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PEI - LASER CUTTING, MARKING AND ENGRAVING PEI PEI (Polyetherimide) Overview. Polyetherimide (PEI), also known by Ultem®, is a high-performance thermoplastic with excellent mechanical, thermal, and electrical properties. Laser cutting and laser engraving of PEI are possible with a 9.3 micron or 10.6 micron CO 2 laser. Charring will occur with both laser wavelengths, althoughit will be
ULTRA R9000 PLATFORM Platform Overview. The ULTRA R9000 platform offers laser material processing for a wide range of materials. It is designed and ideally suited for material processing in manufacturing, research and development, academic research, and prototyping environments. With its unique modular architecture, customizable solutions can be easilyreconfigured
UNIVERSAL LASER SYSTEMS, INC Universal Laser Systems has been advancing the application of modern CO 2 laser technology since 1988. R&D efforts have resulted in numerous patents, with several pending, in our continual pursuit to develop and enhance laser systems that benefit the customer. Our R&D philosophy and execution is based upon designing highly modularplatforms
VLS6.75 PLATFORM
The VLS6.75 is a free-standing platform with a material processing envelope of 32" x 18" x 8.5" or 4,896 in³ (813 x 457 x 216 mm or 80,253 cm³). The single laser platform supports a 10.6µm CO 2 laser source ranging in power from 10 to 75 watts or one 9.3µm CO 2 30 watt, 50 watt, or 75 watt laser source. Download Brochure.VLS2.30DT PLATFORM
The VLS2.30DT Desktop is a compact and economical entry level platform. It offers a material processing envelope of 16" x 12" x 4" or 768 in³ (406 x 305 x 102 mm or 12,585 cm³) and can be equipped with one 10.6µm CO 2 laser source ranging in power from 10 to 30 watts or one 9.3µm CO 2 30 watt laser source. Download Brochure.ILS12.150D PLATFORM
The ILS12.150D is a free-standing platform with a materials processing envelope of 48" x 24" x 12" or 13,824 in³ (1219mm x 610mm x 305mm or 226,795 cm³). The dual laser platform supports a power range of 10 to 150 watts (up to 75 watts with one 10.6µm CO 2VLS3.60DT PLATFORM
The VLS3.60DT is a compact and economical entry level platform that offers a material processing envelope of 24" x 12" x 4" or 1,152 in³ (610 x 305 x 102 mm or 18,878 cm³). The VLS3.60DT can be equipped with one of five 10.6µm CO 2 laser sources ranging in power from 10 to 60 watts or one 9.3µm CO 2 30 watt or 50 watt laser source. LASER CUTTING, ENGRAVING & MARKING MACHINES AND EQUIPMENTCOMPANYTECHNOLOGYMATERIALSRESOURCESPURCHASESUPPORT Universal Laser Systems, Inc. (ULS) is a recognized global innovation leader in DLMP® (Digital Laser Material Processing) technology. For nearly 30 years, organizations worldwide in all types of environments have discovered and leveraged the benefits of our technology to help them achieve their goals. Learn how ULS can help you achieve yours. LASER ENGRAVING AND CUTTING MACHINES FROM UNIVERSAL LASER Laser Engraving, Cutting, and Marking with ULS Laser Systems. One of the most impressive capabilities of ULS laser systems (laser engraving machine, laser cutting machine, laser marking machine) is the capacity to execute two or three laser processes with the same system—whether laser engraving, laser cutting, and/or laser marking—which eliminates the need for multiple laser platforms. SOFTWARE DOWNLOADS FOR UNIVERSAL LASER SYSTEMS PLATFORMS Software Downloads. Download the driver (s) for your specific ULS system. All drivers are pertinent to a specific laser platform and will work for all laser cutting, laser marking, and laser engravingactivities.
PEI - LASER CUTTING, MARKING AND ENGRAVING PEI PEI (Polyetherimide) Overview. Polyetherimide (PEI), also known by Ultem®, is a high-performance thermoplastic with excellent mechanical, thermal, and electrical properties. Laser cutting and laser engraving of PEI are possible with a 9.3 micron or 10.6 micron CO 2 laser. Charring will occur with both laser wavelengths, althoughit will be
ULTRA R9000 PLATFORM Platform Overview. The ULTRA R9000 platform offers laser material processing for a wide range of materials. It is designed and ideally suited for material processing in manufacturing, research and development, academic research, and prototyping environments. With its unique modular architecture, customizable solutions can be easilyreconfigured
UNIVERSAL LASER SYSTEMS, INC Universal Laser Systems has been advancing the application of modern CO 2 laser technology since 1988. R&D efforts have resulted in numerous patents, with several pending, in our continual pursuit to develop and enhance laser systems that benefit the customer. Our R&D philosophy and execution is based upon designing highly modularplatforms
VLS6.75 PLATFORM
The VLS6.75 is a free-standing platform with a material processing envelope of 32" x 18" x 8.5" or 4,896 in³ (813 x 457 x 216 mm or 80,253 cm³). The single laser platform supports a 10.6µm CO 2 laser source ranging in power from 10 to 75 watts or one 9.3µm CO 2 30 watt, 50 watt, or 75 watt laser source. Download Brochure.VLS2.30DT PLATFORM
The VLS2.30DT Desktop is a compact and economical entry level platform. It offers a material processing envelope of 16" x 12" x 4" or 768 in³ (406 x 305 x 102 mm or 12,585 cm³) and can be equipped with one 10.6µm CO 2 laser source ranging in power from 10 to 30 watts or one 9.3µm CO 2 30 watt laser source. Download Brochure.ILS12.150D PLATFORM
The ILS12.150D is a free-standing platform with a materials processing envelope of 48" x 24" x 12" or 13,824 in³ (1219mm x 610mm x 305mm or 226,795 cm³). The dual laser platform supports a power range of 10 to 150 watts (up to 75 watts with one 10.6µm CO 2VLS3.60DT PLATFORM
The VLS3.60DT is a compact and economical entry level platform that offers a material processing envelope of 24" x 12" x 4" or 1,152 in³ (610 x 305 x 102 mm or 18,878 cm³). The VLS3.60DT can be equipped with one of five 10.6µm CO 2 laser sources ranging in power from 10 to 60 watts or one 9.3µm CO 2 30 watt or 50 watt laser source. LASER ENGRAVING AND CUTTING MACHINES FROM UNIVERSAL LASER Laser Engraving, Cutting, and Marking with ULS Laser Systems. One of the most impressive capabilities of ULS laser systems (laser engraving machine, laser cutting machine, laser marking machine) is the capacity to execute two or three laser processes with the same system—whether laser engraving, laser cutting, and/or laser marking—which eliminates the need for multiple laser platforms. SOFTWARE DOWNLOADS FOR UNIVERSAL LASER SYSTEMS PLATFORMS Software Downloads. Download the driver (s) for your specific ULS system. All drivers are pertinent to a specific laser platform and will work for all laser cutting, laser marking, and laser engravingactivities.
DELRIN® - LASER CUTTING, ENGRAVING & MARKING DELRIN Delrin ® is a polyoxymethylene (POM) based thermoplastic developed by DuPont ™.It is also known by other names such as acetal, polyacetal and acetal homopolymer. Laser cutting Delrin ® with a 10.6 micron wavelength CO 2 laser produces clean cuts with smooth edges. Laser engraving Delrin ® with a 10.6 micron wavelength CO 2 laser can produce a high degree of detail and relief.FLUOROPOLYMERS
Fluoropolymers are a class of polymers containing carbon-fluoride bonds characterized by a high resistance to harsh environments. Commercially available fluoropolymers include Teflon ™ (PTFE), Halar (ECTFE) and Kel-F ® (PCTFE). Laser processing of fluoropolymers can be performed with either a 10.6 or 9.3 micron CO 2 laser, with no appreciable difference in process quality. MATBOARD - LASER CUTTING, MARKING & ENGRAVING Matboard is a paper based material that is used in the picture framing process and is available in a variety of colors and styles. Matboard may also be referred to as mount board or museum board. Laser processing of matboard can be performed with either a 9.3 or 10.6 micron CO 2 laser without a noticeable difference in process quality. ULS DIRECT FILE IMPORT OPTION FOR LASER SYSTEMS Direct File Import. ULS laser material processing systems are designed as a computer peripheral. Print drivers are supplied with the laser system to allow users to print design files making them broadly compatible with a wide selection of software from graphic design toCAD/CAM.
NYLON - LASER CUTTING AND ENGRAVING NYLON Nylon is a generic name referring to a series of thermoplastic aliphatic polyamides. Some common formulations are nylon-6 and nylon-6,6. Laser processing of nylon can be performed with a 9.3 or 10.6 micron CO 2 laser. Nylon does not readily absorb the energy from the 1.06 micron fiber laser and is not recommended for this material.FR4-/G10 BOARDS
Laser cutting of FR-4/G10 with a CO 2 laser produces a blackened carbonized edge that can be cleaned with a solvent. Laser marking of FR-4/G10 with a CO 2 laser carbonizes the surface of the epoxy creating a dark visible mark on a lighter surrounding substrate. Laser marking is also possible if there is a solder mask on the surface ofthe
PLS6MW PLATFORM
Platform Overview. The PLS6MW (Multi-Wavelength) is a free-standing platform uses multiple laser wavelengths to process the broadest possible spectrum of materials and supports either CO 2 or fiber lasers. The PLS6MW has a materials processing envelope of 32" x 18" x 8.5" or 4,896 in³ (813 x 457 x 216 mm or 80,253 cm³). PROCESSING TEFLON® USING LASER TECHNOLOGY Processing Teflon ® Using Digital Laser Material Processing (DLMP ®) Technology. Polytetrafluoroethylene (PTFE) is commonly known by the brand name Teflon®. It is a synthetic fluoropolymer most noted for its anti-stick, water-repelling, chemical resistant and temperature resistant properties. Due to its exceptional properties, Teflon is LASER CUTTING, ENGRAVING & MARKING MACHINES AND EQUIPMENTCOMPANYTECHNOLOGYMATERIALSRESOURCESPURCHASESUPPORT Universal Laser Systems, Inc. (ULS) is a recognized global innovation leader in DLMP® (Digital Laser Material Processing) technology. For nearly 30 years, organizations worldwide in all types of environments have discovered and leveraged the benefits of our technology to help them achieve their goals. Learn how ULS can help you achieve yours. LASER ENGRAVING AND CUTTING MACHINES FROM UNIVERSAL LASER Laser Engraving, Cutting, and Marking with ULS Laser Systems. One of the most impressive capabilities of ULS laser systems (laser engraving machine, laser cutting machine, laser marking machine) is the capacity to execute two or three laser processes with the same system—whether laser engraving, laser cutting, and/or laser marking—which eliminates the need for multiple laser platforms. SOFTWARE DOWNLOADS FOR UNIVERSAL LASER SYSTEMS PLATFORMS Software Downloads. Download the driver (s) for your specific ULS system. All drivers are pertinent to a specific laser platform and will work for all laser cutting, laser marking, and laser engravingactivities.
PEI - LASER CUTTING, MARKING AND ENGRAVING PEI PEI (Polyetherimide) Overview. Polyetherimide (PEI), also known by Ultem®, is a high-performance thermoplastic with excellent mechanical, thermal, and electrical properties. Laser cutting and laser engraving of PEI are possible with a 9.3 micron or 10.6 micron CO 2 laser. Charring will occur with both laser wavelengths, althoughit will be
DELRIN® - LASER CUTTING, ENGRAVING & MARKING DELRIN Delrin ® is a polyoxymethylene (POM) based thermoplastic developed by DuPont ™.It is also known by other names such as acetal, polyacetal and acetal homopolymer. Laser cutting Delrin ® with a 10.6 micron wavelength CO 2 laser produces clean cuts with smooth edges. Laser engraving Delrin ® with a 10.6 micron wavelength CO 2 laser can produce a high degree of detail and relief. ULTRA R9000 PLATFORM Platform Overview. The ULTRA R9000 platform offers laser material processing for a wide range of materials. It is designed and ideally suited for material processing in manufacturing, research and development, academic research, and prototyping environments. With its unique modular architecture, customizable solutions can be easilyreconfigured
UNIVERSAL LASER SYSTEMS, INC Universal Laser Systems has been advancing the application of modern CO 2 laser technology since 1988. R&D efforts have resulted in numerous patents, with several pending, in our continual pursuit to develop and enhance laser systems that benefit the customer. Our R&D philosophy and execution is based upon designing highly modularplatforms
VLS6.75 PLATFORM
The VLS6.75 is a free-standing platform with a material processing envelope of 32" x 18" x 8.5" or 4,896 in³ (813 x 457 x 216 mm or 80,253 cm³). The single laser platform supports a 10.6µm CO 2 laser source ranging in power from 10 to 75 watts or one 9.3µm CO 2 30 watt, 50 watt, or 75 watt laser source. Download Brochure.ILS12.150D PLATFORM
The ILS12.150D is a free-standing platform with a materials processing envelope of 48" x 24" x 12" or 13,824 in³ (1219mm x 610mm x 305mm or 226,795 cm³). The dual laser platform supports a power range of 10 to 150 watts (up to 75 watts with one 10.6µm CO 2 PROCESSING TEFLON® USING LASER TECHNOLOGY Processing Teflon ® Using Digital Laser Material Processing (DLMP ®) Technology. Polytetrafluoroethylene (PTFE) is commonly known by the brand name Teflon®. It is a synthetic fluoropolymer most noted for its anti-stick, water-repelling, chemical resistant and temperature resistant properties. Due to its exceptional properties, Teflon is LASER CUTTING, ENGRAVING & MARKING MACHINES AND EQUIPMENTCOMPANYTECHNOLOGYMATERIALSRESOURCESPURCHASESUPPORT Universal Laser Systems, Inc. (ULS) is a recognized global innovation leader in DLMP® (Digital Laser Material Processing) technology. For nearly 30 years, organizations worldwide in all types of environments have discovered and leveraged the benefits of our technology to help them achieve their goals. Learn how ULS can help you achieve yours. LASER ENGRAVING AND CUTTING MACHINES FROM UNIVERSAL LASER Laser Engraving, Cutting, and Marking with ULS Laser Systems. One of the most impressive capabilities of ULS laser systems (laser engraving machine, laser cutting machine, laser marking machine) is the capacity to execute two or three laser processes with the same system—whether laser engraving, laser cutting, and/or laser marking—which eliminates the need for multiple laser platforms. SOFTWARE DOWNLOADS FOR UNIVERSAL LASER SYSTEMS PLATFORMS Software Downloads. Download the driver (s) for your specific ULS system. All drivers are pertinent to a specific laser platform and will work for all laser cutting, laser marking, and laser engravingactivities.
PEI - LASER CUTTING, MARKING AND ENGRAVING PEI PEI (Polyetherimide) Overview. Polyetherimide (PEI), also known by Ultem®, is a high-performance thermoplastic with excellent mechanical, thermal, and electrical properties. Laser cutting and laser engraving of PEI are possible with a 9.3 micron or 10.6 micron CO 2 laser. Charring will occur with both laser wavelengths, althoughit will be
DELRIN® - LASER CUTTING, ENGRAVING & MARKING DELRIN Delrin ® is a polyoxymethylene (POM) based thermoplastic developed by DuPont ™.It is also known by other names such as acetal, polyacetal and acetal homopolymer. Laser cutting Delrin ® with a 10.6 micron wavelength CO 2 laser produces clean cuts with smooth edges. Laser engraving Delrin ® with a 10.6 micron wavelength CO 2 laser can produce a high degree of detail and relief. ULTRA R9000 PLATFORM Platform Overview. The ULTRA R9000 platform offers laser material processing for a wide range of materials. It is designed and ideally suited for material processing in manufacturing, research and development, academic research, and prototyping environments. With its unique modular architecture, customizable solutions can be easilyreconfigured
UNIVERSAL LASER SYSTEMS, INC Universal Laser Systems has been advancing the application of modern CO 2 laser technology since 1988. R&D efforts have resulted in numerous patents, with several pending, in our continual pursuit to develop and enhance laser systems that benefit the customer. Our R&D philosophy and execution is based upon designing highly modularplatforms
VLS6.75 PLATFORM
The VLS6.75 is a free-standing platform with a material processing envelope of 32" x 18" x 8.5" or 4,896 in³ (813 x 457 x 216 mm or 80,253 cm³). The single laser platform supports a 10.6µm CO 2 laser source ranging in power from 10 to 75 watts or one 9.3µm CO 2 30 watt, 50 watt, or 75 watt laser source. Download Brochure.ILS12.150D PLATFORM
The ILS12.150D is a free-standing platform with a materials processing envelope of 48" x 24" x 12" or 13,824 in³ (1219mm x 610mm x 305mm or 226,795 cm³). The dual laser platform supports a power range of 10 to 150 watts (up to 75 watts with one 10.6µm CO 2 PROCESSING TEFLON® USING LASER TECHNOLOGY Processing Teflon ® Using Digital Laser Material Processing (DLMP ®) Technology. Polytetrafluoroethylene (PTFE) is commonly known by the brand name Teflon®. It is a synthetic fluoropolymer most noted for its anti-stick, water-repelling, chemical resistant and temperature resistant properties. Due to its exceptional properties, Teflon is LASER ENGRAVING AND CUTTING MACHINES FROM UNIVERSAL LASER Laser Engraving, Cutting, and Marking with ULS Laser Systems. One of the most impressive capabilities of ULS laser systems (laser engraving machine, laser cutting machine, laser marking machine) is the capacity to execute two or three laser processes with the same system—whether laser engraving, laser cutting, and/or laser marking—which eliminates the need for multiple laser platforms. PEI - LASER CUTTING, MARKING AND ENGRAVING PEI PEI (Polyetherimide) Overview. Polyetherimide (PEI), also known by Ultem®, is a high-performance thermoplastic with excellent mechanical, thermal, and electrical properties. Laser cutting and laser engraving of PEI are possible with a 9.3 micron or 10.6 micron CO 2 laser. Charring will occur with both laser wavelengths, althoughit will be
FLUOROPOLYMERS
Fluoropolymers are a class of polymers containing carbon-fluoride bonds characterized by a high resistance to harsh environments. Commercially available fluoropolymers include Teflon ™ (PTFE), Halar (ECTFE) and Kel-F ® (PCTFE). Laser processing of fluoropolymers can be performed with either a 10.6 or 9.3 micron CO 2 laser, with no appreciable difference in process quality.VLS2.30DT PLATFORM
The VLS2.30DT Desktop is a compact and economical entry level platform. It offers a material processing envelope of 16" x 12" x 4" or 768 in³ (406 x 305 x 102 mm or 12,585 cm³) and can be equipped with one 10.6µm CO 2 laser source ranging in power from 10 to 30 watts or one 9.3µm CO 2 30 watt laser source. Download Brochure. CONFIGURABLE CUTTING TABLES The ULS Flow-through and Configurable Cutting Tables minimize the supporting surface for the target material, preventing damaging back-reflection as well as allowing laser cutting byproducts to be more effectively removed. Damage-free Laser Cutting. Mitigates or eliminates laser damage to lower surface of target-material beinglaser cut.
FR4-/G10 BOARDS
Laser cutting of FR-4/G10 with a CO 2 laser produces a blackened carbonized edge that can be cleaned with a solvent. Laser marking of FR-4/G10 with a CO 2 laser carbonizes the surface of the epoxy creating a dark visible mark on a lighter surrounding substrate. Laser marking is also possible if there is a solder mask on the surface ofthe
NYLON - LASER CUTTING AND ENGRAVING NYLON Nylon is a generic name referring to a series of thermoplastic aliphatic polyamides. Some common formulations are nylon-6 and nylon-6,6. Laser processing of nylon can be performed with a 9.3 or 10.6 micron CO 2 laser. Nylon does not readily absorb the energy from the 1.06 micron fiber laser and is not recommended for this material.VLS3.60DT PLATFORM
The VLS3.60DT is a compact and economical entry level platform that offers a material processing envelope of 24" x 12" x 4" or 1,152 in³ (610 x 305 x 102 mm or 18,878 cm³). The VLS3.60DT can be equipped with one of five 10.6µm CO 2 laser sources ranging in power from 10 to 60 watts or one 9.3µm CO 2 30 watt or 50 watt laser source.PLS6MW PLATFORM
Platform Overview. The PLS6MW (Multi-Wavelength) is a free-standing platform uses multiple laser wavelengths to process the broadest possible spectrum of materials and supports either CO 2 or fiber lasers. The PLS6MW has a materials processing envelope of 32" x 18" x 8.5" or 4,896 in³ (813 x 457 x 216 mm or 80,253 cm³). ULS DIRECT FILE IMPORT OPTION FOR LASER SYSTEMS Direct File Import. ULS laser material processing systems are designed as a computer peripheral. Print drivers are supplied with the laser system to allow users to print design files making them broadly compatible with a wide selection of software from graphic design toCAD/CAM.
LASER CUTTING, ENGRAVING & MARKING MACHINES AND EQUIPMENTCOMPANYTECHNOLOGYMATERIALSRESOURCESPURCHASESUPPORT Universal Laser Systems, Inc. (ULS) is a recognized global innovation leader in DLMP® (Digital Laser Material Processing) technology. For nearly 30 years, organizations worldwide in all types of environments have discovered and leveraged the benefits of our technology to help them achieve their goals. Learn how ULS can help you achieve yours. LASER ENGRAVING AND CUTTING MACHINES FROM UNIVERSAL LASER Laser Engraving, Cutting, and Marking with ULS Laser Systems. One of the most impressive capabilities of ULS laser systems (laser engraving machine, laser cutting machine, laser marking machine) is the capacity to execute two or three laser processes with the same system—whether laser engraving, laser cutting, and/or laser marking—which eliminates the need for multiple laser platforms. SOFTWARE DOWNLOADS FOR UNIVERSAL LASER SYSTEMS PLATFORMS Software Downloads. Download the driver (s) for your specific ULS system. All drivers are pertinent to a specific laser platform and will work for all laser cutting, laser marking, and laser engravingactivities.
PLASTICS - LASER CUTTING, ENGRAVING & MARKING General Plastic Laser System Considerations. Platform Size – Must be large enough to hold the largest pieces of plastic that will be laser processed or be equipped with Class 4 capability for processing larger pieces. Wavelength – The 10.6 micron wavelength is absorbed well by nearly all plastics and is the best choice for most plastic laser cutting, engraving, and marking. PEI - LASER CUTTING, MARKING AND ENGRAVING PEI PEI (Polyetherimide) Overview. Polyetherimide (PEI), also known by Ultem®, is a high-performance thermoplastic with excellent mechanical, thermal, and electrical properties. Laser cutting and laser engraving of PEI are possible with a 9.3 micron or 10.6 micron CO 2 laser. Charring will occur with both laser wavelengths, althoughit will be
UNIVERSAL LASER SYSTEMS, INC Universal Laser Systems has been advancing the application of modern CO 2 laser technology since 1988. R&D efforts have resulted in numerous patents, with several pending, in our continual pursuit to develop and enhance laser systems that benefit the customer. Our R&D philosophy and execution is based upon designing highly modularplatforms
LASER CUTTING, ENGRAVING & MARKING MACHINES AND EQUIPMENTCOMPANYTECHNOLOGYMATERIALSRESOURCESPURCHASESUPPORT Universal Laser Systems, Inc. (ULS) is a recognized global innovation leader in DLMP® (Digital Laser Material Processing) technology. For nearly 30 years, organizations worldwide in all types of environments have discovered and leveraged the benefits of our technology to help them achieve their goals. Learn how ULS can help you achieve yours. LASER ENGRAVING AND CUTTING MACHINES FROM UNIVERSAL LASER Laser Engraving, Cutting, and Marking with ULS Laser Systems. One of the most impressive capabilities of ULS laser systems (laser engraving machine, laser cutting machine, laser marking machine) is the capacity to execute two or three laser processes with the same system—whether laser engraving, laser cutting, and/or laser marking—which eliminates the need for multiple laser platforms. SOFTWARE DOWNLOADS FOR UNIVERSAL LASER SYSTEMS PLATFORMS Software Downloads. Download the driver (s) for your specific ULS system. All drivers are pertinent to a specific laser platform and will work for all laser cutting, laser marking, and laser engravingactivities.
PLASTICS - LASER CUTTING, ENGRAVING & MARKING General Plastic Laser System Considerations. Platform Size – Must be large enough to hold the largest pieces of plastic that will be laser processed or be equipped with Class 4 capability for processing larger pieces. Wavelength – The 10.6 micron wavelength is absorbed well by nearly all plastics and is the best choice for most plastic laser cutting, engraving, and marking. PEI - LASER CUTTING, MARKING AND ENGRAVING PEI PEI (Polyetherimide) Overview. Polyetherimide (PEI), also known by Ultem®, is a high-performance thermoplastic with excellent mechanical, thermal, and electrical properties. Laser cutting and laser engraving of PEI are possible with a 9.3 micron or 10.6 micron CO 2 laser. Charring will occur with both laser wavelengths, althoughit will be
UNIVERSAL LASER SYSTEMS, INC Universal Laser Systems has been advancing the application of modern CO 2 laser technology since 1988. R&D efforts have resulted in numerous patents, with several pending, in our continual pursuit to develop and enhance laser systems that benefit the customer. Our R&D philosophy and execution is based upon designing highly modularplatforms
PLASTICS - LASER CUTTING, ENGRAVING & MARKING General Plastic Laser System Considerations. Platform Size – Must be large enough to hold the largest pieces of plastic that will be laser processed or be equipped with Class 4 capability for processing larger pieces. Wavelength – The 10.6 micron wavelength is absorbed well by nearly all plastics and is the best choice for most plastic laser cutting, engraving, and marking.POLYPROPYLENE
Polypropylene (PP) is a thermoplastic commonly referred to as a polyolefin. Commercially available products based on polypropylene include Formex ™ and Statex ™.Polypropylene can be processed with a 9.3 or 10.6 micron CO 2 laser without an appreciable difference in process quality. Polypropylene does not readily absorb the energy of the 1.06 micron fiber laser. CONFIGURABLE CUTTING TABLES The ULS Flow-through and Configurable Cutting Tables minimize the supporting surface for the target material, preventing damaging back-reflection as well as allowing laser cutting byproducts to be more effectively removed. Damage-free Laser Cutting. Mitigates or eliminates laser damage to lower surface of target-material beinglaser cut.
FAQ FOR UNIVERSAL LASER SYSTEMS All ULS laser products (for laser cutting, laser engraving, and laser marking) comply with all pertinent United States and European Union government laser safety and product safety regulations.. Laser Safety. Laser safety standards are well established and relatively harmonized internationally. The two most prevalent version of these harmonized laser safety standards are 21 CFR 1040.10 andABS PLASTIC
Acrylonitrile butadiene styrene (ABS) is a common thermoplastic made by polymerizing acrylonitrile and styrene in the presence of polybutadiene. Proportions of the component polymers vary from 15-35% acrylonitrile, 5-30% butadiene, and 40-60% Styrene. This mixture results in a material with the strength and rigidity of theacrylonitrile and
NYLON - LASER CUTTING AND ENGRAVING NYLON Nylon is a generic name referring to a series of thermoplastic aliphatic polyamides. Some common formulations are nylon-6 and nylon-6,6. Laser processing of nylon can be performed with a 9.3 or 10.6 micron CO 2 laser. Nylon does not readily absorb the energy from the 1.06 micron fiber laser and is not recommended for this material. ULS LASER SYSTEM USER INTERFACES Laser System User Interfaces. The Universal Control Panel (UCP) and the Laser System Manager (LSM) are user interfaces that control ULS laser systems. Both user interfaces are configured intuitively, enabling all users to produce expert quality results. Both include a Printer Driver and Direct Import Feature for uploading graphicdesigns.
TECHNICAL DOWNLOADS FOR UNIVERSAL LASER SYSTEMS PLATFORMS Our Innovations. Products. Vector Performance Comparison Test. Raster Performance Comparison Test. Technology Videos. Laser Engraving Systems. Materials. Materials Library. Laser Processing Examples. PROCESSING WOOD USING LASER TECHNOLOGY The primary factor affecting the results of using Digital Laser Material Processing (DLMP) technology with wood is the density and the uniformity of its density. This is explained further in the individual processing sections below. The most useful effects of laser energy with wood is material ablation and material modification. DIFFERENCE BETWEEN DC GLASS LASERS AND RF METAL LASERS An RF metal laser has a hermetically-sealed metal chamber that contains the laser gas mixture. Precisely controlled radio frequency energy is used to create ionized gas plasma for the laser to produce a laser beam. The design of RF metal lasers is compact, durable, and contains integrated air cooling. RF metal lasers were originallydeveloped
LASER CUTTING, ENGRAVING & MARKING MACHINES AND EQUIPMENTCOMPANYTECHNOLOGYMATERIALSRESOURCESPURCHASESUPPORT Universal Laser Systems, Inc. (ULS) is a recognized global innovation leader in DLMP® (Digital Laser Material Processing) technology. For nearly 30 years, organizations worldwide in all types of environments have discovered and leveraged the benefits of our technology to help them achieve their goals. Learn how ULS can help you achieve yours. LASER ENGRAVING AND CUTTING MACHINES FROM UNIVERSAL LASER Laser Engraving, Cutting, and Marking with ULS Laser Systems. One of the most impressive capabilities of ULS laser systems (laser engraving machine, laser cutting machine, laser marking machine) is the capacity to execute two or three laser processes with the same system—whether laser engraving, laser cutting, and/or laser marking—which eliminates the need for multiple laser platforms. SOFTWARE DOWNLOADS FOR UNIVERSAL LASER SYSTEMS PLATFORMS Software Downloads. Download the driver (s) for your specific ULS system. All drivers are pertinent to a specific laser platform and will work for all laser cutting, laser marking, and laser engravingactivities.
PLASTICS - LASER CUTTING, ENGRAVING & MARKING General Plastic Laser System Considerations. Platform Size – Must be large enough to hold the largest pieces of plastic that will be laser processed or be equipped with Class 4 capability for processing larger pieces. Wavelength – The 10.6 micron wavelength is absorbed well by nearly all plastics and is the best choice for most plastic laser cutting, engraving, and marking. PEI - LASER CUTTING, MARKING AND ENGRAVING PEI PEI (Polyetherimide) Overview. Polyetherimide (PEI), also known by Ultem®, is a high-performance thermoplastic with excellent mechanical, thermal, and electrical properties. Laser cutting and laser engraving of PEI are possible with a 9.3 micron or 10.6 micron CO 2 laser. Charring will occur with both laser wavelengths, althoughit will be
UNIVERSAL LASER SYSTEMS, INC Universal Laser Systems has been advancing the application of modern CO 2 laser technology since 1988. R&D efforts have resulted in numerous patents, with several pending, in our continual pursuit to develop and enhance laser systems that benefit the customer. Our R&D philosophy and execution is based upon designing highly modularplatforms
LASER CUTTING, ENGRAVING & MARKING MACHINES AND EQUIPMENTCOMPANYTECHNOLOGYMATERIALSRESOURCESPURCHASESUPPORT Universal Laser Systems, Inc. (ULS) is a recognized global innovation leader in DLMP® (Digital Laser Material Processing) technology. For nearly 30 years, organizations worldwide in all types of environments have discovered and leveraged the benefits of our technology to help them achieve their goals. Learn how ULS can help you achieve yours. LASER ENGRAVING AND CUTTING MACHINES FROM UNIVERSAL LASER Laser Engraving, Cutting, and Marking with ULS Laser Systems. One of the most impressive capabilities of ULS laser systems (laser engraving machine, laser cutting machine, laser marking machine) is the capacity to execute two or three laser processes with the same system—whether laser engraving, laser cutting, and/or laser marking—which eliminates the need for multiple laser platforms. SOFTWARE DOWNLOADS FOR UNIVERSAL LASER SYSTEMS PLATFORMS Software Downloads. Download the driver (s) for your specific ULS system. All drivers are pertinent to a specific laser platform and will work for all laser cutting, laser marking, and laser engravingactivities.
PLASTICS - LASER CUTTING, ENGRAVING & MARKING General Plastic Laser System Considerations. Platform Size – Must be large enough to hold the largest pieces of plastic that will be laser processed or be equipped with Class 4 capability for processing larger pieces. Wavelength – The 10.6 micron wavelength is absorbed well by nearly all plastics and is the best choice for most plastic laser cutting, engraving, and marking. PEI - LASER CUTTING, MARKING AND ENGRAVING PEI PEI (Polyetherimide) Overview. Polyetherimide (PEI), also known by Ultem®, is a high-performance thermoplastic with excellent mechanical, thermal, and electrical properties. Laser cutting and laser engraving of PEI are possible with a 9.3 micron or 10.6 micron CO 2 laser. Charring will occur with both laser wavelengths, althoughit will be
UNIVERSAL LASER SYSTEMS, INC Universal Laser Systems has been advancing the application of modern CO 2 laser technology since 1988. R&D efforts have resulted in numerous patents, with several pending, in our continual pursuit to develop and enhance laser systems that benefit the customer. Our R&D philosophy and execution is based upon designing highly modularplatforms
PLASTICS - LASER CUTTING, ENGRAVING & MARKING General Plastic Laser System Considerations. Platform Size – Must be large enough to hold the largest pieces of plastic that will be laser processed or be equipped with Class 4 capability for processing larger pieces. Wavelength – The 10.6 micron wavelength is absorbed well by nearly all plastics and is the best choice for most plastic laser cutting, engraving, and marking.POLYPROPYLENE
Polypropylene (PP) is a thermoplastic commonly referred to as a polyolefin. Commercially available products based on polypropylene include Formex ™ and Statex ™.Polypropylene can be processed with a 9.3 or 10.6 micron CO 2 laser without an appreciable difference in process quality. Polypropylene does not readily absorb the energy of the 1.06 micron fiber laser. CONFIGURABLE CUTTING TABLES The ULS Flow-through and Configurable Cutting Tables minimize the supporting surface for the target material, preventing damaging back-reflection as well as allowing laser cutting byproducts to be more effectively removed. Damage-free Laser Cutting. Mitigates or eliminates laser damage to lower surface of target-material beinglaser cut.
FAQ FOR UNIVERSAL LASER SYSTEMS All ULS laser products (for laser cutting, laser engraving, and laser marking) comply with all pertinent United States and European Union government laser safety and product safety regulations.. Laser Safety. Laser safety standards are well established and relatively harmonized internationally. The two most prevalent version of these harmonized laser safety standards are 21 CFR 1040.10 andABS PLASTIC
Acrylonitrile butadiene styrene (ABS) is a common thermoplastic made by polymerizing acrylonitrile and styrene in the presence of polybutadiene. Proportions of the component polymers vary from 15-35% acrylonitrile, 5-30% butadiene, and 40-60% Styrene. This mixture results in a material with the strength and rigidity of theacrylonitrile and
NYLON - LASER CUTTING AND ENGRAVING NYLON Nylon is a generic name referring to a series of thermoplastic aliphatic polyamides. Some common formulations are nylon-6 and nylon-6,6. Laser processing of nylon can be performed with a 9.3 or 10.6 micron CO 2 laser. Nylon does not readily absorb the energy from the 1.06 micron fiber laser and is not recommended for this material. ULS LASER SYSTEM USER INTERFACES Laser System User Interfaces. The Universal Control Panel (UCP) and the Laser System Manager (LSM) are user interfaces that control ULS laser systems. Both user interfaces are configured intuitively, enabling all users to produce expert quality results. Both include a Printer Driver and Direct Import Feature for uploading graphicdesigns.
TECHNICAL DOWNLOADS FOR UNIVERSAL LASER SYSTEMS PLATFORMS Our Innovations. Products. Vector Performance Comparison Test. Raster Performance Comparison Test. Technology Videos. Laser Engraving Systems. Materials. Materials Library. Laser Processing Examples. PROCESSING WOOD USING LASER TECHNOLOGY The primary factor affecting the results of using Digital Laser Material Processing (DLMP) technology with wood is the density and the uniformity of its density. This is explained further in the individual processing sections below. The most useful effects of laser energy with wood is material ablation and material modification. DIFFERENCE BETWEEN DC GLASS LASERS AND RF METAL LASERS An RF metal laser has a hermetically-sealed metal chamber that contains the laser gas mixture. Precisely controlled radio frequency energy is used to create ionized gas plasma for the laser to produce a laser beam. The design of RF metal lasers is compact, durable, and contains integrated air cooling. RF metal lasers were originallydeveloped
LASER CUTTING, ENGRAVING & MARKING MACHINES AND EQUIPMENTCOMPANYTECHNOLOGYMATERIALSRESOURCESPURCHASESUPPORT Universal Laser Systems, Inc. (ULS) is a recognized global innovation leader in DLMP® (Digital Laser Material Processing) technology. For nearly 30 years, organizations worldwide in all types of environments have discovered and leveraged the benefits of our technology to help them achieve their goals. Learn how ULS can help you achieve yours. LASER ENGRAVING AND CUTTING MACHINES FROM UNIVERSAL LASER Laser Engraving, Cutting, and Marking with ULS Laser Systems. One of the most impressive capabilities of ULS laser systems (laser engraving machine, laser cutting machine, laser marking machine) is the capacity to execute two or three laser processes with the same system—whether laser engraving, laser cutting, and/or laser marking—which eliminates the need for multiple laser platforms. SOFTWARE DOWNLOADS FOR UNIVERSAL LASER SYSTEMS PLATFORMS Software Downloads. Download the driver (s) for your specific ULS system. All drivers are pertinent to a specific laser platform and will work for all laser cutting, laser marking, and laser engravingactivities.
PLASTICS - LASER CUTTING, ENGRAVING & MARKING General Plastic Laser System Considerations. Platform Size – Must be large enough to hold the largest pieces of plastic that will be laser processed or be equipped with Class 4 capability for processing larger pieces. Wavelength – The 10.6 micron wavelength is absorbed well by nearly all plastics and is the best choice for most plastic laser cutting, engraving, and marking. PEI - LASER CUTTING, MARKING AND ENGRAVING PEI PEI (Polyetherimide) Overview. Polyetherimide (PEI), also known by Ultem®, is a high-performance thermoplastic with excellent mechanical, thermal, and electrical properties. Laser cutting and laser engraving of PEI are possible with a 9.3 micron or 10.6 micron CO 2 laser. Charring will occur with both laser wavelengths, althoughit will be
UNIVERSAL LASER SYSTEMS, INC Universal Laser Systems has been advancing the application of modern CO 2 laser technology since 1988. R&D efforts have resulted in numerous patents, with several pending, in our continual pursuit to develop and enhance laser systems that benefit the customer. Our R&D philosophy and execution is based upon designing highly modularplatforms
LASER CUTTING, ENGRAVING & MARKING MACHINES AND EQUIPMENTCOMPANYTECHNOLOGYMATERIALSRESOURCESPURCHASESUPPORT Universal Laser Systems, Inc. (ULS) is a recognized global innovation leader in DLMP® (Digital Laser Material Processing) technology. For nearly 30 years, organizations worldwide in all types of environments have discovered and leveraged the benefits of our technology to help them achieve their goals. Learn how ULS can help you achieve yours. LASER ENGRAVING AND CUTTING MACHINES FROM UNIVERSAL LASER Laser Engraving, Cutting, and Marking with ULS Laser Systems. One of the most impressive capabilities of ULS laser systems (laser engraving machine, laser cutting machine, laser marking machine) is the capacity to execute two or three laser processes with the same system—whether laser engraving, laser cutting, and/or laser marking—which eliminates the need for multiple laser platforms. SOFTWARE DOWNLOADS FOR UNIVERSAL LASER SYSTEMS PLATFORMS Software Downloads. Download the driver (s) for your specific ULS system. All drivers are pertinent to a specific laser platform and will work for all laser cutting, laser marking, and laser engravingactivities.
PLASTICS - LASER CUTTING, ENGRAVING & MARKING General Plastic Laser System Considerations. Platform Size – Must be large enough to hold the largest pieces of plastic that will be laser processed or be equipped with Class 4 capability for processing larger pieces. Wavelength – The 10.6 micron wavelength is absorbed well by nearly all plastics and is the best choice for most plastic laser cutting, engraving, and marking. PEI - LASER CUTTING, MARKING AND ENGRAVING PEI PEI (Polyetherimide) Overview. Polyetherimide (PEI), also known by Ultem®, is a high-performance thermoplastic with excellent mechanical, thermal, and electrical properties. Laser cutting and laser engraving of PEI are possible with a 9.3 micron or 10.6 micron CO 2 laser. Charring will occur with both laser wavelengths, althoughit will be
UNIVERSAL LASER SYSTEMS, INC Universal Laser Systems has been advancing the application of modern CO 2 laser technology since 1988. R&D efforts have resulted in numerous patents, with several pending, in our continual pursuit to develop and enhance laser systems that benefit the customer. Our R&D philosophy and execution is based upon designing highly modularplatforms
PLASTICS - LASER CUTTING, ENGRAVING & MARKING General Plastic Laser System Considerations. Platform Size – Must be large enough to hold the largest pieces of plastic that will be laser processed or be equipped with Class 4 capability for processing larger pieces. Wavelength – The 10.6 micron wavelength is absorbed well by nearly all plastics and is the best choice for most plastic laser cutting, engraving, and marking.POLYPROPYLENE
Polypropylene (PP) is a thermoplastic commonly referred to as a polyolefin. Commercially available products based on polypropylene include Formex ™ and Statex ™.Polypropylene can be processed with a 9.3 or 10.6 micron CO 2 laser without an appreciable difference in process quality. Polypropylene does not readily absorb the energy of the 1.06 micron fiber laser. CONFIGURABLE CUTTING TABLES The ULS Flow-through and Configurable Cutting Tables minimize the supporting surface for the target material, preventing damaging back-reflection as well as allowing laser cutting byproducts to be more effectively removed. Damage-free Laser Cutting. Mitigates or eliminates laser damage to lower surface of target-material beinglaser cut.
FAQ FOR UNIVERSAL LASER SYSTEMS All ULS laser products (for laser cutting, laser engraving, and laser marking) comply with all pertinent United States and European Union government laser safety and product safety regulations.. Laser Safety. Laser safety standards are well established and relatively harmonized internationally. The two most prevalent version of these harmonized laser safety standards are 21 CFR 1040.10 andABS PLASTIC
Acrylonitrile butadiene styrene (ABS) is a common thermoplastic made by polymerizing acrylonitrile and styrene in the presence of polybutadiene. Proportions of the component polymers vary from 15-35% acrylonitrile, 5-30% butadiene, and 40-60% Styrene. This mixture results in a material with the strength and rigidity of theacrylonitrile and
NYLON - LASER CUTTING AND ENGRAVING NYLON Nylon is a generic name referring to a series of thermoplastic aliphatic polyamides. Some common formulations are nylon-6 and nylon-6,6. Laser processing of nylon can be performed with a 9.3 or 10.6 micron CO 2 laser. Nylon does not readily absorb the energy from the 1.06 micron fiber laser and is not recommended for this material. ULS LASER SYSTEM USER INTERFACES Laser System User Interfaces. The Universal Control Panel (UCP) and the Laser System Manager (LSM) are user interfaces that control ULS laser systems. Both user interfaces are configured intuitively, enabling all users to produce expert quality results. Both include a Printer Driver and Direct Import Feature for uploading graphicdesigns.
TECHNICAL DOWNLOADS FOR UNIVERSAL LASER SYSTEMS PLATFORMS Our Innovations. Products. Vector Performance Comparison Test. Raster Performance Comparison Test. Technology Videos. Laser Engraving Systems. Materials. Materials Library. Laser Processing Examples. PROCESSING WOOD USING LASER TECHNOLOGY The primary factor affecting the results of using Digital Laser Material Processing (DLMP) technology with wood is the density and the uniformity of its density. This is explained further in the individual processing sections below. The most useful effects of laser energy with wood is material ablation and material modification. DIFFERENCE BETWEEN DC GLASS LASERS AND RF METAL LASERS An RF metal laser has a hermetically-sealed metal chamber that contains the laser gas mixture. Precisely controlled radio frequency energy is used to create ionized gas plasma for the laser to produce a laser beam. The design of RF metal lasers is compact, durable, and contains integrated air cooling. RF metal lasers were originallydeveloped
LASER CUTTING, ENGRAVING & MARKING MACHINES AND EQUIPMENTCOMPANYTECHNOLOGYMATERIALSRESOURCESPURCHASESUPPORT Universal Laser Systems, Inc. (ULS) is a recognized global innovation leader in DLMP® (Digital Laser Material Processing) technology. For nearly 30 years, organizations worldwide in all types of environments have discovered and leveraged the benefits of our technology to LASER ENGRAVING AND CUTTING MACHINES FROM UNIVERSAL LASER Laser Engraving, Cutting, and Marking with ULS Laser Systems. One of the most impressive capabilities of ULS laser systems (laser engraving machine, laser cutting machine, laser marking machine) is the capacity to execute two or three laser processes with the same system—whether laser engraving, laser cutting, and/or laser marking—which eliminates the need for multiple laser platforms. SOFTWARE DOWNLOADS FOR UNIVERSAL LASER SYSTEMS PLATFORMS Download the driver(s) for your specific ULS system. All drivers are pertinent to a specific laser platform and will work for all laser cutting, laser marking, and laser engraving activities. PLASTICS - LASER CUTTING, ENGRAVING & MARKING General Plastic Laser System Considerations. Platform Size – Must be large enough to hold the largest pieces of plastic that will be laser processed or be equipped with Class 4 capability for processing larger pieces. Wavelength – The 10.6 micron wavelength is absorbed well by nearly all plastics and is the best choice for most plastic laser cutting, engraving, and marking. PEI - LASER CUTTING, MARKING AND ENGRAVING PEI PEI is a thermoplastic with excellent mechanical, thermal, and electrical properties. It is ideal for laser cutting, marking, andengraving.
UNIVERSAL LASER SYSTEMS, INC Universal Laser Systems has been advancing the application of modern CO 2 laser technology since 1988. R&D efforts have resulted in numerous patents, with several pending, in our continual pursuit to develop and enhance laser systems that benefit the customer. ULTRA X6000 PLATFORM Platform Overview. The ULTRA X6000 platform offers laser material processing for the widest possible range of materials. It is designed and ideally suited for precision material processing in manufacturing, research and development, academic research, and prototypingenvironments.
1-TOUCH LASER PHOTO™ 1-Touch Laser Photo ™ Download 30-Day Free Trial. 1-Touch Laser Photo ™ is an innovative product for converting digital photographs (BMP, JPEG, PNG or TIFF formats) into bitmap files that can be used to indelibly mark or laser engrave the image into materials such as hard wood, stone or metal to create high value products. This transforms an ordinary photograph into a professional qualityROTARY FIXTURE
Rotary Fixture. The Rotary Fixture provides an efficient and productive method for laser cutting, engraving, and marking on cylinders and sphere-shaped, tapered, and non-symmetrical objects.ILS12.150D PLATFORM
Platform Overview. The ILS12.150D is a free-standing platform with a materials processing envelope of 48" x 24" x 12" or 13,824 in³ (1219mm x 610mm x 305mm or 226,795 cm³). LASER CUTTING, ENGRAVING & MARKING MACHINES AND EQUIPMENTCOMPANYTECHNOLOGYMATERIALSRESOURCESPURCHASESUPPORT Universal Laser Systems, Inc. (ULS) is a recognized global innovation leader in DLMP® (Digital Laser Material Processing) technology. For nearly 30 years, organizations worldwide in all types of environments have discovered and leveraged the benefits of our technology to LASER ENGRAVING AND CUTTING MACHINES FROM UNIVERSAL LASER Laser Engraving, Cutting, and Marking with ULS Laser Systems. One of the most impressive capabilities of ULS laser systems (laser engraving machine, laser cutting machine, laser marking machine) is the capacity to execute two or three laser processes with the same system—whether laser engraving, laser cutting, and/or laser marking—which eliminates the need for multiple laser platforms. SOFTWARE DOWNLOADS FOR UNIVERSAL LASER SYSTEMS PLATFORMS Download the driver(s) for your specific ULS system. All drivers are pertinent to a specific laser platform and will work for all laser cutting, laser marking, and laser engraving activities. PLASTICS - LASER CUTTING, ENGRAVING & MARKING General Plastic Laser System Considerations. Platform Size – Must be large enough to hold the largest pieces of plastic that will be laser processed or be equipped with Class 4 capability for processing larger pieces. Wavelength – The 10.6 micron wavelength is absorbed well by nearly all plastics and is the best choice for most plastic laser cutting, engraving, and marking. PEI - LASER CUTTING, MARKING AND ENGRAVING PEI PEI is a thermoplastic with excellent mechanical, thermal, and electrical properties. It is ideal for laser cutting, marking, andengraving.
UNIVERSAL LASER SYSTEMS, INC Universal Laser Systems has been advancing the application of modern CO 2 laser technology since 1988. R&D efforts have resulted in numerous patents, with several pending, in our continual pursuit to develop and enhance laser systems that benefit the customer. ULTRA X6000 PLATFORM Platform Overview. The ULTRA X6000 platform offers laser material processing for the widest possible range of materials. It is designed and ideally suited for precision material processing in manufacturing, research and development, academic research, and prototypingenvironments.
1-TOUCH LASER PHOTO™ 1-Touch Laser Photo ™ Download 30-Day Free Trial. 1-Touch Laser Photo ™ is an innovative product for converting digital photographs (BMP, JPEG, PNG or TIFF formats) into bitmap files that can be used to indelibly mark or laser engrave the image into materials such as hard wood, stone or metal to create high value products. This transforms an ordinary photograph into a professional qualityROTARY FIXTURE
Rotary Fixture. The Rotary Fixture provides an efficient and productive method for laser cutting, engraving, and marking on cylinders and sphere-shaped, tapered, and non-symmetrical objects.ILS12.150D PLATFORM
Platform Overview. The ILS12.150D is a free-standing platform with a materials processing envelope of 48" x 24" x 12" or 13,824 in³ (1219mm x 610mm x 305mm or 226,795 cm³). PLASTICS - LASER CUTTING, ENGRAVING & MARKING General Plastic Laser System Considerations. Platform Size – Must be large enough to hold the largest pieces of plastic that will be laser processed or be equipped with Class 4 capability for processing larger pieces. Wavelength – The 10.6 micron wavelength is absorbed well by nearly all plastics and is the best choice for most plastic laser cutting, engraving, and marking.ABS PLASTIC
ABS Plastic is available in a wide selection of colors and is most desirable for its impact resistance and toughness. ABS is ideal for laser cutting, marking, and engraving.POLYPROPYLENE
Polypropylene (PP) is a thermoplastic commonly referred to as a polyolefin. Commercially available products based on polypropylene include Formex ™ and Statex ™.Polypropylene can be processed with a 9.3 or 10.6 micron CO 2 laser without an appreciable difference in process quality. Polypropylene does not readily absorb the energy of the 1.06 micron fiber laser. FAQ FOR UNIVERSAL LASER SYSTEMS All ULS laser products (for laser cutting, laser engraving, and laser marking) comply with all pertinent United States and European Union government laser safety and product safety regulations.. Laser Safety. Laser safety standards are well established and relatively harmonized internationally. The two most prevalent version of these harmonized laser safety standards are 21 CFR 1040.10 and ULS LASER SYSTEM USER INTERFACES Estimate. The Estimate feature allows users to compare processing throughputs with various laser system configurations. Estimates can be run with different platforms, different laser powers, and different throughput enhancing options (such as SuperSpeed TM) to determine what configuration will deliver the best throughput for a particular laser processing operation. CONFIGURABLE CUTTING TABLES The Configurable Cutting Table consists of an anodized aluminum plate with an array of precision holes spaced at regular intervals. The operator may insert specially designed material-support pins into these holes in an arrangement that fully supports the target-materialwhile
NYLON - LASER CUTTING AND ENGRAVING NYLON Nylon is a generic name referring to a series of thermoplastic aliphatic polyamides. Some common formulations are nylon-6 and nylon-6,6. Laser processing of nylon can be performed with a 9.3 or 10.6 micron CO 2 laser. Nylon does not readily absorb the energy from the 1.06 micron fiber laser and is not recommended for this material. PROCESSING WOOD USING LASER TECHNOLOGY Environmental, Health & Safety Considerations. Laser material interactions almost always create gaseous effluent and/or particles. Processing wood with a CO 2 laser generates vapors containing carbon monoxide, acrolein, and formaldehyde, primarily from the combustion of cellulose compounds. Other high boiling point solids and particles derived from the incomplete combustion of lignins will TECHNICAL DOWNLOADS FOR UNIVERSAL LASER SYSTEMS PLATFORMS Download the Installation Software and appropriate User Guide for yourULS laser system.
DIFFERENCE BETWEEN DC GLASS LASERS AND RF METAL LASERS DC Glass Lasers. The first CO 2 lasers invented in the early 1960s were DC glass lasers. DC laser technology has not advanced since the 1960s primarily due to a shift in laser technology development to radio frequency and all metal laser design.Search
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ADVANCED LASER SYSTEMS FOR 1000S OF MATERIALS 3M™ 4926 VHB™ Laminating Adhesive 3M™ 5413 Polyimide Tape 3M™ 6035PC Laminating Adhesive 3M™ 9984 Diagnostic Microfluidic Surfactant Free Fluid TransportFilm
3M™ Adhesive 200MP 7952MP 3M™ Electrically Conductive Acrylic Pad (eCAP) 7850 3M™ Extreme Sealing Tape 4411-4412 3M™ Gripping Material 3M™ Laminating Adhesive - 300 MP 3M™ Protective Product - Bumpon™ 3M™ Safety Walk™ General Purpose 3M™ Scotch-Weld™ Structural Adhesive Film AF 163-2 3M™ Thermally Conductive Tape 8820 3M™ XYZ-Axis Electrically Conductive Adhesive Transfer Tape 9723Aaronia AG Shield
Aaronia MagnoShield® FLEXABS Plastic
Acetal
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BRM E-Webbings®
Chemours™ Viton™ Denka Performance Elastomer LLC NeopreneDSM® Dyneema®
DuPont Greentape™ 951 and 957DuPont® Mylar™
DuPont™ Delrin® 150 NC010 DuPont™ Pyralux® ACDyplast™ ISO-C1®
Eeonyx® EeonTex™ Conductive Nonwoven Fabric Flametec™ KYTEC® PVDFGEHR™ PVDF®
Geolam® Cladding
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Gutsche® Microvel® Hard Anodized Aluminum Henkel Bergquist™ Gap Pad® VO Henkel Bergquist™ IMS® Henkel Bergquist™ Sil-Pads Henkel™ Hysol® EA 9696 .060 HEXCEL® HexForce™ 282Isola 185HR
ITW® Formex™
Kevlar
King™ HY-PACT®
King™ StarBoard®
Kolon Industries® ASTROLL® Kolon Industries® SECURA®Kuraray Vectran™
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Lydall® dBCore® Gradient Density InsulationLydall® LyTherm®
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Quadrant™ Duratron® D7000 PI Quadrant™ EPP Ertalyte® PET-P Quadrant™ EPP Ketron® Quadrant™ Techtron® HPV Rochling™ LubX® C Rochling™ SUSTAPEEK Rogers™ Bisco™ BF-1000 Rogers™ Poron™ Foam 4701-50 Series Rogers™ RF-120 Reflective Silicone Heat Shield Rogers™ RO3000® Laminates Sabic™ 8B35V Lexan™ Polycarbonate FilmSaint-Gobain ADFORS
Saint-Gobain™ Meldin® Saint-Gobain™ Norglide® Saint-Gobain™ Rulon® Saint-Gobain™ Solar Guard® Sekisui™ 5782 Double Faced TapeShowTex CALMUC IFR
Silicone Rubber
Solvay Halar™
Solvay Radel® R-5500 Technical Products, Inc™ SemitronTeflon
Tekra™ Marnot™ XL Hardcoated Lexan™ PC Tekra™ Protek™ Weatherable Clear Polyester Thorlabs™ ITO-Coated PET FilmToray® TORAYCA®
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