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ECTC | IEEE ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE 9:00AM EDT (the following day) Monday, May 31 – Sunday, July 4, 2021. 5:00PM EDT – 9:00AM EDT. 1:00PM EDT. Should you have any questions or need further clarification on accessing ECTC 2021, please contact our registrar at reg.ectc@gmail.com. Additionally, don’t forget about our discount registration date deadline of May 14, 2021. ECTC | IEEE ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE Program. The following is the preliminary technical program for the 71st ECTC, this year a Virtual Conference. This program may undergo many changes, in the weeks and months to come, before evolving into the Final Program of the conference. ECTC | IEEE ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE 2021 Virtual Technology Corner Exhibits. For 2021, ECTC’s Technology Corner will be all virtual and accessible to all conference registrants. This year’s virtual format still provides opportunities for exhibitors and attendees to interact with one another and learn about new technology solutions, applications, and products for the packaging and interconnect industry. ECTC | IEEE ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE SVP of Engineering. Jan Vardaman – President, TechSearch International, Inc. Rebeca Jimenez – Sr. Vice President, Amkor Technology, Inc. 6) 2016 ECTC Plenary Session: Life after Moore’s Law. (Chair: Rozalia Beica – Dow Electronic Materials) Subramanian Iyer – University of California, Los Angeles CHIPS. Luc Van den hove– IMEC.
ECTC | IEEE ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE Please select an item. Zip/Postal Code: Postal Code is required. If you do not have one, please enter "00000". Telephone: A value isrequired. Email
2. FUNDAMENTALS OF GLASS TECHNOLOGY AND APPLICATIONS FOR 2. Fundamentals of Glass Technology and Applications for Advanced Semiconductor Packaging Course Leaders: Dr. Prakash Gajendran and Joseph Canale – Corning, Inc. Course Objective: ADVANCED INSULATING FILM FOR NEXT-GENERATION SMARTPHONE Over View of the Ajinomoto Group (as of March 31, 2017) Foundation Paid-in Capital Net sales FY2017 May 20, 1909 JPY 79,863million Number of employee 34,452 JPY 1,150.2 billion SESSION 26: ANTENNA-IN-PACKAGE FOR 5G/6G AND RADAR SYSTEMS Maciej Wojnowski Infineon Technologies AG T +49 89 234 26531 maciej.wojnowski@infineon.com Amit Agrawal Microchip Technologies T4082398147
10. FAN-OUT WAFER/PANEL LEVEL PACKAGING AND 3D CHIPLET 10. Fan-Out Wafer/Panel Level Packaging and 3D Chiplet Heterogeneous Integrations Course Leader: John Lau – Unimicron Technology Corporation Course Objective: In this lecture, the following topics will be presented and discussed. ECTC | IEEE ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCEHOMEABOUTCALENDARTECHNICAL PROGRAMEXHIBITSAUTHOR INFO ECTC is the premier international conference on microelectronic packaging, components, and systems technology. ECTC brings together around 1,500 professionals from the global microelectronics packaging industry, for four consecutive days packed with Technical presentations. ECTC features 36 sessions of oral presentations oftechnical papers on
ECTC | IEEE ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE 9:00AM EDT (the following day) Monday, May 31 – Sunday, July 4, 2021. 5:00PM EDT – 9:00AM EDT. 1:00PM EDT. Should you have any questions or need further clarification on accessing ECTC 2021, please contact our registrar at reg.ectc@gmail.com. Additionally, don’t forget about our discount registration date deadline of May 14, 2021. ECTC | IEEE ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE Program. The following is the preliminary technical program for the 71st ECTC, this year a Virtual Conference. This program may undergo many changes, in the weeks and months to come, before evolving into the Final Program of the conference. ECTC | IEEE ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE 2021 Virtual Technology Corner Exhibits. For 2021, ECTC’s Technology Corner will be all virtual and accessible to all conference registrants. This year’s virtual format still provides opportunities for exhibitors and attendees to interact with one another and learn about new technology solutions, applications, and products for the packaging and interconnect industry. ECTC | IEEE ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE SVP of Engineering. Jan Vardaman – President, TechSearch International, Inc. Rebeca Jimenez – Sr. Vice President, Amkor Technology, Inc. 6) 2016 ECTC Plenary Session: Life after Moore’s Law. (Chair: Rozalia Beica – Dow Electronic Materials) Subramanian Iyer – University of California, Los Angeles CHIPS. Luc Van den hove– IMEC.
ECTC | IEEE ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE Please select an item. Zip/Postal Code: Postal Code is required. If you do not have one, please enter "00000". Telephone: A value isrequired. Email
2. FUNDAMENTALS OF GLASS TECHNOLOGY AND APPLICATIONS FOR 2. Fundamentals of Glass Technology and Applications for Advanced Semiconductor Packaging Course Leaders: Dr. Prakash Gajendran and Joseph Canale – Corning, Inc. Course Objective: ADVANCED INSULATING FILM FOR NEXT-GENERATION SMARTPHONE Over View of the Ajinomoto Group (as of March 31, 2017) Foundation Paid-in Capital Net sales FY2017 May 20, 1909 JPY 79,863million Number of employee 34,452 JPY 1,150.2 billion SESSION 26: ANTENNA-IN-PACKAGE FOR 5G/6G AND RADAR SYSTEMS Maciej Wojnowski Infineon Technologies AG T +49 89 234 26531 maciej.wojnowski@infineon.com Amit Agrawal Microchip Technologies T4082398147
10. FAN-OUT WAFER/PANEL LEVEL PACKAGING AND 3D CHIPLET 10. Fan-Out Wafer/Panel Level Packaging and 3D Chiplet Heterogeneous Integrations Course Leader: John Lau – Unimicron Technology Corporation Course Objective: In this lecture, the following topics will be presented and discussed. ECTC | IEEE ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE Welcome! The 2021 ECTC Professional Development Courses are a good representation of topics of interests for Electronic Packaging Technologists. Each of these courses are presented by world-class experts, enabling participants to broaden their technical knowledge base. As in previous years there will be 14 courses, each 2.5 hourslong.
ECTC | IEEE ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE ECTC has just announced that its 2021 Conference will be taking place virtually. More information will be posted soon. ECTC | IEEE ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE ECTC Sponsors. We thank our generous Sponsors for their incredible support for the Virtual ECTC 2020 conference. View the 2021 Sponsorship Opportunities. For more information contact: Wolfgang Sauter. ECTC Sponsorship Chair. Marvell Semiconductor. Phone:+1-802-922-3083.
ECTC | IEEE ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE Save on Registration. Join IEEE and Get Free EPS Membership! To take advantage of this offer, simply click here to Create your IEEE Account. After creating an account, proceed to the membership application. At the membership application, both IEEE and free Electronics Packaging Society (EPS) Membership will present in theCart.
ECTC | ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE Select a Subcommittee Packaging Technologies Applied Reliability Assembly & Manufacturing Technology Emerging Technologies High-Speed, Wireless & Components Interactive Presentations Interconnections Materials & Processing Thermal/Mechanical Simulation & Characterization Photonics. SESSION 45: HETEROGENEOUS INTEGRATION, FLEX AND EMERGING Patrick Thompson Texas Instruments, Inc. T +1-214-567-0660 patrick.thompson@ti.com Tengfei Jiang University of Central Florida T1-407-823-2284
3. FUNDAMENTALS OF RF DESIGN AND FABRICATION PROCESSES OF 3. Fundamentals of RF Design and Fabrication Processes of Fan-Out Wafer/Panel Level Packages and Interposers Course Leaders: Ivan Ndip and Markus Wöhrmann – Fraunhofer IZM Course Objective: 11. POLYMERS IN WAFER LEVEL PACKAGING COURSE LEADER 11. Polymers in Wafer Level Packaging Course Leader: Jeffrey Gotro –InnoCentrix, LLC Course Objective: The course will provide an overview of polymers used in wafer level packaging and the SESSION 26: ANTENNA-IN-PACKAGE FOR 5G/6G AND RADAR SYSTEMS Maciej Wojnowski Infineon Technologies AG T +49 89 234 26531 maciej.wojnowski@infineon.com Amit Agrawal Microchip Technologies T4082398147
SESSION 38: RELIABILITY ANALYSIS OF NEW MATERIALS IN Jeffrey Lee iST-Integrated Service Technology Inc. T +886-3-5799909 ext 3000 jeffrey_lee@istgroup.com Mark Eblen Kyocera International SC ECTC | IEEE ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCEHOMEABOUTCALENDARTECHNICAL PROGRAMEXHIBITSAUTHOR INFO ECTC is the premier international conference on microelectronic packaging, components, and systems technology. ECTC brings together around 1,500 professionals from the global microelectronics packaging industry, for four consecutive days packed with Technical presentations. ECTC features 36 sessions of oral presentations oftechnical papers on
ECTC | IEEE ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE 9:00AM EDT (the following day) Monday, May 31 – Sunday, July 4, 2021. 5:00PM EDT – 9:00AM EDT. 1:00PM EDT. Should you have any questions or need further clarification on accessing ECTC 2021, please contact our registrar at reg.ectc@gmail.com. Additionally, don’t forget about our discount registration date deadline of May 14, 2021. ECTC | IEEE ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE Program. The following is the preliminary technical program for the 71st ECTC, this year a Virtual Conference. This program may undergo many changes, in the weeks and months to come, before evolving into the Final Program of the conference. ECTC | IEEE ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE Welcome! The 2021 ECTC Professional Development Courses are a good representation of topics of interests for Electronic Packaging Technologists. Each of these courses are presented by world-class experts, enabling participants to broaden their technical knowledge base. As in previous years there will be 14 courses, each 2.5 hourslong.
ECTC | IEEE ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE 2021 Virtual Technology Corner Exhibits. For 2021, ECTC’s Technology Corner will be all virtual and accessible to all conference registrants. This year’s virtual format still provides opportunities for exhibitors and attendees to interact with one another and learn about new technology solutions, applications, and products for the packaging and interconnect industry. ECTC | IEEE ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE SVP of Engineering. Jan Vardaman – President, TechSearch International, Inc. Rebeca Jimenez – Sr. Vice President, Amkor Technology, Inc. 6) 2016 ECTC Plenary Session: Life after Moore’s Law. (Chair: Rozalia Beica – Dow Electronic Materials) Subramanian Iyer – University of California, Los Angeles CHIPS. Luc Van den hove– IMEC.
ECTC | IEEE ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE Please select an item. Zip/Postal Code: Postal Code is required. If you do not have one, please enter "00000". Telephone: A value isrequired. Email
ECTC | ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE Select a Subcommittee Packaging Technologies Applied Reliability Assembly & Manufacturing Technology Emerging Technologies High-Speed, Wireless & Components Interactive Presentations Interconnections Materials & Processing Thermal/Mechanical Simulation & Characterization Photonics. 10. FAN-OUT WAFER/PANEL LEVEL PACKAGING AND 3D CHIPLET 10. Fan-Out Wafer/Panel Level Packaging and 3D Chiplet Heterogeneous Integrations Course Leader: John Lau – Unimicron Technology Corporation Course Objective: In this lecture, the following topics will be presented and discussed. ECTC | IEEE ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE ECTC | IEEE Electronic Components and Technology Conference ECTC | IEEE ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCEHOMEABOUTCALENDARTECHNICAL PROGRAMEXHIBITSAUTHOR INFO ECTC is the premier international conference on microelectronic packaging, components, and systems technology. ECTC brings together around 1,500 professionals from the global microelectronics packaging industry, for four consecutive days packed with Technical presentations. ECTC features 36 sessions of oral presentations oftechnical papers on
ECTC | IEEE ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE 9:00AM EDT (the following day) Monday, May 31 – Sunday, July 4, 2021. 5:00PM EDT – 9:00AM EDT. 1:00PM EDT. Should you have any questions or need further clarification on accessing ECTC 2021, please contact our registrar at reg.ectc@gmail.com. Additionally, don’t forget about our discount registration date deadline of May 14, 2021. ECTC | IEEE ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE Program. The following is the preliminary technical program for the 71st ECTC, this year a Virtual Conference. This program may undergo many changes, in the weeks and months to come, before evolving into the Final Program of the conference. ECTC | IEEE ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE Welcome! The 2021 ECTC Professional Development Courses are a good representation of topics of interests for Electronic Packaging Technologists. Each of these courses are presented by world-class experts, enabling participants to broaden their technical knowledge base. As in previous years there will be 14 courses, each 2.5 hourslong.
ECTC | IEEE ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE 2021 Virtual Technology Corner Exhibits. For 2021, ECTC’s Technology Corner will be all virtual and accessible to all conference registrants. This year’s virtual format still provides opportunities for exhibitors and attendees to interact with one another and learn about new technology solutions, applications, and products for the packaging and interconnect industry. ECTC | IEEE ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE SVP of Engineering. Jan Vardaman – President, TechSearch International, Inc. Rebeca Jimenez – Sr. Vice President, Amkor Technology, Inc. 6) 2016 ECTC Plenary Session: Life after Moore’s Law. (Chair: Rozalia Beica – Dow Electronic Materials) Subramanian Iyer – University of California, Los Angeles CHIPS. Luc Van den hove– IMEC.
ECTC | IEEE ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE Please select an item. Zip/Postal Code: Postal Code is required. If you do not have one, please enter "00000". Telephone: A value isrequired. Email
ECTC | ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE Select a Subcommittee Packaging Technologies Applied Reliability Assembly & Manufacturing Technology Emerging Technologies High-Speed, Wireless & Components Interactive Presentations Interconnections Materials & Processing Thermal/Mechanical Simulation & Characterization Photonics. 10. FAN-OUT WAFER/PANEL LEVEL PACKAGING AND 3D CHIPLET 10. Fan-Out Wafer/Panel Level Packaging and 3D Chiplet Heterogeneous Integrations Course Leader: John Lau – Unimicron Technology Corporation Course Objective: In this lecture, the following topics will be presented and discussed. ECTC | IEEE ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE ECTC | IEEE Electronic Components and Technology Conference ECTC | IEEE ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE Welcome! The 2021 ECTC Professional Development Courses are a good representation of topics of interests for Electronic Packaging Technologists. Each of these courses are presented by world-class experts, enabling participants to broaden their technical knowledge base. As in previous years there will be 14 courses, each 2.5 hourslong.
ECTC | IEEE ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE ECTC has just announced that its 2021 Conference will be taking place virtually. More information will be posted soon. ECTC | IEEE ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE ECTC Sponsors. We thank our generous Sponsors for their incredible support for the Virtual ECTC 2020 conference. View the 2021 Sponsorship Opportunities. For more information contact: Wolfgang Sauter. ECTC Sponsorship Chair. Marvell Semiconductor. Phone:+1-802-922-3083.
ECTC | IEEE ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE Save on Registration. Join IEEE and Get Free EPS Membership! To take advantage of this offer, simply click here to Create your IEEE Account. After creating an account, proceed to the membership application. At the membership application, both IEEE and free Electronics Packaging Society (EPS) Membership will present in theCart.
ECTC | ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE Select a Subcommittee Packaging Technologies Applied Reliability Assembly & Manufacturing Technology Emerging Technologies High-Speed, Wireless & Components Interactive Presentations Interconnections Materials & Processing Thermal/Mechanical Simulation & Characterization Photonics. SESSION 2: WAFER/PANEL LEVEL SYSTEM INTEGRATION AND Raj Pendse Facebook FRL (Facebook Reality Labs) T +1-(510)709-8076 rajd@fb.com Kuo-Chung Yee Taiwan Semiconductor ManufacturingCorporation, Inc.
SESSION 24: FAN-OUT WAFER LEVEL PACKAGING DEVELOPMENTS AND Jan Vardaman Techsearch International T jan@techsearchinc.com Paul Tiner Texas Instruments T +1-469-471-3565 p-tiner@ti.com SESSION 36: PACKAGING, MACHINE LEARNING, AND INTEGRATION Santosh Kudtarkar Analog Devices T +1-781-9372462 santosh.kudtarkar@analog.com Hongqing Zhang IBM Corporation T 484-896-8709 zhangh@us.ibm.com SESSION 38: RELIABILITY ANALYSIS OF NEW MATERIALS IN Jeffrey Lee iST-Integrated Service Technology Inc. T +886-3-5799909 ext 3000 jeffrey_lee@istgroup.com Mark Eblen Kyocera International SC 3D-ICS: ADVANCES IN THE INDUSTRY IEEE 64th ECTC – Orlando, FL, USA May 27–30, 2014 Add Company Logo Here 3D-ICs: Advances in the Industry Suresh Ramalingam Advanced Packaging, Xilinx 2100 Logic Drive, San ECTC | IEEE ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCEHOMEABOUTCALENDARTECHNICAL PROGRAMEXHIBITSAUTHOR INFO ECTC is the premier international conference on microelectronic packaging, components, and systems technology. ECTC brings together around 1,500 professionals from the global microelectronics packaging industry, for four consecutive days packed with Technical presentations. ECTC features 36 sessions of oral presentations oftechnical papers on
ECTC | IEEE ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE 9:00AM EDT (the following day) Monday, May 31 – Sunday, July 4, 2021. 5:00PM EDT – 9:00AM EDT. 1:00PM EDT. Should you have any questions or need further clarification on accessing ECTC 2021, please contact our registrar at reg.ectc@gmail.com. Additionally, don’t forget about our discount registration date deadline of May 14, 2021. ECTC | IEEE ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE Program. The following is the preliminary technical program for the 71st ECTC, this year a Virtual Conference. This program may undergo many changes, in the weeks and months to come, before evolving into the Final Program of the conference. ECTC | IEEE ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE Welcome! The 2021 ECTC Professional Development Courses are a good representation of topics of interests for Electronic Packaging Technologists. Each of these courses are presented by world-class experts, enabling participants to broaden their technical knowledge base. As in previous years there will be 14 courses, each 2.5 hourslong.
ECTC | IEEE ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE Please select an item. Zip/Postal Code: Postal Code is required. If you do not have one, please enter "00000". Telephone: A value isrequired. Email
SESSION 38: RELIABILITY ANALYSIS OF NEW MATERIALS IN Jeffrey Lee iST-Integrated Service Technology Inc. T +886-3-5799909 ext 3000 jeffrey_lee@istgroup.com Mark Eblen Kyocera International SC ADVANCED INSULATING FILM FOR NEXT-GENERATION SMARTPHONE Over View of the Ajinomoto Group (as of March 31, 2017) Foundation Paid-in Capital Net sales FY2017 May 20, 1909 JPY 79,863million Number of employee 34,452 JPY 1,150.2 billion 10. FAN-OUT WAFER/PANEL LEVEL PACKAGING AND 3D CHIPLET 10. Fan-Out Wafer/Panel Level Packaging and 3D Chiplet Heterogeneous Integrations Course Leader: John Lau – Unimicron Technology Corporation Course Objective: In this lecture, the following topics will be presented and discussed. 3. FUNDAMENTALS OF RF DESIGN AND FABRICATION PROCESSES OF 3. Fundamentals of RF Design and Fabrication Processes of Fan-Out Wafer/Panel Level Packages and Interposers Course Leaders: Ivan Ndip and Markus Wöhrmann – Fraunhofer IZM Course Objective: 3D-ICS: ADVANCES IN THE INDUSTRY IEEE 64th ECTC – Orlando, FL, USA May 27–30, 2014 Add Company Logo Here 3D-ICs: Advances in the Industry Suresh Ramalingam Advanced Packaging, Xilinx 2100 Logic Drive, San ECTC | IEEE ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCEHOMEABOUTCALENDARTECHNICAL PROGRAMEXHIBITSAUTHOR INFO ECTC is the premier international conference on microelectronic packaging, components, and systems technology. ECTC brings together around 1,500 professionals from the global microelectronics packaging industry, for four consecutive days packed with Technical presentations. ECTC features 36 sessions of oral presentations oftechnical papers on
ECTC | IEEE ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE 9:00AM EDT (the following day) Monday, May 31 – Sunday, July 4, 2021. 5:00PM EDT – 9:00AM EDT. 1:00PM EDT. Should you have any questions or need further clarification on accessing ECTC 2021, please contact our registrar at reg.ectc@gmail.com. Additionally, don’t forget about our discount registration date deadline of May 14, 2021. ECTC | IEEE ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE Program. The following is the preliminary technical program for the 71st ECTC, this year a Virtual Conference. This program may undergo many changes, in the weeks and months to come, before evolving into the Final Program of the conference. ECTC | IEEE ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE Welcome! The 2021 ECTC Professional Development Courses are a good representation of topics of interests for Electronic Packaging Technologists. Each of these courses are presented by world-class experts, enabling participants to broaden their technical knowledge base. As in previous years there will be 14 courses, each 2.5 hourslong.
ECTC | IEEE ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE Please select an item. Zip/Postal Code: Postal Code is required. If you do not have one, please enter "00000". Telephone: A value isrequired. Email
SESSION 38: RELIABILITY ANALYSIS OF NEW MATERIALS IN Jeffrey Lee iST-Integrated Service Technology Inc. T +886-3-5799909 ext 3000 jeffrey_lee@istgroup.com Mark Eblen Kyocera International SC ADVANCED INSULATING FILM FOR NEXT-GENERATION SMARTPHONE Over View of the Ajinomoto Group (as of March 31, 2017) Foundation Paid-in Capital Net sales FY2017 May 20, 1909 JPY 79,863million Number of employee 34,452 JPY 1,150.2 billion 10. FAN-OUT WAFER/PANEL LEVEL PACKAGING AND 3D CHIPLET 10. Fan-Out Wafer/Panel Level Packaging and 3D Chiplet Heterogeneous Integrations Course Leader: John Lau – Unimicron Technology Corporation Course Objective: In this lecture, the following topics will be presented and discussed. 3. FUNDAMENTALS OF RF DESIGN AND FABRICATION PROCESSES OF 3. Fundamentals of RF Design and Fabrication Processes of Fan-Out Wafer/Panel Level Packages and Interposers Course Leaders: Ivan Ndip and Markus Wöhrmann – Fraunhofer IZM Course Objective: 3D-ICS: ADVANCES IN THE INDUSTRY IEEE 64th ECTC – Orlando, FL, USA May 27–30, 2014 Add Company Logo Here 3D-ICs: Advances in the Industry Suresh Ramalingam Advanced Packaging, Xilinx 2100 Logic Drive, San ECTC | IEEE ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE The Electronic Components and Technology Conference (ECTC) is the premier international event that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange. ECTC is sponsored by the IEEE Electronics Packaging Society (formerlyCPMT).
ECTC | IEEE ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE ECTC Sponsors. We thank our generous Sponsors for their incredible support for the Virtual ECTC 2020 conference. View the 2021 Sponsorship Opportunities. For more information contact: Wolfgang Sauter. ECTC Sponsorship Chair. Marvell Semiconductor. Phone:+1-802-922-3083.
ECTC | IEEE ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE Save on Registration. Join IEEE and Get Free EPS Membership! To take advantage of this offer, simply click here to Create your IEEE Account. After creating an account, proceed to the membership application. At the membership application, both IEEE and free Electronics Packaging Society (EPS) Membership will present in theCart.
ECTC | ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE Select a Subcommittee Packaging Technologies Applied Reliability Assembly & Manufacturing Technology Emerging Technologies High-Speed, Wireless & Components Interactive Presentations Interconnections Materials & Processing Thermal/Mechanical Simulation & Characterization Photonics. SESSION 23: HETEROGENEOUS INTEGRATION PROCESSES AND Habib Hichri Ajinomoto Fine-Techno USA Corporation T +1 408 564 7245 hichrih@ajiusa.com Yu Wang Sensata Technologies T +1-508-236-1552yu.wang9@gmail.com
SESSION 45: HETEROGENEOUS INTEGRATION, FLEX AND EMERGING Patrick Thompson Texas Instruments, Inc. T +1-214-567-0660 patrick.thompson@ti.com Tengfei Jiang University of Central Florida T1-407-823-2284
12. RELIABILITY MECHANICS AND MODELING FOR IC PACKAGING 12. Reliability Mechanics and Modeling for IC Packaging Course Leaders: Ricky Lee - HKUST and Xuejun Fan – Lamar University Course Objective: This course aims to present a comprehensive coverage of reliability mechanics and modeling TATSUTA EMI SHIELDING SOLUTIONS Tatsuta EMI Shielding Solutions May 30, 2019 Mike Sakaguchi TATSUTA ELECTRIC WIRE & CABLE Co., Ltd Conductive Materials Division 5-1,6chome,Kunimidai,Kizugawa city ECTC | IEEE ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE ECTC | IEEE Electronic Components and Technology Conference 6. RELIABLE INTEGRATED THERMAL PACKAGING FOR POWER 6. Reliable Integrated Thermal Packaging for Power Electronics Course Leader: Patrick McCluskey – University of Maryland Course Objective: Power electronics are becoming ubiquitous in engineered systems as they replace traditional IEEE websites place cookies on your device to give you the best user experience. By using our websites, you agree to the placement of these cookies. To learn more, read our Privacy Policy.Accept & Close
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ECTC is the premier international conference on microelectronic packaging, components, and systems technology.*
ECTC brings together around 1,500 professionals from the global microelectronics packaging industry, for four consecutive days packed with Technical presentations.*
ECTC features 36 sessions of oral presentations of technical papers on a wide spectrum of topics and 16 Professional Development Courses.*
ECTC also features four interactive presentation sessions and one student poster session for technical papers.*
Plenary and Special Session featuring industry experts discussing technology status and roadmaps in key areas of interest.*
Each day of oral presentations starts with a Speaker's Breakfast where the presenting authors connect with their session chairs.*
Opportunity to meet with members of the technical sub-committees and enroll to support future ECTC activities.*
Nightly receptions bring together the presenting authors and the technical program subcommittee members.*
Gala Reception brings together speakers, committee members, organizers for a great networking evening.*
Technology Corner Exhibits provide an opportunity to meet with and learn from industry movers on the latest technological advances.*
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The Electronic Components and Technology Conference (ECTC) is the premier international event that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange. ECTC is sponsored by the IEEE Electronics Packaging Society. RegisterHERE .
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