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focused on 3D TSVs.
SEMICONDUCTOR SHORTAGES, A CAPEX BOOM, AND ONSHORING Semiconductor units grow relatively steadily over time. According to IC Insights, the 43-year compound annual growth rate is 8.6%. 2021 is expected to see 13% growth after a decline of 6.7% in 2019 and 2.6% growth in 2020. So, growth is not always smooth and can be very cyclical. Historically, cyclicality has been driven by memory. RARE EARTH MINING: THE DARK UNDERSIDE OF SUSTAINABILITY The mining and refining of rare earths, as in most mining of resources, has environmental tradeoffs.This includes piles of tailings that can create landslides and concentrate hazardous waste, the potential for groundwater contamination, and the CO 2 footprint — although EVs are starting to be developed for mining purposes — the potential for radiation exposure, and more. 2020 3D TEST WORKSHOP DRUM ROLL PLEASE! THE WINNERS OF THE 2021 3D INCITES Like every other awards event in the past year, the 2021 3D InCites Awards Program had to make some adjustments for celebrating its winners. We can’t gather in person at the IMAPS Device Packaging Conference to applaud the winners, catch up with colleagues over a great barbeque, watch the 3D InCites Mural comes to life, or take lots of silly photos at the photo booth. SOLUTIONS FOR GLASS-BASED PACKAGING ARE HERE Glass-based Solutions for Packaging are Here. A number of research articles have been published over the past several years showing the advantages glass-based solutions can bring to packaging and systems integration including radio frequency (RF) front-end devices, interposers, MEMs devices, and integrated photonics. THE AUTOMOTIVE CHIP SHORTAGE AND SUPPLY CHAINSSEE MORE ON3DINCITES.COM
IFTLE 481: A BRIDG TO SOMEWHERE IFTLE 481: A BRIDG to Somewhere. It was exactly two years ago that IFTLE first discussed the entity known as BRIDG and how it planned to be a “boutique microelectronics fabrication facility” that would be able to prototype 2.5/3D devices for the U. S. government and the microelectronics community. Later in the year, BRIDG announced that it FAN OUT PANEL LEVEL PACKAGING TAKES OFF Fan-Out Panel-Level Packaging Takes Off. Fan out (FO) packaging is one of the key growth segments in advanced packaging, with high adoption rates and strong technology advantages offering a strong pathway moving forward to support industry roadmaps. The nature of reconstituted substrates is now enabling fan-out panel-levelpackaging.
MCM, SIP, SOC, AND HETEROGENEOUS INTEGRATION DEFINED AND MCM, SiP, SoC, and Heterogeneous Integration Defined and Explained. Multichip module (MCM), system-in-package (SiP), system-on-chip (SoC), and heterogeneous integration are all important semiconductor packaging technologies. They deserve to have, at the very least, a book written about them. However, herein I would like to give these COVERING 3D IC TECHNOLOGY AND HETEROGENEOUS INTEGRATION Stirring up interest in heterogeneous integration, 3D InCites follows developments in 3D IC technologies and 3D packaging, particularlyfocused on 3D TSVs.
DIE-TO-WAFER BONDING STEPS INTO THE SPOTLIGHT ON ASEE MORE ON3DINCITES.COM
RARE EARTH MINING: THE DARK UNDERSIDE OF SUSTAINABILITY The mining and refining of rare earths, as in most mining of resources, has environmental tradeoffs.This includes piles of tailings that can create landslides and concentrate hazardous waste, the potential for groundwater contamination, and the CO 2 footprint — although EVs are starting to be developed for mining purposes — the potential for radiation exposure, and more. SEMICONDUCTOR SHORTAGES, A CAPEX BOOM, AND ONSHORING Semiconductor units grow relatively steadily over time. According to IC Insights, the 43-year compound annual growth rate is 8.6%. 2021 is expected to see 13% growth after a decline of 6.7% in 2019 and 2.6% growth in 2020. So, growth is not always smooth and can be very cyclical. Historically, cyclicality has been driven by memory. THE AUTOMOTIVE CHIP SHORTAGE AND SUPPLY CHAINSSEE MORE ON3DINCITES.COM
SOLUTIONS FOR GLASS-BASED PACKAGING ARE HERE Glass-based Solutions for Packaging are Here. A number of research articles have been published over the past several years showing the advantages glass-based solutions can bring to packaging and systems integration including radio frequency (RF) front-end devices, interposers, MEMs devices, and integrated photonics. IFTLE 481: A BRIDG TO SOMEWHERE IFTLE 481: A BRIDG to Somewhere. It was exactly two years ago that IFTLE first discussed the entity known as BRIDG and how it planned to be a “boutique microelectronics fabrication facility” that would be able to prototype 2.5/3D devices for the U. S. government and the microelectronics community. Later in the year, BRIDG announced that it FAN OUT PANEL LEVEL PACKAGING TAKES OFF Fan-Out Panel-Level Packaging Takes Off. Fan out (FO) packaging is one of the key growth segments in advanced packaging, with high adoption rates and strong technology advantages offering a strong pathway moving forward to support industry roadmaps. The nature of reconstituted substrates is now enabling fan-out panel-levelpackaging.
THE 5G ROLLOUT: AN INDUSTRY IN TRANSITION In late summer, to help speed the U.S. rollout of 5G, the White House and the Department of Defense announced a plan to share a portion of their mid-band spectrum with the wireless industry, all though it’s not expected to go into effect until late 2021. On the handset side, now that the infrastructures have expanded, Apple finally introduced AMKOR’S SLIM & SWIFT PACKAGE TECHNOLOGY Amkor Confidential I May-15 3 SLIM & SWIFT Package Definition S EMC ol d er b al l Sold er ball UF Top die 1 Top die 2 RDL EMC Sold er ball UF Top die 1 Top die 2 ECTC 2021: ECONOMIC OUTLOOK FOCUSES ON THE IMPACT OF THE For the first time in its 71-year history, the ECTC committee veered away from strictly technical topics to include a panel discussion on market trends and the economic outlook. IEEE INTERNATIONAL ELECTRON DEVICES MEETING ANNOUNCES 2021 SAN FRANCISCO, CA (June 4, 2021) – Under the theme “Devices for a New Era of Electronics: From 2D Materials to 3D Architectures,” the 67 th annual IEEE International Electron Devices Meeting (IEDM) has issued a Call for Papers seeking the world’s best original work in all areas of microelectronics research and development.. The 2021 IEDM is being planned as an in-person BREWER SCIENCE ACHIEVES ISO 45001:2018 Global technology leader meets the world’s most widely recognized occupational health and safety management standard. Rolla, MO – June 2021 – Brewer Science, a global leader in developing and manufacturing next-generation materials and processes for the microelectronics and optoelectronics industries, is pleased to announce the achievement of ISO 45001:2018 Occupational Health &Safety
ECTC 2021 FEATURES THE HOTTEST TOPICS AND TRENDS IN ECTC 2021 Features the Hottest Topics and Trends in Microelectronics. For the second time in its 71-year history, ECTC will be presented as a virtual conference, opening Tuesday, June 1, 2021, and close on Sunday, July 4, 2021. Keynotes, plenary sessions, and the special panel focus on the year’s most talked-about trends including: Theimpact
DRUM ROLL PLEASE! THE WINNERS OF THE 2021 3D INCITES Like every other awards event in the past year, the 2021 3D InCites Awards Program had to make some adjustments for celebrating its winners. We can’t gather in person at the IMAPS Device Packaging Conference to applaud the winners, catch up with colleagues over a great barbeque, watch the 3D InCites Mural comes to life, or take lots of silly photos at the photo booth. IFTLE 487: YOLE REVIEWS THE ADVANCED PACKAGING MARKET Vaibhav Trivedi of Yole Développement gave an outlook for the advanced packaging market with a focus on 3DIC.The semiconductor market declined 12% YoY to reach $412B in 2019. In 2020 the market grew slightly despite the pandemic to about $439B. THE 5G ROLLOUT: AN INDUSTRY IN TRANSITION In late summer, to help speed the U.S. rollout of 5G, the White House and the Department of Defense announced a plan to share a portion of their mid-band spectrum with the wireless industry, all though it’s not expected to go into effect until late 2021. On the handset side, now that the infrastructures have expanded, Apple finally introduced 3D: THE EL DORADO OF HETEROGENEOUS INTEGRATION 3D: The El Dorado of Heterogeneous Integration. From the cloud to edge computing, the quest for ever-greater power efficiency remains researchers’ top priority. From high-end niche to mass-market applications, the best cost-to-performance tradeoff is key to providing a competitive advantage. While Moore’s Law has helped meetthe performance
TRENDS IN SEMICONDUCTOR MANUFACTURING: WAFER-LEVEL One of the hottest trends in semiconductor manufacturing today is wafer-level packaging (WLP). According to Allied Market Research, the global WLP market size is expected to reach $7.8 billion by 2022, registering a compound annual growth rate (CAGR) of 21.5% from 2016 to 2022.Broadly defined, WLP encompasses different integration approaches such as fan-in and fan-out, as well as a range of IFTLE 468: SAMSUNG ADVANCED PACKAGING AT THE 2020 VIRTUAL IFTLE 468: Samsung Advanced Packaging at the 2020 Virtual IWLPC. Over its 17 years of existence, the IWLPC has morphed from a conference focused on wafer-level packaging to one basically focused on anything advanced packaging. It is organized by SMTA and Chip Scale Review. COVERING 3D IC TECHNOLOGY AND HETEROGENEOUS INTEGRATION Stirring up interest in heterogeneous integration, 3D InCites follows developments in 3D IC technologies and 3D packaging, particularlyfocused on 3D TSVs.
3D: THE EL DORADO OF HETEROGENEOUS INTEGRATION 3D: The El Dorado of Heterogeneous Integration. From the cloud to edge computing, the quest for ever-greater power efficiency remains researchers’ top priority. From high-end niche to mass-market applications, the best cost-to-performance tradeoff is key to providing a competitive advantage. While Moore’s Law has helped meetthe performance
SOLUTIONS FOR GLASS-BASED PACKAGING ARE HERE Glass-based Solutions for Packaging are Here. A number of research articles have been published over the past several years showing the advantages glass-based solutions can bring to packaging and systems integration including radio frequency (RF) front-end devices, interposers, MEMs devices, and integrated photonics. RARE EARTH MINING: THE DARK UNDERSIDE OF SUSTAINABILITY The mining and refining of rare earths, as in most mining of resources, has environmental tradeoffs.This includes piles of tailings that can create landslides and concentrate hazardous waste, the potential for groundwater contamination, and the CO 2 footprint — although EVs are starting to be developed for mining purposes — the potential for radiation exposure, and more. SEMICONDUCTOR SHORTAGES, A CAPEX BOOM, AND ONSHORING Semiconductor units grow relatively steadily over time. According to IC Insights, the 43-year compound annual growth rate is 8.6%. 2021 is expected to see 13% growth after a decline of 6.7% in 2019 and 2.6% growth in 2020. So, growth is not always smooth and can be very cyclical. Historically, cyclicality has been driven by memory. THE AUTOMOTIVE CHIP SHORTAGE AND SUPPLY CHAINSSEE MORE ON3DINCITES.COM
NEWS ANALYSIS: WHAT'S GOING ON INSIDE INTEL? News Analysis: What’s Really Going on Inside Intel? Intel has been in the news for the first weeks of 2021. While this is not unusual due to CES and the associated announcements of new processors for the latest and greatest consumer products, this year has been a bit different. There have been multiple storylines throughout 2020 rollingover
THE 5G ROLLOUT: AN INDUSTRY IN TRANSITION In late summer, to help speed the U.S. rollout of 5G, the White House and the Department of Defense announced a plan to share a portion of their mid-band spectrum with the wireless industry, all though it’s not expected to go into effect until late 2021. On the handset side, now that the infrastructures have expanded, Apple finally introduced COOLCUBE™: MORE THAN A TRUE 3D VLSI ALTERNATIVE TO SCALINGSEE MOREON 3DINCITES.COM
DBI ULTRA CHANGES THE GAME FOR HETEROGENEOUS INTEGRATION Gao said that being able to connect the TSV directly to the pad eliminates the need for underfill and Cu pillars, creating a thinner profile. “With DBI Ultra, the stack height is the sum of die thickness in the stack and it is possible to stack more die on die, and maintain the same total package height,” she said. COVERING 3D IC TECHNOLOGY AND HETEROGENEOUS INTEGRATION Stirring up interest in heterogeneous integration, 3D InCites follows developments in 3D IC technologies and 3D packaging, particularlyfocused on 3D TSVs.
3D: THE EL DORADO OF HETEROGENEOUS INTEGRATION 3D: The El Dorado of Heterogeneous Integration. From the cloud to edge computing, the quest for ever-greater power efficiency remains researchers’ top priority. From high-end niche to mass-market applications, the best cost-to-performance tradeoff is key to providing a competitive advantage. While Moore’s Law has helped meetthe performance
SOLUTIONS FOR GLASS-BASED PACKAGING ARE HERE Glass-based Solutions for Packaging are Here. A number of research articles have been published over the past several years showing the advantages glass-based solutions can bring to packaging and systems integration including radio frequency (RF) front-end devices, interposers, MEMs devices, and integrated photonics. RARE EARTH MINING: THE DARK UNDERSIDE OF SUSTAINABILITY The mining and refining of rare earths, as in most mining of resources, has environmental tradeoffs.This includes piles of tailings that can create landslides and concentrate hazardous waste, the potential for groundwater contamination, and the CO 2 footprint — although EVs are starting to be developed for mining purposes — the potential for radiation exposure, and more. SEMICONDUCTOR SHORTAGES, A CAPEX BOOM, AND ONSHORING Semiconductor units grow relatively steadily over time. According to IC Insights, the 43-year compound annual growth rate is 8.6%. 2021 is expected to see 13% growth after a decline of 6.7% in 2019 and 2.6% growth in 2020. So, growth is not always smooth and can be very cyclical. Historically, cyclicality has been driven by memory. THE AUTOMOTIVE CHIP SHORTAGE AND SUPPLY CHAINSSEE MORE ON3DINCITES.COM
NEWS ANALYSIS: WHAT'S GOING ON INSIDE INTEL? News Analysis: What’s Really Going on Inside Intel? Intel has been in the news for the first weeks of 2021. While this is not unusual due to CES and the associated announcements of new processors for the latest and greatest consumer products, this year has been a bit different. There have been multiple storylines throughout 2020 rollingover
THE 5G ROLLOUT: AN INDUSTRY IN TRANSITION In late summer, to help speed the U.S. rollout of 5G, the White House and the Department of Defense announced a plan to share a portion of their mid-band spectrum with the wireless industry, all though it’s not expected to go into effect until late 2021. On the handset side, now that the infrastructures have expanded, Apple finally introduced COOLCUBE™: MORE THAN A TRUE 3D VLSI ALTERNATIVE TO SCALINGSEE MOREON 3DINCITES.COM
DBI ULTRA CHANGES THE GAME FOR HETEROGENEOUS INTEGRATION Gao said that being able to connect the TSV directly to the pad eliminates the need for underfill and Cu pillars, creating a thinner profile. “With DBI Ultra, the stack height is the sum of die thickness in the stack and it is possible to stack more die on die, and maintain the same total package height,” she said. ECTC 2021: ECONOMIC OUTLOOK FOCUSES ON THE IMPACT OF THE For the first time in its 71-year history, the ECTC committee veered away from strictly technical topics to include a panel discussion on market trends and the economic outlook. SEMICONDUCTOR SHORTAGES, A CAPEX BOOM, AND ONSHORING Semiconductor units grow relatively steadily over time. According to IC Insights, the 43-year compound annual growth rate is 8.6%. 2021 is expected to see 13% growth after a decline of 6.7% in 2019 and 2.6% growth in 2020. So, growth is not always smooth and can be very cyclical. Historically, cyclicality has been driven by memory. MORE THOUGHTS AND LESSONS LEARNED DURING MY CAREER IN 1 day ago · In the Spring 2020 issue of the MEPTEC Report, Herb Reiter briefly emerged from his recent retirement to pen an article and interview based on lessons learned during his 50-year-long career in semiconductors. Turns out he had a lot to say. So with Ira Feldman and Bette Cooper’s blessing, we’re publishing it as a series. HETEROGENEOUS CHIPLET DESIGN AND INTEGRATION The supply chain is also gearing up to support and technology offerings, with all the major foundries supporting advanced packaging. TSMC, UMC, Global Foundries, Samsung, and others now offer sophisticated advanced packaging options. DRUM ROLL PLEASE! THE WINNERS OF THE 2021 3D INCITES Like every other awards event in the past year, the 2021 3D InCites Awards Program had to make some adjustments for celebrating its winners. We can’t gather in person at the IMAPS Device Packaging Conference to applaud the winners, catch up with colleagues over a great barbeque, watch the 3D InCites Mural comes to life, or take lots of silly photos at the photo booth. IEEE INTERNATIONAL ELECTRON DEVICES MEETING ANNOUNCES 2021 SAN FRANCISCO, CA (June 4, 2021) – Under the theme “Devices for a New Era of Electronics: From 2D Materials to 3D Architectures,” the 67 th annual IEEE International Electron Devices Meeting (IEDM) has issued a Call for Papers seeking the world’s best original work in all areas of microelectronics research and development.. The 2021 IEDM is being planned as an in-person BREWER SCIENCE ACHIEVES ISO 45001:2018 Global technology leader meets the world’s most widely recognized occupational health and safety management standard. Rolla, MO – June 2021 – Brewer Science, a global leader in developing and manufacturing next-generation materials and processes for the microelectronics and optoelectronics industries, is pleased to announce the achievement of ISO 45001:2018 Occupational Health &Safety
ECTC 2021 FEATURES THE HOTTEST TOPICS AND TRENDS IN ECTC 2021 Features the Hottest Topics and Trends in Microelectronics. For the second time in its 71-year history, ECTC will be presented as a virtual conference, opening Tuesday, June 1, 2021, and close on Sunday, July 4, 2021. Keynotes, plenary sessions, and the special panel focus on the year’s most talked-about trends including: Theimpact
AN EDA PERSPECTIVE ON TODAY’S ADVANCED PACKAGING An EDA Perspective on Today’s Advanced Packaging. In my alliance management roles at electronic design automation (EDA) companies, I arranged many presentations to convey the benefits of EDA tools to IDMs, fabless IC vendors, and wafer foundries. Some of our EDA marketing people passionately presented their products’ strengthsand
IFTLE 487: YOLE REVIEWS THE ADVANCED PACKAGING MARKET Vaibhav Trivedi of Yole Développement gave an outlook for the advanced packaging market with a focus on 3DIC.The semiconductor market declined 12% YoY to reach $412B in 2019. In 2020 the market grew slightly despite the pandemic to about $439B. COVERING 3D IC TECHNOLOGY AND HETEROGENEOUS INTEGRATION3D TECHNOLOGIES INC3D TECHNOLOGIES LLCCREATIVE 3D TECHNOLOGIES Stirring up interest in heterogeneous integration, 3D InCites follows developments in 3D IC technologies and 3D packaging, particularlyfocused on 3D TSVs.
DIE-TO-WAFER BONDING STEPS INTO THE SPOTLIGHT ON ASEE MORE ON3DINCITES.COM
RARE EARTH MINING: THE DARK UNDERSIDE OF SUSTAINABILITY The mining and refining of rare earths, as in most mining of resources, has environmental tradeoffs.This includes piles of tailings that can create landslides and concentrate hazardous waste, the potential for groundwater contamination, and the CO 2 footprint — although EVs are starting to be developed for mining purposes — the potential for radiation exposure, and more. IFTLE 439: IMEC'S FC ON FOWLP... A CLOSER LOOK- 3D INCITES 3D InCites presented the 2019 process of the year award to Eric Beyne and Arnita Podpod of IMEC for their flip-chip on fan-out wafer-level package (FC on FOWLP) process that avoids the use of TSVs in active chips to achieve high-density packaging. SOLUTIONS FOR GLASS-BASED PACKAGING ARE HERE A number of research articles have been published over the past several years showing the advantages glass-based solutions can bring to packaging and systems integration including radio frequency (RF) front-end devices, interposers, MEMs devices, and integratedphotonics.
3D: THE EL DORADO OF HETEROGENEOUS INTEGRATION CoolCube™: About CEA-Leti’s monolithic 3D technology. Since 2016, CEA-Leti has extended its 3D integration roadmap with its CoolCube® technology in which stacked FDSOI transistors are interconnected with pattern alignment accurate to the nanometer, which is what makes all the difference compared to 2D technology. This also allows an increase in the density of the components without THE AUTOMOTIVE CHIP SHORTAGE AND SUPPLY CHAINSSEE MORE ON3DINCITES.COM
COOLCUBE™: MORE THAN A TRUE 3D VLSI ALTERNATIVE TO SCALINGSEE MOREON 3DINCITES.COM
BREAKTHROUGHS IN 3D STACKED FINFETS AND 3D SEQUENTIALHANDBOOK OF 3D INTEGRATIONSTACK BALL 3DSTACK BLOCKS 3DSTACK HIT 3D Breakthroughs in 3D Sequential Technology. Maud Vinet of Leti, et al, presented the second paper in this session, “Breakthroughs in 3D Sequential Technology”. The requirement of 3D sequential integration for limited top-tier temperature processing poses a number of challenges for both top and bottom tier processing, primarily limiting the top tier thermal budget to 500°C (Figure 3). RUDOLPH WINS ORDERS AWX FSI UNPATTERNED WAFER INSPECTION Rudolph Technologies, Inc. announced that it has won orders for its AWX™ FSI unpatterned wafer inspection system at both a major Southeast Asia-based outsourced assembly and test (OSAT) facility and a key Korean memory manufacturer. In both cases, the systems were selected after direct comparison with entrenched competitors. COVERING 3D IC TECHNOLOGY AND HETEROGENEOUS INTEGRATION3D TECHNOLOGIES INC3D TECHNOLOGIES LLCCREATIVE 3D TECHNOLOGIES Stirring up interest in heterogeneous integration, 3D InCites follows developments in 3D IC technologies and 3D packaging, particularlyfocused on 3D TSVs.
DIE-TO-WAFER BONDING STEPS INTO THE SPOTLIGHT ON ASEE MORE ON3DINCITES.COM
RARE EARTH MINING: THE DARK UNDERSIDE OF SUSTAINABILITY The mining and refining of rare earths, as in most mining of resources, has environmental tradeoffs.This includes piles of tailings that can create landslides and concentrate hazardous waste, the potential for groundwater contamination, and the CO 2 footprint — although EVs are starting to be developed for mining purposes — the potential for radiation exposure, and more. IFTLE 439: IMEC'S FC ON FOWLP... A CLOSER LOOK- 3D INCITES 3D InCites presented the 2019 process of the year award to Eric Beyne and Arnita Podpod of IMEC for their flip-chip on fan-out wafer-level package (FC on FOWLP) process that avoids the use of TSVs in active chips to achieve high-density packaging. SOLUTIONS FOR GLASS-BASED PACKAGING ARE HERE A number of research articles have been published over the past several years showing the advantages glass-based solutions can bring to packaging and systems integration including radio frequency (RF) front-end devices, interposers, MEMs devices, and integratedphotonics.
3D: THE EL DORADO OF HETEROGENEOUS INTEGRATION CoolCube™: About CEA-Leti’s monolithic 3D technology. Since 2016, CEA-Leti has extended its 3D integration roadmap with its CoolCube® technology in which stacked FDSOI transistors are interconnected with pattern alignment accurate to the nanometer, which is what makes all the difference compared to 2D technology. This also allows an increase in the density of the components without THE AUTOMOTIVE CHIP SHORTAGE AND SUPPLY CHAINSSEE MORE ON3DINCITES.COM
COOLCUBE™: MORE THAN A TRUE 3D VLSI ALTERNATIVE TO SCALINGSEE MOREON 3DINCITES.COM
BREAKTHROUGHS IN 3D STACKED FINFETS AND 3D SEQUENTIALHANDBOOK OF 3D INTEGRATIONSTACK BALL 3DSTACK BLOCKS 3DSTACK HIT 3D Breakthroughs in 3D Sequential Technology. Maud Vinet of Leti, et al, presented the second paper in this session, “Breakthroughs in 3D Sequential Technology”. The requirement of 3D sequential integration for limited top-tier temperature processing poses a number of challenges for both top and bottom tier processing, primarily limiting the top tier thermal budget to 500°C (Figure 3). RUDOLPH WINS ORDERS AWX FSI UNPATTERNED WAFER INSPECTION Rudolph Technologies, Inc. announced that it has won orders for its AWX™ FSI unpatterned wafer inspection system at both a major Southeast Asia-based outsourced assembly and test (OSAT) facility and a key Korean memory manufacturer. In both cases, the systems were selected after direct comparison with entrenched competitors. INTRODUCING THE 3D INCITES PODCAST Over the past month, you may have noticed a new addition to the 3D InCites platform. The 3D InCites Podcast made its debut on May 5, 2020, with a conversation with Kiterocket’s Joe Cestari, about how to successfully market a semiconductor business. MORE THOUGHTS AND LESSONS LEARNED DURING MY CAREER IN In the Spring 2020 issue of the MEPTEC Report, Herb Reiter briefly emerged from his recent retirement to pen an article and interview based on lessons learned during his 50-year-long career in semiconductors. Turns out he had a lot to say. So with Ira Feldman and Bette Cooper’s blessing, we’re publishing it as a series. IEEE INTERNATIONAL ELECTRON DEVICES MEETING ANNOUNCES 2021 SAN FRANCISCO, CA (June 4, 2021) – Under the theme “Devices for a New Era of Electronics: From 2D Materials to 3D Architectures,” the 67 th annual IEEE International Electron Devices Meeting (IEDM) has issued a Call for Papers seeking the world’s best original work in all areas of microelectronics research and development.. The 2021 IEDM is being planned as an in-person BREWER SCIENCE ACHIEVES ISO 45001:2018 Global technology leader meets the world’s most widely recognized occupational health and safety management standard. Rolla, MO – June 2021 – Brewer Science, a global leader in developing and manufacturing next-generation materials and processes for the microelectronics and optoelectronics industries, is pleased to announce the achievement of ISO 45001:2018 Occupational Health &Safety
LESSONS 7-13 LEARNED FROM FIFTY YEARS IN THE SEMICONDUCTOR In the Spring 2020 issue of the MEPTEC Report, Herb Reiter briefly emerged from his recent retirement to pen an article and interview based on lessons learned from fifty years in the semiconductor industry. Turns out he had a lot to say. So with Ira Feldman SOLUTIONS FOR GLASS-BASED PACKAGING ARE HERE A number of research articles have been published over the past several years showing the advantages glass-based solutions can bring to packaging and systems integration including radio frequency (RF) front-end devices, interposers, MEMs devices, and integratedphotonics.
3D & SYSTEMS SUMMIT EXPLORES AN EXPANDING APPLICATION Back in 2013, when 3D through silicon via (3D TSV) technology was a hot topic, SEMI Europe created the European 3D TSV Summit in response. Six years later, in response to the changing 3D integration landscape, the event was revised, extended and consequently renamed the AN EDA PERSPECTIVE ON TODAY’S ADVANCED PACKAGING In my alliance management roles at electronic design automation (EDA) companies, I arranged many presentations to convey the benefits of EDAtools to
NEWS ANALYSIS: WHAT'S GOING ON INSIDE INTEL? Something else I see missing from the dialogue is that Intel also continues to be a leader in R&D in transistor technology. At the 2020 VLSI conference and IEDM conference, Intel presented on next-generation transistor technology using nanoribbon, and heterogeneous integration to create a stacked nanosheet transistor. DISCOVER THE WORLD OF ATOTECH GROUP Discover the world of Atotech Group - 3D InCites * 3D In-Depth
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ECTC 2021 FEATURES THE HOTTEST TOPICS AND TRENDS IN MICROELECTRONICSMay 19, 2021
For the second time in its 71-year history, ECTC will... ISS EUROPE 2021 TACKLES DIGITAL TRANSFORMATION AND SUSTAINABILITYApr 28, 2021
While I am very dedicated to my role as a... THE ELECTRONICS SUPPLY CHAIN: IS IT BROKEN?Apr 16, 2021
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PROJECT MANAGER, TECHNOLOGY PRACTICE, (PHOENIX) Posted by Kiterocket PART 2: LESSONS 7-13 LEARNED FROM FIFTY YEARS IN THE SEMICONDUCTOR INDUSTRY – A MEMOIR Jun 01, 2021 · By Herb Reiter · 3D In Context, Blogs INTRODUCING THE 3D INCITES PODCAST Jun 03, 2021 · By Francoise von Trapp · Blogs, Francoise in 3D IFTLE 487: YOLE DÉVELOPPEMENT REVIEWS THE ADVANCED PACKAGING MARKET Jun 02, 2021 · By Phil Garrou · Blogs, Packaging IFTLE PART 2: LESSONS 7-13 LEARNED FROM FIFTY YEARS IN THE SEMICONDUCTOR INDUSTRY – A MEMOIR Jun 01, 2021 · By Herb Reiter · 3D In Context, Blogs INTRODUCING THE 3D INCITES PODCAST Jun 03, 2021 · By Francoise von Trapp · Blogs, Francoise in 3DTOP STORIES
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