TECHINSIGHTS INC.

Leading the world in microelectronics reverse engineering, and building the content platform for the semiconductor industry. TechInsights is proud to support a fair marketplace which promotes innovation, and where electronics Intellectual Property can be created and monetized to advance the world we live in.

TECHINSIGHTS APP

TechInsights App

APPLE IPAD PRO TEARDOWN The mini-LED display market is still in its infancy for the consumer market. Once TechInsights has completed the Deep Dive Teardown and analyzed the entire Display subsystem, we will have a better understanding as to how the new iPad Pro mini-LED display’s cost compares to the the $116 display costs from the 2019 iPad Pro 12.9”, as well as how the new 12.9” mini-LED display compares to APPLE HOMEPOD MINI TEARDOWN Apple has the most design wins for the Apple HomePod Mini A2374. Apple supplied the 64-bit dual-core S5 APL1W82 application processor, which was introduced in the Apple Watch Series 5 in 2019. Apple also used its own 338S00553-A0/D2482A power management chip, developed in cooperation with Dialog Semiconductor, and 339M00117 WiFi/Bluetooth

solution.

APPLE IPHONE 11 PRO MAX TEARDOWN Cameras. Our investigation of iPhone 11 and iPhone 11 Pro Max’s cameras is progressing, and we have summarized a mix of findings from each in Table 1. We were excited during the September Apple Special Event to hear of 100% Focus Pixels for iPhone’s wide-angle camera. We expected this to coincide with full-chip dual photodiode phase QUALCOMM QET5100 ENVELOPE TRACKER ARCHITECTURE ANALYSIS Mobile RF - Envelope Power Tracker Architecture. Report Code. CWR-1911-801. This is a Envelope Tracker Architecture on the Qualcomm envelope tracker integrated circuit (IC). It consists of a Device Summary, Introduction, Architecture Overview including outside and inside connectivity. View Table of Contents. SIC POWER TRANSISTOR PROCESS FLOW ANALYSIS: THE ROHM TechInsights has recently completed a full analysis of the process flow used to fabricate the Rohm SCT3022ALGC11 N-channel, SiC, trench, power MOSFET. The SCT3022ALGC11 is a 650 V, 93 A device, with an R DSON of 22 m . It is a leading etch SiC trench gate power FET, and is designed for use in solar inverters, DC/DC converters, switch mode

power

APPLE IPHONE X TEARDOWN Apple iPhone X Teardown. Apple used the tagline “Say hello to the future” to introduce the era of the iPhone X, and with the iPhone X in our lab for teardown, we are working to bring our readers news of the innovations made by Apple in their latest smartphone offering. We recently completed the iPhone 8 Plus teardown, and have examined the SAMSUNG KLUFG8R1EM-B0C1 64L TLC 3D V-NAND 512 GB DIE MFR-1903-802. This report presents a Memory Floorplan Analysis of the Samsung K9AHGD8U0M die found inside the Samsung KLUFG8R1EM-B0C1 3D V-NAND TLC flash memory package. This report contains the following detailed information: Selected teardown photographs, package photographs, package X-rays, die markings, and die photographs. BROADCOM BCM4387 WI-FI 6/BT 5.0 BASIC FLOORPLAN REPORT Broadcom BCM4387 Wi-Fi 6/BT 5.0 Basic Floorplan Report. This report presents a Basic Floorplan Analysis of the Broadcom BCM4387 die found inside the 339S00761 wireless module, which was extracted from the iPhone 12 Pro Max smartphone. Selected teardown photographs, package photographs, package X-rays, die markings, and die photographs.

TECHINSIGHTS INC.

Leading the world in microelectronics reverse engineering, and building the content platform for the semiconductor industry. TechInsights is proud to support a fair marketplace which promotes innovation, and where electronics Intellectual Property can be created and monetized to advance the world we live in.

TECHINSIGHTS APP

TechInsights App

APPLE IPAD PRO TEARDOWN The mini-LED display market is still in its infancy for the consumer market. Once TechInsights has completed the Deep Dive Teardown and analyzed the entire Display subsystem, we will have a better understanding as to how the new iPad Pro mini-LED display’s cost compares to the the $116 display costs from the 2019 iPad Pro 12.9”, as well as how the new 12.9” mini-LED display compares to APPLE HOMEPOD MINI TEARDOWN Apple has the most design wins for the Apple HomePod Mini A2374. Apple supplied the 64-bit dual-core S5 APL1W82 application processor, which was introduced in the Apple Watch Series 5 in 2019. Apple also used its own 338S00553-A0/D2482A power management chip, developed in cooperation with Dialog Semiconductor, and 339M00117 WiFi/Bluetooth

solution.

APPLE IPHONE 11 PRO MAX TEARDOWN Cameras. Our investigation of iPhone 11 and iPhone 11 Pro Max’s cameras is progressing, and we have summarized a mix of findings from each in Table 1. We were excited during the September Apple Special Event to hear of 100% Focus Pixels for iPhone’s wide-angle camera. We expected this to coincide with full-chip dual photodiode phase QUALCOMM QET5100 ENVELOPE TRACKER ARCHITECTURE ANALYSIS Mobile RF - Envelope Power Tracker Architecture. Report Code. CWR-1911-801. This is a Envelope Tracker Architecture on the Qualcomm envelope tracker integrated circuit (IC). It consists of a Device Summary, Introduction, Architecture Overview including outside and inside connectivity. View Table of Contents. SIC POWER TRANSISTOR PROCESS FLOW ANALYSIS: THE ROHM TechInsights has recently completed a full analysis of the process flow used to fabricate the Rohm SCT3022ALGC11 N-channel, SiC, trench, power MOSFET. The SCT3022ALGC11 is a 650 V, 93 A device, with an R DSON of 22 m . It is a leading etch SiC trench gate power FET, and is designed for use in solar inverters, DC/DC converters, switch mode

power

APPLE IPHONE X TEARDOWN Apple iPhone X Teardown. Apple used the tagline “Say hello to the future” to introduce the era of the iPhone X, and with the iPhone X in our lab for teardown, we are working to bring our readers news of the innovations made by Apple in their latest smartphone offering. We recently completed the iPhone 8 Plus teardown, and have examined the SAMSUNG KLUFG8R1EM-B0C1 64L TLC 3D V-NAND 512 GB DIE MFR-1903-802. This report presents a Memory Floorplan Analysis of the Samsung K9AHGD8U0M die found inside the Samsung KLUFG8R1EM-B0C1 3D V-NAND TLC flash memory package. This report contains the following detailed information: Selected teardown photographs, package photographs, package X-rays, die markings, and die photographs. BROADCOM BCM4387 WI-FI 6/BT 5.0 BASIC FLOORPLAN REPORT Broadcom BCM4387 Wi-Fi 6/BT 5.0 Basic Floorplan Report. This report presents a Basic Floorplan Analysis of the Broadcom BCM4387 die found inside the 339S00761 wireless module, which was extracted from the iPhone 12 Pro Max smartphone. Selected teardown photographs, package photographs, package X-rays, die markings, and die photographs. MEMORY TECHNOLOGY HIGHLIGHTS FROM TECHINSIGHTS 2021 Memory Technology Highlights from TechInsights 2021 Webinar Memory Technology Highlights from TechInsights 2021 Webinar Choose the best timezone for you America/Europe Register for Session 1 June 29, 2021: 3pm - 4pm UTC Asia Pacific Register for Session 2 June 29, 2021: 6am - 7am UTC Due to strong and growing A REVIEW OF THE CHEVY BOLT POWERTRAIN The battery pack on the Chevy Bolt is made by LG Electronics and occupies a large portion of the car’s undercarriage. Lithium ion batteries are somewhat hazardous to work with; due to the very high electrical energy density and the presence of flammable organic electrolyte materials, TechInsights performed the basic teardown work in a storage container in the parking lot of our office, as INTEL'S 2ND GENERATION XPOINT MEMORY In 2017, TechInsights analyzed the details on Intel 1 st gen. XPoint Memory (Optane TM Memory 16GB, MEMPEK1W016GA) including structure, materials, process, design, and circuit as well. Since then, we’ve been waiting for the 2 nd gen. XPoint Memory for many years. 3D XPoint non-volatile memory technology was introduced in 2015, and products started shipping from 2017. LIDAR 101 – SOLID-STATE AND MECHANICAL LIDARS LiDAR 101 – Solid-State and Mechanical LiDARs. 2020 has been an exciting year for LiDAR manufacturers. Five LiDAR companies (Velodyne Inc, Luminar Technologies Inc, Innoviz Technologies Ltd, Aeva Inc, and Ouster Inc) made announcements or went public through SPAC mergers. 2021 promises to get more interesting with LiDARs used in the sensor SIC POWER TRANSISTOR PROCESS FLOW ANALYSIS: THE ROHM TechInsights has recently completed a full analysis of the process flow used to fabricate the Rohm SCT3022ALGC11 N-channel, SiC, trench, power MOSFET. The SCT3022ALGC11 is a 650 V, 93 A device, with an R DSON of 22 m . It is a leading etch SiC trench gate power FET, and is designed for use in solar inverters, DC/DC converters, switch mode

power

GROUNDBREAKING SENSWIR SENSOR BY SONY- IMX990/IMX991 Groundbreaking SenSWIR Sensor by Sony - IMX990/IMX991. Sony announced the IMX990 and IMX991 SenSWIR imagers in 2020, with a 1.34 MP and 0.34 MP resolution, respectively. By moving away from pixel-level bump bonds and taking advantage of greater miniaturization in Cu-Cu Direct Bond Interconnect (DBI), Sony was able to reduce the pixel size of GOOGLE PIXEL 3 XL TEARDOWN Google Pixel 3 XL Teardown. November 18, 2018 - the official launch date in the US, saw the release of the Google Pixel 3 and 3 XL, Google’s most advanced flagship smartphone to date. While we have taken a little time in getting to the teardown analysis of this phone, it is certainly not for lack of interest. We found some interesting PART 4: NON-BAYER CFA, PHASE DETECTION AUTOFOCUS (PDAF This blog series is structured in four parts: (1) chip-stacking and chip-to-chip interconnect, (2) pixel scaling and scaling enablers, (3) active Si thickness and deep trench isolation (DTI) structures, and (4) non-Bayer color filter arrays, and phase detection autofocus (PDAF). The time allotted for the IISW talk did not permit discussion of optical stack trends, and it is not a topic that WORLD’S FIRST 1 GB 28 NM STT-MRAM PRODUCT Everspin’s new 1-Gigabit (Gb) Spin Torque Transfer Magneto-resistive Random Access Memory (STT-MRAM) device with a 28 nm process is the world’s first 1 Gb STT-MRAM product. This 4 th generation MRAM technology release is a standalone market leader. Its only industry peers, Intel and Micron XPoint Memory, are developing MRAM, ReRAM, and ANALYSIS OF QUALCOMM'S SNAPDRAGON SDR865 TRANSCEIVER The Snapdragon 865 platform is Qualcomm's most advanced 5G chipset to date with support for 5G, sub-6, mmWave and LTE. 4G/5G dynamic spectrum sharing, will enable "operators to accelerate 5G deployments by using their existing 4G spectrum holdings to deliver both 4G & 5G services dynamically."

TECHINSIGHTS INC.

Leading the world in microelectronics reverse engineering, and building the content platform for the semiconductor industry. TechInsights is proud to support a fair marketplace which promotes innovation, and where electronics Intellectual Property can be created and monetized to advance the world we live in.

TECHINSIGHTS APP

TechInsights App

APPLE IPAD PRO TEARDOWN The mini-LED display market is still in its infancy for the consumer market. Once TechInsights has completed the Deep Dive Teardown and analyzed the entire Display subsystem, we will have a better understanding as to how the new iPad Pro mini-LED display’s cost compares to the the $116 display costs from the 2019 iPad Pro 12.9”, as well as how the new 12.9” mini-LED display compares to

SAMSUNG GALAXY S21

Samsung D1z 12 Gb LPDDR5 chips are being used for Samsung Galaxy S21 Ultra 5G SM-G998B/DS 12GB RAM, while D1z 16 Gb LPDDR5 chips can be found from S21 5G and S21+ 5G 8 Gb RAM components. We are now tearing down the 8 Gb LPDDR5 S21+ and other models, so we will have more findings to update. February 4 update: Finally! QUALCOMM QET5100 ENVELOPE TRACKER ARCHITECTURE ANALYSIS Mobile RF - Envelope Power Tracker Architecture. Report Code. CWR-1911-801. This is a Envelope Tracker Architecture on the Qualcomm envelope tracker integrated circuit (IC). It consists of a Device Summary, Introduction, Architecture Overview including outside and inside connectivity. View Table of Contents. APPLE HOMEPOD MINI TEARDOWN Apple has the most design wins for the Apple HomePod Mini A2374. Apple supplied the 64-bit dual-core S5 APL1W82 application processor, which was introduced in the Apple Watch Series 5 in 2019. Apple also used its own 338S00553-A0/D2482A power management chip, developed in cooperation with Dialog Semiconductor, and 339M00117 WiFi/Bluetooth

solution.

SIC POWER TRANSISTOR PROCESS FLOW ANALYSIS: THE ROHM TechInsights has recently completed a full analysis of the process flow used to fabricate the Rohm SCT3022ALGC11 N-channel, SiC, trench, power MOSFET. The SCT3022ALGC11 is a 650 V, 93 A device, with an R DSON of 22 m . It is a leading etch SiC trench gate power FET, and is designed for use in solar inverters, DC/DC converters, switch mode

power

APPLE IPHONE X TEARDOWN Apple iPhone X Teardown. Apple used the tagline “Say hello to the future” to introduce the era of the iPhone X, and with the iPhone X in our lab for teardown, we are working to bring our readers news of the innovations made by Apple in their latest smartphone offering. We recently completed the iPhone 8 Plus teardown, and have examined the SAMSUNG KLUFG8R1EM-B0C1 64L TLC 3D V-NAND 512 GB DIE MFR-1903-802. This report presents a Memory Floorplan Analysis of the Samsung K9AHGD8U0M die found inside the Samsung KLUFG8R1EM-B0C1 3D V-NAND TLC flash memory package. This report contains the following detailed information: Selected teardown photographs, package photographs, package X-rays, die markings, and die photographs. BROADCOM BCM4387 WI-FI 6/BT 5.0 BASIC FLOORPLAN REPORT Broadcom BCM4387 Wi-Fi 6/BT 5.0 Basic Floorplan Report. This report presents a Basic Floorplan Analysis of the Broadcom BCM4387 die found inside the 339S00761 wireless module, which was extracted from the iPhone 12 Pro Max smartphone. Selected teardown photographs, package photographs, package X-rays, die markings, and die photographs.

TECHINSIGHTS INC.

Leading the world in microelectronics reverse engineering, and building the content platform for the semiconductor industry. TechInsights is proud to support a fair marketplace which promotes innovation, and where electronics Intellectual Property can be created and monetized to advance the world we live in.

TECHINSIGHTS APP

TechInsights App

APPLE IPAD PRO TEARDOWN The mini-LED display market is still in its infancy for the consumer market. Once TechInsights has completed the Deep Dive Teardown and analyzed the entire Display subsystem, we will have a better understanding as to how the new iPad Pro mini-LED display’s cost compares to the the $116 display costs from the 2019 iPad Pro 12.9”, as well as how the new 12.9” mini-LED display compares to

SAMSUNG GALAXY S21

Samsung D1z 12 Gb LPDDR5 chips are being used for Samsung Galaxy S21 Ultra 5G SM-G998B/DS 12GB RAM, while D1z 16 Gb LPDDR5 chips can be found from S21 5G and S21+ 5G 8 Gb RAM components. We are now tearing down the 8 Gb LPDDR5 S21+ and other models, so we will have more findings to update. February 4 update: Finally! QUALCOMM QET5100 ENVELOPE TRACKER ARCHITECTURE ANALYSIS Mobile RF - Envelope Power Tracker Architecture. Report Code. CWR-1911-801. This is a Envelope Tracker Architecture on the Qualcomm envelope tracker integrated circuit (IC). It consists of a Device Summary, Introduction, Architecture Overview including outside and inside connectivity. View Table of Contents. APPLE HOMEPOD MINI TEARDOWN Apple has the most design wins for the Apple HomePod Mini A2374. Apple supplied the 64-bit dual-core S5 APL1W82 application processor, which was introduced in the Apple Watch Series 5 in 2019. Apple also used its own 338S00553-A0/D2482A power management chip, developed in cooperation with Dialog Semiconductor, and 339M00117 WiFi/Bluetooth

solution.

SIC POWER TRANSISTOR PROCESS FLOW ANALYSIS: THE ROHM TechInsights has recently completed a full analysis of the process flow used to fabricate the Rohm SCT3022ALGC11 N-channel, SiC, trench, power MOSFET. The SCT3022ALGC11 is a 650 V, 93 A device, with an R DSON of 22 m . It is a leading etch SiC trench gate power FET, and is designed for use in solar inverters, DC/DC converters, switch mode

power

APPLE IPHONE X TEARDOWN Apple iPhone X Teardown. Apple used the tagline “Say hello to the future” to introduce the era of the iPhone X, and with the iPhone X in our lab for teardown, we are working to bring our readers news of the innovations made by Apple in their latest smartphone offering. We recently completed the iPhone 8 Plus teardown, and have examined the SAMSUNG KLUFG8R1EM-B0C1 64L TLC 3D V-NAND 512 GB DIE MFR-1903-802. This report presents a Memory Floorplan Analysis of the Samsung K9AHGD8U0M die found inside the Samsung KLUFG8R1EM-B0C1 3D V-NAND TLC flash memory package. This report contains the following detailed information: Selected teardown photographs, package photographs, package X-rays, die markings, and die photographs. BROADCOM BCM4387 WI-FI 6/BT 5.0 BASIC FLOORPLAN REPORT Broadcom BCM4387 Wi-Fi 6/BT 5.0 Basic Floorplan Report. This report presents a Basic Floorplan Analysis of the Broadcom BCM4387 die found inside the 339S00761 wireless module, which was extracted from the iPhone 12 Pro Max smartphone. Selected teardown photographs, package photographs, package X-rays, die markings, and die photographs.

TECHINSIGHTS INC.

Leading the world in microelectronics reverse engineering, and building the content platform for the semiconductor industry. TechInsights is proud to support a fair marketplace which promotes innovation, and where electronics Intellectual Property can be created and monetized to advance the world we live in. APPLE HOMEPOD MINI TEARDOWN Apple has the most design wins for the Apple HomePod Mini A2374. Apple supplied the 64-bit dual-core S5 APL1W82 application processor, which was introduced in the Apple Watch Series 5 in 2019. Apple also used its own 338S00553-A0/D2482A power management chip, developed in cooperation with Dialog Semiconductor, and 339M00117 WiFi/Bluetooth

solution.

BLOGS | TECHINSIGHTS December 21, 2020 Stephen Russell Toshiba Integrated Diode into SiC MOSFET Every silicon carbide (SiC) manufacturer seemingly has their own approach to FET fabrication. BLOGS | TECHINSIGHTS Posted: April 24, 2016 Contributing Authors: Jim Morrison, Ray Fontaine, Dick James and Daniel Yang The following teardown blog contains some of our initial findings. BLOGS | TECHINSIGHTS 4-Part Blog Series: The state of the art of smartphone imagers Part 2: Pixel Scaling and Scaling Enablers Posted: July 16, 2019 Contributing Author: Ray Fontaine Content adapted from TechInsights’ paper for the International Image Sensors Workshop (IISW) 2019 Blog outline of the talk was structured INTEL 2ND GENERATION XPOINT MEMORY Intel 2 nd gen. XPoint Memory Cell Structure. WL and BL pitches measure 40nm for each, which results in the same unit cell size, 0.0016µm 2, with 1 st generation. 4-stack PCM/OTS layer structure, effectively 1F 2, is integrated on M4 layer, likely with a WL/BL/WL/BL/WL stack.The Ovonic Threshold Switching Selector (OTS) co-integrated with a PCM layer for the device, which is the same BLOGS | TECHINSIGHTS Posted: December 24, 2014 Contributing Authors: Martin Bijman On December 23, 2014, RPX purchased the remaining assets of Rockstar for

$900M.

BLOGS | TECHINSIGHTS Posted: November 1, 2013 Inside On October 23, 2013, Apple announced the newest iPad, the iPad Air. Since the announcement, we at TechInsights have been anxiously waiting for the opportunity to get our hands on the device. BLOGS | TECHINSIGHTS Posted: October 17, 2016 Contributing Authors: Dick James One of the lesser-known stories of mobile phone evolution is the development of proximity sensing in order to save power and disable touch screen functions when the phone is actually being used as a phone. BLOGS | TECHINSIGHTS Posted: February 7, 2018 Contributing Authors: Dirk Caspary, David Olaogbebikan and Martin Bijman It has been a year since Microsoft released the Azure IP Advantage program – a service that “provides the industry’s most comprehensive protection against intellectual property (IP) risks” by making 10

TECHINSIGHTS INC.

Leading the world in microelectronics reverse engineering, and building the content platform for the semiconductor industry. TechInsights is proud to support a fair marketplace which promotes innovation, and where electronics Intellectual Property can be created and monetized to advance the world we live in. TECHINSIGHTS APPTECHINSIGHTS PRIVATIZATIONTECHINSIGHTS ROADMAPTECHINSIGHTS IPHONE 11 TEARDOWN

TechInsights App

APPLE IPAD PRO TEARDOWN The mini-LED display market is still in its infancy for the consumer market. Once TechInsights has completed the Deep Dive Teardown and analyzed the entire Display subsystem, we will have a better understanding as to how the new iPad Pro mini-LED display’s cost compares to the the $116 display costs from the 2019 iPad Pro 12.9”, as well as how the new 12.9” mini-LED display compares to QUALCOMM QET5100 ENVELOPE TRACKER ARCHITECTURE ANALYSISARCHITECTURE ANALYSIS DIAGRAMSARCHITECTURE ANALYSIS PAPERARCHITECTURE ANALYSIS PAPERSOFTWARE ARCHITECTURE ANALYSIS METHODSOFTWARE ARCHITECTURE ANALYSIS TOOLSYSTEM ARCHITECTURE ANALYSIS Mobile RF - Envelope Power Tracker Architecture. Report Code. CWR-1911-801. This is a Envelope Tracker Architecture on the Qualcomm envelope tracker integrated circuit (IC). It consists of a Device Summary, Introduction, Architecture Overview including outside and inside connectivity. View Table of Contents. SIC POWER TRANSISTOR PROCESS FLOW ANALYSIS: THE ROHM TechInsights has recently completed a full analysis of the process flow used to fabricate the Rohm SCT3022ALGC11 N-channel, SiC, trench, power MOSFET. The SCT3022ALGC11 is a 650 V, 93 A device, with an R DSON of 22 m . It is a leading etch SiC trench gate power FET, and is designed for use in solar inverters, DC/DC converters, switch mode

power

APPLE HOMEPOD MINI TEARDOWN Apple has the most design wins for the Apple HomePod Mini A2374. Apple supplied the 64-bit dual-core S5 APL1W82 application processor, which was introduced in the Apple Watch Series 5 in 2019. Apple also used its own 338S00553-A0/D2482A power management chip, developed in cooperation with Dialog Semiconductor, and 339M00117 WiFi/Bluetooth

solution.

APPLE IPHONE 11 PRO MAX TEARDOWN Cameras. Our investigation of iPhone 11 and iPhone 11 Pro Max’s cameras is progressing, and we have summarized a mix of findings from each in Table 1. We were excited during the September Apple Special Event to hear of 100% Focus Pixels for iPhone’s wide-angle camera. We expected this to coincide with full-chip dual photodiode phase APPLE IPHONE X TEARDOWN Apple iPhone X Teardown. Apple used the tagline “Say hello to the future” to introduce the era of the iPhone X, and with the iPhone X in our lab for teardown, we are working to bring our readers news of the innovations made by Apple in their latest smartphone offering. We recently completed the iPhone 8 Plus teardown, and have examined the A REVIEW OF THE CHEVY BOLT POWERTRAIN The battery pack on the Chevy Bolt is made by LG Electronics and occupies a large portion of the car’s undercarriage. Lithium ion batteries are somewhat hazardous to work with; due to the very high electrical energy density and the presence of flammable organic electrolyte materials, TechInsights performed the basic teardown work in a storage container in the parking lot of our office, as GOOGLE PIXEL 3 XL TEARDOWN Google Pixel 3 XL Teardown. November 18, 2018 - the official launch date in the US, saw the release of the Google Pixel 3 and 3 XL, Google’s most advanced flagship smartphone to date. While we have taken a little time in getting to the teardown analysis of this phone, it is certainly not for lack of interest. We found some interesting

TECHINSIGHTS INC.

Leading the world in microelectronics reverse engineering, and building the content platform for the semiconductor industry. TechInsights is proud to support a fair marketplace which promotes innovation, and where electronics Intellectual Property can be created and monetized to advance the world we live in. TECHINSIGHTS APPTECHINSIGHTS PRIVATIZATIONTECHINSIGHTS ROADMAPTECHINSIGHTS IPHONE 11 TEARDOWN

TechInsights App

APPLE IPAD PRO TEARDOWN The mini-LED display market is still in its infancy for the consumer market. Once TechInsights has completed the Deep Dive Teardown and analyzed the entire Display subsystem, we will have a better understanding as to how the new iPad Pro mini-LED display’s cost compares to the the $116 display costs from the 2019 iPad Pro 12.9”, as well as how the new 12.9” mini-LED display compares to QUALCOMM QET5100 ENVELOPE TRACKER ARCHITECTURE ANALYSISARCHITECTURE ANALYSIS DIAGRAMSARCHITECTURE ANALYSIS PAPERARCHITECTURE ANALYSIS PAPERSOFTWARE ARCHITECTURE ANALYSIS METHODSOFTWARE ARCHITECTURE ANALYSIS TOOLSYSTEM ARCHITECTURE ANALYSIS Mobile RF - Envelope Power Tracker Architecture. Report Code. CWR-1911-801. This is a Envelope Tracker Architecture on the Qualcomm envelope tracker integrated circuit (IC). It consists of a Device Summary, Introduction, Architecture Overview including outside and inside connectivity. View Table of Contents. SIC POWER TRANSISTOR PROCESS FLOW ANALYSIS: THE ROHM TechInsights has recently completed a full analysis of the process flow used to fabricate the Rohm SCT3022ALGC11 N-channel, SiC, trench, power MOSFET. The SCT3022ALGC11 is a 650 V, 93 A device, with an R DSON of 22 m . It is a leading etch SiC trench gate power FET, and is designed for use in solar inverters, DC/DC converters, switch mode

power

APPLE HOMEPOD MINI TEARDOWN Apple has the most design wins for the Apple HomePod Mini A2374. Apple supplied the 64-bit dual-core S5 APL1W82 application processor, which was introduced in the Apple Watch Series 5 in 2019. Apple also used its own 338S00553-A0/D2482A power management chip, developed in cooperation with Dialog Semiconductor, and 339M00117 WiFi/Bluetooth

solution.

APPLE IPHONE 11 PRO MAX TEARDOWN Cameras. Our investigation of iPhone 11 and iPhone 11 Pro Max’s cameras is progressing, and we have summarized a mix of findings from each in Table 1. We were excited during the September Apple Special Event to hear of 100% Focus Pixels for iPhone’s wide-angle camera. We expected this to coincide with full-chip dual photodiode phase APPLE IPHONE X TEARDOWN Apple iPhone X Teardown. Apple used the tagline “Say hello to the future” to introduce the era of the iPhone X, and with the iPhone X in our lab for teardown, we are working to bring our readers news of the innovations made by Apple in their latest smartphone offering. We recently completed the iPhone 8 Plus teardown, and have examined the A REVIEW OF THE CHEVY BOLT POWERTRAIN The battery pack on the Chevy Bolt is made by LG Electronics and occupies a large portion of the car’s undercarriage. Lithium ion batteries are somewhat hazardous to work with; due to the very high electrical energy density and the presence of flammable organic electrolyte materials, TechInsights performed the basic teardown work in a storage container in the parking lot of our office, as GOOGLE PIXEL 3 XL TEARDOWN Google Pixel 3 XL Teardown. November 18, 2018 - the official launch date in the US, saw the release of the Google Pixel 3 and 3 XL, Google’s most advanced flagship smartphone to date. While we have taken a little time in getting to the teardown analysis of this phone, it is certainly not for lack of interest. We found some interesting ABOUT US | TECHINSIGHTS Your partner for revealing innovation and analyzing patent rights TechInsights is widely recognized the world’s leading provider of advanced technology analysis and intellectual property services, providing content and services to the world’s most successful technology companies. CAREERS | TECHINSIGHTS Why TechInsights? World Respected Leader TechInsights’ success is founded upon the expertise of its patent and technology analysts, their continuous spirit of research and innovation, and a focus on client satisfaction. Our engineering and consulting teams combine cutting edge reverse-engineering capabilities with a deep understanding of patents to deliver high value solutions for our

clients.

APPLE IPHONE 11 PRO MAX TEARDOWN Apple A13 Bionic. The A13 Bionic has an Apple part number APL1W85. It is a Package on Package (PoP) with both the A13 Application Processor and the Samsung K3UH5H50AM-SGCL 4GB LPDDR4X SDRAM, with the same 4GB DRAM capacity as the previous iPhone Xs Max from last year. BLOGS | TECHINSIGHTS Posted: April 24, 2016 Contributing Authors: Jim Morrison, Ray Fontaine, Dick James and Daniel Yang The following teardown blog contains some of our initial findings. BLOGS | TECHINSIGHTS Posted: October 17, 2016 Contributing Authors: Dick James One of the lesser-known stories of mobile phone evolution is the development of proximity sensing in order to save power and disable touch screen functions when the phone is actually being used as a phone. BLOGS | TECHINSIGHTS Posted: December 24, 2014 Contributing Authors: Martin Bijman On December 23, 2014, RPX purchased the remaining assets of Rockstar for

$900M.

BLOGS | TECHINSIGHTS Posted: November 1, 2013 Inside On October 23, 2013, Apple announced the newest iPad, the iPad Air. Since the announcement, we at TechInsights have been anxiously waiting for the opportunity to get our hands on the device. BLOGS | TECHINSIGHTS 4-Part Blog Series: The state of the art of smartphone imagers Part 2: Pixel Scaling and Scaling Enablers Posted: July 16, 2019 Contributing Author: Ray Fontaine Content adapted from TechInsights’ paper for the International Image Sensors Workshop (IISW) 2019 Blog outline of the talk was structured BLOGS | TECHINSIGHTS Posted: February 7, 2018 Contributing Authors: Dirk Caspary, David Olaogbebikan and Martin Bijman It has been a year since Microsoft released the Azure IP Advantage program – a service that “provides the industry’s most comprehensive protection against intellectual property (IP) risks” by making 10 BLOGS | TECHINSIGHTS Posted: June 14, 2017 Contributing Authors: Jeongdong Choe, Senior Technical Fellow Samsung has begun to mass-produce their first 10 nm-class DRAM products, and we’ve taken this opportunity to analyze and compare it to the previous generations of 25 nm and 20 nm DRAM

products.

tag --> Skip to main content

* Subscriber Login

TechInsights Platform Inside Technology

USER ACCOUNT MENU

Guest Login

TechInsights

Search Submit

* Technical Capabilities

* Markets Served

* Consumer Electronics

* Mobile Devices

* Automotive Electronics

* Semiconductors

* Internet of Things

* Storage Devices

* Communications Standards

* Optoelectonics

* Medical Devices

* Clean-Tech Devices

* Devices Analyzed

* Wireless R/F

* DRAM Memory

* NAND Flash Memory

* Microprocessors / Controllers

* Sensors

* Power Management

* Displays

* Analog

* Antennas

* Batteries

* Scope of Analysis

* Teardown / Costing * Functional Testing

* Packaging

* Structural/Process

* Circuit

* Transistor Characterization

* Waveform

* Software Analysis

* Access our Reverse Engineering * Curated Subscriptions * Consumer Electronics Teardown

* Mobile Devices

* Wearables

* SSDs

* Notebooks & Tablets

* Smart Home

* IoT Modules

* Costing

* Costing & Design Wins Database * Component Price Landscape

* Logic

* NAND & DRAM Memory * Embedded & Emerging Memory

* Image Sensors

* Power Semiconductor * Mobile Radio Frequency * IoT Connectivity SoC

* Batteries

* Storage

* Automotive

* TechLibrary for Patent Investigations

* Custom Analysis

* IP Services

* Assertion

* Defense

* Portfolio Assessment * Patent Strengthening * Patent Landscaping * For Lawyers and Law Firms

* About

* Careers

* Newsroom

* Blogs

* Webinars

* Events

* News & Articles

* Featured Reports

* Community Initiatives

* Contact Us

* Subscriber Login

TechInsights Platform Inside Technology

USER ACCOUNT MENU

Guest Login

Video file

Play Video

Pause

Unmute

Current Time 0:00

/

Duration Time 0:00

Loaded: 0%

Progress: 0%

Stream TypeLIVE

Remaining Time -0:00

Playback Rate

1

Chapters

* Chapters

Subtitles

* subtitles off

Captions

* captions off

Fullscreen

Foreground --- White Black Red Green Blue Yellow Magenta Cyan ---

Opaque Semi-Opaque

Background --- White Black Red Green Blue Yellow Magenta Cyan --- Opaque Semi-Transparent Transparent Window --- White Black Red Green Blue Yellow Magenta Cyan --- Opaque Semi-Transparent Transparent Font Size 50% 75% 100% 125% 150% 175% 200% 300% 400% Text Edge Style None Raised Depressed Uniform Dropshadow Font Family Default Monospace Serif Proportional Serif Monospace Sans-Serif Proportional Sans-Serif Casual Script Small Caps

Defaults Done

Revealing the innovations others cannot inside advanced technology

products

Start searching our library todaySubmit Technology Professional    IP Professional    Supply Chain Professional

Law Firms

Prospective

Employees

LEADING THE WORLD IN MICROELECTRONICS REVERSE ENGINEERING, AND BUILDING THE CONTENT PLATFORM FOR THE SEMICONDUCTOR INDUSTRY. TECHINSIGHTS IS PROUD TO SUPPORT A FAIR MARKETPLACE WHICH PROMOTES INNOVATION, AND WHERE ELECTRONICS INTELLECTUAL PROPERTY CAN BE CREATED AND MONETIZED TO ADVANCE THE WORLD WE LIVE IN. Competitive Technology Intelligence Monitoring and analyzing semiconductor and microelectronics innovation from the system to the atomic level (sub 5 nm) Platform for the Semiconductor Industry TechInsights Platform provides a central repository of benchmarking data, costing, analysis, technology roadmaps, and schematics Intellectual Property Proving patent value in advanced technology markets, matching patent claims to the evidence of their use in consumer products SEARCH OUR ANALYSIS AND WEBSITE Start searching our library today Submit

OUR LATEST ANALYSIS

QUICK SURVEY TEARDOWN OF THE SAMSUNG GALAXY S21+ 5G SM-996U

SMARTPHONE

Samsung

5G Handset

SURVEY PLUS TEARDOWN OF THE SAMSUNG GALAXY S21+ 5G SM-996U SMARTPHONE

Samsung

5G Handset

QUALCOMM SNAPDRAGON 888 SAMSUNG 5LPP PROCESS ACMOS ESSENTIALS

Xiaomi Tech

Multi-band Handset

BILL OF MATERIALS OF THE MICROSOFT XBOX SERIES S 1883 VIDEO GAME

CONSOLE

Microsoft

Game Console

DEEP DIVE TEARDOWN OF THE MICROSOFT XBOX SERIES S 1883 VIDEO GAME

CONSOLE

Microsoft

Game Console

BILL OF MATERIALS OF THE LIVOX AVIA LIDAR SENSOR

Livox

LIDAR

RECENT NEWS AND BLOGS

* All

* Webinars

* Technology Blog

* Latest News

* IP Blogs

* Featured Analysis

* Events

ELECTRIC VEHICLE TECHNOLOGIES WEBINAR: AN IN-DEPTH ANALYSIS FROM THE MARKET TO THE SEMICONDUCTOR Electric Vehicle Technologies Webinar An in-depth analysis from the market to the semiconductor Choose the best timezone for you America/Europe Register for Session 1 June 15, 2021: 3pm - 4:30pm UTC Asia Pacific Register for Session 2 June 17, 2021

Read More

15Jun

INTEL 2ND GENERATION XPOINT MEMORY Embedded and Emerging Memory Technology Here, we have the Intel 2nd gen. XPoint Memory die! Finally, we’ve found the Intel XPointTM Memory 2nd generation die! We’ve quickly viewed the die removed from Intel OptaneTM SSD DC P5800X 400GB (Model

Read More

03Jun

TEARDOWN: APPLE IPHONE 12 PRO MAX 5G Electronics360 News Desk: The following is a partial deep dive into a Teardown of the Apple iPhone 12 Pro Max 5G smartphone conducted by

TechInsights.

Read More

25May

APPLE IPAD PRO TEARDOWN Teardown Technology Stacy Wegner, Daniel Yang, Ziad Shukri Apple introduced the new iPad Pro (2021) on April 20th, continuing the Apple M1 CPU expansion into their popular iPad Pro product line. The Apple-designed M1 chip started to replace Intel

Read More

24May

GROUNDBREAKING SENSWIR SENSOR BY SONY- IMX990/IMX991 Image Sensor Technology Groundbreaking SenSWIR Sensor by Sony - IMX990/IMX991 Sony announced the IMX990 and IMX991 SenSWIR imagers in 2020, with a 1.34 MP and 0.34 MP resolution, respectively. By moving away from pixel-level bump bonds and taking

Read More

19May

WEBINAR: THE POWER REVOLUTION - INNOVATION AND IP IN POWER MANAGEMENT

TECHNOLOGIES

Webinar The Power Revolution: Innovation and IP in Power Management Technologies Innovations relating to power and power consumption are an increasingly hot topics as society works to reduce our power footprint by reducing power consumption and

Read More

11May

APPLE HOMEPOD MINI TEARDOWN May 5, 2021 Teardown Technology A quick look inside the Apple Homepod Mini design wins, but is there a secret part waiting to be intialized? The Apple HomePod Mini A2374 is a voice-interactive smart speaker with Siri assistant. It features four

Read More

05May

INTEL'S 2ND GENERATION XPOINT MEMORY April 30, 2021 Dr. Jeongdong Choe Intel's 2nd Generation XPoint Memory - Will it be worth the long wait ahead? In 2017, TechInsights analyzed the details on Intel 1st gen. XPoint Memory (OptaneTM Memory 16GB, MEMPEK1W016GA) including structure

Read More

30Apr

QUALCOMM EXTENDS THEIR MMWAVE LEADERSHIP POSITION April 21, 2021 Kyle Nolan Qualcomm extends their mmWave leadership position 5G mmWave is still far from worldwide adoption but Qualcomm is keeping their foot on the pedal despite no one really close on their tail. One of Qualcomm’s Sr. Directors of

Read More

21Apr

SAMSUNG D1Z LPDDR5 DRAM WITH EUV LITHOGRAPHY (EUVL) - MEMORY BLOG April 16, 2021 Dr. Jeongdong Choe Originally published in Samsung D1z LPDDR5 DRAM with EUV Lithography (EUVL) Finally! After months of waiting, we have seen Samsung Electronics’ applied extreme ultraviolet (EUV) lithography technology for D1z DRAM in

Read More

16Apr

WORLD’S FIRST 1 GB 28 NM STT-MRAM PRODUCT - BY EVERSPIN March 30, 2021 Embedded & Emerging Memory World’s First 1 Gb 28 nm STT-MRAM Product - by Everspin Everspin’s new 1-Gigabit (Gb) Spin Torque Transfer Magneto-resistive Random Access Memory (STT-MRAM) device with a 28 nm process is the world’s first 1

Read More

31Mar

TECHINSIGHTS IDENTIFIES SOME OF BLACKBERRY’S HIGHEST VALUE PATENT ASSETS THROUGH PORTFOLIO ANALYSIS March 23, 2021 Abdullah Rahal TechInsights identifies some of Blackberry’s highest value patent assets through portfolio analysis Download the Summary of Analysis TechInsights’ analysts have examined the Blackberry patent portfolio and partitioned it

Read More

23Mar

KIOXIA’S NEW XL-FLASH FOR ULTRA-LOW LATENCY NAND APPLICATION March 23, 2021 Dr. Jeongdong Choe KIOXIA’s new XL-FLASH for ultra-low latency NAND application We’ve just found a new XL-FLASH product with 96L BiCS4 NAND cell architecture from KIOXIA. According to KIOXIA, XL-FLASH is extremely low-latency, high

Read More

23Mar

DYNAMIC VISION SENSORS – A BRIEF OVERVIEW - IMAGE SENSOR TECHSTREAM

BLOG

March 16, 2021 Ziad Shukri Dynamic Vision Sensors – A Brief Overview Dynamic Vison Sensors are Asynchronous imagers. Much like the human eye, they are designed to respond to changes in brightness, with no “Frames” to capture. With DVS, individual

Read More

18Mar

ADVANCED 1 GB 28 NM STT-MRAM PRODUCTS FROM EVERSPIN TECHNOLOGIES March 16, 2021 Dr. Jeongdong Choe Advanced 1 Gb 28 nm STT-MRAM products from Everspin Technologies We’ve been waiting for a long time to see the technology details of Everspin’s new stand-alone 1-Gigabit (Gb) Spin Torque Transfer Magneto-resistive

Read More

16Mar

A NEW AND ADVANCED RERAM FROM FUJITSU March 9, 2021 Dr. Jeongdong Choe A New and advanced ReRAM from Fujitsu We’ve been analyzing a new ReRAM product from Fujitsu Semiconductor. Fujitsu 8 Mb MB85AS8MT is the world’s largest density as a stand-alone mass-produced ReRAM product. The

Read More

11Mar

GAN USB-C CHARGER MARKET HEATING UP IN 2021 March 10, 2021 Sinjin Dixon-Warren Power Technology GaN USB-C Charger Market Heating Up in 2021 Gallium nitride (GaN) based high power USB chargers for smartphones, tablets and laptops is a growing area in the power electronics market. TechInsights

Read More

10Mar

PROSPECTS FOR COMMERCIAL HIGH VOLTAGE SILICON CARBIDE DEVICES - A

SUMMARY

March 03, 2021 Dr Peter Gammon Power Technology Prospects for Commercial High Voltage Silicon Carbide Devices - a Summary SiC power devices have the potential to reach voltage ratings beyond 30 kV, yet today, SiC chip manufacturers are focussed on

Read More

03Mar

WEBINAR: SELECTED IMAGER AND SENSOR TRENDS AND COMPARISONS March 3, 2021 Image Sensor Technology Webinar: Selected Imager and Sensor Trends and Comparisons Now on-demand! The intent of this webinar is to share selected content from our 2020 Image Sensor Device Essentials (DEF) subscription annual

Read More

03Mar

LIDAR 101 – SOLID-STATE AND MECHANICAL LIDARS February 19, 2021 Automotive Technology LiDAR 101 – Solid-State and Mechanical LiDARs 2020 has been an exciting year for LiDAR manufacturers. Five LiDAR companies (Velodyne Inc, Luminar Technologies Inc, Innoviz Technologies Ltd, Aeva Inc, and Ouster

Read More

19Feb

WEBINAR: GEARING UP FOR THE ELECTRIC VEHICLE (EV) REVOLUTION Presented by: Stephen Russell & TechInsights Power Subscription Gearing Up for the Electronic Vehicle (EV) Revolution State of the Art Power Devices The global drive towards green energy is accelerating. Ten years ago, electric vehicles (EVs) were a

Read More

03Feb

QUALCOMM SNAPDRAGON 888 IN THE XIAOMI MI 11 BRINGS A NEW 5 NM ENTRANT

TO MARKET

February 03, 2021 Logic Disruptive Technology Download the brief Qualcomm Snapdragon 888 in the Xiaomi Mi 11 brings a new 5 nm entrant to market With their release of the Snapdragon 888, Qualcomm finds itself in competition with other 5 nm offerings

Read More

03Feb

SUPPORTING IP STRATEGY IN THE SEMICONDUCTOR INDUSTRY Supporting IP strategy in the semiconductor industry Growing complexity of the chip market has made it harder than ever for intellectual property owners to monitor developments, making reverse engineering a crucial process The breadth of reverse

Read More

27Jan

SONY D-TOF SENSOR FOUND IN APPLE’S NEW LIDAR CAMERA January 19, 2021 Image Sensor Disruptive Technology Sony d-ToF Sensor found in Apple’s new LiDAR camera Apple’s LiDAR camera was first observed in 2020’s iPad Pro; as expected, we saw that same part used in the iPhone 12 Pro in October. Industry

Read More

19Jan

WEBINAR: INCREASING VALUE OF SEMICONDUCTOR IP IN THE AUTOMOTIVE SUPPLY

CHAIN

Increasing Value of Semiconductor IP in the Automotive Supply Chain Today, automobiles are more than just transportation devices. Automobiles are hotspots with entertainment systems, state of the art communications capabilities, and cutting edge

Read More

17Dec

TEARDOWN: VELODYNE LIDAR PUCK VLP-16 SENSOR (ELECTRONICS360) A deep dive into the major components used in the light detection and ranging technology. Posted in Electronics360.

Read More

14Dec

WEBINAR: EMERGING GAN TECHNOLOGY IN USB-C POWER DELIVERY ADAPTERS Emerging GaN Technology in USB-C Power Delivery Adapters This event was presented by Sinjin Dixon-Warren & TechInsights Power adapters with a USB connection are ubiquitous in modern life. The wonderful mobile devices we use require regular connection

Read More

09Dec

3D FLASH MEMORY, 176 LAYERS! So far, NAND Flash has shown a white-hot stage. Not long ago, storage vendors were still "seeing the scenery on the high platform of flash memory" with 128 layers.

Read More

09Dec

WEBINAR: MEMORY TECHNOLOGY 2020 AND BEYOND - NAND, DRAM, EMERGING AND EMBEDDED MEMORY TECHNOLOGY TRENDS Memory Technology 2020 and Beyond NAND, DRAM, Emerging and Embedded Memory Technology Trends This webinar was presented by TechInsights In this webinar, Dr. Jeongdong Choe will present his detailed review of the latest NAND, DRAM, emerging and

Read More

02Dec

WEBINAR: AN EXAMINATION OF THE TECHNICAL AND FINANCIAL IMPLICATIONS OF

THE APPLE IPHONE 12

An Examination of the Technical and Financial Implications of the Apple iPhone 12 This webinar was presented by TechInsights Join TechInsights and Bloomberg Intelligence Analysts as they share their technical and financial insights on Apple’s most

Read More

10Nov

MICRO LOADING AND ITS IMPACT ON DEVICE PERFORMANCE How SEMulator3D can be used to study micro loading and manufacturing variability in an advanced DRAM process that exhibits a wiggling AA

profile.

Read More

02Nov

WEBINAR: ALD/ALE PROCESS IN COMMERCIALLY AVAILABLE MEMORY DEVICES ALD/ALE Process in Commercially Available Memory Devices 2018 saw memory product manufacturers Samsung, Hynix, Toshiba and Micron introducing 64- or 72- stacked layer 3D-NAND devices, and move into 1x generation DRAM devices. This presentation will

Read More

28Oct

IPHONE CAMERA HISTORY: IPHONE 12'S ALTERNATIVE AND NORMAL The evolutionary history of the iPhone camera can also be seen as the history of the development of the phone CIS, even if the iPhone does not fully follow the CIS technology trends to advance. Just take this opportunity, but also through the last

Read More

21Oct

WEBINAR: SPACE, POWER, BEAMS – SHORTEN THE TREK TO GAIN THE EDGE IN 5G TRANSCEIVER DESIGN AND MANUFACTURING Space, Power, BEAMs Shorten the trek to gain the edge in 5G transceiver design and manufacturing The Mobile RF landscape has become more competitive with the introduction of 5G, complemented by relevant innovation aimed at addressing varying

Read More

23Sep

SK HYNIX 128L 3D PUC NAND (4D NAND) SK hynix has released the world’s first 128-layer (128L) 3D NAND, which they have termed 4D NAND. This is their second NAND generation built using Periphery Under Cell (PUC) architecture; the first was their 96L NAND. In PUC architecture, peripheral

Read More

14Sep

WEBINAR: ALD/ALE PROCESS IN COMMERCIALLY AVAILABLE LOGIC DEVICES ALD/ALE Process in Commercially Available Logic Devices 2018 saw the introduction of a new generation of logic products featuring finFET transistors headlined by Intel with their 10 nm generation microprocessor, followed by TSMC and Samsung towards

Read More

26Aug

60 YEARS OF THE SEMICONDUCTOR INDUSTRY AND ITS CHANGING PATENT

STRATEGY

Contributed by: Arabinda Das Today the semiconductor industry is a behemoth whose annual sales revenue crosses US $400 Billion. Over its 60 years of existence, this mature industry has experimented with various models like integrated device

Read More

04Aug

APPLE IPHONE 11 PRO TEARDOWNS LOOK ENCOURAGING FOR STMICRO AND SONY STMicroelectronics and Sony each appear to be supplying four chips for Apple's latest flagship iPhones. Many other historical iPhone suppliers also make appearances in the latest teardowns.

Read More

26Sep

TESLA POISED TO APPLY MAXWELL’S DRY ELECTRODE INNOVATION TO BATTERY

CELL FABRICATION

Posted: February 7, 2019 Contributing Authors: Marty Bijman and Jim Hines Figure 1 – Tesla's portfolio including Maxwell and SolarCity acquisitions Figure 2 – Tesla Portfolio landscapes showing which inventions originated from Tesla, SolarCity, and

Read More

07Feb

CREATING BETTER APPLICATIONS THROUGH PATENT STRENGTHENING Patent strengthening is the term we use to refer to the process of achieving the greatest potential for value from a patent during the prosecution – before a patent is even granted.

Read More

20Jun

WHAT DOES UBER’S PATENT LANDSCAPE LOOK LIKE? Posted: February 27, 2018 Contributing Authors: Marty Bijman Recently, IAM’s Timothy Au posted a blog providing a look at Uber’s portfolio. The blog references Uber’s portfolio makeup, and provides a chronicle of their IP events over the last 5 years

Read More

27Feb

COVID-19

We have been closely monitoring the progress of COVID-19 in recent weeks, regularly updating our travel and operations policies to include increasingly strict restrictions we have chosen to implement. Our priority is ensuring the continued health and

Read More

04MarPreviousNext

TechInsights

Revealing the innovations others cannot inside advanced technology products More ways to find us:   Call 1-877-826-4447 , subscribe , or contact us

.

FOOTER MENU 2

* ">Home

* Technical Capabilities * Access Our Reverse Engineering

* IP Services

* About

FOOTER MENU 3

* Careers

* Contact Us

Copyright © 2021 TechInsights Inc. All rights reserved.

FOOTER MENU

* Accessibility

* Privacy Policy

* Conflict of Interest and Confidential Information

* Contact