELA
* WCELRF
* WCM
* WCMB
* WCS
* WD
* WDC
* WDM
* WDO
* WDS
* WE
* Weave
* WEBG
* WEC
* WECARE
* WECW
* Weft
* Weighed Voting
* Weighted Mean
* Weight Percent
* Weld
* Weld Decay
* Welding
* WEMA
* WESS
* WEST
* WFG
* WFUO
* WGE
* WGM
* WGS
* W/H
* WH
* Whack-A-Mole
* WHI
* Whisker
* White Cast Iron
* Whiteware
* WHL
* WHQ
* WIDS II
* WIKIWISI
* Wilcoxon Mann-Whitney Test* Willing Worker
* WIM
* WINQ
* WINS
* WIP
* WIPT
* WIS
* WISE
* Withdrawel Kanban
* WITI
* Witness Lines
* WL
* W/LACE
* WLAN
* WLDG
* WLL
* WLM
* WMF
* WMGR
* WMMS
* WMS
* WM SCM
* WMSCM
* W/O
* WO
* WOL
* WOM
* Work
* Work In Progress (WIP) * Work load balancing* Work Unit
* Work Cells: (a.k.a. U-Shaped Cells, Work Cells)* Work Environment
* Workflow Diagram
* Work Hardening
* Working Point (Glass)* Working Prototype
* Working Sequence
* Working Time
* Work in Process
* Work In Process Inventory* Work Measurement
* Work Team
* World Class Quality (WCM)* WORM
* WOT
* Woven Roving
* WOW
* WP
* WPC
* WPCS
* W/PMP
* WPO
* WPP
* WPR
* WR
* WRAF
* WRAIR
* WRAP
* WRAS
* WRC
* WRE
* WREVS
* WRG
* WRNG
* Wrought Alloy
* WRT
* W/S
* WS
* WSC
* WSF
* WSG
* WSI
* WSO
* WSPIT
* WSR
* WSS
* W/STR
* WSW
* WSWA
* WT
* WTCC
* WTL
* WTO
* WTS
* WUC
* W/UP
* WVAE
* WVEC
* WVRM
* W/W
* WWF
* WWFG
* WWJD
* WWP
* WWT&B
* www
* WX
* WYBIWYG
* WYNIWYG
* WYSIAYG
* WYSINWYG
* WYSIWIS
* WYSIWYG
* WYSIWYL
X (CLICK TO OPEN/CLOSE)* X-bar
* X-Bar and R Chart
* X-bar Chart
* x Chart
* XCO
* XCVR
* XDCR
* XDR
* Xe
* XFER
* XFMR
* XGA
* XHTML
* XID
* XIOS
* XMAS
* Xmit
* XML
* XMS
* XMTR
* XOR
* XPCI
* XPLA
* Xplat
* Xpress
* XSL
* XTAL
* XTC
* XUI
* xy Equation aka X + (xy) = 8 Y (CLICK TO OPEN/CLOSE)* Y
* Y = f-(x)
* Y12
* Y2K
* YACC
* YAFIYGI
* YAG
* YAHOO
* Yb
* YEA
* Yellow Belt
* YGWYPF
* Yield
* Yielding
* Yield Strength
* YIG
* YMCK
* Young's Modulus
* YOYO
* YRS
* YS
* YTC
* YTD
Z (CLICK TO OPEN/CLOSE)* Z
* ZAC
* ZBT
* ZCS
* ZD
* Zero Acceptance Sampling* Zero Defects
* Zero Quality Control* ZEV
* ZF
* ZIF
* ZIP
* ZISC
* Zlower
* Zmin
* ZMRI
* ZPR
* ZQC
* Zr
* ZSA
* Z-Score
* z Statistic
* z Test
* Z Upper
* Z Value
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