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LIVE VIRTUAL WORKSHOP ON MEDICAL MICROELECTRONICS 1:00pm-1:25pm: Glass Core Technology for Enabling Miniaturization and Next Generation Integration of Medical Devices As Moore’s Law seemingly slows, the need for novel substrates/interposers and packaging methods become more and more critical to continue driving miniaturization and more functionality from our devices. SUBMIT YOUR ABSTRACT The IMAPS Technical Committee seeks original papers that demonstrate how new technologies and applications are expanding and redefining the international role of microelectronics. All abstracts submitted are recommended to be approximately 1,000-words in length. All abstracts submitted for publishable proceedings papers must represent original, previously unpublished work.ABOUT MEMBERSHIP
Member Benefits. High quality technical programs offer content on cutting edge and long-term research and development is presented in venues from the informal and focused Advanced Technology Workshops to the more formal International Symposia. IMAPSource offers instant access to our archive of thousands of digital documents and researchpapers
ADVANCING MICROELECTRONICS MAGAZINE IMAPS is eager to reveal an exciting new facelift to our hallmark member magazine Advancing Microelectronics!After decades of mailbox delivery, the magazine has moved to a purely interactive digital format effective with the 2020 Advanced SiP Special Issue. DEVICE PACKAGING REGISTRATION Make payment online with a credit card. Receive a confirmation via email. This will not include your login details for the conference. You will receive that in a separate email prior to the event. If you wish to pay via credit card over the phone, please call (919) 293-5000 to make your registration over the phone. GLOBAL BUSINESS COUNCIL (GBC) The Global Business Council (GBC) is an IMAPS initiative that focuses on business issues related to the technology areas addressed by the corporate organizational members of IMAPS. The revised charter is as follows: PURPOSE: The IMAPS Global Business Council (GBC) is an initiative within IMAPS which leads the development and communicationof
TECHNOLOGY CROSSOVER Registration Inclusions. Member, Non-member, Speaker/Chair, Student, and Early Career conference registration fees include: Access to all live and on-demand keynotes, Author Round Rooms with Q&A and featured content beginning on April 26, 2021 for one (1) person. INTERNATIONAL SYMPOSIUM ON MICROELECTRONICS The 54 th International Symposium on Microelectronics is being organized by the International Microelectronics Assembly and Packaging Society (IMAPS). The IMAPS 2021 Technical Committee seeks original papers that present progress on technologies throughout the entire microelectronics/packaging supply chain. DEVICE PACKAGING CONFERENCE The 18th Annual Device Packaging Conference (DPC 2022) will be held at the WeKoPa Resort and Conference Center, from March 7-10, 2022. It is an international event organized by the International Microelectronics Assembly and Packaging Society (IMAPS). DEVICE PACKAGING 2021 PDCS Device Packaging 2021 PDC Course Offerings. NEW! The 2021 PDC courses are offered each day of the virtual conference. Attendees must register for each course as an add-on to their overall symposium registration at $250 each. Attendees may select up to one course ineach time slot.
LIVE VIRTUAL WORKSHOP ON MEDICAL MICROELECTRONICS 1:00pm-1:25pm: Glass Core Technology for Enabling Miniaturization and Next Generation Integration of Medical Devices As Moore’s Law seemingly slows, the need for novel substrates/interposers and packaging methods become more and more critical to continue driving miniaturization and more functionality from our devices. SUBMIT YOUR ABSTRACT The IMAPS Technical Committee seeks original papers that demonstrate how new technologies and applications are expanding and redefining the international role of microelectronics. All abstracts submitted are recommended to be approximately 1,000-words in length. All abstracts submitted for publishable proceedings papers must represent original, previously unpublished work.ABOUT MEMBERSHIP
Member Benefits. High quality technical programs offer content on cutting edge and long-term research and development is presented in venues from the informal and focused Advanced Technology Workshops to the more formal International Symposia. IMAPSource offers instant access to our archive of thousands of digital documents and researchpapers
ADVANCING MICROELECTRONICS MAGAZINE IMAPS is eager to reveal an exciting new facelift to our hallmark member magazine Advancing Microelectronics!After decades of mailbox delivery, the magazine has moved to a purely interactive digital format effective with the 2020 Advanced SiP Special Issue. DEVICE PACKAGING REGISTRATION Make payment online with a credit card. Receive a confirmation via email. This will not include your login details for the conference. You will receive that in a separate email prior to the event. If you wish to pay via credit card over the phone, please call (919) 293-5000 to make your registration over the phone. GLOBAL BUSINESS COUNCIL (GBC) The Global Business Council (GBC) is an IMAPS initiative that focuses on business issues related to the technology areas addressed by the corporate organizational members of IMAPS. The revised charter is as follows: PURPOSE: The IMAPS Global Business Council (GBC) is an initiative within IMAPS which leads the development and communicationof
TECHNOLOGY CROSSOVER Registration Inclusions. Member, Non-member, Speaker/Chair, Student, and Early Career conference registration fees include: Access to all live and on-demand keynotes, Author Round Rooms with Q&A and featured content beginning on April 26, 2021 for one (1) person.ABOUT IMAPS
IMAPS is the leading international microelectronics and electronic packaging society representing more than 3,000 members around the world in US, European, and Asian chapters. Members of the Society represent every discipline and specialty in the electronics industry and include both technical and marketing professionals. TECHNOLOGY CROSSOVER AGENDA ON-DEMAND Technical Presentations - Available April 12 - June 1, 2021. Full Conference Registrants Only - Delivered through the Virtual Conference Portal. On-Demand Technical Presentations Catalog. PLENARY SESSION: LIVE 10:00 am - 12:30 pm Eastern. Plenary Presentation for Each Dedicated Conference Followed by Q&A. 10:00 am - 10:15 amEastern.
ABOUT MEMBERSHIP
Member Benefits. High quality technical programs offer content on cutting edge and long-term research and development is presented in venues from the informal and focused Advanced Technology Workshops to the more formal International Symposia. IMAPSource offers instant access to our archive of thousands of digital documents and researchpapers
CONTACT US - INTERNATIONAL MICROELECTRONICS ASSEMBLY IMAPS Headquarters (Ph): 919-293-5000 (F): 919-287-2339. P.O. Box 110127 Research Triangle Park, NC 27709 www.imaps.org LIVE VIRTUAL WORKSHOP ON WIRE BONDING The International Microelectronics Assembly and Packaging Society (IMAPS) will host a Virtual Workshop on WIRE BONDING on May 5, 2021, using the Microsoft Teams Live Event software. The objective of the Wire Bonding Virtual Workshop is to have a unique forum that brings together scientists, engineers, manufacturing and academia people from around the world who have been working in the area of ADVANCING MICROELECTRONICS MAGAZINE IMAPS is eager to reveal an exciting new facelift to our hallmark member magazine Advancing Microelectronics!After decades of mailbox delivery, the magazine has moved to a purely interactive digital format effective with the 2020 Advanced SiP Special Issue. EDUCATIONAL FOUNDATION The Microelectronics Education Foundation supports student activities that cultivate an understanding of packaging, components, and assembly technologies; how they are used; and understanding materials used in the processes. To promote these activities, the Foundation sponsors technical paper and poster contest awards at various chapter and DEVICE PACKAGING TECHNICAL SPEAKERS Over 65 technical presentations across 3 tracks and 16 session categories will be available for on-demand viewing beginning on April 12-15th. Posters will also be available for on-demand viewing, complemented by a live Q&A sessionApril 15th. View the technical speakers and titles below! 3D Integration FO-WLP/ Flip Chip Automotive/ 5G Advanced
GLOBAL BUSINESS COUNCIL (GBC) The Global Business Council (GBC) is an IMAPS initiative that focuses on business issues related to the technology areas addressed by the corporate organizational members of IMAPS. The revised charter is as follows: PURPOSE: The IMAPS Global Business Council (GBC) is an initiative within IMAPS which leads the development and communicationof
ADVANCED PACKAGING FOR MEDICAL MICROELECTRONICS Event Description: The International Microelectronics Assembly and Packaging Society (IMAPS) will host a Live Virtual Workshop on Advanced Packaging and Business Outlook for Medical Microelectronics..The workshop will bring together technologists in semiconductor packaging with life science experts interested in applying advanced packaging methods to enable the next generation ofmedical
INTERNATIONAL SYMPOSIUM ON MICROELECTRONICS The 54 th International Symposium on Microelectronics is being organized by the International Microelectronics Assembly and Packaging Society (IMAPS). The IMAPS 2021 Technical Committee seeks original papers that present progress on technologies throughout the entire microelectronics/packaging supply chain.ABOUT IMAPS
IMAPS is the leading international microelectronics and electronic packaging society representing more than 3,000 members around the world in US, European, and Asian chapters. Members of the Society represent every discipline and specialty in the electronics industry and include both technical and marketing professionals. DEVICE PACKAGING 2021 PDCS Device Packaging 2021 PDC Course Offerings. NEW! The 2021 PDC courses are offered each day of the virtual conference. Attendees must register for each course as an add-on to their overall symposium registration at $250 each. Attendees may select up to one course ineach time slot.
DEVICE PACKAGING CONFERENCE The 18th Annual Device Packaging Conference (DPC 2022) will be held at the WeKoPa Resort and Conference Center, from March 7-10, 2022. It is an international event organized by the International Microelectronics Assembly and Packaging Society (IMAPS).IMAPS CHAPTERS
IMAPS chapters serve as local networks that allow mircoelectronics professionals to build business relationships, share industry information, and find technical solutions. IMAPS chapters organize and sponsor local symposia/ conferences, vendor days, technical presentations, and social events. IMAPS members are automatically enrolled as a member SUBMIT YOUR ABSTRACT The IMAPS Technical Committee seeks original papers that demonstrate how new technologies and applications are expanding and redefining the international role of microelectronics. All abstracts submitted are recommended to be approximately 1,000-words in length. All abstracts submitted for publishable proceedings papers must represent original, previously unpublished work.ABOUT MEMBERSHIP
Member Benefits. High quality technical programs offer content on cutting edge and long-term research and development is presented in venues from the informal and focused Advanced Technology Workshops to the more formal International Symposia. IMAPSource offers instant access to our archive of thousands of digital documents and researchpapers
DEVICE PACKAGING REGISTRATION Make payment online with a credit card. Receive a confirmation via email. This will not include your login details for the conference. You will receive that in a separate email prior to the event. If you wish to pay via credit card over the phone, please call (919) 293-5000 to make your registration over the phone. ADVANCING MICROELECTRONICS MAGAZINE IMAPS is eager to reveal an exciting new facelift to our hallmark member magazine Advancing Microelectronics!After decades of mailbox delivery, the magazine has moved to a purely interactive digital format effective with the 2020 Advanced SiP Special Issue. GLOBAL BUSINESS COUNCIL (GBC) The Global Business Council (GBC) is an IMAPS initiative that focuses on business issues related to the technology areas addressed by the corporate organizational members of IMAPS. The revised charter is as follows: PURPOSE: The IMAPS Global Business Council (GBC) is an initiative within IMAPS which leads the development and communicationof
INTERNATIONAL SYMPOSIUM ON MICROELECTRONICS The 54 th International Symposium on Microelectronics is being organized by the International Microelectronics Assembly and Packaging Society (IMAPS). The IMAPS 2021 Technical Committee seeks original papers that present progress on technologies throughout the entire microelectronics/packaging supply chain.ABOUT IMAPS
IMAPS is the leading international microelectronics and electronic packaging society representing more than 3,000 members around the world in US, European, and Asian chapters. Members of the Society represent every discipline and specialty in the electronics industry and include both technical and marketing professionals. DEVICE PACKAGING 2021 PDCS Device Packaging 2021 PDC Course Offerings. NEW! The 2021 PDC courses are offered each day of the virtual conference. Attendees must register for each course as an add-on to their overall symposium registration at $250 each. Attendees may select up to one course ineach time slot.
DEVICE PACKAGING CONFERENCE The 18th Annual Device Packaging Conference (DPC 2022) will be held at the WeKoPa Resort and Conference Center, from March 7-10, 2022. It is an international event organized by the International Microelectronics Assembly and Packaging Society (IMAPS).IMAPS CHAPTERS
IMAPS chapters serve as local networks that allow mircoelectronics professionals to build business relationships, share industry information, and find technical solutions. IMAPS chapters organize and sponsor local symposia/ conferences, vendor days, technical presentations, and social events. IMAPS members are automatically enrolled as a member SUBMIT YOUR ABSTRACT The IMAPS Technical Committee seeks original papers that demonstrate how new technologies and applications are expanding and redefining the international role of microelectronics. All abstracts submitted are recommended to be approximately 1,000-words in length. All abstracts submitted for publishable proceedings papers must represent original, previously unpublished work.ABOUT MEMBERSHIP
Member Benefits. High quality technical programs offer content on cutting edge and long-term research and development is presented in venues from the informal and focused Advanced Technology Workshops to the more formal International Symposia. IMAPSource offers instant access to our archive of thousands of digital documents and researchpapers
DEVICE PACKAGING REGISTRATION Make payment online with a credit card. Receive a confirmation via email. This will not include your login details for the conference. You will receive that in a separate email prior to the event. If you wish to pay via credit card over the phone, please call (919) 293-5000 to make your registration over the phone. ADVANCING MICROELECTRONICS MAGAZINE IMAPS is eager to reveal an exciting new facelift to our hallmark member magazine Advancing Microelectronics!After decades of mailbox delivery, the magazine has moved to a purely interactive digital format effective with the 2020 Advanced SiP Special Issue. GLOBAL BUSINESS COUNCIL (GBC) The Global Business Council (GBC) is an IMAPS initiative that focuses on business issues related to the technology areas addressed by the corporate organizational members of IMAPS. The revised charter is as follows: PURPOSE: The IMAPS Global Business Council (GBC) is an initiative within IMAPS which leads the development and communicationof
ABOUT IMAPS
IMAPS is the leading international microelectronics and electronic packaging society representing more than 3,000 members around the world in US, European, and Asian chapters. Members of the Society represent every discipline and specialty in the electronics industry and include both technical and marketing professionals.IMAPS CHAPTERS
IMAPS chapters serve as local networks that allow mircoelectronics professionals to build business relationships, share industry information, and find technical solutions. IMAPS chapters organize and sponsor local symposia/ conferences, vendor days, technical presentations, and social events. IMAPS members are automatically enrolled as a memberABOUT MEMBERSHIP
Member Benefits. High quality technical programs offer content on cutting edge and long-term research and development is presented in venues from the informal and focused Advanced Technology Workshops to the more formal International Symposia. IMAPSource offers instant access to our archive of thousands of digital documents and researchpapers
LIVE VIRTUAL WORKSHOP ON MEDICAL MICROELECTRONICS 1:00pm-1:25pm: Glass Core Technology for Enabling Miniaturization and Next Generation Integration of Medical Devices As Moore’s Law seemingly slows, the need for novel substrates/interposers and packaging methods become more and more critical to continue driving miniaturization and more functionality from our devices. TECHNOLOGY CROSSOVER AGENDA ON-DEMAND Technical Presentations - Available April 12 - June 1, 2021. Full Conference Registrants Only - Delivered through the Virtual Conference Portal. On-Demand Technical Presentations Catalog. PLENARY SESSION: LIVE 10:00 am - 12:30 pm Eastern. Plenary Presentation for Each Dedicated Conference Followed by Q&A. 10:00 am - 10:15 amEastern.
DEVICE PACKAGING AGENDA DPC Registration will remain OPEN through May 14, 2021. Full conference registration After April 15 will give the attendee access to: ALL LIVE CONTENT including Keynote presentations, panels, sessions, etc. are already recorded and available for viewing. through the Virtual Conference Portal until May 14, 2021. (with the exceptionof PDCs)
PROPOSE A PDC
Propose a PDC. ACTIVE CALL FOR PDC PROPOSALS: IMAPS 2021 (San Diego) | PDCs Proposals Still Being Accepted. A major purpose of IMAPS is to advance and expand microelectronic packaging technologies through professional and public education to our collective international membership base. In support of this important societal objective:SOCIETY AWARDS
See Past Award Winners Here. The ten awards presented annually are: The IMAPS Leadership Award (NEW!) recognizes significant contributions to the growth of the Society in terms of mentorship, technical or business achievement. Aimed at mid-career thought leaders in microelectronics, nominees are expected to have 8-20 years in the field and 5 years in the society. TECHNOLOGY CROSSOVER Registration Inclusions. Member, Non-member, Speaker/Chair, Student, and Early Career conference registration fees include: Access to all live and on-demand keynotes, Author Round Rooms with Q&A and featured content beginning on April 26, 2021 for one (1) person. ADVANCED PACKAGING FOR MEDICAL MICROELECTRONICS Event Description: The International Microelectronics Assembly and Packaging Society (IMAPS) will host a Live Virtual Workshop on Advanced Packaging and Business Outlook for Medical Microelectronics..The workshop will bring together technologists in semiconductor packaging with life science experts interested in applying advanced packaging methods to enable the next generation ofmedical
INTERNATIONAL SYMPOSIUM ON MICROELECTRONICS The 54 th International Symposium on Microelectronics is being organized by the International Microelectronics Assembly and Packaging Society (IMAPS). The IMAPS 2021 Technical Committee seeks original papers that present progress on technologies throughout the entire microelectronics/packaging supply chain. DEVICE PACKAGING 2021 PDCS Device Packaging 2021 PDC Course Offerings. NEW! The 2021 PDC courses are offered each day of the virtual conference. Attendees must register for each course as an add-on to their overall symposium registration at $250 each. Attendees may select up to one course ineach time slot.
SUBMIT YOUR ABSTRACT Submit your Abstract. The IMAPS Technical Committee seeks original papers that demonstrate how new technologies and applications are expanding and redefining the international role of microelectronics. All abstracts submitted are recommended to be approximately 1,000-words in length. TECHNOLOGY CROSSOVER AGENDA ON-DEMAND Technical Presentations - Available April 12 - June 1, 2021. Full Conference Registrants Only - Delivered through the Virtual Conference Portal. On-Demand Technical Presentations Catalog. PLENARY SESSION: LIVE 10:00 am - 12:30 pm Eastern. Plenary Presentation for Each Dedicated Conference Followed by Q&A. 10:00 am - 10:15 amEastern.
DEVICE PACKAGING CONFERENCE The 18th Annual Device Packaging Conference (DPC 2022) will be held at the WeKoPa Resort and Conference Center, from March 7-10, 2022. It is an international event organized by the International Microelectronics Assembly and Packaging Society (IMAPS). LIVE VIRTUAL WORKSHOP ON MEDICAL MICROELECTRONICS 1:00pm-1:25pm: Glass Core Technology for Enabling Miniaturization and Next Generation Integration of Medical Devices As Moore’s Law seemingly slows, the need for novel substrates/interposers and packaging methods become more and more critical to continue driving miniaturization and more functionality from our devices. ADVANCING MICROELECTRONICS MAGAZINE IMAPS is eager to reveal an exciting new facelift to our hallmark member magazine Advancing Microelectronics!After decades of mailbox delivery, the magazine has moved to a purely interactive digital format effective with the 2020 Advanced SiP Special Issue. ADVANCED PACKAGING FOR MEDICAL MICROELECTRONICS Event Description: The International Microelectronics Assembly and Packaging Society (IMAPS) will host a Live Virtual Workshop on Advanced Packaging and Business Outlook for Medical Microelectronics..The workshop will bring together technologists in semiconductor packaging with life science experts interested in applying advanced packaging methods to enable the next generation ofmedical
DEVICE PACKAGING REGISTRATION Make payment online with a credit card. Receive a confirmation via email. This will not include your login details for the conference. You will receive that in a separate email prior to the event. If you wish to pay via credit card over the phone, please call (919) 293-5000 to make your registration over the phone. TECHNOLOGY CROSSOVER Registration Inclusions. Member, Non-member, Speaker/Chair, Student, and Early Career conference registration fees include: Access to all live and on-demand keynotes, Author Round Rooms with Q&A and featured content beginning on April 26, 2021 for one (1) person. INTERNATIONAL SYMPOSIUM ON MICROELECTRONICS The 54 th International Symposium on Microelectronics is being organized by the International Microelectronics Assembly and Packaging Society (IMAPS). The IMAPS 2021 Technical Committee seeks original papers that present progress on technologies throughout the entire microelectronics/packaging supply chain. DEVICE PACKAGING 2021 PDCS Device Packaging 2021 PDC Course Offerings. NEW! The 2021 PDC courses are offered each day of the virtual conference. Attendees must register for each course as an add-on to their overall symposium registration at $250 each. Attendees may select up to one course ineach time slot.
SUBMIT YOUR ABSTRACT Submit your Abstract. The IMAPS Technical Committee seeks original papers that demonstrate how new technologies and applications are expanding and redefining the international role of microelectronics. All abstracts submitted are recommended to be approximately 1,000-words in length. TECHNOLOGY CROSSOVER AGENDA ON-DEMAND Technical Presentations - Available April 12 - June 1, 2021. Full Conference Registrants Only - Delivered through the Virtual Conference Portal. On-Demand Technical Presentations Catalog. PLENARY SESSION: LIVE 10:00 am - 12:30 pm Eastern. Plenary Presentation for Each Dedicated Conference Followed by Q&A. 10:00 am - 10:15 amEastern.
DEVICE PACKAGING CONFERENCE The 18th Annual Device Packaging Conference (DPC 2022) will be held at the WeKoPa Resort and Conference Center, from March 7-10, 2022. It is an international event organized by the International Microelectronics Assembly and Packaging Society (IMAPS). LIVE VIRTUAL WORKSHOP ON MEDICAL MICROELECTRONICS 1:00pm-1:25pm: Glass Core Technology for Enabling Miniaturization and Next Generation Integration of Medical Devices As Moore’s Law seemingly slows, the need for novel substrates/interposers and packaging methods become more and more critical to continue driving miniaturization and more functionality from our devices. ADVANCING MICROELECTRONICS MAGAZINE IMAPS is eager to reveal an exciting new facelift to our hallmark member magazine Advancing Microelectronics!After decades of mailbox delivery, the magazine has moved to a purely interactive digital format effective with the 2020 Advanced SiP Special Issue. ADVANCED PACKAGING FOR MEDICAL MICROELECTRONICS Event Description: The International Microelectronics Assembly and Packaging Society (IMAPS) will host a Live Virtual Workshop on Advanced Packaging and Business Outlook for Medical Microelectronics..The workshop will bring together technologists in semiconductor packaging with life science experts interested in applying advanced packaging methods to enable the next generation ofmedical
DEVICE PACKAGING REGISTRATION Make payment online with a credit card. Receive a confirmation via email. This will not include your login details for the conference. You will receive that in a separate email prior to the event. If you wish to pay via credit card over the phone, please call (919) 293-5000 to make your registration over the phone. TECHNOLOGY CROSSOVER Registration Inclusions. Member, Non-member, Speaker/Chair, Student, and Early Career conference registration fees include: Access to all live and on-demand keynotes, Author Round Rooms with Q&A and featured content beginning on April 26, 2021 for one (1) person.VIRTUAL EVENTS
VIRTUAL WORKSHOPS. Virtual workshops and events take attendees on a deeper dive into a particular topical area. These programs feature multiple speakers. Pricing is $100 for IMAPS members, free for students, or $200 for non-members (inclusive of a one-year membership). Sponsorships for the morning and afternoon session areavailable.
IMAPS CHAPTERS
IMAPS chapters serve as local networks that allow mircoelectronics professionals to build business relationships, share industry information, and find technical solutions. IMAPS chapters organize and sponsor local symposia/ conferences, vendor days, technical presentations, and social events. IMAPS members are automatically enrolled as a memberABOUT MEMBERSHIP
Member Benefits. High quality technical programs offer content on cutting edge and long-term research and development is presented in venues from the informal and focused Advanced Technology Workshops to the more formal International Symposia. IMAPSource offers instant access to our archive of thousands of digital documents and researchpapers
LIVE VIRTUAL WORKSHOP ON WIRE BONDING The International Microelectronics Assembly and Packaging Society (IMAPS) will host a Virtual Workshop on WIRE BONDING on May 5, 2021, using the Microsoft Teams Live Event software. The objective of the Wire Bonding Virtual Workshop is to have a unique forum that brings together scientists, engineers, manufacturing and academia people from around the world who have been working in the area of DEVICE PACKAGING HIGHLIGHTS The 2020 conference featured four premier technical keynote speakers, a Global Business Council (GBC) plenary session on the Electronics Industry Transition, and twelve technical sessions featuring more than 60 technical presentations all covering the latest in packaging technology innovation.Attendees also enjoyed a poster session and happy hour, a selection of nine professional development ADVANCING MICROELECTRONICS MAGAZINE IMAPS is eager to reveal an exciting new facelift to our hallmark member magazine Advancing Microelectronics!After decades of mailbox delivery, the magazine has moved to a purely interactive digital format effective with the 2020 Advanced SiP Special Issue. DEVICE PACKAGING REGISTRATION Make payment online with a credit card. Receive a confirmation via email. This will not include your login details for the conference. You will receive that in a separate email prior to the event. If you wish to pay via credit card over the phone, please call (919) 293-5000 to make your registration over the phone. ADVANCED PACKAGING FOR MEDICAL MICROELECTRONICS Event Description: The International Microelectronics Assembly and Packaging Society (IMAPS) will host a Live Virtual Workshop on Advanced Packaging and Business Outlook for Medical Microelectronics..The workshop will bring together technologists in semiconductor packaging with life science experts interested in applying advanced packaging methods to enable the next generation ofmedical
LIVE VIRTUAL WORKSHOP ON THERMAL MANAGEMENT Sponsored by: Event Description: IMAPS Virtual workshops take attendees on a deeper dive into a particular topical area, for this meeting – THERMAL MANAGEMENT and related topics! Attendees will have an opportunity to pose questions to the speakers during this LIVEVirtual Workshop.
EXECUTIVE COUNCIL
IMAPS Executive Council. The Executive Council is the primary leadership arm of IMAPS, composed of elected volunteers from within the Society. Executive Council members are voted into leadership by IMAPS members and carry a two-year term. INTERNATIONAL SYMPOSIUM ON MICROELECTRONICS The 54 th International Symposium on Microelectronics is being organized by the International Microelectronics Assembly and Packaging Society (IMAPS). The IMAPS 2021 Technical Committee seeks original papers that present progress on technologies throughout the entire microelectronics/packaging supply chain.ABOUT IMAPS
IMAPS is the leading international microelectronics and electronic packaging society representing more than 3,000 members around the world in US, European, and Asian chapters. Members of the Society represent every discipline and specialty in the electronics industry and include both technical and marketing professionals. SUBMIT YOUR ABSTRACT Submit your Abstract. The IMAPS Technical Committee seeks original papers that demonstrate how new technologies and applications are expanding and redefining the international role of microelectronics. All abstracts submitted are recommended to be approximately 1,000-words in length. TECHNOLOGY CROSSOVER AGENDA ON-DEMAND Technical Presentations - Available April 12 - June 1, 2021. Full Conference Registrants Only - Delivered through the Virtual Conference Portal. On-Demand Technical Presentations Catalog. PLENARY SESSION: LIVE 10:00 am - 12:30 pm Eastern. Plenary Presentation for Each Dedicated Conference Followed by Q&A. 10:00 am - 10:15 amEastern.
IMAPS CHAPTERS
IMAPS chapters serve as local networks that allow mircoelectronics professionals to build business relationships, share industry information, and find technical solutions. IMAPS chapters organize and sponsor local symposia/ conferences, vendor days, technical presentations, and social events. IMAPS members are automatically enrolled as a member DEVICE PACKAGING CONFERENCE The 18th Annual Device Packaging Conference (DPC 2022) will be held at the WeKoPa Resort and Conference Center, from March 7-10, 2022. It is an international event organized by the International Microelectronics Assembly and Packaging Society (IMAPS). DEVICE PACKAGING 2021 PDCS Device Packaging 2021 PDC Course Offerings. NEW! The 2021 PDC courses are offered each day of the virtual conference. Attendees must register for each course as an add-on to their overall symposium registration at $250 each. Attendees may select up to one course ineach time slot.
LIVE VIRTUAL WORKSHOP ON MEDICAL MICROELECTRONICS 1:00pm-1:25pm: Glass Core Technology for Enabling Miniaturization and Next Generation Integration of Medical Devices As Moore’s Law seemingly slows, the need for novel substrates/interposers and packaging methods become more and more critical to continue driving miniaturization and more functionality from our devices. ADVANCING MICROELECTRONICS MAGAZINE IMAPS is eager to reveal an exciting new facelift to our hallmark member magazine Advancing Microelectronics!After decades of mailbox delivery, the magazine has moved to a purely interactive digital format effective with the 2020 Advanced SiP Special Issue. DEVICE PACKAGING REGISTRATION Make payment online with a credit card. Receive a confirmation via email. This will not include your login details for the conference. You will receive that in a separate email prior to the event. If you wish to pay via credit card over the phone, please call (919) 293-5000 to make your registration over the phone. INTERNATIONAL SYMPOSIUM ON MICROELECTRONICS The 54 th International Symposium on Microelectronics is being organized by the International Microelectronics Assembly and Packaging Society (IMAPS). The IMAPS 2021 Technical Committee seeks original papers that present progress on technologies throughout the entire microelectronics/packaging supply chain.ABOUT IMAPS
IMAPS is the leading international microelectronics and electronic packaging society representing more than 3,000 members around the world in US, European, and Asian chapters. Members of the Society represent every discipline and specialty in the electronics industry and include both technical and marketing professionals. SUBMIT YOUR ABSTRACT Submit your Abstract. The IMAPS Technical Committee seeks original papers that demonstrate how new technologies and applications are expanding and redefining the international role of microelectronics. All abstracts submitted are recommended to be approximately 1,000-words in length. TECHNOLOGY CROSSOVER AGENDA ON-DEMAND Technical Presentations - Available April 12 - June 1, 2021. Full Conference Registrants Only - Delivered through the Virtual Conference Portal. On-Demand Technical Presentations Catalog. PLENARY SESSION: LIVE 10:00 am - 12:30 pm Eastern. Plenary Presentation for Each Dedicated Conference Followed by Q&A. 10:00 am - 10:15 amEastern.
IMAPS CHAPTERS
IMAPS chapters serve as local networks that allow mircoelectronics professionals to build business relationships, share industry information, and find technical solutions. IMAPS chapters organize and sponsor local symposia/ conferences, vendor days, technical presentations, and social events. IMAPS members are automatically enrolled as a member DEVICE PACKAGING CONFERENCE The 18th Annual Device Packaging Conference (DPC 2022) will be held at the WeKoPa Resort and Conference Center, from March 7-10, 2022. It is an international event organized by the International Microelectronics Assembly and Packaging Society (IMAPS). DEVICE PACKAGING 2021 PDCS Device Packaging 2021 PDC Course Offerings. NEW! The 2021 PDC courses are offered each day of the virtual conference. Attendees must register for each course as an add-on to their overall symposium registration at $250 each. Attendees may select up to one course ineach time slot.
LIVE VIRTUAL WORKSHOP ON MEDICAL MICROELECTRONICS 1:00pm-1:25pm: Glass Core Technology for Enabling Miniaturization and Next Generation Integration of Medical Devices As Moore’s Law seemingly slows, the need for novel substrates/interposers and packaging methods become more and more critical to continue driving miniaturization and more functionality from our devices. ADVANCING MICROELECTRONICS MAGAZINE IMAPS is eager to reveal an exciting new facelift to our hallmark member magazine Advancing Microelectronics!After decades of mailbox delivery, the magazine has moved to a purely interactive digital format effective with the 2020 Advanced SiP Special Issue. DEVICE PACKAGING REGISTRATION Make payment online with a credit card. Receive a confirmation via email. This will not include your login details for the conference. You will receive that in a separate email prior to the event. If you wish to pay via credit card over the phone, please call (919) 293-5000 to make your registration over the phone.ABOUT IMAPS
IMAPS is the leading international microelectronics and electronic packaging society representing more than 3,000 members around the world in US, European, and Asian chapters. Members of the Society represent every discipline and specialty in the electronics industry and include both technical and marketing professionals.ABOUT MEMBERSHIP
Member Benefits. High quality technical programs offer content on cutting edge and long-term research and development is presented in venues from the informal and focused Advanced Technology Workshops to the more formal International Symposia. IMAPSource offers instant access to our archive of thousands of digital documents and researchpapers
LIVE VIRTUAL WORKSHOP ON MEDICAL MICROELECTRONICS 1:00pm-1:25pm: Glass Core Technology for Enabling Miniaturization and Next Generation Integration of Medical Devices As Moore’s Law seemingly slows, the need for novel substrates/interposers and packaging methods become more and more critical to continue driving miniaturization and more functionality from our devices. LIVE VIRTUAL WORKSHOP ON WIRE BONDING The International Microelectronics Assembly and Packaging Society (IMAPS) will host a Virtual Workshop on WIRE BONDING on May 5, 2021, using the Microsoft Teams Live Event software. The objective of the Wire Bonding Virtual Workshop is to have a unique forum that brings together scientists, engineers, manufacturing and academia people from around the world who have been working in the area of TECHNOLOGY CROSSOVER Three star IMAPS conferences will align virtually in 2021 for an incredible attendee experience. The forces behind the International Conferences on High Temperature Electronics (HiTEC), Ceramic Interconnect & Ceramic Microsystems Technologies (CICMT), and Advanced Power Electronics Packaging (APEPS) have joined for a special crossover technology extravaganza! TECHNOLOGY CROSSOVER LAST CALL FOR ABSTRACTS -- NOW DUE: JANUARY 13, 2021. HiTEC 2021 continues the tradition of providing the leading biennial conference dedicated to the advancement and dissemination of knowledge of the high temperature electronics industry. Under the organizational sponsorship of the International Microelectronics Assembly andPackaging Society
EDUCATIONAL FOUNDATION The Microelectronics Education Foundation supports student activities that cultivate an understanding of packaging, components, and assembly technologies; how they are used; and understanding materials used in the processes. To promote these activities, the Foundation sponsors technical paper and poster contest awards at various chapter andSOCIETY AWARDS
See Past Award Winners Here. The ten awards presented annually are: The IMAPS Leadership Award (NEW!) recognizes significant contributions to the growth of the Society in terms of mentorship, technical or business achievement. Aimed at mid-career thought leaders in microelectronics, nominees are expected to have 8-20 years in the field and 5 years in the society. TECHNOLOGY CROSSOVER Registration Inclusions. Member, Non-member, Speaker/Chair, Student, and Early Career conference registration fees include: Access to all live and on-demand keynotes, Author Round Rooms with Q&A and featured content beginning on April 26, 2021 for one (1) person.EXECUTIVE COUNCIL
IMAPS Executive Council. The Executive Council is the primary leadership arm of IMAPS, composed of elected volunteers from within the Society. Executive Council members are voted into leadership by IMAPS members and carry a two-year term.* +
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International Conference on Device Packaging Abstracts Due Dec 18 High Temp, Ceramics, Power Electronics Abstracts Due Dec 18 Advancing Microelectronics Moves Digital Sept-Oct Issue NOW AVAILABLE‹ ›
UPCOMING EVENTS
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LIVE TECHNICAL WEBINAR SERIES: POWER ELECTRONICS: IMPROVE BONDLINE CONTROL & RELIABILITY WITH REINFORCED MATRIX PREFORMSDecember 09, 2020
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IMAPS LIVE VIRTUAL WORKSHOP ON MEDICAL MICROELECTRONICSFebruary 24, 2021
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17TH INTERNATIONAL CONFERENCE AND EXHIBITION ON DEVICE PACKAGING (DPC2021)
April 12, 2021
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ADVANCING MICROELECTRONICS SEPT-OCT ISSUE NOW AVAILABLEOctober 28, 2020
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Instant, easy online access to our _exclusive_ archive of thousands of digital documents and research papers from IMAPS symposia, conferences, and publications. International Microelectronics Assembly & Packaging Society* About Us
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* International Symposium on Microelectronics * Live Virtual Workshop on Medical Microelectronics * Device Packaging Conference * Technology Crossover | CICMT - HiTEC - Power Pkg * Advanced System-in-Package (SiP) Conference* Publications
* Visit IMAPSource Research Portal * Advertising Opportunities * Journal Copyright Transfer Form * Advancing Microelectronics Magazine* News
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* Value of Membership * IMAPS for Students * Corporate Connections PO Box 110127, Research Triangle Park, NC 27709-5127 Phone: +1(919)293-5000 | Email: info@imaps.org © 2020 INTERNATIONAL MICROELECTRONICS ASSEMBLY & PACKAGING SOCIETY Website powered by MemberLeap.Privacy Policy
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