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MEETINGSJOINABOUT
JC-70, JEDEC’s newest main committee, is focused on the development of universal standards to help advance the adoption of wide bandgap (WBG) power technologies. STANDARDS & DOCUMENTS SEARCH HIGHLY ACCELERATED TEMPERATURE AND HUMIDITY STRESS TEST (HAST) JESD22-A110E. JOINT IPC/JEDEC STANDARD FOR HANDLING, PACKING, SHIPPING, AND USE OF MOISTURE/REFLOW SENSITIVE SURFACE-MOUNT DEVICES. J-STD-033D. JOINT IPC/JEDEC STANDARD FOR MOISTURE/REFLOW SENSITIVITY CLASSIFICATION FOR NONHERMETIC SURFACE-MOUNT DEVICES. STANDARDS & DOCUMENTS SEARCH JEP70C. Oct 2013. This document gathers and organizes common standards and publications relating to quality processes and methods relating to the solid-state, microelectronics, and associated industries. This is intended to facilitate access to the applicable documents when working with electronic hardware. STANDARDS & DOCUMENTS SEARCH Status: SupersededBy J-STD-046, July 2016. JESD46D. Dec 2011. This standard establishes procedures to notify customers of semiconductor product and process changes. Requirements include: documentation; procedures for classification, notification and customer response; content; and records. Documentation of a suppliers change notificationsystem
REGISTERED OUTLINES: JEP95 Registered Outlines: JEP95. JEP95, JEDEC Registered and Standard Outlines for Solid State and Related Products, is a compilation of some 3000 pages of outline drawings for microelectronic packages including transistors, diodes, DIPS, chip carriers, sockets, and package interface BGA outlines in both inch and metric versions. STANDARDS & DOCUMENTS SEARCH JESD84-B51A. Jan 2019. This document provides a comprehensive definition of the e •MMC Electrical Interface, its environment, and handling. It also provides design guidelines and defines a tool box of macro functions and algorithms intended to reduce design-in overhead. The purpose of this standard is the definition of the e •MMCElectrical
JEP30: PART MODEL GUIDELINES JEP30: Part Model Guidelines. JEP30 and its related documents are currently published and maintained as a JEDEC-wide project between the JC-11, JC-14, JC-15 and JC-42 Committees. JEP30 establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products. CUSTOMER NOTIFICATION STANDARD FOR PRODUCT/PROCESS … J-STD-046. Published: Jul 2016. This standard is applicable to suppliers of, and affected customers for, electronic products and their constituent components. This standard establishes the requirements for timely customer notification of changes to electronic products and associated processes. This document replaces JESD46. Committee (s): JC-14.4. LOW TEMPERATURE STORAGE LIFE The test is applicable for evaluation, screening, monitoring, and/or qualification of all solid state devices Low Temperature storage test is typically used to determine the effect of time and temperature, under storage conditions, for thermally activated failure mechanisms of solid state electronic devices, including nonvolatile memory devices (data retention failure mechanisms). DDR4 MINI WORKSHOPDDR4 MINI WORKSHOP Disclaimer E th h M j it f DDR4 h b d fi d/Fi d thEven though Majority of DDR4 spec has been defined/Fixed, there might be chance of updatebefore publicationt
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JC-70, JEDEC’s newest main committee, is focused on the development of universal standards to help advance the adoption of wide bandgap (WBG) power technologies. STANDARDS & DOCUMENTS SEARCH HIGHLY ACCELERATED TEMPERATURE AND HUMIDITY STRESS TEST (HAST) JESD22-A110E. JOINT IPC/JEDEC STANDARD FOR HANDLING, PACKING, SHIPPING, AND USE OF MOISTURE/REFLOW SENSITIVE SURFACE-MOUNT DEVICES. J-STD-033D. JOINT IPC/JEDEC STANDARD FOR MOISTURE/REFLOW SENSITIVITY CLASSIFICATION FOR NONHERMETIC SURFACE-MOUNT DEVICES. STANDARDS & DOCUMENTS SEARCH JEP70C. Oct 2013. This document gathers and organizes common standards and publications relating to quality processes and methods relating to the solid-state, microelectronics, and associated industries. This is intended to facilitate access to the applicable documents when working with electronic hardware. STANDARDS & DOCUMENTS SEARCH Status: SupersededBy J-STD-046, July 2016. JESD46D. Dec 2011. This standard establishes procedures to notify customers of semiconductor product and process changes. Requirements include: documentation; procedures for classification, notification and customer response; content; and records. Documentation of a suppliers change notificationsystem
REGISTERED OUTLINES: JEP95 Registered Outlines: JEP95. JEP95, JEDEC Registered and Standard Outlines for Solid State and Related Products, is a compilation of some 3000 pages of outline drawings for microelectronic packages including transistors, diodes, DIPS, chip carriers, sockets, and package interface BGA outlines in both inch and metric versions. STANDARDS & DOCUMENTS SEARCH JESD84-B51A. Jan 2019. This document provides a comprehensive definition of the e •MMC Electrical Interface, its environment, and handling. It also provides design guidelines and defines a tool box of macro functions and algorithms intended to reduce design-in overhead. The purpose of this standard is the definition of the e •MMCElectrical
JEP30: PART MODEL GUIDELINES JEP30: Part Model Guidelines. JEP30 and its related documents are currently published and maintained as a JEDEC-wide project between the JC-11, JC-14, JC-15 and JC-42 Committees. JEP30 establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products. CUSTOMER NOTIFICATION STANDARD FOR PRODUCT/PROCESS … J-STD-046. Published: Jul 2016. This standard is applicable to suppliers of, and affected customers for, electronic products and their constituent components. This standard establishes the requirements for timely customer notification of changes to electronic products and associated processes. This document replaces JESD46. Committee (s): JC-14.4. LOW TEMPERATURE STORAGE LIFE The test is applicable for evaluation, screening, monitoring, and/or qualification of all solid state devices Low Temperature storage test is typically used to determine the effect of time and temperature, under storage conditions, for thermally activated failure mechanisms of solid state electronic devices, including nonvolatile memory devices (data retention failure mechanisms). DDR4 MINI WORKSHOPDDR4 MINI WORKSHOP Disclaimer E th h M j it f DDR4 h b d fi d/Fi d thEven though Majority of DDR4 spec has been defined/Fixed, there might be chance of updatebefore publicationt
STANDARDS & DOCUMENTS SEARCH Aug 2018. This standard describes a baseline set of acceptance tests for use in qualifying electronic components as new products, a product family, or as products in a process which is being changed. Committee (s): JC-14.3. Available for purchase: $76.00 Add to Cart. STANDARDS & DOCUMENTS SEARCH JC-13: Government Liaison (4) Apply JC-13: Government Liaison filter JC-14: Quality and Reliability of Solid State Products (10) Apply JC-14: Quality and Reliability of Solid State Products filter JC-16: Interface Technology (1) Apply JC-16: Interface Technology filter JC-42: Solid State Memories (1) Apply JC-42: Solid State Memories filter JC-45: DRAM Modules (1) Apply JC-45: DRAM Modules filter STANDARDS & DOCUMENTS SEARCH JESD47K. Aug 2018. This standard describes a baseline set of acceptance tests for use in qualifying electronic components as new products, a product family, or as products in a process which is being changed. Committee (s): JC-14.3. Available for purchase: $76.00 Add to Cart. To help cover the costs of producing standards, JEDEC is nowcharging
STANDARDS & DOCUMENTS SEARCH JEP70C. Oct 2013. This document gathers and organizes common standards and publications relating to quality processes and methods relating to the solid-state, microelectronics, and associated industries. This is intended to facilitate access to the applicable documents when working with electronic hardware. STANDARDS & DOCUMENTS SEARCH RELIABILITY QUALIFICATION OF POWER AMPLIFIER MODULES. JESD237. Mar 2014. This standard is intended to identify a core set of qualification tests that apply specifically for Power Amplifier Modules and their primary application in mobile devices such as cellular phones. This standard is intended to describe specific stresses and failure STANDARDS & DOCUMENTS SEARCH JC-10: Terms, Definitions, and Symbols (17) Apply JC-10: Terms, Definitions, and Symbols filter JC-11: Mechanical Standardization (600) Apply JC-11: Mechanical Standardization filter JC-13: Government Liaison (36) Apply JC-13: Government Liaison filter JC-14: Quality and Reliability of Solid State Products (154) Apply JC-14: Quality and Reliability of Solid State Products filter JEP30: PART MODEL GUIDELINES JEP30: Part Model Guidelines. JEP30 and its related documents are currently published and maintained as a JEDEC-wide project between the JC-11, JC-14, JC-15 and JC-42 Committees. JEP30 establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products.JC-70 | JEDEC
JC-70 Wide Bandgap Power Electronic Conversion Semiconductors is JEDEC's newest main committee. Led by Chair Dr. Stephanie Watts Butler from Texas Instruments, the new JC-70 committee has two subcommittees: JC-70.1 Subcommittee for GaN Power Electronic Conversion Semiconductor Standards, and JC-70.2 Subcommittee for SiC Power Electronic Conversion Semiconductor Standards.JC-14 | JEDEC
JC-14 is responsible for standardizing quality and reliability methodologies for solid state products used in commercial applications such as computers, automobiles, telecommunications equipment, etc. It also includes developing standards for board-level reliability of solid state products used in ESD: ELECTROSTATIC DISCHARGE ESD: Electrostatic Discharge. JEDEC has taken a leadership role in developing standards for ESD since the early 1980s, including standards for device handling and test methods related to ESD. Below is a summary of useful standards and documents related to ESD. HOME | JEDECSTANDARDS & DOCUMENTSCOMMITTEESNEWSEVENTS &MEETINGSJOINABOUT
JC-70, JEDEC’s newest main committee, is focused on the development of universal standards to help advance the adoption of wide bandgap (WBG) power technologies. STANDARDS & DOCUMENTS SEARCH HIGHLY ACCELERATED TEMPERATURE AND HUMIDITY STRESS TEST (HAST) JESD22-A110E. JOINT IPC/JEDEC STANDARD FOR HANDLING, PACKING, SHIPPING, AND USE OF MOISTURE/REFLOW SENSITIVE SURFACE-MOUNT DEVICES. J-STD-033D. JOINT IPC/JEDEC STANDARD FOR MOISTURE/REFLOW SENSITIVITY CLASSIFICATION FOR NONHERMETIC SURFACE-MOUNT DEVICES. STANDARDS & DOCUMENTS SEARCH JEP70C. Oct 2013. This document gathers and organizes common standards and publications relating to quality processes and methods relating to the solid-state, microelectronics, and associated industries. This is intended to facilitate access to the applicable documents when working with electronic hardware. STANDARDS & DOCUMENTS SEARCH Status: SupersededBy J-STD-046, July 2016. JESD46D. Dec 2011. This standard establishes procedures to notify customers of semiconductor product and process changes. Requirements include: documentation; procedures for classification, notification and customer response; content; and records. Documentation of a suppliers change notificationsystem
REGISTERED OUTLINES: JEP95 Registered Outlines: JEP95. JEP95, JEDEC Registered and Standard Outlines for Solid State and Related Products, is a compilation of some 3000 pages of outline drawings for microelectronic packages including transistors, diodes, DIPS, chip carriers, sockets, and package interface BGA outlines in both inch and metric versions. STANDARDS & DOCUMENTS SEARCH JESD84-B51A. Jan 2019. This document provides a comprehensive definition of the e •MMC Electrical Interface, its environment, and handling. It also provides design guidelines and defines a tool box of macro functions and algorithms intended to reduce design-in overhead. The purpose of this standard is the definition of the e •MMCElectrical
JEP30: PART MODEL GUIDELINES JEP30: Part Model Guidelines. JEP30 and its related documents are currently published and maintained as a JEDEC-wide project between the JC-11, JC-14, JC-15 and JC-42 Committees. JEP30 establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products. CUSTOMER NOTIFICATION STANDARD FOR PRODUCT/PROCESS … J-STD-046. Published: Jul 2016. This standard is applicable to suppliers of, and affected customers for, electronic products and their constituent components. This standard establishes the requirements for timely customer notification of changes to electronic products and associated processes. This document replaces JESD46. Committee (s): JC-14.4. LOW TEMPERATURE STORAGE LIFE The test is applicable for evaluation, screening, monitoring, and/or qualification of all solid state devices Low Temperature storage test is typically used to determine the effect of time and temperature, under storage conditions, for thermally activated failure mechanisms of solid state electronic devices, including nonvolatile memory devices (data retention failure mechanisms). DDR4 MINI WORKSHOPDDR4 MINI WORKSHOP Disclaimer E th h M j it f DDR4 h b d fi d/Fi d thEven though Majority of DDR4 spec has been defined/Fixed, there might be chance of updatebefore publicationt
HOME | JEDECSTANDARDS & DOCUMENTSCOMMITTEESNEWSEVENTS &MEETINGSJOINABOUT
JC-70, JEDEC’s newest main committee, is focused on the development of universal standards to help advance the adoption of wide bandgap (WBG) power technologies. STANDARDS & DOCUMENTS SEARCH HIGHLY ACCELERATED TEMPERATURE AND HUMIDITY STRESS TEST (HAST) JESD22-A110E. JOINT IPC/JEDEC STANDARD FOR HANDLING, PACKING, SHIPPING, AND USE OF MOISTURE/REFLOW SENSITIVE SURFACE-MOUNT DEVICES. J-STD-033D. JOINT IPC/JEDEC STANDARD FOR MOISTURE/REFLOW SENSITIVITY CLASSIFICATION FOR NONHERMETIC SURFACE-MOUNT DEVICES. STANDARDS & DOCUMENTS SEARCH JEP70C. Oct 2013. This document gathers and organizes common standards and publications relating to quality processes and methods relating to the solid-state, microelectronics, and associated industries. This is intended to facilitate access to the applicable documents when working with electronic hardware. STANDARDS & DOCUMENTS SEARCH Status: SupersededBy J-STD-046, July 2016. JESD46D. Dec 2011. This standard establishes procedures to notify customers of semiconductor product and process changes. Requirements include: documentation; procedures for classification, notification and customer response; content; and records. Documentation of a suppliers change notificationsystem
REGISTERED OUTLINES: JEP95 Registered Outlines: JEP95. JEP95, JEDEC Registered and Standard Outlines for Solid State and Related Products, is a compilation of some 3000 pages of outline drawings for microelectronic packages including transistors, diodes, DIPS, chip carriers, sockets, and package interface BGA outlines in both inch and metric versions. STANDARDS & DOCUMENTS SEARCH JESD84-B51A. Jan 2019. This document provides a comprehensive definition of the e •MMC Electrical Interface, its environment, and handling. It also provides design guidelines and defines a tool box of macro functions and algorithms intended to reduce design-in overhead. The purpose of this standard is the definition of the e •MMCElectrical
JEP30: PART MODEL GUIDELINES JEP30: Part Model Guidelines. JEP30 and its related documents are currently published and maintained as a JEDEC-wide project between the JC-11, JC-14, JC-15 and JC-42 Committees. JEP30 establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products. CUSTOMER NOTIFICATION STANDARD FOR PRODUCT/PROCESS … J-STD-046. Published: Jul 2016. This standard is applicable to suppliers of, and affected customers for, electronic products and their constituent components. This standard establishes the requirements for timely customer notification of changes to electronic products and associated processes. This document replaces JESD46. Committee (s): JC-14.4. LOW TEMPERATURE STORAGE LIFE The test is applicable for evaluation, screening, monitoring, and/or qualification of all solid state devices Low Temperature storage test is typically used to determine the effect of time and temperature, under storage conditions, for thermally activated failure mechanisms of solid state electronic devices, including nonvolatile memory devices (data retention failure mechanisms). DDR4 MINI WORKSHOPDDR4 MINI WORKSHOP Disclaimer E th h M j it f DDR4 h b d fi d/Fi d thEven though Majority of DDR4 spec has been defined/Fixed, there might be chance of updatebefore publicationt
STANDARDS & DOCUMENTS SEARCH Aug 2018. This standard describes a baseline set of acceptance tests for use in qualifying electronic components as new products, a product family, or as products in a process which is being changed. Committee (s): JC-14.3. Available for purchase: $76.00 Add to Cart. STANDARDS & DOCUMENTS SEARCH JC-13: Government Liaison (4) Apply JC-13: Government Liaison filter JC-14: Quality and Reliability of Solid State Products (10) Apply JC-14: Quality and Reliability of Solid State Products filter JC-16: Interface Technology (1) Apply JC-16: Interface Technology filter JC-42: Solid State Memories (1) Apply JC-42: Solid State Memories filter JC-45: DRAM Modules (1) Apply JC-45: DRAM Modules filter STANDARDS & DOCUMENTS SEARCH JESD47K. Aug 2018. This standard describes a baseline set of acceptance tests for use in qualifying electronic components as new products, a product family, or as products in a process which is being changed. Committee (s): JC-14.3. Available for purchase: $76.00 Add to Cart. To help cover the costs of producing standards, JEDEC is nowcharging
STANDARDS & DOCUMENTS SEARCH JEP70C. Oct 2013. This document gathers and organizes common standards and publications relating to quality processes and methods relating to the solid-state, microelectronics, and associated industries. This is intended to facilitate access to the applicable documents when working with electronic hardware. STANDARDS & DOCUMENTS SEARCH RELIABILITY QUALIFICATION OF POWER AMPLIFIER MODULES. JESD237. Mar 2014. This standard is intended to identify a core set of qualification tests that apply specifically for Power Amplifier Modules and their primary application in mobile devices such as cellular phones. This standard is intended to describe specific stresses and failure STANDARDS & DOCUMENTS SEARCH JC-10: Terms, Definitions, and Symbols (17) Apply JC-10: Terms, Definitions, and Symbols filter JC-11: Mechanical Standardization (600) Apply JC-11: Mechanical Standardization filter JC-13: Government Liaison (36) Apply JC-13: Government Liaison filter JC-14: Quality and Reliability of Solid State Products (154) Apply JC-14: Quality and Reliability of Solid State Products filter JEP30: PART MODEL GUIDELINES JEP30: Part Model Guidelines. JEP30 and its related documents are currently published and maintained as a JEDEC-wide project between the JC-11, JC-14, JC-15 and JC-42 Committees. JEP30 establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products.JC-70 | JEDEC
JC-70 Wide Bandgap Power Electronic Conversion Semiconductors is JEDEC's newest main committee. Led by Chair Dr. Stephanie Watts Butler from Texas Instruments, the new JC-70 committee has two subcommittees: JC-70.1 Subcommittee for GaN Power Electronic Conversion Semiconductor Standards, and JC-70.2 Subcommittee for SiC Power Electronic Conversion Semiconductor Standards.JC-14 | JEDEC
JC-14 is responsible for standardizing quality and reliability methodologies for solid state products used in commercial applications such as computers, automobiles, telecommunications equipment, etc. It also includes developing standards for board-level reliability of solid state products used in ESD: ELECTROSTATIC DISCHARGE ESD: Electrostatic Discharge. JEDEC has taken a leadership role in developing standards for ESD since the early 1980s, including standards for device handling and test methods related to ESD. Below is a summary of useful standards and documents related to ESD. HOME | JEDECSTANDARDS & DOCUMENTSCOMMITTEESNEWSEVENTS &MEETINGSJOINABOUT
JC-70, JEDEC’s newest main committee, is focused on the development of universal standards to help advance the adoption of wide bandgap (WBG) power technologies. STANDARDS & DOCUMENTS SEARCH JEP70C. Oct 2013. This document gathers and organizes common standards and publications relating to quality processes and methods relating to the solid-state, microelectronics, and associated industries. This is intended to facilitate access to the applicable documents when working with electronic hardware. STANDARDS & DOCUMENTS SEARCH RELIABILITY QUALIFICATION OF POWER AMPLIFIER MODULES. JESD237. Mar 2014. This standard is intended to identify a core set of qualification tests that apply specifically for Power Amplifier Modules and their primary application in mobile devices such as cellular phones. This standard is intended to describe specific stresses and failure STANDARDS & DOCUMENTS SEARCH Title Document # Date; Addendum No. 1 to JESD79-3 - 1.35 V DDR3L-800, DDR3L-1066, DDR3L-1333, DDR3L-1600, and DDR3L-1866 This is a minor editorial revision, the differences between revisions can be found on page 17 of the document. ROCS WORKSHOP: MAY 24, 2021 Registration is now closed. On Monday, May 24, 2021 we will hold the 35th Annual ROCS (Reliability of Compound Semiconductors) Workshop. ROCS will be co-located with the CS MANTECH Conference on its online, virtual conference platform, with the objective of bringing together researchers, manufacturers and users of compound semiconductordevices.
CUSTOMER NOTIFICATION STANDARD FOR PRODUCT/PROCESS … J-STD-046. Published: Jul 2016. This standard is applicable to suppliers of, and affected customers for, electronic products and their constituent components. This standard establishes the requirements for timely customer notification of changes to electronic products and associated processes. This document replaces JESD46. Committee (s): JC-14.4. LONG-TERM STORAGE GUIDELINES FOR ELECTRONIC SOLID … This publication examines the LTS requirements of wafers, dice, and packaged solid-state devices. The user should evaluate and choose the best practices to ensure their product will maintain as-received device integrity and minimize age- and storage-related degradation effects. Committee (s): GUIDELINES FOR MEASURING THE THRESHOLD VOLTAGE (VT) OF SIC JEP183. Published: Jan 2021. This publication describes the guidelines for VT measurement methods and conditioning prior to VT testing in SiC power MOSFETs to reduce or eliminate the effect of the aforementioned hysteresis. Committee (s): JC-70.1. Free download. Registration orlogin required.
LOW TEMPERATURE STORAGE LIFE The test is applicable for evaluation, screening, monitoring, and/or qualification of all solid state devices Low Temperature storage test is typically used to determine the effect of time and temperature, under storage conditions, for thermally activated failure mechanisms of solid state electronic devices, including nonvolatile memory devices (data retention failure mechanisms).REGISTRATION
registration - 288 pin ddr5 dimm smt, 0.85 mm pitch socket outline. so-023c. published: sep 2020 HOME | JEDECSTANDARDS & DOCUMENTSCOMMITTEESNEWSEVENTS &MEETINGSJOINABOUT
JC-70, JEDEC’s newest main committee, is focused on the development of universal standards to help advance the adoption of wide bandgap (WBG) power technologies. STANDARDS & DOCUMENTS SEARCH JEP70C. Oct 2013. This document gathers and organizes common standards and publications relating to quality processes and methods relating to the solid-state, microelectronics, and associated industries. This is intended to facilitate access to the applicable documents when working with electronic hardware. STANDARDS & DOCUMENTS SEARCH RELIABILITY QUALIFICATION OF POWER AMPLIFIER MODULES. JESD237. Mar 2014. This standard is intended to identify a core set of qualification tests that apply specifically for Power Amplifier Modules and their primary application in mobile devices such as cellular phones. This standard is intended to describe specific stresses and failure STANDARDS & DOCUMENTS SEARCH Title Document # Date; Addendum No. 1 to JESD79-3 - 1.35 V DDR3L-800, DDR3L-1066, DDR3L-1333, DDR3L-1600, and DDR3L-1866 This is a minor editorial revision, the differences between revisions can be found on page 17 of the document. ROCS WORKSHOP: MAY 24, 2021 Registration is now closed. On Monday, May 24, 2021 we will hold the 35th Annual ROCS (Reliability of Compound Semiconductors) Workshop. ROCS will be co-located with the CS MANTECH Conference on its online, virtual conference platform, with the objective of bringing together researchers, manufacturers and users of compound semiconductordevices.
CUSTOMER NOTIFICATION STANDARD FOR PRODUCT/PROCESS … J-STD-046. Published: Jul 2016. This standard is applicable to suppliers of, and affected customers for, electronic products and their constituent components. This standard establishes the requirements for timely customer notification of changes to electronic products and associated processes. This document replaces JESD46. Committee (s): JC-14.4. LONG-TERM STORAGE GUIDELINES FOR ELECTRONIC SOLID … This publication examines the LTS requirements of wafers, dice, and packaged solid-state devices. The user should evaluate and choose the best practices to ensure their product will maintain as-received device integrity and minimize age- and storage-related degradation effects. Committee (s): GUIDELINES FOR MEASURING THE THRESHOLD VOLTAGE (VT) OF SIC JEP183. Published: Jan 2021. This publication describes the guidelines for VT measurement methods and conditioning prior to VT testing in SiC power MOSFETs to reduce or eliminate the effect of the aforementioned hysteresis. Committee (s): JC-70.1. Free download. Registration orlogin required.
LOW TEMPERATURE STORAGE LIFE The test is applicable for evaluation, screening, monitoring, and/or qualification of all solid state devices Low Temperature storage test is typically used to determine the effect of time and temperature, under storage conditions, for thermally activated failure mechanisms of solid state electronic devices, including nonvolatile memory devices (data retention failure mechanisms).REGISTRATION
registration - 288 pin ddr5 dimm smt, 0.85 mm pitch socket outline. so-023c. published: sep 2020 STANDARDS & DOCUMENTS SEARCH JC-13: Government Liaison (4) Apply JC-13: Government Liaison filter JC-14: Quality and Reliability of Solid State Products (10) Apply JC-14: Quality and Reliability of Solid State Products filter JC-16: Interface Technology (1) Apply JC-16: Interface Technology filter JC-42: Solid State Memories (1) Apply JC-42: Solid State Memories filter JC-45: DRAM Modules (1) Apply JC-45: DRAM Modules filter STANDARDS & DOCUMENTS SEARCH The appropriate references to existing and proposed JEDEC (or EIA) standards and publications are cited. This document is also intended to provide an educational background and overview of some of the technical and economic factors associated with assessing and qualifying microcircuit reliability. Committee (s): JC-14, JC-14.3. STANDARDS & DOCUMENTS SEARCH JEP70C. Oct 2013. This document gathers and organizes common standards and publications relating to quality processes and methods relating to the solid-state, microelectronics, and associated industries. This is intended to facilitate access to the applicable documents when working with electronic hardware. STANDARDS & DOCUMENTS SEARCH JC-10: Terms, Definitions, and Symbols (17) Apply JC-10: Terms, Definitions, and Symbols filter JC-11: Mechanical Standardization (600) Apply JC-11: Mechanical Standardization filter JC-13: Government Liaison (36) Apply JC-13: Government Liaison filter JC-14: Quality and Reliability of Solid State Products (154) Apply JC-14: Quality and Reliability of Solid State Products filter STANDARDS & DOCUMENTS SEARCH This standard defines the form, fit and function of DDR4 connectors for U/R/LR modules supporting channels with transfer rates as high as 3.2 GT/S. It contains mechanical, electrical and reliability requirements for a one-piece connector mated to a module with nominal thickness of 1.40 mm. The intent of this document is to providePerformance
STANDARD MANUFACTURERS IDENTIFICATION CODE JEP106BC. The manufacturers identification code is defined by one or more 8 bit fields, each consisting of 7 data bits plus 1 odd parity bit. The manufacturers identification code is assigned, maintained and updated by the JEDEC Office. The intent of this identification code is that it may be used whenever a digital field is required, e.g STANDARDS & DOCUMENTS SEARCH JESD84-B51A. Jan 2019. This document provides a comprehensive definition of the e •MMC Electrical Interface, its environment, and handling. It also provides design guidelines and defines a tool box of macro functions and algorithms intended to reduce design-in overhead. The purpose of this standard is the definition of the e •MMCElectrical
RECOMMENDED ESD TARGET LEVELS FOR HBM/MM QUALIFICATION … JEP155B. This document was written with the intent to provide information for quality organizations in both semiconductor companies and their customers to assess and make decisions on safe ESD level requirements. It will be shown through this document why realistic modifying of the ESD target levels for component level ESD is not onlyessential
INSPECTION CRITERIA FOR MICROELECTRONIC PACKAGES AND Published: May 2017. The purpose of this JEDEC standard is to verify the workmanship and requirements of microelectronic packages and covers (lids) intended for use in fabricating hybrid microelectronic circuits/microcircuits (hereafter referred to as “microcircuits”). It is applicable for use by the package manufacturer (i.e., package MARKING, SYMBOLS, AND LABELS FOR IDENTIFICATION OF … marking, symbols, and labels for identification of lead (pb) free assemblies, components, and devices - superseded by j-std-609, august2007
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JC-70, JEDEC’s newest main committee, is focused on the development of universal standards to help advance the adoption of wide bandgap (WBG) power technologies. STANDARDS & DOCUMENTS SEARCH JEP70C. Oct 2013. This document gathers and organizes common standards and publications relating to quality processes and methods relating to the solid-state, microelectronics, and associated industries. This is intended to facilitate access to the applicable documents when working with electronic hardware. STANDARDS & DOCUMENTS SEARCH Title Document # Date; Addendum No. 1 to JESD79-3 - 1.35 V DDR3L-800, DDR3L-1066, DDR3L-1333, DDR3L-1600, and DDR3L-1866 This is a minor editorial revision, the differences between revisions can be found on page 17 of the document. CUSTOMER NOTIFICATION STANDARD FOR PRODUCT/PROCESS …JEDEC MEMORY STANDARDJEDEC STANDARD PDFJEDEC STANDARD TRAYSWHAT IS JEDEC J-STD-046. Published: Jul 2016. This standard is applicable to suppliers of, and affected customers for, electronic products and their constituent components. This standard establishes the requirements for timely customer notification of changes to electronic products and associated processes. This document replaces JESD46. Committee (s): JC-14.4. ROCS WORKSHOP: MAY 24, 2021 Registration is now closed. On Monday, May 24, 2021 we will hold the 35th Annual ROCS (Reliability of Compound Semiconductors) Workshop. ROCS will be co-located with the CS MANTECH Conference on its online, virtual conference platform, with the objective of bringing together researchers, manufacturers and users of compound semiconductordevices.
LONG-TERM STORAGE GUIDELINES FOR ELECTRONIC SOLID … This publication examines the LTS requirements of wafers, dice, and packaged solid-state devices. The user should evaluate and choose the best practices to ensure their product will maintain as-received device integrity and minimize age- and storage-related degradation effects. Committee (s): LOW TEMPERATURE STORAGE LIFE The test is applicable for evaluation, screening, monitoring, and/or qualification of all solid state devices Low Temperature storage test is typically used to determine the effect of time and temperature, under storage conditions, for thermally activated failure mechanisms of solid state electronic devices, including nonvolatile memory devices (data retention failure mechanisms).REGISTRATION
registration - 288 pin ddr5 dimm smt, 0.85 mm pitch socket outline. so-023c. published: sep 2020 STRESS-TEST-DRIVEN QUALIFICATION OF AND FAILURE … This publication contains a set of frequently recommended and accepted JEDEC reliability stress tests. These tests are used for qualifying new and modified technology/ process/ product families, as well as individual solid state surface-mount products, in particular leadless chip carriers, ball grid array (BGA) packages, direct chip attach die and packages with exposed pads that are attached UNDERSTANDING THE MOST ADVANCED FUTURE MOBILE DRAM SOLUTIONS Global Mobile Data Traffic 6 8 10 12 Exabytes per Month 7.4 EB 11.2 EB 66% CAGR 2012–2017 13X 0 2 4 2012 2013 2014 2015 2016 2017 0.9 EB 4.7 EB 2.8 EB 1.6 EB Source HOME | JEDECSTANDARDS & DOCUMENTSCOMMITTEESNEWSEVENTS &MEETINGSJOINABOUT
JC-70, JEDEC’s newest main committee, is focused on the development of universal standards to help advance the adoption of wide bandgap (WBG) power technologies. STANDARDS & DOCUMENTS SEARCH JEP70C. Oct 2013. This document gathers and organizes common standards and publications relating to quality processes and methods relating to the solid-state, microelectronics, and associated industries. This is intended to facilitate access to the applicable documents when working with electronic hardware. STANDARDS & DOCUMENTS SEARCH Title Document # Date; Addendum No. 1 to JESD79-3 - 1.35 V DDR3L-800, DDR3L-1066, DDR3L-1333, DDR3L-1600, and DDR3L-1866 This is a minor editorial revision, the differences between revisions can be found on page 17 of the document. CUSTOMER NOTIFICATION STANDARD FOR PRODUCT/PROCESS …JEDEC MEMORY STANDARDJEDEC STANDARD PDFJEDEC STANDARD TRAYSWHAT IS JEDEC J-STD-046. Published: Jul 2016. This standard is applicable to suppliers of, and affected customers for, electronic products and their constituent components. This standard establishes the requirements for timely customer notification of changes to electronic products and associated processes. This document replaces JESD46. Committee (s): JC-14.4. ROCS WORKSHOP: MAY 24, 2021 Registration is now closed. On Monday, May 24, 2021 we will hold the 35th Annual ROCS (Reliability of Compound Semiconductors) Workshop. ROCS will be co-located with the CS MANTECH Conference on its online, virtual conference platform, with the objective of bringing together researchers, manufacturers and users of compound semiconductordevices.
LONG-TERM STORAGE GUIDELINES FOR ELECTRONIC SOLID … This publication examines the LTS requirements of wafers, dice, and packaged solid-state devices. The user should evaluate and choose the best practices to ensure their product will maintain as-received device integrity and minimize age- and storage-related degradation effects. Committee (s): LOW TEMPERATURE STORAGE LIFE The test is applicable for evaluation, screening, monitoring, and/or qualification of all solid state devices Low Temperature storage test is typically used to determine the effect of time and temperature, under storage conditions, for thermally activated failure mechanisms of solid state electronic devices, including nonvolatile memory devices (data retention failure mechanisms).REGISTRATION
registration - 288 pin ddr5 dimm smt, 0.85 mm pitch socket outline. so-023c. published: sep 2020 STRESS-TEST-DRIVEN QUALIFICATION OF AND FAILURE … This publication contains a set of frequently recommended and accepted JEDEC reliability stress tests. These tests are used for qualifying new and modified technology/ process/ product families, as well as individual solid state surface-mount products, in particular leadless chip carriers, ball grid array (BGA) packages, direct chip attach die and packages with exposed pads that are attached UNDERSTANDING THE MOST ADVANCED FUTURE MOBILE DRAM SOLUTIONS Global Mobile Data Traffic 6 8 10 12 Exabytes per Month 7.4 EB 11.2 EB 66% CAGR 2012–2017 13X 0 2 4 2012 2013 2014 2015 2016 2017 0.9 EB 4.7 EB 2.8 EB 1.6 EB Source STANDARDS & DOCUMENTS SEARCH JC-13: Government Liaison (4) Apply JC-13: Government Liaison filter JC-14: Quality and Reliability of Solid State Products (10) Apply JC-14: Quality and Reliability of Solid State Products filter JC-16: Interface Technology (1) Apply JC-16: Interface Technology filter JC-42: Solid State Memories (1) Apply JC-42: Solid State Memories filter JC-45: DRAM Modules (1) Apply JC-45: DRAM Modules filter STANDARDS & DOCUMENTS SEARCH JC-10: Terms, Definitions, and Symbols (17) Apply JC-10: Terms, Definitions, and Symbols filter JC-11: Mechanical Standardization (600) Apply JC-11: Mechanical Standardization filter JC-13: Government Liaison (36) Apply JC-13: Government Liaison filter JC-14: Quality and Reliability of Solid State Products (154) Apply JC-14: Quality and Reliability of Solid State Products filter STANDARDS & DOCUMENTS SEARCH This standard defines the form, fit and function of DDR4 connectors for U/R/LR modules supporting channels with transfer rates as high as 3.2 GT/S. It contains mechanical, electrical and reliability requirements for a one-piece connector mated to a module with nominal thickness of 1.40 mm. The intent of this document is to providePerformance
STANDARDS & DOCUMENTS SEARCH JEP70C. Oct 2013. This document gathers and organizes common standards and publications relating to quality processes and methods relating to the solid-state, microelectronics, and associated industries. This is intended to facilitate access to the applicable documents when working with electronic hardware. STANDARDS & DOCUMENTS SEARCH The appropriate references to existing and proposed JEDEC (or EIA) standards and publications are cited. This document is also intended to provide an educational background and overview of some of the technical and economic factors associated with assessing and qualifying microcircuit reliability. Committee (s): JC-14, JC-14.3. STANDARDS & DOCUMENTS SEARCH JESD251A. Feb 2020. This standard is intended for use by SoC, ASIC, ASSP, and FPGA developers or vendors interested in incorporating a master interface having a low signal count and high data transfer bandwidth with access to multiple sources of slave devices compliant with the interface. It is also, intended for use by peripheraldevelopers or
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Please direct all media inquiries to: Emily Desjardins JEDEC Director of Marketing & Communications 703-907-7560 Email Emily STANDARD MANUFACTURERS IDENTIFICATION CODE JEP106BC. The manufacturers identification code is defined by one or more 8 bit fields, each consisting of 7 data bits plus 1 odd parity bit. The manufacturers identification code is assigned, maintained and updated by the JEDEC Office. The intent of this identification code is that it may be used whenever a digital field is required, e.g STANDARDS & DOCUMENTS SEARCH JESD84-B51A. Jan 2019. This document provides a comprehensive definition of the e •MMC Electrical Interface, its environment, and handling. It also provides design guidelines and defines a tool box of macro functions and algorithms intended to reduce design-in overhead. The purpose of this standard is the definition of the e •MMCElectrical
CONTENTS JEDEC STANDARD NO. 21--C RELEASE # PAGE # 1 Contents JEDEC Standard No. 21--C Release # Page # 1 2 HOME | JEDECSTANDARDS & DOCUMENTSCOMMITTEESNEWSEVENTS &MEETINGSJOINABOUT
JC-70, JEDEC’s newest main committee, is focused on the development of universal standards to help advance the adoption of wide bandgap (WBG) power technologies. STANDARDS & DOCUMENTS SEARCH HIGHLY ACCELERATED TEMPERATURE AND HUMIDITY STRESS TEST (HAST) JESD22-A110E. JOINT IPC/JEDEC STANDARD FOR HANDLING, PACKING, SHIPPING, AND USE OF MOISTURE/REFLOW SENSITIVE SURFACE-MOUNT DEVICES. J-STD-033D. JOINT IPC/JEDEC STANDARD FOR MOISTURE/REFLOW SENSITIVITY CLASSIFICATION FOR NONHERMETIC SURFACE-MOUNT DEVICES. STANDARDS & DOCUMENTS SEARCH Title Document # Date; Addendum No. 1 to JESD79-3 - 1.35 V DDR3L-800, DDR3L-1066, DDR3L-1333, DDR3L-1600, and DDR3L-1866 This is a minor editorial revision, the differences between revisions can be found on page 17 of the document. JEP30: PART MODEL GUIDELINES JEP30: Part Model Guidelines. JEP30 and its related documents are currently published and maintained as a JEDEC-wide project between the JC-11, JC-14, JC-15 and JC-42 Committees. JEP30 establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products. CUSTOMER NOTIFICATION STANDARD FOR PRODUCT/PROCESS …JEDEC MEMORY STANDARDJEDEC STANDARD PDFJEDEC STANDARD TRAYSWHAT IS JEDEC J-STD-046. Published: Jul 2016. This standard is applicable to suppliers of, and affected customers for, electronic products and their constituent components. This standard establishes the requirements for timely customer notification of changes to electronic products and associated processes. This document replaces JESD46. Committee (s): JC-14.4. STANDARDS & DOCUMENTS SEARCH JEP152. May 2007. This document is the work product of the JC-45.1 DDR2 DIMM Clock Skew Measurement task group.The purpose of this document is to define procedures to measure clock parameters on registered DIMMs using the DDR2 Clock Reference Board. It is NOT the intent of this document to set specification values or validationrequirements.
STANDARDS & DOCUMENTS SEARCH Title Document # Date; WIRE BOND SHEAR TEST: JESD22-B116B May 2017: This fully revised test provides a means for determining the strength of gold and copper ball bonds to a die or package bonding surface, and may be performed on pre-encapsulation or post-encapsulation parts. GUIDELINES FOR MEASURING THE THRESHOLD VOLTAGE (VT) OF SIC JEP183. Published: Jan 2021. This publication describes the guidelines for VT measurement methods and conditioning prior to VT testing in SiC power MOSFETs to reduce or eliminate the effect of the aforementioned hysteresis. Committee (s): JC-70.1. Free download. Registration orlogin required.
STRESS-TEST-DRIVEN QUALIFICATION OF AND FAILURE … This publication contains a set of frequently recommended and accepted JEDEC reliability stress tests. These tests are used for qualifying new and modified technology/ process/ product families, as well as individual solid state surface-mount products, in particular leadless chip carriers, ball grid array (BGA) packages, direct chip attach die and packages with exposed pads that are attached REQUIREMENTS FOR MICROELECTRONIC SCREENING AND TEST This document is designed to assist the manufacturer in optimizing the test flow while maintaining and/or improving assurance of providing high quality and reliable product in an efficient manner. This will allow for optimization of testing that is not adding value, hence, reducing cycle time and costs. Committee (s): JC-13, JC-13.2. HOME | JEDECSTANDARDS & DOCUMENTSCOMMITTEESNEWSEVENTS &MEETINGSJOINABOUT
JC-70, JEDEC’s newest main committee, is focused on the development of universal standards to help advance the adoption of wide bandgap (WBG) power technologies. STANDARDS & DOCUMENTS SEARCH HIGHLY ACCELERATED TEMPERATURE AND HUMIDITY STRESS TEST (HAST) JESD22-A110E. JOINT IPC/JEDEC STANDARD FOR HANDLING, PACKING, SHIPPING, AND USE OF MOISTURE/REFLOW SENSITIVE SURFACE-MOUNT DEVICES. J-STD-033D. JOINT IPC/JEDEC STANDARD FOR MOISTURE/REFLOW SENSITIVITY CLASSIFICATION FOR NONHERMETIC SURFACE-MOUNT DEVICES. STANDARDS & DOCUMENTS SEARCH Title Document # Date; Addendum No. 1 to JESD79-3 - 1.35 V DDR3L-800, DDR3L-1066, DDR3L-1333, DDR3L-1600, and DDR3L-1866 This is a minor editorial revision, the differences between revisions can be found on page 17 of the document. JEP30: PART MODEL GUIDELINES JEP30: Part Model Guidelines. JEP30 and its related documents are currently published and maintained as a JEDEC-wide project between the JC-11, JC-14, JC-15 and JC-42 Committees. JEP30 establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products. CUSTOMER NOTIFICATION STANDARD FOR PRODUCT/PROCESS …JEDEC MEMORY STANDARDJEDEC STANDARD PDFJEDEC STANDARD TRAYSWHAT IS JEDEC J-STD-046. Published: Jul 2016. This standard is applicable to suppliers of, and affected customers for, electronic products and their constituent components. This standard establishes the requirements for timely customer notification of changes to electronic products and associated processes. This document replaces JESD46. Committee (s): JC-14.4. STANDARDS & DOCUMENTS SEARCH JEP152. May 2007. This document is the work product of the JC-45.1 DDR2 DIMM Clock Skew Measurement task group.The purpose of this document is to define procedures to measure clock parameters on registered DIMMs using the DDR2 Clock Reference Board. It is NOT the intent of this document to set specification values or validationrequirements.
STANDARDS & DOCUMENTS SEARCH Title Document # Date; WIRE BOND SHEAR TEST: JESD22-B116B May 2017: This fully revised test provides a means for determining the strength of gold and copper ball bonds to a die or package bonding surface, and may be performed on pre-encapsulation or post-encapsulation parts. GUIDELINES FOR MEASURING THE THRESHOLD VOLTAGE (VT) OF SIC JEP183. Published: Jan 2021. This publication describes the guidelines for VT measurement methods and conditioning prior to VT testing in SiC power MOSFETs to reduce or eliminate the effect of the aforementioned hysteresis. Committee (s): JC-70.1. Free download. Registration orlogin required.
STRESS-TEST-DRIVEN QUALIFICATION OF AND FAILURE … This publication contains a set of frequently recommended and accepted JEDEC reliability stress tests. These tests are used for qualifying new and modified technology/ process/ product families, as well as individual solid state surface-mount products, in particular leadless chip carriers, ball grid array (BGA) packages, direct chip attach die and packages with exposed pads that are attached REQUIREMENTS FOR MICROELECTRONIC SCREENING AND TEST This document is designed to assist the manufacturer in optimizing the test flow while maintaining and/or improving assurance of providing high quality and reliable product in an efficient manner. This will allow for optimization of testing that is not adding value, hence, reducing cycle time and costs. Committee (s): JC-13, JC-13.2. STANDARDS & DOCUMENTS SEARCH This standard establishes requirements for the generation of electronic-device package designators for the JEDEC Solid State Technology Association. The requirements herein are intended to ensure that such designators are presented in as uniform a manner as practicable. Item 11.2-962. Committee (s): JC-11.2. STANDARDS & DOCUMENTS SEARCH JC-13: Government Liaison (4) Apply JC-13: Government Liaison filter JC-14: Quality and Reliability of Solid State Products (10) Apply JC-14: Quality and Reliability of Solid State Products filter JC-16: Interface Technology (1) Apply JC-16: Interface Technology filter JC-42: Solid State Memories (1) Apply JC-42: Solid State Memories filter JC-45: DRAM Modules (1) Apply JC-45: DRAM Modules filter STANDARDS & DOCUMENTS SEARCH JEP70C. Oct 2013. This document gathers and organizes common standards and publications relating to quality processes and methods relating to the solid-state, microelectronics, and associated industries. This is intended to facilitate access to the applicable documents when working with electronic hardware. STANDARDS & DOCUMENTS SEARCH Aug 2018. This standard describes a baseline set of acceptance tests for use in qualifying electronic components as new products, a product family, or as products in a process which is being changed. Committee (s): JC-14.3. Available for purchase: $76.00 Add to Cart. STANDARDS & DOCUMENTS SEARCH JC-10: Terms, Definitions, and Symbols (17) Apply JC-10: Terms, Definitions, and Symbols filter JC-11: Mechanical Standardization (600) Apply JC-11: Mechanical Standardization filter JC-13: Government Liaison (36) Apply JC-13: Government Liaison filter JC-14: Quality and Reliability of Solid State Products (154) Apply JC-14: Quality and Reliability of Solid State Products filter STANDARDS & DOCUMENTS SEARCH This standard defines the form, fit and function of DDR4 connectors for U/R/LR modules supporting channels with transfer rates as high as 3.2 GT/S. It contains mechanical, electrical and reliability requirements for a one-piece connector mated to a module with nominal thickness of 1.40 mm. The intent of this document is to providePerformance
STANDARDS & DOCUMENTS SEARCH JEP70C. Oct 2013. This document gathers and organizes common standards and publications relating to quality processes and methods relating to the solid-state, microelectronics, and associated industries. This is intended to facilitate access to the applicable documents when working with electronic hardware. This will have a positive effect onNEWS | JEDEC
Please direct all media inquiries to: Emily Desjardins JEDEC Director of Marketing & Communications 703-907-7560 Email Emily STANDARDS & DOCUMENTS SEARCH JESD204C. Dec 2017. This standard describes a serialized interface between data converters and logic devices. It contains normative information to enable designers to implement devices that communicate with other devices covered by this document. Informative sections are included to clarify and exemplify the standard. Committee (s): JC-16. STANDARDS & DOCUMENTS SEARCH JESD251A. Feb 2020. This standard is intended for use by SoC, ASIC, ASSP, and FPGA developers or vendors interested in incorporating a master interface having a low signal count and high data transfer bandwidth with access to multiple sources of slave devices compliant with the interface. It is also, intended for use by peripheraldevelopers or
HOME | JEDECSTANDARDS & DOCUMENTSCOMMITTEESNEWSEVENTS &MEETINGSJOINABOUT
JC-70, JEDEC’s newest main committee, is focused on the development of universal standards to help advance the adoption of wide bandgap (WBG) power technologies. STANDARDS & DOCUMENTS SEARCH HIGHLY ACCELERATED TEMPERATURE AND HUMIDITY STRESS TEST (HAST) JESD22-A110E. JOINT IPC/JEDEC STANDARD FOR HANDLING, PACKING, SHIPPING, AND USE OF MOISTURE/REFLOW SENSITIVE SURFACE-MOUNT DEVICES. J-STD-033D. JOINT IPC/JEDEC STANDARD FOR MOISTURE/REFLOW SENSITIVITY CLASSIFICATION FOR NONHERMETIC SURFACE-MOUNT DEVICES. STANDARDS & DOCUMENTS SEARCH Title Document # Date; Addendum No. 1 to JESD79-3 - 1.35 V DDR3L-800, DDR3L-1066, DDR3L-1333, DDR3L-1600, and DDR3L-1866 This is a minor editorial revision, the differences between revisions can be found on page 17 of the document. JEP30: PART MODEL GUIDELINES JEP30: Part Model Guidelines. JEP30 and its related documents are currently published and maintained as a JEDEC-wide project between the JC-11, JC-14, JC-15 and JC-42 Committees. JEP30 establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products. CUSTOMER NOTIFICATION STANDARD FOR PRODUCT/PROCESS …JEDEC MEMORY STANDARDJEDEC STANDARD PDFJEDEC STANDARD TRAYSWHAT IS JEDEC J-STD-046. Published: Jul 2016. This standard is applicable to suppliers of, and affected customers for, electronic products and their constituent components. This standard establishes the requirements for timely customer notification of changes to electronic products and associated processes. This document replaces JESD46. Committee (s): JC-14.4. STANDARDS & DOCUMENTS SEARCH JEP152. May 2007. This document is the work product of the JC-45.1 DDR2 DIMM Clock Skew Measurement task group.The purpose of this document is to define procedures to measure clock parameters on registered DIMMs using the DDR2 Clock Reference Board. It is NOT the intent of this document to set specification values or validationrequirements.
STANDARDS & DOCUMENTS SEARCH Title Document # Date; WIRE BOND SHEAR TEST: JESD22-B116B May 2017: This fully revised test provides a means for determining the strength of gold and copper ball bonds to a die or package bonding surface, and may be performed on pre-encapsulation or post-encapsulation parts. GUIDELINES FOR MEASURING THE THRESHOLD VOLTAGE (VT) OF SIC JEP183. Published: Jan 2021. This publication describes the guidelines for VT measurement methods and conditioning prior to VT testing in SiC power MOSFETs to reduce or eliminate the effect of the aforementioned hysteresis. Committee (s): JC-70.1. Free download. Registration orlogin required.
STRESS-TEST-DRIVEN QUALIFICATION OF AND FAILURE … This publication contains a set of frequently recommended and accepted JEDEC reliability stress tests. These tests are used for qualifying new and modified technology/ process/ product families, as well as individual solid state surface-mount products, in particular leadless chip carriers, ball grid array (BGA) packages, direct chip attach die and packages with exposed pads that are attached REQUIREMENTS FOR MICROELECTRONIC SCREENING AND TEST This document is designed to assist the manufacturer in optimizing the test flow while maintaining and/or improving assurance of providing high quality and reliable product in an efficient manner. This will allow for optimization of testing that is not adding value, hence, reducing cycle time and costs. Committee (s): JC-13, JC-13.2. HOME | JEDECSTANDARDS & DOCUMENTSCOMMITTEESNEWSEVENTS &MEETINGSJOINABOUT
JC-70, JEDEC’s newest main committee, is focused on the development of universal standards to help advance the adoption of wide bandgap (WBG) power technologies. STANDARDS & DOCUMENTS SEARCH HIGHLY ACCELERATED TEMPERATURE AND HUMIDITY STRESS TEST (HAST) JESD22-A110E. JOINT IPC/JEDEC STANDARD FOR HANDLING, PACKING, SHIPPING, AND USE OF MOISTURE/REFLOW SENSITIVE SURFACE-MOUNT DEVICES. J-STD-033D. JOINT IPC/JEDEC STANDARD FOR MOISTURE/REFLOW SENSITIVITY CLASSIFICATION FOR NONHERMETIC SURFACE-MOUNT DEVICES. STANDARDS & DOCUMENTS SEARCH Title Document # Date; Addendum No. 1 to JESD79-3 - 1.35 V DDR3L-800, DDR3L-1066, DDR3L-1333, DDR3L-1600, and DDR3L-1866 This is a minor editorial revision, the differences between revisions can be found on page 17 of the document. JEP30: PART MODEL GUIDELINES JEP30: Part Model Guidelines. JEP30 and its related documents are currently published and maintained as a JEDEC-wide project between the JC-11, JC-14, JC-15 and JC-42 Committees. JEP30 establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products. CUSTOMER NOTIFICATION STANDARD FOR PRODUCT/PROCESS …JEDEC MEMORY STANDARDJEDEC STANDARD PDFJEDEC STANDARD TRAYSWHAT IS JEDEC J-STD-046. Published: Jul 2016. This standard is applicable to suppliers of, and affected customers for, electronic products and their constituent components. This standard establishes the requirements for timely customer notification of changes to electronic products and associated processes. This document replaces JESD46. Committee (s): JC-14.4. STANDARDS & DOCUMENTS SEARCH JEP152. May 2007. This document is the work product of the JC-45.1 DDR2 DIMM Clock Skew Measurement task group.The purpose of this document is to define procedures to measure clock parameters on registered DIMMs using the DDR2 Clock Reference Board. It is NOT the intent of this document to set specification values or validationrequirements.
STANDARDS & DOCUMENTS SEARCH Title Document # Date; WIRE BOND SHEAR TEST: JESD22-B116B May 2017: This fully revised test provides a means for determining the strength of gold and copper ball bonds to a die or package bonding surface, and may be performed on pre-encapsulation or post-encapsulation parts. GUIDELINES FOR MEASURING THE THRESHOLD VOLTAGE (VT) OF SIC JEP183. Published: Jan 2021. This publication describes the guidelines for VT measurement methods and conditioning prior to VT testing in SiC power MOSFETs to reduce or eliminate the effect of the aforementioned hysteresis. Committee (s): JC-70.1. Free download. Registration orlogin required.
STRESS-TEST-DRIVEN QUALIFICATION OF AND FAILURE … This publication contains a set of frequently recommended and accepted JEDEC reliability stress tests. These tests are used for qualifying new and modified technology/ process/ product families, as well as individual solid state surface-mount products, in particular leadless chip carriers, ball grid array (BGA) packages, direct chip attach die and packages with exposed pads that are attached REQUIREMENTS FOR MICROELECTRONIC SCREENING AND TEST This document is designed to assist the manufacturer in optimizing the test flow while maintaining and/or improving assurance of providing high quality and reliable product in an efficient manner. This will allow for optimization of testing that is not adding value, hence, reducing cycle time and costs. Committee (s): JC-13, JC-13.2. STANDARDS & DOCUMENTS SEARCH This standard establishes requirements for the generation of electronic-device package designators for the JEDEC Solid State Technology Association. The requirements herein are intended to ensure that such designators are presented in as uniform a manner as practicable. Item 11.2-962. Committee (s): JC-11.2. STANDARDS & DOCUMENTS SEARCH JC-13: Government Liaison (4) Apply JC-13: Government Liaison filter JC-14: Quality and Reliability of Solid State Products (10) Apply JC-14: Quality and Reliability of Solid State Products filter JC-16: Interface Technology (1) Apply JC-16: Interface Technology filter JC-42: Solid State Memories (1) Apply JC-42: Solid State Memories filter JC-45: DRAM Modules (1) Apply JC-45: DRAM Modules filter STANDARDS & DOCUMENTS SEARCH JEP70C. Oct 2013. This document gathers and organizes common standards and publications relating to quality processes and methods relating to the solid-state, microelectronics, and associated industries. This is intended to facilitate access to the applicable documents when working with electronic hardware. STANDARDS & DOCUMENTS SEARCH Aug 2018. This standard describes a baseline set of acceptance tests for use in qualifying electronic components as new products, a product family, or as products in a process which is being changed. Committee (s): JC-14.3. Available for purchase: $76.00 Add to Cart. STANDARDS & DOCUMENTS SEARCH JC-10: Terms, Definitions, and Symbols (17) Apply JC-10: Terms, Definitions, and Symbols filter JC-11: Mechanical Standardization (600) Apply JC-11: Mechanical Standardization filter JC-13: Government Liaison (36) Apply JC-13: Government Liaison filter JC-14: Quality and Reliability of Solid State Products (154) Apply JC-14: Quality and Reliability of Solid State Products filter STANDARDS & DOCUMENTS SEARCH This standard defines the form, fit and function of DDR4 connectors for U/R/LR modules supporting channels with transfer rates as high as 3.2 GT/S. It contains mechanical, electrical and reliability requirements for a one-piece connector mated to a module with nominal thickness of 1.40 mm. The intent of this document is to providePerformance
STANDARDS & DOCUMENTS SEARCH JEP70C. Oct 2013. This document gathers and organizes common standards and publications relating to quality processes and methods relating to the solid-state, microelectronics, and associated industries. This is intended to facilitate access to the applicable documents when working with electronic hardware. This will have a positive effect onNEWS | JEDEC
Please direct all media inquiries to: Emily Desjardins JEDEC Director of Marketing & Communications 703-907-7560 Email Emily STANDARDS & DOCUMENTS SEARCH JESD204C. Dec 2017. This standard describes a serialized interface between data converters and logic devices. It contains normative information to enable designers to implement devices that communicate with other devices covered by this document. Informative sections are included to clarify and exemplify the standard. Committee (s): JC-16. STANDARDS & DOCUMENTS SEARCH JESD251A. Feb 2020. This standard is intended for use by SoC, ASIC, ASSP, and FPGA developers or vendors interested in incorporating a master interface having a low signal count and high data transfer bandwidth with access to multiple sources of slave devices compliant with the interface. It is also, intended for use by peripheraldevelopers or
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SEARCH & DOWNLOAD JEDEC DOCUMENTS Search by keyword or document number. Search: or Browse by Keyword » ------------------------- TECHNOLOGY FOCUS AREAS For over 50 years, JEDEC has been the global leader in developing open standards and publications for the microelectronics industry. JEDEC committees provide industry leadership in developing standards for a broad range of technologies. Current areas of focus include: * Main Memory: DDR4 & DDR5 SDRAM * Flash Memory: SSDs, UFS, e.MMC * Mobile Memory: LPDDR, Wide I/O * Memory Module Design File Registrations * Memory Configurations: JESD21-C * Registered Outlines: JEP95 * JEP30: Part Model Guidelines * Lead-Free Manufacturing * ESD: Electrostatic Discharge * Wide Bandgap Power Semiconductors: GaN, SiCCOMMITTEE MEETINGS
JC-15
1 Jun 2021
JC-11
2 - 3 Jun 2021
JC-16,40,42,45,63,647 - 10 Jun 2021
Board of Directors
3 Aug 2021
JC-16,40,42,45,63,6430 Aug - 2 Sep 2021
JC-11
1 - 2 Sep 2021
JC-13
20 - 23 Sep 2021
JC-14
21 - 23 Sep 2021
See more meetings »COMMITTEE MEETINGS
JC-15
1 Jun 2021
JC-11
2 - 3 Jun 2021
JC-16,40,42,45,63,647 - 10 Jun 2021
Board of Directors
3 Aug 2021
JC-16,40,42,45,63,6430 Aug - 2 Sep 2021
JC-11
1 - 2 Sep 2021
JC-13
20 - 23 Sep 2021
JC-14
21 - 23 Sep 2021
See more meetings »EVENTS
No public events available. JEDEC STANDARDS FOR WIDE BANDGAP POWER SEMICONDUCTORS JC-70, JEDEC’s newest main committee, is focused on the development of universal standards to help advance the adoption of wide bandgap (WBG) power technologies. JC-70 is rapidly expanding its ecosystem of publications, and recent documents include two SiC related publications as well as a new test method for GaN power devices. Find out more about JC-70 and itspublications here .
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SIGN UP FOR JEDEC SMARTBRIEF The latest industry news delivered right to your inbox - Free! » RECENT PRESS RELEASES JEDEC Wide Bandgap Power Semiconductor Committee Publishes a Milestone Document for Bias Temperature Instability of Silicon Carbide(SiC) MOS Devices
JEDEC Publishes DDR4 NVDIMM-P Bus Protocol Standard JEDEC Wide Bandgap Power Semiconductor Committee Publishes its First Guideline for Silicon Carbide (SiC) Based Power ConversionDevices
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