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MICRON GIVES
Micron’s culture of giving spotlighted in 2020. With the unprecedented challenges of 2020, Dee Mooney, Micron Foundation Director, discusses how the Foundation accomplished the following: The Micron Foundation more than doubled giving, distributing nearly $24 million to charitable organizations worldwide, including $10 millionto COVID-19
COVID-19 PLAYBOOK
All these questions and more are answered in the recently published Micron COVID-19 Playbook, our guide to on-site work. We’re taking a phased approach in bringing team members back to on-site work through our workplace and team member readiness plans. SOFTWARE AND DRIVERS Storage Executive Software for Windows Systems. Storage Executive Software (EXE) – 4.19.2021. Storage Executive is a Graphical User Interface (GUI) for managing and supporting Micron SSDs. Windows 64-bit Storage Executive version 7.01.012021.03. Download.TOOLS AND UTILITIES
Technology Leadership. Backed by world-class manufacturing, Micron is pioneering the world's most advanced 1-alpha (1α) DRAM and 176-layer 3D NAND technologies, enabling businesses around the globe to turn data into insight to gain a competitive edge.INTERNSHIPS
To be eligible for an internship you must be pursuing a degree (Bachelor’s, Master’s or Ph.D.) at an accredited university aligned with the position you are applying to. You will also need to meet the required availability for the position. For example, most summer internships are MT25QU02GCBB8E12-0SIT MT25Q, 2Gb, 1.8V Multiple I/O Serial Flash Memory Data Sheet. MT25Q is a high-performance multiple input/output, 2Gb, 1.8V, SPI Flash memory device; MT25QU02GCBB. File Type: PDF. AUTHORIZED DISTRIBUTORS Technology Leadership. Backed by world-class manufacturing, Micron is pioneering the world's most advanced 1-alpha (1α) DRAM and 176-layer 3D NAND technologies, enabling businesses around the globe to turn data into insight to gain a competitive edge.MT41J256M8DA-125
TN-00-08: Thermal Applications. This document describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics. File Type: PDF. Updated: 2020-03-25. MT25QL01GBBB8E12-0SIT MT25Q, 1Gb, 3V Multiple I/O Serial Flash Memory Data Sheet. MT25Q is a high-performance multiple input/output, 1Gb, 3V, SPI Flash memory device; MT25QL01GBBB. File Type: PDF. Updated: 2018-07-17. Download. MICRON TECHNOLOGY, INC.PRODUCTSSOLUTIONSSUPPORTINSIGHTABOUT5G Micron innovation and your inspiration are shaping tomorrow's products, industries, and the world. Change the world. Join our team. Our memory needs your mind. At Micron, we're looking for visionaries, scientists, leaders, and believers to help us develop technologies that will transform our world. Join us.MICRON GIVES
Micron’s culture of giving spotlighted in 2020. With the unprecedented challenges of 2020, Dee Mooney, Micron Foundation Director, discusses how the Foundation accomplished the following: The Micron Foundation more than doubled giving, distributing nearly $24 million to charitable organizations worldwide, including $10 millionto COVID-19
COVID-19 PLAYBOOK
All these questions and more are answered in the recently published Micron COVID-19 Playbook, our guide to on-site work. We’re taking a phased approach in bringing team members back to on-site work through our workplace and team member readiness plans. SOFTWARE AND DRIVERS Storage Executive Software for Windows Systems. Storage Executive Software (EXE) – 4.19.2021. Storage Executive is a Graphical User Interface (GUI) for managing and supporting Micron SSDs. Windows 64-bit Storage Executive version 7.01.012021.03. Download.TOOLS AND UTILITIES
Technology Leadership. Backed by world-class manufacturing, Micron is pioneering the world's most advanced 1-alpha (1α) DRAM and 176-layer 3D NAND technologies, enabling businesses around the globe to turn data into insight to gain a competitive edge.INTERNSHIPS
To be eligible for an internship you must be pursuing a degree (Bachelor’s, Master’s or Ph.D.) at an accredited university aligned with the position you are applying to. You will also need to meet the required availability for the position. For example, most summer internships are MT25QU02GCBB8E12-0SIT MT25Q, 2Gb, 1.8V Multiple I/O Serial Flash Memory Data Sheet. MT25Q is a high-performance multiple input/output, 2Gb, 1.8V, SPI Flash memory device; MT25QU02GCBB. File Type: PDF. AUTHORIZED DISTRIBUTORS Technology Leadership. Backed by world-class manufacturing, Micron is pioneering the world's most advanced 1-alpha (1α) DRAM and 176-layer 3D NAND technologies, enabling businesses around the globe to turn data into insight to gain a competitive edge.MT41J256M8DA-125
TN-00-08: Thermal Applications. This document describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics. File Type: PDF. Updated: 2020-03-25. MT25QL01GBBB8E12-0SIT MT25Q, 1Gb, 3V Multiple I/O Serial Flash Memory Data Sheet. MT25Q is a high-performance multiple input/output, 1Gb, 3V, SPI Flash memory device; MT25QL01GBBB. File Type: PDF. Updated: 2018-07-17. Download. SOFTWARE AND DRIVERS Storage Executive Software for Windows Systems. Storage Executive Software (EXE) – 4.19.2021. Storage Executive is a Graphical User Interface (GUI) for managing and supporting Micron SSDs. Windows 64-bit Storage Executive version 7.01.012021.03. Download. CONSUMER - MICRON.COM Virtual reality glasses, smart watches, 4K TVs and smart speakers are some of the innovative products that are captivating consumer interest and expanding the realm of what’s possible. Micron’s consumer solutions help these devices connect, store and share — quickly andsecurely.
TOOLS AND UTILITIES
Technology Leadership. Backed by world-class manufacturing, Micron is pioneering the world's most advanced 1-alpha (1α) DRAM and 176-layer 3D NAND technologies, enabling businesses around the globe to turn data into insight to gain a competitive edge. 1ALPHA DRAM TECHNOLOGY Technology Leadership. Backed by world-class manufacturing, Micron is pioneering the world's most advanced 1-alpha (1α) DRAM and 176-layer 3D NAND technologies, enabling businesses around the globe to turn data into insight to gain a competitive edge. AUTHORIZED DISTRIBUTORS Technology Leadership. Backed by world-class manufacturing, Micron is pioneering the world's most advanced 1-alpha (1α) DRAM and 176-layer 3D NAND technologies, enabling businesses around the globe to turn data into insight to gain a competitive edge.9200 - MICRON.COM
Access complex, varied data sooner with high-performance, high-capacity Micron 9200 SSD with NVMe™ SSD to protect your data against ever-growing threats with federal security solutions. MLC NAND - MICRON.COM Multilevel cell (MLC) is the most popular NAND Flash, providing the right combination of price and performance for a wide range of cost-sensitive, high-density applications. FBGA AND COMPONENT MARKING DECODER FBGA and Component Marking Decoder. Due to space limitations, FBGA-packaged components have an abbreviated part marking that is different from the part number. Micron's FBGA Part Marking Decoder makes it easier to understand that part marking. Simply enter the five-digit code in the FBGA Code field and click "Search" to get thefull part number.
MICRON ECOSYSTEM PARTNER PROGRAMS The Channel Partner MVP program is designed for e-tailers, retailers, resellers and distributors that sell memory and storage products to businesses, government agencies and consumers. Through this program, you’ll gain access to our full range of Micron and Crucial memory and storage solutions, along with the training, support and marketing MT35XU512ABA1G12-0AAT This technical note discusses how a single 24-ball BGA package (6 x 8 mm) can support a variety of flash products, enabling designers to offer a range of densities, features and performance levels simply by replacing the installed flash device. File Type: PDF. Updated: 2018-09-17. Download. MICRON TECHNOLOGY, INC. Micron innovation and your inspiration are shaping tomorrow's products, industries, and the world. Change the world. Join our team. Our memory needs your mind. At Micron, we're looking for visionaries, scientists, leaders, and believers to help us develop technologies that will transform our world. Join us.MICRON GIVES
Micron’s culture of giving spotlighted in 2020. With the unprecedented challenges of 2020, Dee Mooney, Micron Foundation Director, discusses how the Foundation accomplished the following: The Micron Foundation more than doubled giving, distributing nearly $24 million to charitable organizations worldwide, including $10 millionto COVID-19
COVID-19 PLAYBOOK
All these questions and more are answered in the recently published Micron COVID-19 Playbook, our guide to on-site work. We’re taking a phased approach in bringing team members back to on-site work through our workplace and team member readiness plans. SOFTWARE AND DRIVERS Storage Executive Software for Windows Systems. Storage Executive Software (EXE) – 4.19.2021. Storage Executive is a Graphical User Interface (GUI) for managing and supporting Micron SSDs. Windows 64-bit Storage Executive version 7.01.012021.03. Download. STORAGE EXECUTIVE SOFTWARE Storage Executive Software for Windows Systems. Storage Executive Software (EXE) – 4.19.2021. Storage Executive is a Graphical User Interface (GUI) for managing and supporting Micron SSDs. Windows 64-bit Storage Executive version 7.01.012021.03. Download. MT25QU256ABA8ESF-0SIT TN-00-08: Thermal Applications. This document describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics. File Type: PDF. Updated: 2020-03-25.MTFC8GACAEDQ-AAT
TN-00-08: Thermal Applications. This document describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics. File Type: PDF. Updated: 2020-03-25. MT35XU512ABA1G12-0AAT This technical note discusses how a single 24-ball BGA package (6 x 8 mm) can support a variety of flash products, enabling designers to offer a range of densities, features and performance levels simply by replacing the installed flash device. File Type: PDF. Updated: 2018-09-17. Download.MT40A512M16TB-062E
TN-00-08: Thermal Applications. This document describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics. File Type: PDF. Updated: 2020-03-25.MTA36ASF8G72PZ-3G2
Technology Leadership. Backed by world-class manufacturing, Micron is pioneering the world's most advanced 1-alpha (1α) DRAM and 176-layer 3D NAND technologies, enabling businesses around the globe to turn data into insight to gain a competitive edge. MICRON TECHNOLOGY, INC. Micron innovation and your inspiration are shaping tomorrow's products, industries, and the world. Change the world. Join our team. Our memory needs your mind. At Micron, we're looking for visionaries, scientists, leaders, and believers to help us develop technologies that will transform our world. Join us.MICRON GIVES
Micron’s culture of giving spotlighted in 2020. With the unprecedented challenges of 2020, Dee Mooney, Micron Foundation Director, discusses how the Foundation accomplished the following: The Micron Foundation more than doubled giving, distributing nearly $24 million to charitable organizations worldwide, including $10 millionto COVID-19
COVID-19 PLAYBOOK
All these questions and more are answered in the recently published Micron COVID-19 Playbook, our guide to on-site work. We’re taking a phased approach in bringing team members back to on-site work through our workplace and team member readiness plans. SOFTWARE AND DRIVERS Storage Executive Software for Windows Systems. Storage Executive Software (EXE) – 4.19.2021. Storage Executive is a Graphical User Interface (GUI) for managing and supporting Micron SSDs. Windows 64-bit Storage Executive version 7.01.012021.03. Download. STORAGE EXECUTIVE SOFTWARE Storage Executive Software for Windows Systems. Storage Executive Software (EXE) – 4.19.2021. Storage Executive is a Graphical User Interface (GUI) for managing and supporting Micron SSDs. Windows 64-bit Storage Executive version 7.01.012021.03. Download. MT25QU256ABA8ESF-0SIT TN-00-08: Thermal Applications. This document describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics. File Type: PDF. Updated: 2020-03-25.MTFC8GACAEDQ-AAT
TN-00-08: Thermal Applications. This document describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics. File Type: PDF. Updated: 2020-03-25. MT35XU512ABA1G12-0AAT This technical note discusses how a single 24-ball BGA package (6 x 8 mm) can support a variety of flash products, enabling designers to offer a range of densities, features and performance levels simply by replacing the installed flash device. File Type: PDF. Updated: 2018-09-17. Download.MT40A512M16TB-062E
TN-00-08: Thermal Applications. This document describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics. File Type: PDF. Updated: 2020-03-25.MTA36ASF8G72PZ-3G2
Technology Leadership. Backed by world-class manufacturing, Micron is pioneering the world's most advanced 1-alpha (1α) DRAM and 176-layer 3D NAND technologies, enabling businesses around the globe to turn data into insight to gain a competitive edge. SOFTWARE AND DRIVERS Storage Executive Software for Windows Systems. Storage Executive Software (EXE) – 4.19.2021. Storage Executive is a Graphical User Interface (GUI) for managing and supporting Micron SSDs. Windows 64-bit Storage Executive version 7.01.012021.03. Download. STORAGE EXECUTIVE SOFTWARE Storage Executive Software for Windows Systems. Storage Executive Software (EXE) – 4.19.2021. Storage Executive is a Graphical User Interface (GUI) for managing and supporting Micron SSDs. Windows 64-bit Storage Executive version 7.01.012021.03. Download. 1ALPHA DRAM TECHNOLOGY Technology Leadership. Backed by world-class manufacturing, Micron is pioneering the world's most advanced 1-alpha (1α) DRAM and 176-layer 3D NAND technologies, enabling businesses around the globe to turn data into insight to gain a competitive edge. CONSUMER - MICRON.COM Virtual reality glasses, smart watches, 4K TVs and smart speakers are some of the innovative products that are captivating consumer interest and expanding the realm of what’s possible. Micron’s consumer solutions help these devices connect, store and share — quickly andsecurely.
GDDR6X - MICRON
Memory Reimagined. Choose the innovative PAM4 signaling technology in Micron’s GDDR6X memory to double your data rate, delivering unprecedented graphics memory performance to feed the most data-hungry workloads. Get the world’s fastest discrete memory for your gaming, professional visualization and AI workloads. AUTHORIZED DISTRIBUTORS Technology Leadership. Backed by world-class manufacturing, Micron is pioneering the world's most advanced 1-alpha (1α) DRAM and 176-layer 3D NAND technologies, enabling businesses around the globe to turn data into insight to gain a competitive edge.9200 - MICRON.COM
Access complex, varied data sooner with high-performance, high-capacity Micron 9200 SSD with NVMe™ SSD to protect your data against ever-growing threats with federal security solutions. MLC NAND - MICRON.COM Multilevel cell (MLC) is the most popular NAND Flash, providing the right combination of price and performance for a wide range of cost-sensitive, high-density applications.M29W320DB70N3F
Technology Leadership. Backed by world-class manufacturing, Micron is pioneering the world's most advanced 1-alpha (1α) DRAM and 176-layer 3D NAND technologies, enabling businesses around the globe to turn data into insight to gain a competitive edge.PC28F512M29EWLA
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MTFC128GAPALBH-AAT
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128GB
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TFBGA
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2.7V-3.6V
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5.1
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-40C to +105C
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153-ball
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13x11.5x1.1
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MTFC128GAPALBH-AIT
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128GB
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WFBGA
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2.7V-3.6V
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5.1
Op. Temp.
-40C to +85C
Pin Count
153-ball
Package Size
13x11.5x1.1
Applications
Automotive
Width
x8View details
MTFC128GAPALNA-AAT
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128GB
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Production
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TBGA
Voltage
2.7V-3.6V
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5.1
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-40C to +105C
Pin Count
100-ball
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MTFC128GAPALNA-AIT
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128GB
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Production
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TBGA
Voltage
2.7V-3.6V
MMC Interface
5.1
Op. Temp.
-40C to +85C
Pin Count
100-ball
Package Size
18x14x1.2
Applications
Automotive
Width
x8View details
MTFC128GAPALNS-AAT
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Density
128GB
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Production
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TFBGA
Voltage
2.7V-3.6V
MMC Interface
5.1
Op. Temp.
-40C to +105C
Pin Count
153-ball
Package Size
13x11.5x1.2
Applications
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x8View details
MTFC128GAPALNS-AIT
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Density
128GB
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Production
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TFBGA
Voltage
2.7V-3.6V
MMC Interface
5.1
Op. Temp.
-40C to +85C
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153-ball
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13x11.5x1.2
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x8View details
MTFC128GAPALPH-AAT
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Density
128GB
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Production
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TBGA
Voltage
2.7V-3.6V
MMC Interface
5.1
Op. Temp.
-40C to +105C
Pin Count
100-ball
Package Size
18x14x1.2
Applications
Automotive
Width
x8View details
MTFC128GAPALPH-AIT
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Density
128GB
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Production
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TBGA
Voltage
2.7V-3.6V
MMC Interface
5.1
Op. Temp.
-40C to +85C
Pin Count
100-ball
Package Size
18x14x1.2
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Automotive
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x8View details
MTFC16GAKAEDQ-AAT
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16GB
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Production
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LBGA
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5.0
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-40C to +105C
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100-ball
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14 x 18 x 1.4
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MTFC16GAKAEEF-AAT
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16GB
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-40C to +105C
Pin Count
169-ball
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14 x 18 x 1.2
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x8View details
MTFC16GAKAEEF-AIT
__
Density
16GB
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Production
Package
TFBGA
Voltage
3.3V
MMC Interface
5.0
Op. Temp.
-40C to +85C
Pin Count
169-ball
Package Size
14 x 18 x 1.2
Applications
Automotive
Width
x8View details
MTFC16GAPALBH-AAT
__
Density
16GB
Part Status
Production
Package
TFBGA
Voltage
2.7V-3.6V
MMC Interface
5.1
Op. Temp.
-40C to +105C
Pin Count
153-ball
Package Size
13x11.5x1.1
Applications
Automotive
Width
x8View details
MTFC16GAPALBH-AIT
__
Density
16GB
Part Status
Production
Package
TFBGA
Voltage
2.7V-3.6V
MMC Interface
5.1
Op. Temp.
-40C to +85C
Pin Count
153-ball
Package Size
13x11.5x1.1
Applications
Automotive
Width
x8View details
MTFC16GAPALGT-AAT
__
Density
16GB
Part Status
Production
Package
WFBGA
Voltage
2.7V-3.6V
MMC Interface
5.1
Op. Temp.
-40C to +105C
Pin Count
153-ball
Package Size
13x11.5x0.8
Applications
Automotive
Width
x8View details
MTFC16GAPALGT-AIT
__
Density
16GB
Part Status
Production
Package
WFBGA
Voltage
2.7V-3.6V
MMC Interface
5.1
Op. Temp.
-40C to +85C
Pin Count
153-ball
Package Size
13x11.5x0.8
Applications
Automotive
Width
x8View details
MTFC16GAPALGT-S1 AAT__
Density
16GB
Part Status
Sampling
Package
WFBGA
Voltage
2.7V-3.6V
MMC Interface
5.1
Op. Temp.
-40C to +105C
Pin Count
153-ball
Package Size
11.5 x 13 x .8
Applications
Automotive
Width
x11.5View details
MTFC16GAPALHT-AAT
__
Density
16GB
Part Status
Production
Package
VBGA
Voltage
2.7V-3.6V
MMC Interface
5.1
Op. Temp.
-40C to +105C
Pin Count
100-ball
Package Size
18x14x1
Applications
Automotive
Width
x8View details
MTFC16GAPALHT-AIT
__
Density
16GB
Part Status
Production
Package
VBGA
Voltage
2.7V-3.6V
MMC Interface
5.1
Op. Temp.
-40C to +85C
Pin Count
100-ball
Package Size
18x14x1
Applications
Automotive
Width
x8View details
MTFC16GAPALNA-AAT
__
Density
16GB
Part Status
Production
Package
TBGA
Voltage
2.7V-3.6V
MMC Interface
5.1
Op. Temp.
-40C to +105C
Pin Count
100-ball
Package Size
18x14x1.2
Applications
Automotive
Width
x8View details
MTFC16GAPALNA-AIT
__
Density
16GB
Part Status
Production
Package
TBGA
Voltage
2.7V-3.6V
MMC Interface
5.1
Op. Temp.
-40C to +85C
Pin Count
100-ball
Package Size
18x14x1.2
Applications
Automotive
Width
x8View details
MTFC32GAKAEDQ-AAT
__
Density
32GB
Part Status
Production
Package
LBGA
Voltage
System.Object
MMC Interface
5.0
Op. Temp.
-40C to +105C
Pin Count
100-ball
Package Size
14 x 18 x 1.4
Applications
Automotive
Width
x8View details
MTFC32GAKAEDQ-AIT
__
Density
32GB
Part Status
Production
Package
LFBGA
Voltage
3.3V
MMC Interface
5.0
Op. Temp.
-40C to +85C
Pin Count
100-ball
Package Size
14 x 18 x 1.4
Applications
Automotive
Width
x8View details
MTFC32GAKAEEF-AAT
__
Density
32GB
Part Status
Production
Package
TFBGA
Voltage
System.Object
MMC Interface
5.0
Op. Temp.
-40C to +105C
Pin Count
169-ball
Package Size
14 x 18 x 1.2
Applications
Automotive
Width
x8View details
MTFC32GAKAEEF-AIT
__
Density
32GB
Part Status
Production
Package
TFBGA
Voltage
3.3V
MMC Interface
5.0
Op. Temp.
-40C to +85C
Pin Count
169-ball
Package Size
14 x 18 x 1.2
Applications
Automotive
Width
x8View details
MTFC32GAPALBH-AAT
__
Density
32GB
Part Status
Production
Package
TFBGA
Voltage
2.7V-3.6V
MMC Interface
5.1
Op. Temp.
-40C to +105C
Pin Count
153-ball
Package Size
13x11.5x1.1
Applications
Automotive
Width
x8View details
MTFC32GAPALBH-AIT
__
Density
32GB
Part Status
Production
Package
TFBGA
Voltage
2.7V-3.6V
MMC Interface
5.1
Op. Temp.
-40C to +85C
Pin Count
153-ball
Package Size
13x11.5x1.1
Applications
Automotive
Width
x8View details
MTFC32GAPALGT-AAT
__
Density
32GB
Part Status
Production
Package
WFBGA
Voltage
2.7V-3.6V
MMC Interface
5.1
Op. Temp.
-40C to +105C
Pin Count
153-ball
Package Size
13x11.5x0.8
Applications
Automotive
Width
x8View details
MTFC32GAPALGT-AIT
__
Density
32GB
Part Status
Production
Package
WFBGA
Voltage
2.7V-3.6V
MMC Interface
5.1
Op. Temp.
-40C to +85C
Pin Count
153-ball
Package Size
13x11.5x0.8
Applications
Automotive
Width
x8View details
MTFC32GAPALGT-S1 AAT__
Density
32GB
Part Status
Sampling
Package
WFBGA
Voltage
2.7V-3.6V
MMC Interface
5.1
Op. Temp.
-40C to +105C
Pin Count
153-ball
Package Size
11.5 x 13 x .8
Applications
Automotive
Width
x11.5View details
MTFC32GAPALHT-AAT
__
Density
32GB
Part Status
Production
Package
VBGA
Voltage
2.7V-3.6V
MMC Interface
5.1
Op. Temp.
-40C to +105C
Pin Count
100-ball
Package Size
18x14x1
Applications
Automotive
Width
x8View details
MTFC32GAPALHT-AIT
__
Density
32GB
Part Status
Production
Package
VBGA
Voltage
2.7V-3.6V
MMC Interface
5.1
Op. Temp.
-40C to +85C
Pin Count
100-ball
Package Size
18x14x1
Applications
Automotive
Width
x8View details
MTFC32GAPALNA-AAT
__
Density
32GB
Part Status
Production
Package
TBGA
Voltage
2.7V-3.6V
MMC Interface
5.1
Op. Temp.
-40C to +105C
Pin Count
100-ball
Package Size
18x14x1.2
Applications
Automotive
Width
x8View details
MTFC32GAPALNA-AIT
__
Density
32GB
Part Status
Production
Package
TBGA
Voltage
2.7V-3.6V
MMC Interface
5.1
Op. Temp.
-40C to +85C
Pin Count
100-ball
Package Size
18x14x1.2
Applications
Automotive
Width
x8View details
MTFC64GAJAEDQ-AAT
__
Density
64GB
Part Status
Production
Package
LBGA
Voltage
System.Object
MMC Interface
Op. Temp.
-40C to +105C
Pin Count
100-ball
Package Size
Applications
Automotive
Width
x8View details
MTFC64GAJAEDQ-AIT
__
Density
64GB
Part Status
Production
Package
LFBGA
Voltage
3.3V
MMC Interface
5.0
Op. Temp.
-40C to +85C
Pin Count
100-ball
Package Size
Applications
Automotive
Width
x8View details
MTFC64GAPALBH-AAT
__
Density
64GB
Part Status
Production
Package
TFBGA
Voltage
2.7V-3.6V
MMC Interface
5.1
Op. Temp.
-40C to +105C
Pin Count
153-ball
Package Size
13x11.5x1.1
Applications
Automotive
Width
x8View details
MTFC64GAPALBH-AIT
__
Density
64GB
Part Status
Production
Package
TFBGA
Voltage
2.7V-3.6V
MMC Interface
5.1
Op. Temp.
-40C to +85C
Pin Count
153-ball
Package Size
13x11.5x1.1
Applications
Automotive
Width
x8View details
MTFC64GAPALGT-AAT
__
Density
64GB
Part Status
Production
Package
WFBGA
Voltage
2.7V-3.6V
MMC Interface
5.1
Op. Temp.
-40C to +105C
Pin Count
153-ball
Package Size
13x11.5x0.8
Applications
Automotive
Width
x8View details
MTFC64GAPALGT-AIT
__
Density
64GB
Part Status
Production
Package
WFBGA
Voltage
2.7V-3.6V
MMC Interface
5.1
Op. Temp.
-40C to +85C
Pin Count
153-ball
Package Size
13x11.5x0.8
Applications
Automotive
Width
x8View details
MTFC64GAPALHT-AAT
__
Density
64GB
Part Status
Production
Package
VBGA
Voltage
2.7V-3.6V
MMC Interface
5.1
Op. Temp.
-40C to +105C
Pin Count
100-ball
Package Size
18x14x1
Applications
Automotive
Width
x8View details
MTFC64GAPALHT-AIT
__
Density
64GB
Part Status
Production
Package
VBGA
Voltage
2.7V-3.6V
MMC Interface
5.1
Op. Temp.
-40C to +85C
Pin Count
100-ball
Package Size
18x14x1
Applications
Automotive
Width
x8View details
MTFC64GAPALNA-AAT
__
Density
64GB
Part Status
Production
Package
TBGA
Voltage
2.7V-3.6V
MMC Interface
5.1
Op. Temp.
-40C to +105C
Pin Count
100-ball
Package Size
18x14x1.2
Applications
Automotive
Width
x8View details
MTFC64GAPALNA-AIT
__
Density
64GB
Part Status
Production
Package
TBGA
Voltage
2.7V-3.6V
MMC Interface
5.1
Op. Temp.
-40C to +85C
Pin Count
100-ball
Package Size
18x14x1.2
Applications
Automotive
Width
x8View details
MTFC8GACAEDQ-AAT
__
Density
8GB
Part Status
Production
Package
LBGA
Voltage
System.Object
MMC Interface
5.0
Op. Temp.
-40C to +105C
Pin Count
100-ball
Package Size
14 x 18 x 1.4
Applications
Automotive
Width
x8View details
MTFC8GACAEDQ-K1
__
Density
8GB
Part Status
Production
Package
LFBGA
Voltage
2.7V-3.6V
MMC Interface
5.0
Op. Temp.
-40C to +85C
Pin Count
100-ball
Package Size
14 x 18 x 1.4
Applications
Automotive
Width
x8View details
MTFC8GACAENS-AAT
__
Density
8GB
Part Status
Production
Package
TFBGA
Voltage
System.Object
MMC Interface
5.0
Op. Temp.
-40C to +105C
Pin Count
153-ball
Package Size
11.5 x 13 x 1.2
Applications
Automotive
Width
x8View details
MTFC8GAMALBH-AAT
__
Density
8GB
Part Status
Production
Package
TFBGA
Voltage
2.7V-3.6V
MMC Interface
5.1
Op. Temp.
-40C to +105C
Pin Count
153-ball
Package Size
13x11.5x1.1
Applications
Automotive
Width
x8View details
MTFC8GAMALBH-AIT
__
Density
8GB
Part Status
Production
Package
TFBGA
Voltage
2.7V-3.6V
MMC Interface
5.1
Op. Temp.
-40C to +85C
Pin Count
153-ball
Package Size
13x11.5x1.1
Applications
Automotive
Width
x8View details
MTFC8GAMALGT-AAT
__
Density
8GB
Part Status
Production
Package
WFBGA
Voltage
2.7V-3.6V
MMC Interface
5.1
Op. Temp.
-40C to +105C
Pin Count
153-ball
Package Size
13x11.5x0.8
Applications
Automotive
Width
x8View details
MTFC8GAMALGT-AIT
__
Density
8GB
Part Status
Production
Package
WFBGA
Voltage
2.7V-3.6V
MMC Interface
5.1
Op. Temp.
-40C to +85C
Pin Count
153-ball
Package Size
13x11.5x0.8
Applications
Automotive
Width
x8View details
MTFC8GAMALHT-AAT
__
Density
8GB
Part Status
Production
Package
VBGA
Voltage
2.7V-3.6V
MMC Interface
5.1
Op. Temp.
-40C to +105C
Pin Count
153-ball
Package Size
18x14x1
Applications
Automotive
Width
x8View details
MTFC8GAMALHT-AIT
__
Density
8GB
Part Status
Production
Package
VBGA
Voltage
2.7V-3.6V
MMC Interface
5.1
Op. Temp.
-40C to +85C
Pin Count
153-ball
Package Size
18x14x1
Applications
Automotive
Width
x8View details
MTFC8GAMALNA-AAT
__
Density
8GB
Part Status
Production
Package
TBGA
Voltage
2.7V-3.6V
MMC Interface
5.1
Op. Temp.
-40C to +105C
Pin Count
100-ball
Package Size
18x14x1.2
Applications
Automotive
Width
x8View details
MTFC8GAMALNA-AIT
__
Density
8GB
Part Status
Production
Package
TBGA
Voltage
2.7V-3.6V
MMC Interface
5.1
Op. Temp.
-40C to +85C
Pin Count
100-ball
Package Size
18x14x1.2
Applications
Automotive
Width
x8View details
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